CN204459933U - Lamp device and lighting device - Google Patents
Lamp device and lighting device Download PDFInfo
- Publication number
- CN204459933U CN204459933U CN201520062633.5U CN201520062633U CN204459933U CN 204459933 U CN204459933 U CN 204459933U CN 201520062633 U CN201520062633 U CN 201520062633U CN 204459933 U CN204459933 U CN 204459933U
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- Prior art keywords
- lamp
- diffusion plate
- thermal diffusion
- framework
- substrate
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Abstract
The utility model provides a kind of lamp device and lighting device.Lamp device comprises light emitting module, framework and lamp holder; Light emitting module has substrate and is installed on the light-emitting component of substrate; Framework has the resin portion of thermal diffusion plate and cover heating diffuser plate; Formed in a part for thermal diffusion plate and to expose and the substrate mounting surface faces of installation base plate from resin portion; Lamp holder is arranged at another side of framework.The utility model can realize lightweight and make manufacturing become good while guaranteeing thermal diffusivity.
Description
Technical field
Embodiment of the present utility model relates to and a kind ofly employs the lamp device of light-emitting component and employ the lighting device of this lamp device
Background technology
In the past, as the lamp device employing light-emitting component, such as, there are the flat type lamp device employing GX53 type lamp holder or the bulb-like light device etc. employing E type lamp holder.
In this kind of lamp device, use the metal frameworks such as aluminium casting, there is the light emitting module of light-emitting component, at another side configured light head of framework in the end side configuration of framework.And light-emitting component adopts by the heat trnasfer that produces during lighting to framework, and form from the heat radiation that framework is dispelled the heat to air.And, in order to improve the thermal diffusivity from framework, also there is the formation that radiating fin is set at the outer surface of framework.
Like this, with regard to lamp device, using metal framework because considering thermal diffusivity, becoming heavy problem so exist.And, because exposing metal covering at the outer surface of lamp device, need the Surface Machining of framework or the problem of application so exist.
Utility model content
The lamp device of embodiment comprises: light emitting module, has substrate and is installed on the light-emitting component of this substrate; Framework, at one end side configures described light emitting module; Lamp holder, is arranged at another side of described framework; The feature of described lamp device is: described framework has thermal diffusion plate and covers the resin portion of this thermal diffusion plate, is formed expose from described resin portion and install the substrate mounting surface faces of described substrate in a part for described thermal diffusion plate.
In described lamp device, described framework comprises the peripheral part of the substrate installation portion arranging described substrate mounting surface faces and the surrounding being formed at described substrate installation portion, forms described thermal diffusion plate and described resin portion continuously from described substrate installation portion to described peripheral part.
In described lamp device, described substrate installation portion is at the peripheral location of described substrate mounting surface faces, there is through described thermal diffusion plate and described resin portion and multiple installing holes of described lamp holder are installed, and at the inner side of described substrate mounting surface faces, there is the joint portion of the described resin portion of through described thermal diffusion plate.
In described lamp device, the described joint portion of described resin portion has and described substrate recess in opposite directions.
In described lamp device, the described substrate mounting surface faces of described framework only described thermal diffusion plate exposes from described resin portion.
In described lamp device, the teat exposed from described resin portion is set in a part for described thermal diffusion plate, forms described substrate mounting surface faces at described teat.
In described lamp device, the size of the described substrate of described light emitting module is larger than the size of the described substrate mounting surface faces of described thermal diffusion plate.
The lamp socket that the lighting device of embodiment comprises described lamp device and connected by the described lamp holder of described lamp device.
[effect of utility model]
According to the utility model, can lightweight be realized while can expecting to guarantee thermal diffusivity and make manufacturing become good.
Detailed description of the invention
The lamp device of embodiment comprises light emitting module, framework and lamp holder.Light emitting module has substrate and is installed on the light-emitting component of substrate.Framework has thermal diffusion plate and covers the resin portion of this thermal diffusion plate.Formed in a part for thermal diffusion plate and to expose and the substrate mounting surface faces of installation base plate from resin portion.Lamp holder is arranged at another side of framework.
According to the lamp device of embodiment, can lightweight be realized while can expecting to guarantee thermal diffusivity and manufacturing can be made to become good.
Below, referring to figs. 1 through Fig. 4, the first embodiment is described.
