CN204461449U - Electronic installation - Google Patents
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- CN204461449U CN204461449U CN201420849421.7U CN201420849421U CN204461449U CN 204461449 U CN204461449 U CN 204461449U CN 201420849421 U CN201420849421 U CN 201420849421U CN 204461449 U CN204461449 U CN 204461449U
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Abstract
According to an embodiment of the present disclosure, provide a kind of electronic installation, it is characterized in that, comprising: the first printed circuit board substrate, be included in more than first contact pad on the first side of described first printed circuit board substrate; Semiconductor die, comprise sensor region on an upper and more than second contact pad, described semiconductor die is positioned on described first printed circuit board substrate, makes its upper surface deviate from described first printed circuit board (PCB); And multiple electric connector, the contact pad in each electric connector and described more than second contact pad and the corresponding contact pad in described more than first contact pad carry out electrical communication; First lens, on the described sensor region being positioned at described semiconductor die; Luminescence component, comprises the luminescent device with light-emitting zone, is positioned at the second lens on described light-emitting zone, and in the face of the 3rd many contact pads of described first printed circuit board substrate; And encapsulated layer, be arranged on described first printed circuit board substrate, at least one of described multiple electric connector, described semiconductor die, described first lens and described luminescence component.
Description
Technical field
The application is usually directed to semiconductor devices, and relates more specifically to semiconductor proximity sense device.
Background technology
Figure 1A is the top plan view of traditional proximity sense 100.Proximity sense 100 comprises sealing cap 102, has the first hole 104 and the second hole 106 be formed in wherein.Figure 1B is the cut-open view of the proximity sense 100 along the 1B-1B of line shown in Figure 1A.Proximity sense 100 comprises and is arranged in luminescent device 108 in printed circuit board substrate 112 and semiconductor die 110.Sensor region 114 is arranged on the upper surface of semiconductor die 110.Lens 116 use transparent adhesion material 118 to be fixed to semiconductor die 110 on sensor region 114.Luminescent device 108 sends light through the first hole 104.By the reflections off objects near proximity sense 100, the light that sent by luminescent device 108 can enter the second hole 106, through lens 116, and illumination sensor region 114.Proximity sense 100 exports the signal indicating the light intensity be incident on sensor region 114.
As shown in Figure 1B, sealing cap 102 comprises the first sealing cap block part 102a, the second sealing cap block part 102b, and the 3rd sealing cap block part 102c.Sealing cap block part 102a-102c is extremely little, usually has the size between 15 microns and 150 microns.First sealing cap block part 102a uses adhesion material 120a to be fixed to printed circuit board substrate 112.Second sealing cap block part 102b uses adhesion material 120b to be fixed to semiconductor die 110.3rd sealing cap block part 102c uses adhesion material 120c to be fixed to printed circuit board substrate 112.
During the manufacture of proximity sense 100, adhesion material 120a and adhesion material 120c is deposited on the upper surface of printed circuit board substrate 112, and adhesion material 120b is deposited on the upper surface of semiconductor die 110.Small sealing cap block part 102a-102c is positioned on adhesion material 120a-120c respectively carefully.If sealing cap block part 102a-102c and/or adhesion material 120a-120c is not accurately placed in the position of their design, sealing cap block part 102a-120c can adhere to irrelevantly and/or can not form hole 104 and 106 on luminescent device 108 and sensor region 114 respectively.Therefore, the manufacture of proximity sense 100 can cause high ratio of defects, and this can increase manufacturing cost.
Therefore, needing can with the proximity sense apparatus manufactured compared with Low Defectivity.
Utility model content
According to an embodiment, provide a kind of electronic installation, it is characterized in that, comprising: the first printed circuit board substrate, be included in more than first contact pad on the first side of described first printed circuit board substrate; Semiconductor die, comprise sensor region on an upper and more than second contact pad, described semiconductor die is positioned on described first printed circuit board substrate, makes its upper surface deviate from described first printed circuit board (PCB); And multiple electric connector, the contact pad in each electric connector and described more than second contact pad and the corresponding contact pad in described more than first contact pad carry out electrical communication; First lens, on the described sensor region being positioned at described semiconductor die; Luminescence component, comprises the luminescent device with light-emitting zone, is positioned at the second lens on described light-emitting zone, and in the face of the 3rd many contact pads of described first printed circuit board substrate; And encapsulated layer, be arranged on described first printed circuit board substrate, at least one of described multiple electric connector, described semiconductor die, described first lens and described luminescence component.
Alternatively, described encapsulated layer is arranged on each multiple surfaces of described semiconductor die, described first lens and described luminescence component.
Alternatively, described luminescence component comprises the 3rd lens be positioned on described second lens, and described encapsulated layer is positioned on multiple surfaces of described 3rd lens.
Alternatively, described luminescence component is positioned on described semiconductor die.
Alternatively, described luminescence component is positioned in described first printed circuit board substrate.
Alternatively, described luminescence component comprises: the second printed circuit board substrate, comprise: described 3rd many contact pads, be positioned on the first side of described second printed circuit board substrate, 4th many contact pads, be positioned on the second side of described second printed circuit board substrate, and multiple conductive trace, each conductive trace to extend in described second printed circuit board substrate and makes two or more contact pads in described 3rd many contact pads and described 4th many contact pads carry out electrical communication, 5th many contact pads, be positioned on described luminescent device, and more than second electric connector, make the corresponding contact pad in each contact pad in described 4th many contact pads and described 5th many contact pads carry out electrical communication.
Alternatively, described second lens are arranged at least one and described second printed circuit board substrate of described more than second electric connector.
Alternatively, described second printed circuit board substrate is positioned in described first printed circuit board substrate.
Alternatively, described second printed circuit board substrate is positioned on described semiconductor die.
Alternatively, the described 3rd many contact pads are positioned on the lower surface of described luminescent device.
Accompanying drawing explanation
Figure 1A is the top plan view of traditional proximity sense.
Figure 1B is the cut-open view of proximity sense shown in Figure 1A.
