CN204466066U - The mounting tool of wiring substrate - Google Patents
The mounting tool of wiring substrate Download PDFInfo
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- CN204466066U CN204466066U CN201520065267.9U CN201520065267U CN204466066U CN 204466066 U CN204466066 U CN 204466066U CN 201520065267 U CN201520065267 U CN 201520065267U CN 204466066 U CN204466066 U CN 204466066U
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- electronic unit
- mounting tool
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Abstract
The utility model provides a kind of mounting tool of wiring substrate, even if the electronic unit that the mounting tool of this wiring substrate is given prominence to than wiring substrate for its part under the state be connected with wiring substrate, the generation of skew and bad connection also can be suppressed when mounted downwards.Mounting tool (10) has: support body (11), and it supports FPC substrate (20) from below; Peristome (12), its storage protuberance (41a), electronic unit (40) is connected with the upper surface of FPC substrate (20) via the bonder terminal (43) being arranged at cardinal extremity (45) and reinforcement terminal (44), and this protuberance (41a) is given prominence to downwards than FPC substrate (20); Circumference (13), the cardinal extremity (45) of its supporting electronic components (40); And end difference (14), its supporting is positioned at the front end splicing ear (42) of the front end of electronic unit (40).
Description
Technical field
The utility model relates to the mounting tool supporting this wiring substrate in operation electronic unit being installed on wiring substrate from below.
Background technology
In order to be arranged on by electronic unit on the wiring substrate such as flexible printed board and rigidity printed base plate, carry out such as reflow process and resin working procedure of coating etc.When carrying out these operations, usually, mounting tool is used to support wiring substrate and transmit.As such mounting tool, be known to the structure such as described in patent documentation 1.
Existing patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 10-276000 publication
But, there is such as USB device etc. as electronic unit, to be mechanically connected with wiring substrate via the splicing ear being arranged at its cardinal extremity and to be electrically connected, and there is a part in mounted condition and give prominence to downwards than wiring substrate.When this electronic unit is installed on wiring substrate, in order to the interference avoiding electronic unit and wiring substrate and load between tool, structure part corresponding with electronic unit in wiring substrate and mounting tool being formed with opening can be adopted.When have employed this structure, mounting tool is via the cardinal extremity of wiring substrate supporting electronic components, and the part that the ratio wiring substrate of electronic unit is more outstanding runs through the peristome inserting wiring substrate, and is incorporated in the peristome of mounting tool.
But, because electronic unit is connected with wiring substrate by means of only the splicing ear being arranged at its cardinal extremity, therefore, there will be in reflow process and resin working procedure of coating, electronic unit causes the part of the peristome being accommodated in mounting tool to reduce because deadweight waits, the situation that electronic unit is integral inclined.Can occur like this, the adaptation being arranged at the connection between the splicing ear of the cardinal extremity of electronic unit and wiring substrate reduces, the mounted skew of electronic unit and the situation of bad connection.
Utility model content
The object of this programme is, even if provide a kind of when electronic unit has the part more outstanding than wiring substrate, also can suppress the mounting tool of the skew of electronic unit and the wiring substrate of bad connection in installation process.
The mounting tool of the wiring substrate of this programme has: support body, and it supports wiring substrate from below; Peristome, the protuberance of its housing electronic parts, described electronic unit is connected with the upper surface of described wiring substrate via the cardinal extremity splicing ear being arranged at its cardinal extremity, and described protuberance is given prominence to downwards than described wiring substrate; 1st support, it supports the described cardinal extremity of described electronic unit; And the 2nd support, it supports in described electronic unit from the supported portion that described cardinal extremity leaves.
According to above-mentioned mounting tool, even if when electronic unit has the part more outstanding than wiring substrate, also the skew of electronic unit and the generation of bad connection can be suppressed in installation process.
Accompanying drawing explanation
Fig. 1 illustrates that the mounting tool of the 1st execution mode using this programme is to support the exploded perspective view of the structure of wiring substrate.
Fig. 2 is the partial section of the relation between wiring substrate, electronic unit and mounting tool for being shown specifically this execution mode.
Fig. 3 is the vertical view of the relation between wiring substrate, electronic unit and mounting tool for being shown specifically this execution mode.
Fig. 4 is the vertical view of the relation between the wiring substrate of the 2nd execution mode for being shown specifically this programme, electronic unit and mounting tool.
