CN204492089U - The moistureproof circuit board of a kind of ground heating heat insulation - Google Patents

The moistureproof circuit board of a kind of ground heating heat insulation Download PDF

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Publication number
CN204492089U
CN204492089U CN201520097777.4U CN201520097777U CN204492089U CN 204492089 U CN204492089 U CN 204492089U CN 201520097777 U CN201520097777 U CN 201520097777U CN 204492089 U CN204492089 U CN 204492089U
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CN
China
Prior art keywords
heat insulation
moistureproof
circuit board
geothermal
damp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520097777.4U
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Chinese (zh)
Inventor
张诗山
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Individual
Original Assignee
Individual
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Filing date
Publication date
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Priority to CN201520097777.4U priority Critical patent/CN204492089U/en
Application granted granted Critical
Publication of CN204492089U publication Critical patent/CN204492089U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses the moistureproof circuit board of a kind of ground heating heat insulation, be made up of panel layer, insulation layer, geothermal cushion, damp-proof course and bottom, described panel layer, insulation layer, geothermal cushion, damp-proof course and bottom arrange successively from top to bottom, and described geothermal cushion inside is provided with interlaced wire gauze.The utility model structure is simple, and easy to use, technology is reasonable.The material of insulation layer is extruded sheet, and like this, the quality of insulation layer is light, heat insulation effect, and the bottom surface of described damp-proof course is provided with ground thermal reflecting coating and can effectively reduces floor water content.

Description

The moistureproof circuit board of a kind of ground heating heat insulation
Technical field
The utility model belongs to decorative panel field, is specifically related to the moistureproof circuit board of a kind of ground heating heat insulation.
Background technology
At present, adopt marble as ground paving in the finishing of a lot of occasion, expensive, Colour selection has significant limitation, and decorative pattern is inconsistent, and arrange in pairs or groups also unreasonable, this has had a strong impact on its boundary of works area and decorative effect.And marmorean weight is large, material is comparatively hard, feel is bad, often needs to carpet to strengthen the comfort that pin is stepped on.In order to solve above-mentioned shortcoming, some circuit boards have also appearred in market, but the damping effect of the circuit board of prior art is bad, affects comfortableness.And the floor heating of prior art often needs to lay heating wire, and need external power supply, lay cost higher, electronic devices and components are easily damaged, and application life is not long, and have certain potential safety hazard, and warming effect is also undesirable.The poor quality of floor heating wood flooring in addition, without strict drying process, thus water content is too high, and after using, along with moisture content reduces, timber shrinks, and cracks, and in fact, this floor, being namely used in is not the indoor that floor heating heats, and can split equally yet.When floor heating cement backfill not yet bone dry, too early paving wood flooring.After wood flooring paving, the moisture in concrete, still in continuous evaporation, the moisture content of original drier wood flooring is raised, thus balloon sticks up.
Utility model content
The purpose of this utility model is to provide the moistureproof circuit board of a kind of ground heating heat insulation, to solve the deficiency existed in above-mentioned technology.
In order to achieve the above object, the technical scheme that the utility model adopts is:
The moistureproof circuit board of a kind of ground heating heat insulation, be made up of panel layer, insulation layer, geothermal cushion, damp-proof course and bottom, described panel layer, insulation layer, geothermal cushion, damp-proof course and bottom arrange successively from top to bottom, and described geothermal cushion inside is provided with interlaced wire gauze.
The material of described insulation layer is extruded sheet.
The bottom surface of described damp-proof course is provided with ground thermal reflecting coating.
Described ground thermal reflecting coating is tinfoil.
The utility model structure is simple, and easy to use, technology is reasonable.The material of insulation layer is extruded sheet, and like this, the quality of insulation layer is light, heat insulation effect, and the bottom surface of described damp-proof course is provided with ground thermal reflecting coating and can effectively reduces floor water content.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the structural representation of the utility model geothermal cushion.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
As shown in Figure 1 to Figure 2, the moistureproof circuit board of a kind of ground heating heat insulation, be made up of panel layer 1, insulation layer 2, geothermal cushion 3, damp-proof course 4 and bottom 5, described panel layer 1, insulation layer 2, geothermal cushion 3, damp-proof course 4 and bottom 5 arrange successively from top to bottom, described geothermal cushion 3 inside is provided with interlaced wire gauze, the material of described insulation layer 2 is extruded sheet, and the bottom surface of described damp-proof course 4 is provided with ground thermal reflecting coating, and described ground thermal reflecting coating is tinfoil.

Claims (4)

1. the moistureproof circuit board of ground heating heat insulation, be made up of panel layer, insulation layer, geothermal cushion, damp-proof course and bottom, it is characterized in that: described panel layer, insulation layer, geothermal cushion, damp-proof course and bottom arrange successively from top to bottom, described geothermal cushion inside is provided with interlaced wire gauze.
2. the moistureproof circuit board of a kind of ground heating heat insulation according to claim 1, is characterized in that: the material of described insulation layer is extruded sheet.
3. the moistureproof circuit board of a kind of ground heating heat insulation according to claim 1, is characterized in that: the bottom surface of described damp-proof course is provided with ground thermal reflecting coating.
4. the moistureproof circuit board of a kind of ground heating heat insulation according to claim 3, is characterized in that: described ground thermal reflecting coating is tinfoil.
CN201520097777.4U 2015-02-11 2015-02-11 The moistureproof circuit board of a kind of ground heating heat insulation Expired - Fee Related CN204492089U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520097777.4U CN204492089U (en) 2015-02-11 2015-02-11 The moistureproof circuit board of a kind of ground heating heat insulation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520097777.4U CN204492089U (en) 2015-02-11 2015-02-11 The moistureproof circuit board of a kind of ground heating heat insulation

Publications (1)

Publication Number Publication Date
CN204492089U true CN204492089U (en) 2015-07-22

Family

ID=53571403

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520097777.4U Expired - Fee Related CN204492089U (en) 2015-02-11 2015-02-11 The moistureproof circuit board of a kind of ground heating heat insulation

Country Status (1)

Country Link
CN (1) CN204492089U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150722

Termination date: 20160211

CF01 Termination of patent right due to non-payment of annual fee