Fig. 2 A-Fig. 2 D shows the semiconductor subassembly located in each fabrication phase according to an embodiment.
Fig. 3 is the cut-open view of the luminescence component according to an embodiment.
Fig. 4 is the structural drawing of the communicator according to an embodiment.
Fig. 5 A-Fig. 5 E show according to an embodiment each fabrication phase place semiconductor subassembly.
Fig. 6 A is the top plan view of the proximity sense according to an embodiment.
Fig. 6 B is the cut-open view of proximity sense shown in Fig. 6 A.
Fig. 7 A is the top plan view of the proximity sense according to an embodiment.
Fig. 7 B is the cut-open view of proximity sense shown in Fig. 7 A.
Fig. 8 A is the top plan view of the proximity sense according to an embodiment.
Fig. 8 B is the cut-open view of proximity sense shown in Fig. 8 A.
Fig. 9 A is the top plan view of the proximity sense according to an embodiment.
Fig. 9 B is the cut-open view of proximity sense shown in Fig. 9 A.
Figure 10 A is the top plan view of the proximity sense according to an embodiment.
Figure 10 B is the cut-open view of proximity sense shown in Figure 10 A.
Figure 11 A is the top plan view of the proximity sense according to an embodiment.
Figure 11 B is the cut-open view of proximity sense shown in Figure 11 A.
Embodiment
Fig. 2 A-Fig. 2 D shows the semiconductor subassembly 200 located in each fabrication phase according to an embodiment.As shown in Figure 2 A, semiconductor subassembly 200 comprises printed circuit board substrate 202.The upper surface of printed circuit board substrate 202 comprises multiple contact pad 204.The lower surface of printed circuit board substrate 202 comprises multiple contact pad 206.Multiple conductive trace 208 defines one or more contact pad 204 on the upper surface of printed circuit board substrate 202 and the one or more electrical connections contacted between 206 on the lower surface of printed circuit board substrate 202.
As shown in Figure 2 B, multiple luminescent device 210 is placed on the upper surface of printed circuit board substrate 202.In one embodiment, each luminescent device 210 is traditional light emitting diodes (LED).In one embodiment, each luminescent device 210 is traditional vertical cavity surface emitting lasers (VCSEL).
The upper surface of each luminescent device 210 comprises light-emitting zone 212 and contact pad 214.Traditional conduction adhesion material 216 defines the electrical connection on the lower surface of each luminescent device 210 and the upper surface of printed circuit board substrate 202 between a contact pad 204.Each luminescent device 210 is fixed to the upper surface of printed circuit board substrate 202 by conduction adhesion material 216.
In one embodiment, on the predetermined contact pad in the contact pad 204 that conduction adhesion material 216 is formed on the upper surface of printed circuit board substrate 202, and the lower surface of luminescent device 210 is placed as and conducts electricity adhesion material 216 and contact subsequently.In one embodiment, the conduction of the employing at least partially adhesion material 216 of the lower surface of each luminescent device 210 applies, and it is placed as subsequently and contacts with the predetermined contact pad in the contact pad 204 on the upper surface of printed circuit board substrate 202.Such as, the pick and place machine structure of traditional surface mounting technique is adopted to may be used for placing luminescent device 210 on the upper surface of printed circuit board substrate 202.
As shown in Figure 2 C, the contact pad 214 subsequently on the upper surface of luminescent device 210 is electrically connected with being formed between the corresponding contact pad 204 on the upper surface of printed circuit board substrate 202.In one embodiment, one end of each wiring in multiple wiring 218 is connected to one of contact pad 204 on the upper surface of printed circuit board substrate 202 by traditional wiring keying features, and subsequently the other end of wiring 218 is connected to one of contact pad 214 on the upper surface of the corresponding luminescent device in luminescent device 210.
As shown in Figure 2 D, the layer of conventional transparent material 220 is formed on each upper surface in the upper surface of printed circuit board substrate 202 and luminescent device 210 and wiring 218 and side surface subsequently.Initially, transparent material 220 can be liquid or colloidal form, and can pour into or be infused on printed circuit board substrate 202, luminescent device 210 and wiring 218.Transparent material 220 can adopt subsequently UV light, heat and/or moisture-curable with make transparent material 220 more cache obtain solid form.
Transparent material 220 can make the light of the major part (and if not all) be incident on transparent material 220 pass from it.Such as, transparent material 220 can make to be incident at least 85% of the light (such as long from about 400 nanometer to 700 nanometer optical waves) in the visible spectrum on transparent material 220 or the light (such as long from about 700 nanometer to 1250 nanometer optical waves) infrared spectrum and passes from it.Additionally or alternatively, transparent material 220 can as the light filter preventing predetermined wavelength from passing from it.Such as, the light that transparent material 220 can prevent from being incident in light in the visible spectrum on transparent material 220 or infrared spectrum passes from it.
With reference to Fig. 2 D and Fig. 3, sawing subsequently or otherwise discrete semiconductor components 200 are to form multiple luminescence component 300.Such as, the blade of saw is placed on the upper surface of semiconductor subassembly 200 at position 222 place, and moves down subsequently until pass layer and the printed circuit board substrate 202 of transparent material 220.
Fig. 3 is the cut-open view of luminescence component 300.Luminescence component 300 comprises printed circuit board substrate 202.The upper surface of printed circuit board substrate 202 comprises contact pad 204.The lower surface of printed circuit board substrate 202 comprises contact pad 206.Electrical connection on the lower surface that conductive trace 208 defines one or more contact pad 204 and printed circuit board substrate 202 on the upper surface of printed circuit board substrate 202 between one or more contact pad 206.
Luminescent device 210 is arranged on the upper surface of printed circuit board substrate 202.The upper surface of luminescent device 210 comprises light-emitting zone 212 and contact pad 214.Conduction adhesion material 216 defines the electrical connection on the lower surface of luminescent device 210 and the upper surface of printed circuit board substrate 202 between a contact pad 204.Electrical connection on the upper surface that wiring 218 defines contact pad 214 and printed circuit board substrate 202 on the upper surface of luminescent device 210 between a contact pad 204.Lens 302 are formed by transparent material 220.