Fig. 1 and Fig. 2 represents the lamp device 10 of flat type form.In addition, below, before the end side of lamp device 10 being set to (front side or front surface), another side is set to rear (rear side or rear surface) and is described.
Lamp device 10 comprises framework 11, is installed on the light emitting module 12 of the front side of this framework 11 and lampshade 13, the lamp holder 14 being installed on the rear side of framework 11 and the lamp circuit 15 be contained in lamp holder 14.
First, shown in Fig. 1 to Fig. 3, framework 11 comprises substrate installation portion 20 and is formed at the peripheral part 21 of peripheral part of this substrate installation portion 20.Substrate installation portion 20 is formed as tabular.Peripheral part 21 is formed as cylindric, and outstanding to the front side of substrate installation portion 20.
In the front surface central authorities of substrate installation portion 20, form the substrate mounting surface faces 22 installing light emitting module 12.At the peripheral location of substrate mounting surface faces 22, multiple installing hole 23 through substrate installation portion 20 and being formed, and a wiring hole 24 through substrate installation portion 20 and being formed.The wall portion 25 of projecting the cylindrical shape embedded for lamp holder 14 in the rear surface of substrate installation portion 20.
At the inner peripheral surface of peripheral part 21, projecting the multiple fasteners 26 in order to install lampshade 13.
And framework 11 has thermal diffusion plate 28 and covers the resin portion 29 of this thermal diffusion plate 28, formed in a part for thermal diffusion plate 28 and expose and the substrate mounting surface faces 22 of installation base plate 50 from resin portion 29.Framework 11 such as utilizes to be carried out insertion shaping (insert forming) of cover heating diffuser plate 28 by resin portion 29 and is integrally formed.
Thermal diffusion plate 28 is formed by making the such as metal material of the function well of thermal diffusion.Such as aluminium is used as metal material.In present embodiment, thermal diffusion plate 28 is formed as discoideus, and is configured at substrate installation portion 20.
In the central authorities of thermal diffusion plate 28, form the outstanding and teat 30 that is that expose in the front side of resin portion 29 in front side to thermal diffusion plate 28, form substrate mounting surface faces 22 at the front surface of this teat 30.Substrate mounting surface faces 22 is formed as quadrilateral shape.In addition, substrate mounting surface faces 22 is formed as plane, is the same face or more outstanding a little than the front surface of this resin portion 29 with the front surface of the resin portion 29 of the surrounding of substrate mounting surface faces 22.
In the position of each installing hole 23, thermal diffusion plate 28 forms through hole 31, and cover the inner side of through hole 31 (installing hole 23) and resin portion 29 be formed as cylindric.The resin portion 29 being formed at the inner side of each installing hole 23 makes thermal diffusion plate 28 insulate, and also plays function as the resin portion 29 of the front surface by thermal diffusion plate 28 with the joint portion 32 that the resin portion 29 of the rear surface of thermal diffusion plate 28 is combined.
In the position of wiring hole 24, thermal diffusion plate 28 forms through hole 33, and cover the inner side of through hole 33 (wiring hole 24) and resin portion 29 be formed as cylindric.The resin portion 29 being formed at the inner side of through hole 33 makes thermal diffusion plate 28 insulate, and also plays function as the resin portion 29 of the front surface by thermal diffusion plate 28 with the joint portion 34 that the resin portion 29 of the rear surface of thermal diffusion plate 28 is combined.
At the inner side of substrate mounting surface faces 22, thermal diffusion plate 28 forms through hole 35, and around through hole 35 and the front surface of teat 30 forms rank portion 36.In through hole 33 and rank portion 36, from the resin portion 29 of the rear surface of thermal diffusion plate 28, fill molten resin continuously.
When framework 11 is inserted shaping, in mould, configure thermal diffusion plate 28, in mould, fill molten resin and form resin portion 29, as the cast gate (gate) of filling molten resin in mould, and use the through hole 35 of thermal diffusion plate 28.Through hole 35, because being positioned at the central authorities of substrate installation portion 20, spreads so be injected into the molten resin in mould equably to the external diameter direction of substrate installation portion 20 and peripheral part 21, can to the integral-filled molten resin of the forming region of resin portion 29.
