CN204470031U - A kind of light-duty high rigidity ultrasonic transducer - Google Patents
A kind of light-duty high rigidity ultrasonic transducer Download PDFInfo
- Publication number
- CN204470031U CN204470031U CN201520040162.8U CN201520040162U CN204470031U CN 204470031 U CN204470031 U CN 204470031U CN 201520040162 U CN201520040162 U CN 201520040162U CN 204470031 U CN204470031 U CN 204470031U
- Authority
- CN
- China
- Prior art keywords
- transducer
- muscle
- piezo
- vibration nodal
- node
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
Abstract
The utility model relates to the technical field of ultrasonic transducer, particularly relate to a kind of on bonding equipment the ultrasonic transducer for ultra-sonic welded.This transducer only has two vibration nodal points, and a node is between head and piezo-electric crystal, and another one node is at piezo-electric crystal place, and the both sides of two node locations have muscle to stretch out respectively and install Flange joint together.Because this transducer only has two vibration nodal points, transducer can do short and light; Meanwhile, because the muscle supporting this transducer is being drawn along the diverse location of two on transducer axis direction, the bending stiffness of transducer is more easily guaranteed; Meanwhile, because muscle is drawn from the vibration nodal point position of transducer, and the position that to be transducer vibrations amplitude minimum, vibration nodal point position, the interference by installation position after making transducer install machine drops to minimum.
Description
Technical field
The present invention relates to the technical field of ultrasonic transducer, particularly relate to a kind of on bonding equipment the ultrasonic transducer for ultra-sonic welded.
Background technology
Bonding equipment is widely used in semiconductor packaging industry.Transducer, as one of critical component on bonding equipment, has material impact to the performance of bonding equipment.Along with the development of semiconductor packaging industry, more and more higher requirement is proposed to the speed of service of bonding equipment.The speed of service of bonding equipment can arrive welding 20 line per second.In addition, different types of slice, thin piece gets more and more, and requires that bonding equipment can be applicable to the welding demand of multiple different slice, thin piece, comprises the QFN comparing and be difficult to weld.
In bonding equipment running, the transducer be contained on bonding equipment moves up and down at a high speed under motor driving, itself produces ultrasonic vibration and converts electric energy to ultrasonic vibrational energy by accepting electric drive and be delivered to porcelain mouth, and porcelain mouth is vibrated along transducer axis direction back and forth with supersonic frequency.
More and more faster along with the high-speed full-automatic bonding equipment speed of service, the weight of transducer itself starts to become a bottleneck.Need light-duty transducer.
In addition, operationally, porcelain mouth of its clamping is with solder joint contact and the reaction force being subject to upwards in vertical direction, and therefore transducer head produces being bent upwards to a certain degree for transducer, the larger interference to ultrasonic vibration of degree of crook is larger, more unfavorable to ultra-sonic welded quality.Therefore, while the light-duty transducer of design, the bending stiffness of not falling end transducer must be taken into account.
Moreover provide transducer to be mechanically fastened on machine, operationally, its ultrasonic vibration is inevitably subject to the impact of installation position.Can by reducing the impact of installing contact area and reducing from installation position, but simple reduction installs the reduction that contact area can cause the bending stiffness of transducer.
Summary of the invention
The technical issues that need to address of the present invention are: by considering various influence factor, design a kind of transducer, have both made its quality enough slim and graceful, have had again enough bending stiffnesses, be arranged on adverse effect machine being operationally subject to installation position little simultaneously.
Another embodiment of the present invention, is characterized in that: porcelain mouth is clamped in transducer one end by locking porcelain mouth screw or other modes; Along transducer axis direction only having two vibration nodal point positions; There is a node location at position between porcelain mouth and piezo-electric crystal; Piezo-electric crystal is in another node location; The both sides of two node locations have front muscle and rear muscle to stretch out respectively; Front muscle and rear muscle link together, and are connected with mounting flange.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described.
Fig. 1 be transducer top view on superposition to shake shape schematic diagram;
Fig. 2 is one embodiment of the present of invention schematic diagrames;
Wherein: 1, piezo-electric crystal, 2, porcelain mouth, 3, porcelain mouth screw, 4, shake shape, 5, node location, 6, node location, 7, front muscle, 8, rear muscle, 9, flange.
Detailed description of the invention
The porcelain mouth 2 of transducer of the present invention is clamped in one end of transducer by locking porcelain mouth screw 3 or other modes.
Transducer operationally, has certain shape of shaking, and has vibration nodal point.In vibration nodal point position, the Oscillation Amplitude of transducer is minimum.On the top view that Figure 1 shows that transducer, superposition is shaken shape 4.This transducer only has two vibration nodal points, and thus transducer can do short and light.A node location 5 is had between piezo-electric crystal 1 and porcelain mouth 2.Another vibration nodal point 6 is in piezo-electric crystal position 1.Between node location 5 and node location 6 in transducer axes to there being certain spacing.Drawing support from these two node locations and form mounting structure like this to make transducer be mounted on after on machine, and its bending stiffness is more easily guaranteed, and the interference that simultaneously transducer is subject to installing junction drops to minimum.
Fig. 2 is one embodiment of the present of invention schematic diagram.Porcelain mouth 2 is clamped in transducer one end by locking porcelain mouth screw 3; Transducer only has two vibration nodal points in the axial direction; Before both sides, vibration nodal point position between piezo-electric crystal 1 and porcelain mouth 2 have, muscle 7 stretches out; After the both sides of another node location residing for piezo-electric crystal have, muscle 8 stretches out; Front muscle 7 is connected with mounting flange with rear muscle.
Content of the present invention is introduced by example, but the concrete shape of figure display should not be considered to restriction of the present utility model.The present invention is limited by claim.
Claims (1)
1. a ultrasonic transducer, is characterized in that: porcelain mouth (2) is clamped in transducer one end by locking porcelain mouth screw (3); Along transducer axis direction only having two vibration nodal point positions; There is a node location (5) at position between porcelain mouth (2) and piezo-electric crystal; Piezo-electric crystal (1) is in another node location (6); The both sides of two node locations have front muscle (7) and rear muscle (8) to stretch out respectively; Front muscle (7) and rear muscle (8) link together, and are connected with mounting flange (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520040162.8U CN204470031U (en) | 2015-01-21 | 2015-01-21 | A kind of light-duty high rigidity ultrasonic transducer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520040162.8U CN204470031U (en) | 2015-01-21 | 2015-01-21 | A kind of light-duty high rigidity ultrasonic transducer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204470031U true CN204470031U (en) | 2015-07-15 |
Family
ID=53625773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520040162.8U Withdrawn - After Issue CN204470031U (en) | 2015-01-21 | 2015-01-21 | A kind of light-duty high rigidity ultrasonic transducer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204470031U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105312216A (en) * | 2015-01-21 | 2016-02-10 | 上海声定科技有限公司 | Light high-rigidity ultrasonic transducer |
-
2015
- 2015-01-21 CN CN201520040162.8U patent/CN204470031U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105312216A (en) * | 2015-01-21 | 2016-02-10 | 上海声定科技有限公司 | Light high-rigidity ultrasonic transducer |
| CN105312216B (en) * | 2015-01-21 | 2017-08-11 | 上海声定科技有限公司 | A kind of light-duty high rigidity ultrasonic transducer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20150715 Effective date of abandoning: 20170811 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20150715 Effective date of abandoning: 20170811 |