Fig. 4 is the structural drawing of the communicator 400 according to an embodiment.Communicator 400 comprises proximity sense 402, controller 404, and display device 406.In one embodiment, communicator 400 is cell phones, and proximity sense 402 is proximity senses 600 shown in Fig. 6 A and Fig. 6 B, and display device 406 is touch panel devices.If proximity sense 402 is not near the health of user, such as, proximity sense 402 exports the first signal to controller 404, indicates a small amount of (if any) light exported from proximity sense 402 and has reflected from user's health and be back to proximity sense 402.When controller 404 receives the first signal from proximity sense 402, controller 404 provides the first control signal to display device 406, its enable display device 406 and/or make the backlight of display device 406 to export predetermined maximum light.
Proximity sense 402 can be positioned at the loudspeaker (not shown) annex of communicator 400.If proximity sense 402 is positioned near user's health (such as user ear), proximity sense 402 exports secondary signal to controller, and its light indicating at least scheduled volume exported from proximity sense 402 has reflected from user's health and has been back to proximity sense 402.When controller 404 receives secondary signal from proximity sense 402, controller 404 provides the second control signal to display device 406, and it have disabled display device 406 and/or makes the backlight of display device 406 to export the light of predetermined minimum amount.Therefore, proximity sense 402 may be used for the power consumption reducing communicator 400.
Fig. 5 A-Fig. 5 E shows the semiconductor subassembly 500 located in each fabrication phase according to an embodiment.
As shown in Figure 5A, semiconductor subassembly 500 comprises printed circuit board substrate 502.The upper surface of printed circuit board substrate 502 comprises multiple contact pad 504.The lower surface of printed circuit board substrate 502 comprises multiple contact pad 506.Electrical connection on the lower surface that multiple conductive trace 508 defines one or more contact pad 504 and printed circuit board substrate 502 on the upper surface of printed circuit board substrate 502 between one or more contact pad 506.
Multiple traditional semiconductor die 510 is placed on the upper surface of printed circuit board substrate 502.Such as, the pick and place machine structure of conventional surface field engineering is adopted to may be used for placing semiconductor die 510 on the upper surface of printed circuit board substrate 502.The upper surface of each semiconductor die 510 comprises sensor region 512 and contact pad 514.In one embodiment, sensor region 512 is the parts of photodiode light being converted to electric current, and wherein the amplitude proportional of electric current is in the amplitude of light intensity.
As shown in Figure 5 B, multiple luminescence component 300 is placed on the upper surface of printed circuit board substrate 502.Such as, the pick and place machine structure of conventional surface field engineering is adopted to may be used for placing luminescence component 300 on the upper surface of printed circuit board substrate 502.
Semiconductor die 510 and luminescence component 300 are fixed to the upper surface of printed circuit board substrate 502 by traditional adhesion material 516.Additionally, the adhesion material 516 that conducts electricity defines the electrical connection between a contact pad 504 on the lower surface of each semiconductor die 510 and the upper surface of printed circuit board substrate 502.Electrical connection on the lower surface that conduction adhesion material 516 also form each luminescence component 300 between each contact pad 206 contact pad 504 corresponding on the upper surface of printed circuit board substrate 502.
As shown in Figure 5 C, be connected electrically between at least one contact pad 514 contact pad 504 corresponding on the upper surface of printed circuit board substrate 502 on the upper surface of each semiconductor die 510 and formed.In one embodiment, the first end of wiring 518 is connected to the corresponding contact pad of the contact pad 504 on the upper surface of printed circuit board substrate 502 by traditional wiring keying features, and the corresponding contact pad on the upper surface subsequently corresponding second end of wiring 518 being connected to semiconductor die 510 at least one contact pad 514.Additionally, multiple conventional lenses 520 is placed on the sensor region 512 of semiconductor die 510.Such as, the pick and place machine structure of conventional surface field engineering is adopted to may be used on the upper surface of a semiconductor die 510, place each lens 520.Each lens 520 are fixed to the corresponding semiconductor nude film in semiconductor die 510 by traditional transparent adhesion material 522.
Each lens 520 and/or transparent adhesion material 522 can make the light of the major part (and if not all) be incident on lens 520 and/or lens adhesion material 522 pass from it.Such as, lens 520 and/or transparent adhesion material 522 can make to be incident at least 85% of light in light in the visible spectrum on lens 520 and/or transparent adhesion material 522 or infrared spectrum and pass from it.Additionally or alternatively, lens 520 and/or transparent adhesion material 522 can as the light filters preventing predetermined wavelength from passing from it.Such as, lens 520 and/or transparent adhesion material 522 can prevent from being incident on the light in the visible spectrum on lens 520 and/or transparent adhesion material 522 or the light in infrared spectrum passes from it.
As shown in Figure 5 D, multiple mask 524 is positioned on lens 520, and lens are positioned on the sensor region 512 of semiconductor die 510.In addition, multiple mask 526 is positioned on the lens 302 of luminescence component 300.In one embodiment, mask 524 is fixed to lens 520 and also mask 526 is fixed to lens 302 by traditional adhesion material (not shown).
Encapsulated layer 528 is formed on the upper surface of printed circuit board substrate 502, on each upper surface in semiconductor die 510, wiring 518, lens 520 and lens 302 and side surface, and on the side surface of luminescence component 300.The conventional molded compound that encapsulated layer 528 can not be passed from it by light is formed.Such as, encapsulated layer 528 can be formed by black material.Initially, encapsulated layer 528 can be liquid or colloidal form, and can pour into or be injected on printed circuit board substrate 502, semiconductor die 510, wiring 518, lens 520 and luminescence component 300.Encapsulated layer 528 can adopt subsequently UV light, heat and/or moisture-curable with make encapsulated layer 528 more cache obtain solid form.Preferably, the mold compound of encapsulated layer 528 changes liquid or colloidal form into temperature from solid form changes liquid or colloidal form into from solid form temperature lower than the transparent material 220 of lens 302 forming luminescence component 300 is formed.Therefore, semiconductor subassembly 500 can be in the temperature that the transparent material 220 making encapsulated layer 528 simultaneously form the lens 302 of luminescence component 300 for liquid or colloidal form remains solid form.