The resin portion 29 being filled into the inner side of through hole 35 plays function as by the resin portion 29 of front surface of thermal diffusion plate 28 (rank portion 36) with the joint portion 37 that the resin portion 29 of the rear surface of thermal diffusion plate 28 is combined.At the front surface of this joint portion 37, form the recess 38 produced with inserting shaping.In addition, when being gripped with the greases such as silicone to improve adhesion when installing light emitting module 12 on substrate mounting surface faces 22, this grease can be put in advance in recess 38.
Resin portion 29, use has insulating properties and is such as the high reverse--bias resin of white.At the front surface of the substrate installation portion 20 of framework 11 and the inner peripheral surface of peripheral part 21, resin portion 29 is utilized to form the reflecting surface 39 of high reflectance.
And light emitting module 12 comprises substrate 50 and is installed on the light-emitting component 51 of front surface of this substrate 50.And then, at the front surface of substrate 50, the connector 52 connecting light-emitting component 51 and lamp circuit 15 is installed.
Substrate 50 is such as formed as quadrangle tabular by metal or the pottery etc. such as aluminium of excellent thermal conductivity.The size of substrate 50 is formed as any one of following three kinds of situations, that is, identical with substrate mounting surface faces 22, larger or less than substrate mounting surface faces 22 than substrate mounting surface faces 22.At the front surface of substrate 50, form Wiring pattern via insulating barrier, Wiring pattern is installed with light-emitting component 51 and connector 52.In addition, on Wiring pattern, except the installation portion of light-emitting component 51 and connector 52, the white insulating barrier that reflectivity is high is formed.And the rear surface of substrate 50 is engaged in the substrate mounting surface faces 22 of framework 11 by substrate 50, and by this substrate 50, multiple screw 53 is rotatably connected in the teat 30 of thermal diffusion plate 28, thermally coupled with thermal diffusion plate 28 thus.
Light-emitting component 51 is such as light emitting diode (light-emitting diode, LED).In present embodiment, as light-emitting component 51, use multiple surface mount devices (Surface Mount Device, SMD) encapsulation of having carried LED chip.Light-emitting component 51 radiates the illumination light of white color system.In addition, light-emitting component 51 can be chip on board (Chip On Board, COB) module, also can use other light-emitting components such as electroluminescent (Electroluminescence, EL) element.
And as shown in Figures 1 and 2, lampshade 13 is for having light transmission and diffusible synthetic resin system and being formed as discoideus.Lampshade 13 covers the lower surface of framework 11, embeds and is installed on the inner side of the peripheral part 21 of framework 11.The fastener 26 being stuck in peripheral part 21 and the claw 56 installed is formed in lampshade 13.
And lamp holder 14 is such as GX53 type lamp holder.Lamp holder 14 comprises lamp holder body 60 and a pair lamp base 61 (with reference to Fig. 4) outstanding from the rear surface of this lamp holder body 60.
Lamp holder body 60 is for having the resin-made of insulating properties and being integrally formed.Lamp holder body 60 comprises annulus 62, the fitting portion 63 of cylindrical shape given prominence to from the forward face side, circumference of this annulus 62 and from the middle section of annulus 62 protuberance 64 of cylindrical shape given prominence to of side backward.Thus, the front surface opening of lamp holder body 60, forms the space of storage lamp circuit 15 in the inside of lamp holder body 60.
The front surface of annulus 62 projecting multiple projection seat 65.And, fitting portion 63 is embedded in the wall portion 25 of framework 11, multiple screw 66 is rotatably connected in projection seat 65 by the installing hole 23 of framework 11, thus fixed frame 11 and lamp holder 14.
At the outer peripheral face of protuberance 64, relative to lamp holder 14 centrosymmetric position and depart from the position of the position of configuration a pair lamp base 61, form the wedge groove 67 of a pair L-shaped.And the end face 68 of protuberance 64 is formed as plane.In the central authorities of end face 68, form recess 69, described recess 69 with by corresponding for the position of the cast gate of lamp holder body 60 in mould during ejection formation.And, form multiple maintaining parts 70 of holding point circuit for lamp 15 at the inner peripheral surface of protuberance 64.
A pair lamp base 61 is for having the metal of electric conductivity, and front end forms large-diameter portion 71.
And lamp circuit 15 comprises circuit substrate 75 and is installed on multiple electronic components 76 of this circuit substrate 75.The electronic part 76 with wire in electronic component 76 is installed on the front surface of circuit substrate 75, and the small electronic component 76 of shaped like chips is installed on the rear surface of circuit substrate 75.