Fig. 5 is the partial section of the relation between wiring substrate, electronic unit and mounting tool for being shown specifically this execution mode.
Embodiment
[the utility model execution mode is described]
First outline and execution mode of the present utility model is described.
(1) wiring substrate of execution mode has: support body, and it supports wiring substrate from below; Peristome, the protuberance of its housing electronic parts, described electronic unit is connected with the upper surface of described wiring substrate via the cardinal extremity splicing ear being arranged at its cardinal extremity, and described protuberance is given prominence to downwards than described wiring substrate; 1st support, it supports the described cardinal extremity of described electronic unit; And the 2nd support, it supports in described electronic unit from the supported portion that described cardinal extremity leaves.
According to the wiring substrate of said structure, can by the cardinal extremity of the 1st support supporting electronic components, and by position supporting electronic components that the 2nd support is leaving from this cardinal extremity.Thus, even if when electronic unit has the part more outstanding than wiring substrate, 2 position supporting electronic components that also can separate, therefore, it is possible to suppress the part being accommodated in the peristome of mounting tool caused because deadweight waits to decline thus the situation making electronic unit integral inclined.Thus, in the operation for installing this electronic unit, the skew of electronic unit and the generation of bad connection can be suppressed.
(2), when the described wiring substrate be connected by horizontal arrangement and with described electronic unit in described support body is placed in described mounting tool, the center of gravity of described electronic unit is positioned at the position corresponding with the described peristome of described mounting tool for the projection of described mounting tool.
When this electronic unit, due to when wiring substrate being placed in the mounting tool of level, the center of gravity of electronic unit is positioned at the position corresponding with the peristome of mounting tool, and the inclination caused because of the deadweight etc. of electronic unit more easily produces.If but adopt the mounting tool of this programme, even if when mounting is connected with the wiring substrate of such electronic unit, the situation that electronic unit tilts because deadweight waits also effectively can be suppressed.
(3) preferably, described support body is provided with permanent magnet.
If adopt such structure, when the cap layer formed by magnetic being stacked on wiring substrate under the state that support body supports wiring substrate from below, by the magnetic force of these permanent magnets, wiring substrate quilt cover and support body are clamped, thus maintain flat condition.
(4) preferably, described 2nd support is end difference, and this end difference forms in the inner circumferential of described peristome and described support body, and supports the described supported portion of described electronic unit from below.
Because the 2nd support is formed in the inner circumferential of the peristome of mounting tool, namely the below of the upper surface of mounting tool is positioned at, therefore, compared with being formed at the situations such as the upper surface loading tool with such as the 2nd support, the height that electronic unit is given prominence to upward from mounting tool can be suppressed.Its result is, can realize the miniaturization of the device for mounting electronic parts.In addition, because the 2nd support and support body form, therefore, compared with the situation that such as the 2nd support and support body are formed dividually, the quantity of parts can be reduced, easily can form the 2nd support.
(5) preferably, described 1st support and described 2nd support are formed as, under by described support body horizontal arrangement, described 1st support and described 2nd support support the described cardinal extremity of described electronic unit and the bearing state of described supported portion respectively, described electronic unit is by horizontal arrangement, or described electronic unit tilts from described cardinal extremity upward towards front end.
Due to electronic unit horizontal arrangement under bearing state, or described electronic unit tilts from described cardinal extremity upward towards described front end, therefore, the gravity Negative lotus being applied to the cardinal extremity of electronic unit increases, and can improve the adaptation between the cardinal extremity splicing ear of the cardinal extremity being arranged at electronic unit and wiring substrate.Thereby, it is possible to more effectively suppress the skew of electronic unit and the generation of bad connection in an installation.
(6) in addition, preferably under described bearing state, the front end of electronic unit exceeds 0mm ~ 0.2mm from horizontal arrangement position.In this case, the adaptation between the cardinal extremity splicing ear of electronic unit and wiring substrate can be improved most effectively.
(7) preferably, described 1st support and described 2nd support are formed as, and under the state of the described cardinal extremity and described supported portion that support described electronic unit respectively, are positioned at the position of the center of gravity clipping described electronic unit.