As shown in fig. 5e, mask 524 removes from the lens 520 on the sensor region 512 of semiconductor die 510 subsequently, and mask 526 removes from the lens 302 of luminescence component 300.When removing mask 524 and mask 526, the first hole 530 is formed on the respective lens 302 of luminescence component 300, and the second hole 532 be formed in semiconductor die 510 sensor region 512 on respective lens 520 on.In one embodiment, blade is used for scraping off or otherwise remove a part for encapsulated layer 528 to form the first opening 530 and the second opening 532 respectively from the upper surface of the lens 520 on the lens 302 of luminescence component 300 and the sensor region 512 of semiconductor die 510.
In one embodiment, mask 524 and mask 526 are raised from what be included in that traditional film assists the upper surface of molded mechanism cavity to downward-extension.Semiconductor subassembly 500 is placed in the cavities, and semiconductor subassembly 500 lifts towards the upper surface of cavity in mechanism, until mask 524 and mask 526 contact the upper surface of the lens 520 on the lens 302 of luminescence component 300 and the sensor region 512 of semiconductor die 510 respectively.When semiconductor subassembly 500 is fixed on this position by mechanism, the mold compound forming encapsulated layer 528 is injected cavity by mechanism.After mold compound has solidified at least in part or has hardened, the upper surface of semiconductor subassembly 500 away from cavity moves by mechanism, until mask 524 and mask 526 contact the lens 520 on the lens 302 of luminescence component 300 and the sensor region 512 of semiconductor die 510 no longer respectively.
With reference to Fig. 5 E, Fig. 6 A and Fig. 6 B, sawing subsequently or otherwise discrete semiconductor components 500 are to form multiple proximity sense 600.Such as, blade position 534 place in Fig. 5 E of saw is placed on the upper surface of encapsulated layer 528, and moves down subsequently, until through encapsulated layer 528 and printed circuit board substrate 502 to form multiple proximity sense 600.
Fig. 6 A is the top plan view of proximity sense 600.Proximity sense 600 comprises the capping 602 formed by encapsulated layer 528.Capping 602 has the first hole 604 and the second hole 606 be formed in wherein.First hole 604 is formed by first hole 530, and the second hole 606 is formed by second hole 532.
Fig. 6 B is the cut-open view of the proximity sense 600 along line 6B-6B shown in Fig. 6 A.Proximity sense 600 comprises printed circuit board substrate 502.The upper surface of printed circuit board substrate 502 comprises contact pad 504.The lower surface of printed circuit board substrate 502 comprises contact pad 506.Conductive trace 508 defines the electrical connection between the one or more contact pads 506 on the lower surface of one or more contact pad 504 on the upper surface of printed circuit board substrate 502 and printed circuit board substrate 502.
Semiconductor die 510 is arranged on the upper surface of printed circuit board substrate 502.The upper surface of semiconductor die 510 comprises sensor region 512 and at least one contact pad 514.Conduction adhesion material 516 defines the electrical connection on the lower surface of semiconductor die 510 and the upper surface of printed circuit board substrate 502 between a contact pad 504.Conduction adhesion material 516 also form the electrical connection between the corresponding contact pad in the contact pad 504 on the upper surface of each contact pad 206 and printed circuit board substrate 502 on the lower surface of the printed circuit board substrate 202 of luminescence component 300.
At least one wiring 518 defines the electrical connection between at least one contact pad 514 on the upper surface of at least one contact pad 504 on the upper surface of printed circuit board substrate 502 and semiconductor die 510.Lens 520 are arranged on the sensor region 512 of semiconductor die 510.Lens 520 are fixed to semiconductor die 510 by transparent adhesion material 522.Proximity sense 600 also comprises luminescence component 300 as above.
Because capping 602 is formed by opaque material, therefore capping 602 prevents exterior light from arriving the sensor region 512 of semiconductor die 510.Additionally, capping 602 prevent from sending from luminescent device 210, do not leave proximity sense 600 by the first hole 604 and arrived the sensor region 512 of semiconductor die 510 by the light that the second hole 606 enters proximity sense again.
During the operation of proximity sense 600, on the lower surface of electric energy by printed circuit board substrate 502, one or more contact pad 506 is provided to proximity sense 600.Electric energy can be provided to semiconductor die 510 via one or more conductive traces 508 of one of the contact pad 504 be connected on the upper surface of printed circuit board substrate 502, and this contact pad 504 is connected at least one contact pad 514 on the upper surface of semiconductor die 510 by least one wiring 518.Common reference potential (such as ground connection) can be provided to proximity sense 600 by contact pad 506 one or more on the lower surface of printed circuit board substrate 502.Common reference potential can be provided to semiconductor die 510 via one or more conductive traces 508 of the contact pad 504 be connected on the upper surface of printed circuit board substrate 502, and a contact pad 504 is connected to the lower surface of semiconductor die 510.
Additionally, electric energy and common reference potential can be provided to luminescence component 300 via two or more conductive traces 508 of two contact pads 504 be connected on the upper surface of printed circuit board substrate 502, and two contact pads 504 are connected to the corresponding contact pad in the contact pad 206 on the lower surface of printed circuit board substrate 202.Proximity sense 600 also provides data from the one or more contact pads 506 on the lower surface of printed circuit board substrate 502 or control signal.Those contact pads 506 are connected to the one or more contact pads 504 on the upper surface of printed circuit board substrate 502 by one or more conductive trace 508, one or more contact pad 504 is also connected to the one or more contact pads 514 on the upper surface of semiconductor die 510 by one or more wiring 518.This kind of contact pad 504, contact pad 514 and a wiring 518 is illustrate only in Fig. 6 B.