Circuit substrate 75 is inserted into the inner side of the protuberance 64 of lamp holder 14, and utilizes maintaining part 70 to be held in lamp holder 14.
The input part of lamp circuit 15 is electrically connected by electric wire with a pair lamp base 61.The efferent of lamp circuit 15 is connected to the electric wire with connector, this electric wire with connector is electrically connected with the connector 52 of light emitting module 12 by the wiring hole 24 of framework 11.And inputted alternating electromotive force is converted to the direct current power of regulation and is supplied to the light-emitting component 51 of light emitting module 12 by lamp circuit 15.
Next, the lighting device 80 using lamp device 10 is represented in Fig. 4.Lighting device 80 is such as Down lamp.Lighting device 80 comprises apparatus body 81, lamp socket 82 and lamp device 10.
Apparatus body 81 lower opening, is also formed as reflector.
Lamp socket 82 comprises lamp holder body 83 and is contained in the terminal in this lamp holder body 83.Lamp holder body 83 is for having the resin-made of insulating properties and being formed as ring-type, and central authorities form the inserting hole 84 supplying the protuberance 64 of lamp device 10 to insert.
At the lower surface of lamp holder body 83, in the centrosymmetric position relative to lamp socket 82, form each lamp base 61 being inserted with lamp device 10 and a pair connecting hole 85 rotated.Described connecting hole 85 is along the long elongated hole of the circumference of lamp holder body 83, and forms the hole portion 86 that can insert for the large-diameter portion 71 of lamp base 61 in its one end.In the inner side of each connecting hole 85, accommodate the terminal that electrically connect the lamp base 61 that is inserted into connecting hole 85.
At the inner peripheral surface of lamp holder body 83, projecting wedge 87, rotate along with being inserted in connecting hole 85 by the lamp base 61 of lamp holder 14, this wedge 87 is embedded in the wedge groove 67 of the roughly L-shaped of the outer peripheral face of the protuberance 64 being formed at lamp holder 14, and lamp holder 14 is supported in lamp holder body 83.
Next, the effect of present embodiment is described.
When lamp device 10 is installed on lamp socket 82, the protuberance 64 of lamp holder 14 is inserted in the inserting hole 84 of lamp socket 82, each lamp base 61 of lamp device 10 is inserted in the connecting hole 85 of lamp socket 82.Correspondingly, each wedge groove 67 of lamp holder 14 is embedded in each wedge 87 of lamp socket 82.
Under the state that lamp device 10 is pressed into lamp socket 82, rotate to installing direction by making lamp device 10, and each lamp base 61 of lamp device 10 moves and is electrically connected with each terminal of the inner side being configured at connecting hole 85 in the connecting hole 85 of lamp socket 82, and the wedge groove 67 of lamp holder 14 is embedded in the wedge 87 of lamp socket 82, thus lamp device 10 is supported in lamp socket 82.
And, by the terminal of lamp socket 82 and the lamp base 61 of lamp device 10, alternating electromotive force is supplied to lamp circuit 15, alternating electromotive force is converted to the direct current power of regulation and is supplied to the light-emitting component 51 of light emitting module 12 by lamp circuit 15 thus, thus light-emitting component 51 is luminous.
The light transmission lampshade 13 of light-emitting component 51 and irradiating to lighting space.
The hot main conduction that light-emitting component 51 produces time luminous to substrate 50, and conducts from this substrate 50 to the thermal diffusion plate 28 of framework 11.At the central part of thermal diffusion plate 28, the external diameter direction of the heat of conducting from substrate 50 to thermal diffusion plate 28 is spread, and described heat is conducted to resin portion 29 from thermal diffusion plate 28 in the whole region of thermal diffusion plate 28.Thus, the heat conducting to resin portion 29 is distributed to air from the outer surface of resin portion 29.And, also conduct to lamp holder 14 from framework 11, distribute to air from lamp holder 14, and distribute to lamp socket 82 from lamp holder 14.
The heat that the electronic component 76 of lamp circuit 15 produces mainly is distributed to air from lamp holder 14, and distributes from lamp holder 14 to lamp socket 82.
And, lamp device 10 according to the present embodiment, framework 11 utilizes to be carried out the insertion shaping of cover heating diffuser plate 28 by resin portion 29 and is formed, thus lightweight can be realized while guaranteeing thermal diffusivity, and do not need by metal material formed framework overall time Surface Machining or application, thus manufacturing can be made to become good.In addition, the outer surface of framework 11 is resin and nonmetal, even if thus when operating light device 10 framework 11 touch a part and also can reduce damage.