According to this structure, when the wiring substrate being connected with electronic unit being placed in mounting tool, because the 1st support and the 2nd support are clipping the position supporting electronic components of center of gravity of electronic unit, therefore, it is possible to stable state support electronic unit.Thereby, it is possible to effectively suppress the situation that electronic unit tilts because deadweight waits, thus in the operation of mounting electronic parts, can effectively suppress the skew of electronic unit and the generation of bad connection.
(8) in addition, in this case, described supported portion is preferably the front end of described electronic unit.By this structure, because the 1st support and the 2nd support distinguish cardinal extremity and the front end of supporting electronic components, therefore, it is possible to electronic unit is placed in mounting tool with more stable state.
(9) following structure can be adopted: the mounting tool of described wiring substrate has 2 described 2nd supports, and these 2 described 2nd supports support 2 described supported portion of the different parts being formed in described electronic unit respectively.
According to such structure, when electronic unit being placed in mounting tool, because a position, 2 beyond cardinal extremity is supported by the 2nd support, therefore, it is possible to electronic unit is placed in mounting tool with stable state.
(10) in addition, in this case preferably, described 1st support and described 2 the 2nd supports, under the state of the described cardinal extremity and described supported portion that support described electronic unit respectively, surround the center of gravity of described electronic unit.
According to such structure, when electronic unit being placed in mounting tool, due to 3 supports, i.e. the center of gravity of the 1st support and 2 the 2nd support encirclement electronic units, therefore, it is possible to be placed in mounting tool with extremely stable state by electronic unit.
(11) when wiring substrate is flexible printed board, the inclination tendency that electronic unit causes because deadweight waits becomes remarkable.If but adopt the mounting tool of this programme, even if then wiring substrate is flexible printed board, in the operation of mounting electronic parts, also effectively can suppress the skew of electronic unit and the generation of bad connection.
[details of execution mode of the present utility model]
About the mounting tool of the wiring substrate of execution mode, with reference to the accompanying drawings its concrete example is described.In addition, this programme is not limited to these and illustrates, can think to comprise disclosed in the scope of claim, with all changes in the meaning of scope equivalence of claim and the scope of this claim.
(the 1st execution mode)
Below, with reference to Fig. 1 ~ Fig. 3, the 1st execution mode that the mounting tool of the wiring substrate by this programme is specialized is described.Fig. 1 illustrates to use mounting tool to support the exploded perspective view of the structure of wiring substrate.Fig. 2 and Fig. 3 is for being shown specifically electronic unit, wiring substrate and loading partial section and the vertical view of the relation between tool.
As shown in FIG. 1 to 3, mounting tool 10 has support body 11, and this support body 11 supports the flexible printed board (hereinafter, referred to as " FPC substrate ") 20 as wiring substrate from below, and this support body 11 has the thickness of 1.0 ~ 3.5mm.As the mounting material preferred glass epoxy resin of tool 10, aluminium or the aluminium implementing anodized to surface.FPC substrate 20 has the thickness of 0.1mm ~ 0.6mm, is connected with the multiple electronic units 40 (only illustrating 1 in Fig. 1) being arranged in array-like at the upper surface of FPC substrate 20.This electronic unit 40 is the electronic units with convex form as USB splicing ear etc., and when being installed in FPC substrate 20, a part is given prominence to downwards than FPC substrate 20.In addition, at the upper surface of FPC substrate 20, the electronic unit beyond electronic unit 40 is also installed, but omits their diagram at this.
Electronic unit 40 has: main part 41, be arranged at the front of main part 41 front end splicing ear 42, as be arranged at main part 41 cardinal extremity Side cardinal extremity splicing ear bonder terminal 43 and strengthen terminal 44.Electronic unit 40 is via these bonder terminals 43 and strengthen terminal 44 and to be electrically connected with FPC substrate 20 and to be mechanically connected.
The main part 41 of electronic unit 40 has protuberance 41a, and under the state that electronic unit 40 is installed on FPC substrate 20, protuberance 41a gives prominence to downwards than FPC substrate 20.FPC substrate 20 is formed with peristome 21, protuberance 41a can run through this peristome 21 of insertion.Further, by under the state of electronic unit 40 horizontal arrangement as shown in Figure 2, the lower limb of front end splicing ear 42 is positioned at the below of bonder terminal 43.