In luminescent device 210 scioptics 302 and capping 602, the first hole 604 is luminous.The second hole 606 in capping 602 can be entered by the light of reflections off objects near proximity sense 600, through lens 520, and irradiate the sensor region 512 of semiconductor die 510.Semiconductor die 510 exports one or more signal, and it indicates the intensity amplitude that is incident on sensor region 512 glazing or is just becoming ratio with it, from the one or more contact pads 514 on the upper surface of semiconductor die 510.Semiconductor die 510 can comprise the driver causing and will be provided to the electric energy of luminescence component 300 at predetermined instant.
Fig. 7 A is the top plan view of the proximity sense 700 according to an embodiment.Fig. 7 B is the cut-open view of the proximity sense 700 along line 7B-7B shown in Fig. 7 A.Proximity sense 700 is similar to proximity sense 600 shown in Fig. 6 A and Fig. 6 B, except as detailed below such is close to the extra lens that sensor 700 is included on luminescence component.
Proximity sense 700 comprises capping 702, has the first hole 704 and the second hole 706 be formed in wherein.Proximity sense 700 also comprises printed circuit board substrate 708.The upper surface of printed circuit board substrate 708 comprises multiple contact pad 710.The lower surface of printed circuit board substrate 708 comprises multiple contact pad 712.Multiple conductive trace 714 defines the electrical connection between the one or more contact pads 712 on the lower surface of one or more contact pad 710 on the upper surface of printed circuit board substrate 708 and printed circuit board substrate 708.
Traditional semiconductor die 716 is arranged on the upper surface of printed circuit board substrate 708.Semiconductor die 716 is included in sensor region on the upper surface of semiconductor die 716 718 and at least one contact pad 720.In one embodiment, sensor region 718 is the parts of photodiode light being converted to electric current, and wherein the amplitude proportional of electric current is in the amplitude of light intensity.
Traditional conduction adhesion material 722 defines the electrical connection between a contact pad 710 on the lower surface of semiconductor die 716 and the upper surface of printed circuit board substrate 708.Conduction adhesion material 722 also form the electrical connection between each contact pad 206 on the lower surface of printed circuit board substrate 202 and the corresponding contact pad 710 on the upper surface of printed circuit board (PCB) 708.
At least one defining between at least one contact pad 710 on the upper surface of printed circuit board substrate 708 and at least one contact pad 720 on the upper surface of semiconductor die 716 of at least one wiring 724 is electrically connected.
Traditional lens 726 are arranged on the sensor region 718 of semiconductor die 716.Lens 726 are fixed to semiconductor die 716 by transparent adhesion material 728.Lens 730 are arranged on the lens 302 of luminescence component 300.Lens 730 are fixed to the lens 302 of luminescence component 300 by transparent adhesion material 732.
Lens 726, transparent adhesion material 728, lens 730 and/or transparent adhesion material 732 can make the light of incident major part (and if not all) on it pass from it.Such as, lens 726, transparent adhesion material 728, lens 730 and/or transparent adhesion material 732 can make at least 85% of the light in incident visible spectrum on it or the light in infrared spectrum to pass from it.Additionally or alternatively, lens 726, transparent adhesion material 728, lens 730 and/or transparent adhesion material 732 can as the light filters preventing optical wavelength from passing from it.Such as, lens 726, transparent adhesion material 728, lens 730 and/or transparent adhesion material 732 can to prevent in incident visible spectrum on it light in light or infrared spectrum to pass from it.
During the manufacture of proximity sense 700, mask (not shown) be placed on the upper surface of lens 726 and lens 730 at least partially on.The encapsulated layer forming capping 702 is placed on the upper surface of printed circuit board substrate 708, in semiconductor die 716, wiring 724, lens 726 and each upper surface of lens 730 and going up at least partially of side surface, and on the side surface of luminescence component 300.Remove mask subsequently to form the first hole 704 and the second hole 706.
Fig. 8 A is the top plan view of the proximity sense 800 according to an embodiment.Fig. 8 B is the cut-open view of the proximity sense 800 obtained along the line 8B-8B of Fig. 8 A.Proximity sense 800 is similar to proximity sense 600 shown in Fig. 6 A and Fig. 6 B, except such luminescence component is as detailed below arranged on except on semiconductor die.
Proximity sense 800 comprises capping 802, and it has the first hole 804 and the second hole 806 be formed in wherein.Proximity sense 800 also comprises printed circuit board substrate 808.The upper surface of printed circuit board substrate 808 comprises multiple contact pad 810.The lower surface of printed circuit board substrate 808 comprises multiple contact pad 812.Multiple conductive trace 814 defines the electrical connection between the one or more contact pads 812 on the lower surface of one or more contact pad 810 on the upper surface of printed circuit board substrate 808 and printed circuit board substrate 808.
Traditional semiconductor die 816 is arranged on the upper surface of printed circuit board substrate 808.Semiconductor die 816 is included in sensor region 818 on the upper surface of semiconductor die 816 and multiple contact pad 820.In one embodiment, sensor region 818 is the parts of photodiode light being converted to electric current, and wherein the amplitude proportional of electric current is in the amplitude of light intensity.
Traditional conduction adhesion material 822 defines the electrical connection on the lower surface of semiconductor die 816 and the upper surface of printed circuit board substrate 808 between a contact pad 810.At least one wiring 824 defines the electrical connection between at least one contact pad 820 on the upper surface of at least one contact pad 810 on the upper surface of printed circuit board substrate 808 and semiconductor die 816.
Traditional lens 826 are arranged on the sensor region 818 of semiconductor die 816.Lens 826 are fixed to semiconductor die 816 by traditional transparent adhesion material 828.Lens 826 and/or transparent adhesion material 828 can make the light of incident major part (and if not all) on it pass from it.Such as, lens 826 and/or transparent adhesion material 828 can make at least 85% of light in light in incident visible spectrum on it or infrared spectrum to pass from it.Additionally or alternatively, lens 826 and/or transparent adhesion material 828 can as the light filters preventing predetermined wavelength from passing from it.Such as, lens 826 and/or transparent adhesion material 828 can to prevent in incident visible spectrum on it light in light or infrared spectrum to pass from it.