And, resin portion 29 is formed by the high reverse--bias resin of white, the reflecting surface 39 of high reflectance can be formed thus at the inner peripheral surface of the front surface of the substrate installation portion 20 of framework 11 and peripheral part 21, thus can efficiency utilize reflecting surface 39 to reflex to outside by the irreflexive light in the inner side of lampshade 13 well, thus the light extraction efficiency of lamp device 10 can be improved.
And, on substrate installation portion 20, at the peripheral location of substrate mounting surface faces 22, through thermal diffusion plate 28 and resin portion 29 are set and multiple installing holes 23 of lamp holder 14 are installed, and at the inner side of substrate mounting surface faces 22, the joint portion 37 of the resin portion 29 of through thermal diffusion plate 28 is set, even if thus apply load because spiral shell is solid to the periphery of multiple installing hole 23, between multiple installing hole 23, resin portion 29 also from thermal diffusion plate 28 buoyance lift, thus can not can be maintained at the bonding state of thermal diffusion plate 28 and resin portion 29.And, when framework 11 is inserted shaping, configuration thermal diffusion plate 28 in mould, in mould, fill molten resin and form resin portion 29, but be used as the cast gate of filling molten resin in mould by using the part of joint portion 37, and be injected into the molten resin in mould and spread equably to the forming region entirety of resin portion 29, thus can to the integral-filled molten resin of the forming region of resin portion 29.
And, framework 11 is exposed from resin portion because of the substrate mounting surface faces 22 of only thermal diffusion plate 28, even if so the substrate 50 of light emitting module 12 for metal and its metal covering contact with substrate mounting surface faces 22, the outer surface of framework 11 does not have electric current yet and flows through, even if thus do not use special insulation system can guarantee insulating properties yet.
And, when the size of substrate 50 is larger than substrate mounting surface faces 22, the metal covering of thermal diffusion plate 28 expose minimizing, thus can reflecting effect be improved.
Next, Fig. 5 represents the second embodiment.In addition, identical symbol is used to the formation identical with the first embodiment, and omit the explanation about its formation and action effect.
Thermal diffusion plate 28 is formed continuously from the substrate installation portion 20 of framework 11 to peripheral part 21.That is, around thermal diffusion plate 28, the edge 28a being configured at the cylindrical shape of peripheral part 21 is formed.
Like this, thermal diffusion plate 28 has the edge 28a of the cylindrical shape of the peripheral part 21 being configured at framework 11, can improve the radiating effect of the peripheral part 21 from framework 11 thus.
Next, Fig. 6 represents the 3rd embodiment.In addition, identical symbol is used to the formation identical with the first embodiment, and omit the explanation about its formation and action effect.
The lamp device 10 of Fig. 6 indication lamp alveolitoid form.
The lamp circuit 15 that lamp device 10 comprises framework 11, be installed on the light emitting module 12 of the front side of framework 11 and dome-type lampshade 13, the lid 90 being installed on the rear side of framework 11 and lamp holder 91 and be contained in lid 90.
Framework 11 and light emitting module 12 are formed in the same manner as the first embodiment.Lid 90 is the synthetic resin system with insulating properties, and installed in front is in framework 11, and rear side is installed with lamp holder 91.Lamp holder 91 is E type lamp holder.
In the lamp device 10 of this bulb type form, framework 11 also utilizes to be carried out the insertion shaping of cover heating diffuser plate 28 by resin portion 29 and is formed, thus lightweight can be realized while guaranteeing thermal diffusivity, and do not need by metal material formed framework overall time Surface Machining or application, thus manufacturing can be made to become good.
Some embodiments of the present utility model are illustrated, but these embodiments are only illustration, are not intended the scope limiting utility model.In fact, these embodiments can be implemented in other various modes, in addition, in the scope of purport not departing from utility model, can carry out various omission, replacement, change to described embodiment.These embodiments or its be out of shape be included in utility model scope or purport in, and to be included in the scope of utility model and the equalization thereof recorded in technical scheme.
Accompanying drawing explanation
Fig. 1 is the profile of the lamp device representing the first embodiment.
Fig. 2 is the stereogram of the decomposing state of lamp device.