Mounting tool 10 is arranged at the below of FPC substrate 20, is formed with the peristome 12 for receiving this protuberance 41a in the part that the protuberance 41a with electronic unit 40 is corresponding.Namely, as shown in Figure 2, when the FPC substrate 20 being provided with electronic unit 40 being placed in mounting tool 10, the protuberance 41a of electronic unit 40 runs through the peristome 21 inserting FPC substrate 20, and enters the peristome 12 of mounting tool 10 thus be incorporated in this peristome 12.In this condition, the cardinal extremity 45 of the electronic unit 40 being provided with bonder terminal 43 and strengthening terminal 44 is supported by the circumference 13 (the 1st support) be positioned at below this cardinal extremity 45.This circumference 13 is parts of support body 11, namely loads a part for tool 10.
The inner circumferential of the peristome 12 of mounting tool 10 is provided with end difference 14 (the 2nd support), and this end difference 14 is formed with support body 11 by cut etc.Further, end difference 14 is positioned at the below of upper surface of the support body 11 of mounting tool 10, the front end splicing ear 42 (supported portion) of supporting electronic components 40 from below under the state that electronic unit 40 is installed in FPC substrate 20.
And, as shown in Figure 2, under the cardinal extremity 45 and front end splicing ear 42 (i.e. the front end of electronic unit 40) state of support body 11 horizontal arrangement and circumference 13 and end difference 14 difference supporting electronic components 40 that will load tool 10, electronic unit 40 tilts from cardinal extremity 45 upward towards front end splicing ear 42.Specifically, front end splicing ear 42 exceeds 0mm ~ 0.2mm from horizontal arrangement position.
Further, in this condition, the center of gravity G of electronic unit 40 is positioned at the position corresponding with the peristome 12 of mounting tool 10 for the projection loading tool 10.In addition, as shown in Figures 2 and 3, circumference 13 and end difference 14, under the state supporting cardinal extremity 45 and front end splicing ear 42 respectively, are positioned at the position of the center of gravity G clipping electronic unit 40.
Cover 30 is also laminated with above FPC substrate 20.This cover 30 is formed by strong ferromagnetic body such as stainless steels, and the position corresponding with the electronic unit 40 being installed on FPC substrate 20 is formed with peristome 12.This peristome 12 has the size larger than the peristome 21 of FPC substrate 20.Further, load in the support body 11 of tool 10 and be embedded with not shown multiple permanent magnets.When cover 30 is laminated in FPC substrate 20, by the magnetic force of these permanent magnets, clamped FPC substrate 20 by cover 30 and mounting tool 10 and FPC substrate 20 is maintained smooth state.
Like this, under the state FPC substrate 20 being provided with electronic unit 40 being placed in mounting tool 10, reflow process and resin working procedure of coating etc. is carried out.
By present embodiment, following effect can be realized.
(1) the mounting tool 10 of wiring substrate according to the present embodiment, can by the cardinal extremity 45 of circumference 13 supporting electronic components 40, and by end difference 14 at the position supporting electronic components 40 left from this cardinal extremity 45.Thus, even if when electronic unit 40 has the part more outstanding than FPC substrate 20, due to 2 position supporting electronic components 40 that can separate, therefore, it is possible to suppress the part being incorporated in the peristome 12 of mounting tool 10 caused because deadweight waits to reduce thus the situation making electronic unit 40 integral inclined.Thereby, it is possible in the operation for mounting electronic parts 40, suppress the skew of electronic unit 40 and the generation of bad connection.
(2) when FPC substrate 20 being placed in the mounting tool 10 of level, the center of gravity due to electronic unit 40 is positioned at position corresponding to peristome 12 with mounting tool 10, therefore, and easier deadweight because of electronic unit 40 etc. and cause tilting.But, by adopting the mounting tool 10 of present embodiment, even if when FPC substrate 20 mounting being provided with such electronic unit 40, also effectively can suppressing the deadweight etc. because of electronic unit 40 and causing situation about tilting.
(3) owing to being provided with permanent magnet in the support body 11 of mounting tool 10, when the cover 30 formed by ferromagnetic body being layered on FPC substrate 20 under the state that support body 11 supports FPC substrate 20 from below, by these permanent magnets magnetic force, FPC substrate 20 quilt cover 30 and support body 11 are clamped and maintain smooth state.