Proximity sense 800 also comprises luminescence component 300 as above.Electrical connection on the upper surface that conduction adhesion material 822 defines each contact pad 206 on the lower surface of printed circuit board substrate 202 and semiconductor die 816 between corresponding contact pad 820.During the manufacture of proximity sense 800, mask (not shown) be placed on the upper surface of lens 826 and lens 832 at least partially on.The encapsulated layer forming capping 802 is placed on the upper surface of printed circuit board substrate 808, and in semiconductor die 816, wiring 824, lens 826 and each upper surface of luminescence component 830 and going up at least partially of side surface.Remove mask subsequently to form the first hole 804 and the second hole 806.
Fig. 9 A is the top plan view of the proximity sense 900 according to an embodiment.Fig. 9 B is the cut-open view of the proximity sense 900 along the acquisition of line 9B-9B shown in Fig. 9 A.Proximity sense 900 is similar to proximity sense 800 shown in Fig. 8 A and Fig. 8 B, except lens additional like that are as detailed below arranged on except on luminescence component.
Proximity sense 900 comprises capping 902, and it has the first hole 904 and the second hole 906 be formed in wherein.Proximity sense 900 also comprises printed circuit board substrate 908.The upper surface of printed circuit board substrate 908 comprises multiple contact pad 910.The lower surface of printed circuit board substrate 908 comprises multiple contact pad 912.Multiple conductive trace 914 defines the electrical connection between the one or more contact pads 912 on the lower surface of one or more contact pad 910 on the upper surface of printed circuit board substrate 908 and printed circuit board substrate 908.
Traditional semiconductor die 916 is arranged on the upper surface of printed circuit board substrate 908.Semiconductor die 916 is included in sensor region 918 on the upper surface of semiconductor die 916 and multiple contact pad 920.In one embodiment, sensor region 918 is the parts of photodiode light being converted to electric current, and wherein the amplitude proportional of electric current is in the amplitude of light intensity.
Traditional conduction adhesion material 922 defines the electrical connection on the lower surface of semiconductor die 916 and the upper surface of printed circuit board substrate 908 between a contact pad 910.At least one wiring 924 defines the electrical connection between at least one contact pad 920 on the upper surface of at least one contact pad 910 on the upper surface of printed circuit board substrate 908 and semiconductor die 916.
Traditional lens 926 are arranged on the sensor region 918 of semiconductor die 916.Lens 926 are fixed to semiconductor die 916 by traditional transparent adhesion material 928.Proximity sense 900 also comprises luminescence component 300 as above.Electrical connection on the upper surface that conduction adhesion material 922 defines each contact pad 206 on the lower surface of printed circuit board substrate 202 and semiconductor die 916 between corresponding contact pad 820.Lens 930 are arranged on the lens 302 of luminescence component 300.Lens 930 are fixed to the lens 302 of luminescence component 300 by transparent adhesion material 932.
Lens 926, transparent adhesion material 928, lens 930 and/or transparent adhesion material 932 can make the light of incident major part (and if not all) on it pass from it.Such as, lens 926, transparent adhesion material 928, lens 930 and/or transparent adhesion material 932 can make at least 85% of light in light in incident visible spectrum on it or infrared spectrum to pass from it.Additionally or alternatively, lens 926, transparent adhesion material 928, lens 930 and/or transparent adhesion material 932 can as the light filters preventing predetermined wavelength from passing from it.Such as, lens 926, transparent adhesion material 928, lens 930 and/or transparent adhesion material 932 can to prevent in incident visible spectrum on it light in light or infrared spectrum to pass from it.
During the manufacture of proximity sense 900, mask (not shown) be placed on the upper surface of lens 926 and lens 930 at least partially on.The encapsulated layer forming capping 902 is placed on the upper surface of printed circuit board substrate 908, going up at least partially of each upper surface in semiconductor die 916, wiring 924, lens 926 and lens 930 and side surface, and on the side surface of luminescence component 300.Remove mask subsequently to form the first hole 904 and the second hole 906.
Figure 10 A is the top plan view of the proximity sense 1000 according to an embodiment.Figure 10 B is the cut-open view of the proximity sense 1000 along line 10B-10B shown in Figure 10 A.Proximity sense 1000 is similar to proximity sense 600 shown in Fig. 6 A and Fig. 6 B, except such luminescence component as detailed below does not comprise printed circuit board substrate and luminescent device comprises except multiple contact pads on the lower surface thereof.
Proximity sense 1000 comprises capping 1002, and it has the first hole 1004 and the second hole 1006 be formed in wherein.Proximity sense 1000 also comprises printed circuit board substrate 1008.The upper surface of printed circuit board substrate 1008 comprises multiple contact pad 1010.The lower surface of printed circuit board substrate 1008 comprises multiple contact pad 1012.Electrical connection on the lower surface that multiple conductive trace 1014 defines one or more contact pad 1010 and printed circuit board substrate 1008 on the upper surface of printed circuit board substrate 1008 between one or more contact pad 1012.
Traditional semiconductor die 1016 is arranged on the upper surface of printed circuit board substrate 1008.Semiconductor die 1016 is included in sensor region on the upper surface of semiconductor die 1,016 1018 and at least one contact pad 1020.In one embodiment, sensor region 1018 is the parts of photodiode light being converted to electric current, and wherein the amplitude proportional of electric current is in the amplitude of light intensity.
Traditional conduction adhesion material 1022 defines the electrical connection on the lower surface of semiconductor die 1016 and the upper surface of printed circuit board substrate 1008 between a contact pad 1010.At least one wiring 1024 defines the electrical connection between at least one contact pad 1020 on the upper surface of at least one contact pad 1010 on the upper surface of printed circuit board substrate 1008 and semiconductor die 1016.