Fig. 3 is the framework of lamp device and the ground plan of light emitting module.
Fig. 4 is the use of the stereogram of the lighting device of lamp device.
Fig. 5 is the profile of the lamp device representing the second embodiment.
Fig. 6 is the profile of the lamp device representing the 3rd embodiment.
Reference numeral:
10: lamp device
11: framework
12: light emitting module
13: lampshade
14: lamp holder
15: lamp circuit
20: substrate installation portion
21: peripheral part
22: substrate mounting surface faces
23: installing hole
24: wiring hole
25: wall portion
26: fastener
28: thermal diffusion plate
28a: edge
29: resin portion
30: teat
31,33,35: through hole
32,34,37: joint portion
36: rank portion
38,69: recess
39: reflecting surface
50: substrate
51: light-emitting component
52: connector
53: screw
56: claw
60: lamp holder body
61: lamp base
62: annulus
63: fitting portion
64: protuberance
65: projection seat
66: screw
67: wedge groove
68: end face
70: maintaining part
71: large-diameter portion
75: circuit substrate
76: electronic component
80: lighting device
81: apparatus body
82: lamp socket
83: lamp holder body
84: inserting hole
85: connecting hole
86: hole portion
87: wedge
90: lid
91: lamp holder
Claims (8)
1. a lamp device (10), is characterized in that, comprising:
Light emitting module (12), has substrate (50) and is installed on the light-emitting component (51) of described substrate (50);
Framework (11), at one end side configures described light emitting module (12); And
Lamp holder (14), is arranged at another side of described framework (11);
The feature of described lamp device (10) is:
Described framework (11) has thermal diffusion plate (28) and covers the resin portion (29) of described thermal diffusion plate (28), is formed expose from described resin portion (29) and install the substrate mounting surface faces (22) of described substrate (50) in a part for described thermal diffusion plate (28).
2. lamp device (10) according to claim 1, is characterized in that:
Described framework (11) comprises the peripheral part (21) of the substrate installation portion (20) arranging described substrate mounting surface faces (22) and the surrounding being formed at described substrate installation portion (20), forms described thermal diffusion plate (28) and described resin portion (29) continuously from described substrate installation portion (20) to described peripheral part (21).
3. lamp device (10) according to claim 2, is characterized in that:
The peripheral location of described substrate installation portion (20) in described substrate mounting surface faces (22), there is through described thermal diffusion plate (28) and described resin portion (29) and multiple installing holes (23) of described lamp holder (14) are installed, and at the inner side of described substrate mounting surface faces (22), there is the joint portion (37) of the described resin portion (29) of through described thermal diffusion plate (28).
4. lamp device (10) according to claim 3, is characterized in that:
The described joint portion (37) of described resin portion (29) has and described substrate (50) recess in opposite directions (38).
5. lamp device (10) according to any one of claim 1 to 4, is characterized in that:
The described substrate mounting surface faces (22) of described framework (11) only described thermal diffusion plate (28) exposes from described resin portion (29).
6. lamp device (10) according to any one of claim 1 to 4, is characterized in that:
The teat (30) exposed from described resin portion (29) is set in a part for described thermal diffusion plate (28), forms described substrate mounting surface faces (22) at described teat (30).
7. lamp device (10) according to any one of claim 1 to 4, is characterized in that:
The size of the described substrate (50) of described light emitting module (12) is larger than the size of the described substrate mounting surface faces (22) of described thermal diffusion plate (28).
8. a lighting device (80), is characterized in that comprising:
Lamp device (10) according to any one of claim 1 to 7; And
Lamp socket (82), connects the described lamp holder (14) of described lamp device (10).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014122884A JP2016004635A (en) | 2014-06-13 | 2014-06-13 | Lamp device and lighting device |
| JP2014-122884 | 2014-06-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204459933U true CN204459933U (en) | 2015-07-08 |
Family
ID=52686072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520062633.5U Expired - Fee Related CN204459933U (en) | 2014-06-13 | 2015-01-29 | Lamp device and lighting device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2016004635A (en) |
| CN (1) | CN204459933U (en) |
-
2014
- 2014-06-13 JP JP2014122884A patent/JP2016004635A/en not_active Abandoned
-
2015
- 2015-01-29 CN CN201520062633.5U patent/CN204459933U/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016004635A (en) | 2016-01-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150708 Termination date: 20180129 |