(4) end difference 14 as the support of supporting front end splicing ear 42 is formed in the inner circumferential of the peristome 12 of mounting tool 10, namely owing to being positioned at the below of the upper surface of mounting tool 10, therefore, compared with such as this support being formed at the situation of the upper surface loading tool 10, the height that electronic unit 40 is given prominence to upward from mounting tool 10 can be suppressed.Its result is, can realize the miniaturization of the device for mounting electronic parts 40.In addition, because end difference 14 and support body 11 form, therefore, such as, compared with situation about being formed of turning up the soil with this supporting part, the quantity of parts can be reduced, and can easily form this support.
(5) in the present embodiment, in support body 11 horizontal arrangement by mounting tool 10, under circumference 13 and end difference 14 distinguish the cardinal extremity 45 of supporting electronic components 40 and the state of front end splicing ear 42, because electronic unit 40 tilts from cardinal extremity 45 upward towards front end splicing ear 42, therefore, the gravity Negative lotus being applied to the cardinal extremity 45 of electronic unit 40 becomes large, the bonder terminal 43 that can improve the cardinal extremity 45 being arranged at electronic unit 40 and the adaptation strengthened between terminal 44 and FPC substrate 20.Thereby, it is possible to effectively suppress the skew of electronic unit 40 and the generation of bad connection further in an installation.
(6) under above-mentioned bearing state, about the degree that electronic unit 40 tilts, the front end of electronic unit 40 is adopted to exceed 0mm ~ 0.2mm size suitable like this from the position of horizontal arrangement, the adaptation effectively can improved bonder terminal 43 and strengthen between terminal 44 and FPC substrate 20.
(7) circumference 13 and end difference 14 are under the difference cardinal extremity 45 of supporting electronic components 40 and the state of front end splicing ear 42, are positioned at the position of the center of gravity G clipping electronic unit 40, therefore, it is possible to stable state support electronic unit 40.Thereby, it is possible to the situation effectively suppressing electronic unit 40 to tilt because deadweight waits, in the operation for mounting electronic parts 40, the skew of electronic unit 40 and the generation of bad connection can be suppressed.
(8) in addition, because end difference 14 supports front end splicing ear 42 (front end of electronic unit 40), the i.e. front and base end side of end difference 14 and circumference 13 difference supporting electronic components 40, therefore, it is possible to be placed in mounting tool with more stable state by electronic unit.
(9) as present embodiment, when FPC substrate 20 is flexible printed board, the inclination tendency that electronic unit 40 causes because deadweight waits becomes more remarkable.But, by adopting the mounting tool 10 of present embodiment, even if then when flexible printed board, in the operation for mounting electronic parts 40, also the skew of electronic unit 40 and the generation of bad connection effectively can be suppressed.
(the 2nd execution mode)
Below, with reference to Fig. 4 and Fig. 5, the 2nd execution mode that the mounting tool of the wiring substrate by this programme is specialized is described.Fig. 4 and Fig. 5 is for being shown specifically electronic unit, wiring substrate and loading vertical view and the partial section of the relation between tool.In addition, in the 2nd execution mode, the structure of the supporting electronic components 40 of mounting tool 10 is different from the 1st execution mode, but other structure is identical with the 1st execution mode.Here, the parts identical with the 1st execution mode are added to identical symbol and omit detailed description, only describes above-mentioned difference in detail.
As shown in Figure 4 and Figure 5, blade part 46a, 46b of 2 tabulars is provided with in the both sides transversely of the main part 41 of electronic unit 40.On the other hand, in the inner circumferential of the peristome 21 of mounting tool 10, the position corresponding respectively with blade part 46a, 46b is formed with 2 end differences 114a, 114b.These 2 end differences 114a, 114b are formed with support body 11 by cut etc., be positioned at the below of the upper surface of the support body 11 of mounting tool 10, under the state that electronic unit 40 is installed on FPC substrate 20, support 2 blade parts 46a, 46b respectively.
And, will mounting support body 11 horizontal arrangement of tool 10 and circumference 13 and end difference 114a, 114b respectively under the cardinal extremity 45 of supporting electronic components 40 and the state of blade part 46a, 46b, electronic unit 40 tilts from cardinal extremity 45 upward towards front end splicing ear 42.Specifically, front end splicing ear 42 exceeds 0.2mm ~ 0.5mm from horizontal arrangement position.Further, circumference 13 and end difference 114a, 114b, under the state supporting cardinal extremity 45 and blade part 46a, 46b respectively, are formed on the position of the center of gravity G surrounding electronic unit 40.