Traditional lens 1026 are arranged on the sensor region 1018 of semiconductor die 1016.Lens 1026 are fixed to semiconductor die 1016 by traditional transparent adhesion material 1028.Proximity sense 1000 also comprises luminescence component 1030.Luminescence component 1030 comprises traditional luminescent device 1032.In one embodiment, luminescent device 1032 is traditional light emitting diodes (LED).In one embodiment, luminescent device 1032 is traditional vertical cavity surface emitting lasers (VCSEL).
The lower surface of luminescent device 1032 comprises multiple contact pad 1034.Traditional lens 1036 are arranged on the light-emitting zone of luminescent device 1032.Lens 1036 are fixed to luminescent device 1032 by traditional transparent adhesion material 1038.
Traditional lens 1026, transparent adhesion material 1028, lens 1036 and/or transparent adhesion material 1038 can make the light of incident major part (and if not all) on it pass from it.Such as, lens 1026, transparent adhesion material 1028, lens 1036 and/or transparent adhesion material 1038 can make at least 85% of light in light in incident visible spectrum on it or infrared spectrum to pass from it.Additionally or alternatively, lens 1026, transparent adhesion material 1028, lens 1036 and/or transparent adhesion material 1038 can as the light filters preventing predetermined wavelength from passing from it.Such as, lens 1026, transparent adhesion material 1028, lens 1036 and/or transparent adhesion material 1038 can to prevent in incident visible spectrum on it light in light or infrared spectrum to pass from it.
Multiple solder projection 1040 defines the electrical connection between contact pad 1034 on the upper surface being formed at printed circuit board substrate 1008 and corresponding contact pad 1010.Such as, during the manufacture of proximity sense 1000, solder projection 1040 is formed on the contact pad 1034 on the lower surface being positioned at luminescent device 1032.Luminescence component 1030 is placed on the upper surface of printed circuit board substrate 1008 subsequently, solder projection 1040 is aimed at the corresponding contact pad 1010 on the upper surface of printed circuit board substrate 1008, and solder projection 1040 to be placed on the upper surface of printed circuit board substrate 1008 on corresponding contact pad 1010.Heat the assembly obtained subsequently, and the electrical connection that solder projection 1040 defines on the upper surface of contact pad 1034 and printed circuit board substrate 1008 on the lower surface of luminescent device 1032 between corresponding contact pad 1010.
Subsequently, mask (not shown) be placed on the upper surface of lens 1026 and lens 1036 at least partially on.The encapsulated layer forming capping 1002 is placed on the upper surface of printed circuit board substrate 1008, going up at least partially of each upper surface in semiconductor die 1016, wiring 1024, lens 1026 and lens 1036 and side surface, and on the side surface of luminescence component 1030.Remove mask subsequently to form the first hole 1004 and the second hole 1006.
Figure 11 A is the top plan view of the proximity sense 1100 according to an embodiment.Figure 11 B is the cut-open view of the proximity sense 1100 obtained along line 11B-11B shown in Figure 11 A.Proximity sense 1100 is similar to proximity sense 1000 described in Figure 10 A and Figure 10 B, except such luminescence component is as detailed below arranged on except on semiconductor die.
Proximity sense 1100 comprises capping 1102, and it has the first hole 1104 and the second hole 1106 be formed in wherein.Proximity sense 1100 also comprises printed circuit board substrate 1108.The upper surface of printed circuit board substrate 1108 comprises multiple contact pad 1110.The lower surface of printed circuit board substrate 1108 comprises multiple contact pad 1112.Multiple conductive trace 1114 defines the electrical connection between the one or more contact pads 1112 on the lower surface of one or more contact pad 1110 on the upper surface of printed circuit board substrate 1108 and printed circuit board substrate 1108.
Traditional semiconductor die 1116 is arranged on the upper surface of printed circuit board substrate 1108.Semiconductor die 1116 is included in sensor region 1118 on the upper surface of semiconductor die 1116 and multiple contact pad 1120.In one embodiment, sensor region 1118 is the parts of photodiode light being converted to electric current, and wherein the amplitude proportional of electric current is in the amplitude of light intensity.
Conduction adhesion material 1122 defines the electrical connection between a contact pad 1110 on the lower surface of semiconductor die 1116 and the upper surface of printed circuit board substrate 1108.At least one wiring 1124 defines the electrical connection between at least one contact pad 1120 on the upper surface of at least one contact pad 1110 on the upper surface of printed circuit board substrate 1108 and semiconductor die 1116.
Traditional lens 1126 are arranged on the sensor region 1118 of semiconductor die 1116.Lens 1126 are fixed to semiconductor die 1116 by traditional transparent adhesion material 1128.Proximity sense 1100 also comprises luminescence component 1130.Luminescence component 1130 comprises traditional luminescent device 1132.In one embodiment, luminescent device 1132 is traditional light emitting diodes (LED).In one embodiment, luminescent device 1132 is traditional vertical cavity surface emitting lasers (VCSEL).
The lower surface of luminescent device 1132 comprises multiple contact pad 1134.Traditional lens 1136 are arranged on the light-emitting zone of luminescent device 1132.Lens 1136 are fixed to luminescent device 1132 by traditional transparent adhesion material 1138.
Lens 1126, transparent adhesion material 1128, lens 1136 and/or transparent adhesion material 1138 can make the light of incident major part (and if not all) on it pass from it.Such as, lens 1126, transparent adhesion material 1128, lens 1136 and/or transparent adhesion material 1138 can make at least 85% of light in light in incident visible spectrum on it or infrared spectrum to pass from it.Additionally or alternatively, the light filter that lens 1126, transparent adhesion material 1128, lens 1136 and/or transparent adhesion material 1138 can prevent predetermined wavelength from passing from it.Such as, lens 1126, transparent adhesion material 1128, lens 1136 and/or transparent adhesion material 1138 can to prevent in incident visible spectrum on it light in light or infrared spectrum to pass from it.