By present embodiment, except effect (1) ~ (5) of the 1st execution mode, (8), following effect can also be realized.
(10) because mounting tool 10 has 2 end differences 114a, 114b supporting 2 positions, i.e. blade part 46a, 46b beyond cardinal extremity 45 respectively, therefore, it is possible to electronic unit 40 is placed in mounting tool with stable state.
(11) and, will mounting support body 11 horizontal arrangement of tool 10 and circumference 13 and end difference 114a, 114b respectively under the cardinal extremity 45 of supporting electronic components 40 and the state of blade part 46a, 46b, because circumference 13 and end difference 114a, 114b surround the center of gravity G of electronic unit 40, therefore, it is possible to electronic unit 40 is placed in mounting tool 10 with extremely stable state.
(other execution mode)
This technology is not limited to above-mentioned execution mode.Below, other execution mode is described.
In above-mentioned each execution mode, adopt following structure: in support body 11 horizontal arrangement by mounting tool 10, when the FPC substrate 20 having installed electronic unit 40 being placed in mounting tool 10, the center of gravity of electronic unit 40 is positioned at the position corresponding with the peristome 12 of mounting tool 10 for the projection loading tool 10.But even if when the projection of the center of gravity of electronic unit 40 is such as positioned at the position corresponding with the support body 11 of mounting tool 10, when transmitting FPC substrate 20 grade, electronic unit 40 also can produce inclination because deadweight waits.Therefore, by applying this programme in such an embodiment, also above-mentioned effect can be realized.
End difference 114a, 114b in 1st execution mode in end difference 14 and the 2nd execution mode and support body 11 form, but, be not limited only to this, such as, also can form these end differences by other parts.
In above-mentioned each execution mode, adopt following structure: under state electronic unit 40 being placed in mounting tool 10, electronic unit 40 tilts from cardinal extremity 45 upward towards front end splicing ear 42, front end splicing ear 42 exceeds 0mm ~ 0.2mm from the position of horizontal arrangement, but, the adaptation as long as bonder terminal 43 can guaranteed and strengthen between terminal 44 and FPC substrate 20, then the degree that the front end that also can change electronic unit 40 tilts.Specifically, as long as the size that front end splicing ear 42 vertically tilts from horizontal arrangement position is in the Fan Wall of-0.2mm ~ 0.5mm, then the installation of electronic unit 40 can be carried out.Here, even if front end splicing ear 42 slightly lower than horizontal arrangement position (-0.2mm ~ 0mm), as long as under the state supported by circumference 13 and end difference 14,114a, 114b, also this structure can be adopted.
In the 1st execution mode, circumference 13 and end difference 14 are under the difference cardinal extremity 45 of supporting electronic components 40 and the state of front end splicing ear 42, be formed as the center of gravity G clipping electronic unit 40, but, as long as the stability of electronic unit 40 can be guaranteed, then such as also end difference 14 can be formed in the Side side of electronic unit 40.
In the 1st execution mode, adopt following structure, circumference 13 and end difference 14 are under the difference cardinal extremity 45 of supporting electronic components 40 and the state of front end splicing ear 42, end difference 14 supports front end splicing ear 42, the i.e. front end of electronic unit 40, but as long as can guarantee the stability of electronic unit 40, then end difference 14 also can change in the front end than electronic unit 40 more by the structure of supporting electronic components 40 on the position of cardinal extremity Side.
In the 2nd execution mode, have employed the structure with 2 end differences 114a, 114b, but, as long as the stability of electronic unit 40 can be guaranteed, then also can omit 1 in end difference 114a, 114b.Further, the end difference of more than 3 can also be formed.
In the 2nd execution mode, circumference 13 and end difference 114a, 114b are under the difference cardinal extremity 45 of supporting electronic components 40 and the state of blade part 46a, 46b, be formed as the center of gravity G surrounding electronic unit 40, but, as long as the stability of electronic unit 40 can be guaranteed, then also can form these circumferences 13 and end difference 114a, 114b in the mode making the center of gravity G of electronic unit 40 be positioned at the outside in the region surrounded by circumference 13 and end difference 114a, 114b.
In above-mentioned each execution mode, electronic unit 40 is connected with FPC substrate 20 with reinforcement terminal 44 via the bonder terminal 43 being arranged at cardinal extremity 45, but, also can omit and strengthen terminal 44.