Multiple solder projection 1140 defines the electrical connection with the corresponding contact pad 1120 on the upper surface of semiconductor die 1116.Such as, during the manufacture of proximity sense 1100, solder projection 1140 is formed on the contact pad 1134 on the lower surface being positioned at luminescent device 1132.Luminescence component 1130 is placed on the upper surface of semiconductor die 1116 subsequently, solder projection 1140 is aimed at the corresponding contact pad 1120 on the upper surface of semiconductor die 1116, and solder projection 1140 is placed on the corresponding contact pad 1120 on the upper surface of semiconductor die 1116.Heat the assembly obtained subsequently, and the electrical connection that solder projection 1140 defines on the upper surface of contact pad 1134 on the lower surface of luminescent device 1132 and semiconductor die 1116 between corresponding contact pad 1120.
Subsequently, mask (not shown) be placed on the upper surface of lens 1126 and lens 1136 at least partially on.The encapsulated layer forming capping 1102 is placed on the upper surface of printed circuit board substrate 1108, going up at least partially of each upper surface in semiconductor die 1116, wiring 1124, lens 1126 and lens 1136 and side surface, and on the side surface of luminescence component 1130.Remove mask subsequently to form the first hole 1104 and the second hole 1106.
Each embodiment as above can combine to provide other embodiment.That relate to this instructions and/or that list in request for data table all United States Patent (USP)s, U.S. Patent Application Publication, U.S. Patent application, foreign patent, foreign patent application and non-patent is quoted in full open with for referencial use at this.Can if necessary with the characteristic aspect of revision for execution example, to provide each patent, application and disclosed concept to provide other embodiments in addition.
Can be made these and other to embodiment to change under above-mentioned detailed description book instruction.Usually, in following claim, the term used should not be configured to claim to be restricted to the specific embodiment described in instructions and claims, but should be configured to comprise all possible embodiment and the four corner with these claim equivalences.Therefore, claim is not by restriction of the present disclosure.
Claims (10)
1. an electronic installation, is characterized in that, comprising:
First printed circuit board substrate, is included in more than first contact pad on the first side of described first printed circuit board substrate;
Semiconductor die, comprise sensor region on an upper and more than second contact pad, described semiconductor die is positioned on described first printed circuit board substrate, makes its upper surface deviate from described first printed circuit board (PCB); And
Multiple electric connector, the contact pad in each electric connector and described more than second contact pad and the corresponding contact pad in described more than first contact pad carry out electrical communication;
First lens, on the described sensor region being positioned at described semiconductor die;
Luminescence component, comprises the luminescent device with light-emitting zone, is positioned at the second lens on described light-emitting zone, and in the face of the 3rd many contact pads of described first printed circuit board substrate; And
Encapsulated layer, is arranged on described first printed circuit board substrate, at least one of described multiple electric connector, described semiconductor die, described first lens and described luminescence component.
2. electronic installation according to claim 1, is characterized in that, described encapsulated layer is arranged on each multiple surfaces of described semiconductor die, described first lens and described luminescence component.
3. electronic installation according to claim 1, is characterized in that, described luminescence component comprises the 3rd lens be positioned on described second lens, and described encapsulated layer is positioned on multiple surfaces of described 3rd lens.
4. electronic installation according to claim 1, is characterized in that, described luminescence component is positioned on described semiconductor die.
5. electronic installation according to claim 1, is characterized in that, described luminescence component is positioned in described first printed circuit board substrate.
6. electronic installation according to claim 1, is characterized in that, described luminescence component comprises:
Second printed circuit board substrate, comprising:
Described 3rd many contact pads, are positioned on the first side of described second printed circuit board substrate,
4th many contact pads, are positioned on the second side of described second printed circuit board substrate, and
Multiple conductive trace, each conductive trace to extend in described second printed circuit board substrate and makes two or more contact pads in described 3rd many contact pads and described 4th many contact pads carry out electrical communication,
5th many contact pads, are positioned on described luminescent device; And
More than second electric connector, makes the corresponding contact pad in each contact pad in described 4th many contact pads and described 5th many contact pads carry out electrical communication.
7. electronic installation according to claim 6, is characterized in that, described second lens are arranged at least one and described second printed circuit board substrate of described more than second electric connector.
8. electronic installation according to claim 6, is characterized in that, described second printed circuit board substrate is positioned in described first printed circuit board substrate.
9. electronic installation according to claim 6, is characterized in that, described second printed circuit board substrate is positioned on described semiconductor die.
10. electronic installation according to claim 1, is characterized in that, the described 3rd many contact pads are positioned on the lower surface of described luminescent device.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420849421.7U CN204461449U (en) | 2014-12-25 | 2014-12-25 | Electronic installation |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420849421.7U CN204461449U (en) | 2014-12-25 | 2014-12-25 | Electronic installation |
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| CN204461449U true CN204461449U (en) | 2015-07-08 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105890631A (en) * | 2014-12-25 | 2016-08-24 | 意法半导体有限公司 | Molded proximity sensor |
| CN108844562A (en) * | 2017-04-11 | 2018-11-20 | 三星电子株式会社 | Biometric sensors and equipment including the biometric sensors |
| CN110504248A (en) * | 2018-05-18 | 2019-11-26 | 意法半导体(格勒诺布尔2)公司 | Optics transmission/reception circuit |
-
2014
- 2014-12-25 CN CN201420849421.7U patent/CN204461449U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105890631A (en) * | 2014-12-25 | 2016-08-24 | 意法半导体有限公司 | Molded proximity sensor |
| CN108844562A (en) * | 2017-04-11 | 2018-11-20 | 三星电子株式会社 | Biometric sensors and equipment including the biometric sensors |
| US10983558B2 (en) | 2017-04-11 | 2021-04-20 | Samsung Electronics Co., Inc. | Biometric sensor and device including the same |
| US11334114B2 (en) | 2017-04-11 | 2022-05-17 | Samsung Electronics Co., Ltd. | Biometric sensor and device including the same |
| US11650624B2 (en) | 2017-04-11 | 2023-05-16 | Samsung Electronics Co., Ltd. | Biometric sensor and device including the same |
| CN110504248A (en) * | 2018-05-18 | 2019-11-26 | 意法半导体(格勒诺布尔2)公司 | Optics transmission/reception circuit |
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