The situation applying this programme in the mounting tool of mounting as the flexible printed board of wiring substrate is illustrated, but, also can apply this programme in the mounting tool of mounting rigidity printed base plate.In this case, corresponding effect can also be realized.
utilizability in industry
Mounting tool 10 shown in execution mode is when being useful to support from below when FPC substrate 20 (wiring substrate) uses.
Label declaration
10: mounting tool; 11: support body; 12: peristome; 13: circumference (the 1st support); 14: end difference (the 2nd support); 20: flexible printed board (wiring substrate); 21: peristome; 30: cover; 40: electronic unit; 41: main part; 41a: protuberance; 114a, 114b: end difference.
Claims (11)
1. a mounting tool for wiring substrate, wherein, the mounting tool of described wiring substrate has:
Support body, it supports wiring substrate from below;
Peristome, the protuberance of its housing electronic parts, described electronic unit is connected with the upper surface of described wiring substrate via the cardinal extremity splicing ear being arranged at its cardinal extremity, and described protuberance is given prominence to downwards than described wiring substrate;
1st support, it supports the described cardinal extremity of described electronic unit; And
2nd support, it supports in described electronic unit from the supported portion that described cardinal extremity leaves.
2. the mounting tool of wiring substrate according to claim 1, wherein,
When the described wiring substrate that described support body is connected by horizontal arrangement and with described electronic unit is placed in described mounting tool, the center of gravity of described electronic unit is positioned at the position corresponding with the described peristome of described mounting tool for the projection of described mounting tool.
3. the mounting tool of wiring substrate according to claim 1, wherein,
Described support body is provided with permanent magnet.
4. the mounting tool of the wiring substrate according to any one in claims 1 to 3, wherein,
Described 2nd support is end difference, and this end difference forms in the inner circumferential of described peristome and described support body, and supports the described supported portion of described electronic unit from below.
5. the mounting tool of the wiring substrate according to any one in claims 1 to 3, wherein,
Described 1st support and described 2nd support are formed as, under by described support body horizontal arrangement, described 1st support and described 2nd support support the described cardinal extremity of described electronic unit and the bearing state of described supported portion respectively, described electronic unit is by horizontal arrangement, or described electronic unit tilts from described cardinal extremity upward towards its front end.
6. the mounting tool of wiring substrate according to claim 5, wherein,
Described 1st support and described 2nd support are formed as, and under described bearing state, the front end of electronic unit exceeds 0 ~ 0.2mm from horizontal arrangement position.
7. the mounting tool of the wiring substrate according to any one in claims 1 to 3, wherein,
Described 1st support and described 2nd support are formed as, and under the state of the described cardinal extremity and described supported portion that support described electronic unit respectively, are positioned at the position of the center of gravity clipping described electronic unit.
8. the mounting tool of wiring substrate according to claim 7, wherein,
Described supported portion is the front end in described electronic unit.
9. the mounting tool of the wiring substrate according to any one in claims 1 to 3, wherein,
The mounting tool of described wiring substrate has 2 described 2nd supports, and these 2 described 2nd supports support 2 described supported portion of the different parts being formed in described electronic unit respectively.
10. the mounting tool of wiring substrate according to claim 9, wherein,
Described 1st support and described 2 the 2nd supports, under the state of the described cardinal extremity and described supported portion that support described electronic unit respectively, surround the center of gravity of described electronic unit.
The mounting tool of 11. wiring substrates according to any one in claims 1 to 3, wherein,
Described wiring substrate is flexible printed board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520065267.9U CN204466066U (en) | 2015-01-29 | 2015-01-29 | The mounting tool of wiring substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520065267.9U CN204466066U (en) | 2015-01-29 | 2015-01-29 | The mounting tool of wiring substrate |
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| Publication Number | Publication Date |
|---|---|
| CN204466066U true CN204466066U (en) | 2015-07-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520065267.9U Active CN204466066U (en) | 2015-01-29 | 2015-01-29 | The mounting tool of wiring substrate |
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| CN (1) | CN204466066U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107613668A (en) * | 2017-10-31 | 2018-01-19 | 广东欧珀移动通信有限公司 | Flexible PCB patch jig |
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2015
- 2015-01-29 CN CN201520065267.9U patent/CN204466066U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107613668A (en) * | 2017-10-31 | 2018-01-19 | 广东欧珀移动通信有限公司 | Flexible PCB patch jig |
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