CN204438589U - A kind of outside strong heat exchange type multichip semiconductor function two-purpose case - Google Patents

A kind of outside strong heat exchange type multichip semiconductor function two-purpose case Download PDF

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Publication number
CN204438589U
CN204438589U CN201420874107.4U CN201420874107U CN204438589U CN 204438589 U CN204438589 U CN 204438589U CN 201420874107 U CN201420874107 U CN 201420874107U CN 204438589 U CN204438589 U CN 204438589U
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CN
China
Prior art keywords
heat exchanger
room
producing machine
outdoor heat
semiconductor refrigerating
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Expired - Fee Related
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CN201420874107.4U
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Chinese (zh)
Inventor
刘万辉
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Chongqing Match Meter Kang Da Share Control Takeover Co Ltd
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Chongqing Match Meter Kang Da Share Control Takeover Co Ltd
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Publication of CN204438589U publication Critical patent/CN204438589U/en
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Abstract

A kind of outside strong heat exchange type semiconductor cold-storage and warm-storage case, it comprises indoor heat exchanger, semiconductor refrigerating heat-producing machine, outdoor heat exchanger, composite condenser, infusion pump and electronic control panel, one side and the indoor heat exchanger phase close contact of semiconductor refrigerating heat-producing machine, another side and the phase close contact in front in outdoor heat exchanger of semiconductor refrigerating heat-producing machine, outdoor heat exchanger, composite condenser and infusion pump are interconnected connection, form the circulation flow passage of liquid coolant, it is characterized in that: composite condenser is placed in the outer back side of semiconductor cold-storage and warm-storage case, composite condenser side is provided with the outer heat exchange blower fan that can improve composite condenser and air heat-exchange ability.The utility model has and can freeze arbitrarily or heat, basic noiselessness, and refrigerating efficiency and heating efficiency are far above the feature of former semiconductor cold-storage and warm-storage case.

Description

A kind of outside strong heat exchange type multichip semiconductor function two-purpose case
Technical field: the utility model relates to the household electrical appliance that a kind of semiconductor refrigerating heats, the particularly strong heat exchange type in a kind of outside multichip semiconductor function two-purpose case and a kind of Novel integrated heat exchanger be applied on this multichip semiconductor function two-purpose case.
Background technology: at present, market also there is no the household electrical appliance that multi-chamber's semiconductor refrigerating that can freeze simultaneously and heat heats, let alone this household electrical appliance also there is the heat that semiconductor refrigerating heat-producing machine can be taken out of refrigeration chamber and semiconductor refrigerating heat-producing machine to heat taken out of cold to warm keeping chamber and mutually neutralize utilization, thus improve the feature of the refrigerating efficiency of semiconductor refrigerating heat-producing machine and the heating efficiency of semiconductor refrigerating heat-producing machine.
Goal of the invention: the purpose of this utility model is to provide so a kind of multichip semiconductor function two-purpose case, it has room between two, between two, can freeze arbitrarily or heat in room, also there is the heat that semiconductor refrigerating heat-producing machine can be taken out of refrigeration chamber and semiconductor refrigerating heat-producing machine heat taken out of cold to warm keeping chamber and mutually neutralize utilization, thus improve the feature of the refrigerating efficiency of semiconductor refrigerating heat-producing machine and the heating efficiency of semiconductor refrigerating heat-producing machine.
The purpose of this utility model is realized by technical scheme below: makes one have suitable upper room and time between the multichip semiconductor function two-purpose box body of room, be made into suitable upper indoor heat exchanger with the metal material that heat conductivility is good and lower between indoor heat exchanger, with suitable material be made into liquid coolant can upper outdoor heat exchanger of internal flow and lower between outdoor heat exchanger, make suitable upper room semiconductor refrigerating heat-producing machine and lower between room semiconductor refrigerating heat-producing machine, between upper room semiconductor refrigerating heat-producing machine one side with upper between indoor heat exchanger phase close contact, between upper room semiconductor refrigerating heat-producing machine another side with upper between the interior front phase close contact of outdoor heat exchanger, this interior front is made with the metal material that heat conductivility is good, between upper, the inside of outdoor heat exchanger has the flow passage of liquid coolant flowing, room inflow/outflow mouth between on the liquid coolant that the flow passage that between upper, outdoor heat exchanger has the liquid coolant flowing of the same outdoor heat exchanger inside is connected, between lower room semiconductor refrigerating heat-producing machine one side with lower between indoor heat exchanger phase close contact, between lower room semiconductor refrigerating heat-producing machine another side with lower between the interior front phase close contact of outdoor heat exchanger, this interior front is made with the metal material that heat conductivility is good, between lower, the inside of outdoor heat exchanger has the flow passage of liquid coolant flowing, between lower outdoor heat exchanger have under the liquid coolant that flow passage that the liquid coolant with lower outdoor heat exchanger inside flows is connected between room inflow/outflow mouth, make special electronic control panel, electronic control panel with upper between room semiconductor refrigerating heat-producing machine be electrically connected mutually, electronic control panel with lower between room semiconductor refrigerating heat-producing machine be electrically connected mutually, the metal material good with heat conductivility is made into composite condenser, composite condenser is communicated with by one or more individual layer condenser and forms, usual use two individual layer condensers are communicated with composition, the position of each individual layer condenser is parallel stacking, select suitable infusion pump, outdoor heat exchanger between upper, outdoor heat exchanger between lower, composite condenser and infusion pump are interconnected to constitute the circulation flow passage of liquid coolant flowing, it is characterized in that: composite condenser is placed on the outer back of multichip semiconductor function two-purpose case.
Operation principle of the present utility model is such, here between heating with upper the room of the multichip semiconductor function two-purpose case of two rooms and descending, room refrigeration illustrates, start working after the energising of multichip semiconductor function two-purpose case, between lower, room semiconductor refrigerating heat-producing machine passes through lower indoor heat exchanger constantly from lower indoor draw heat, outdoor heat exchanger between heat is passed to down, between lower, indoor temperature reduces, reach the object of refrigeration, between upper room semiconductor refrigerating heat-producing machine constantly on clump between outdoor heat exchanger draw heat, indoor heat exchanger between heat is passed to continuously, indoor between again heat being dispersed into, between upper, indoor temperature raises, reach the object heated, due to the work of infusion pump, liquid coolant is at so a kind of cold and hot complementary comprehensive heat exchanger internal circulation flow, cold between making on outdoor heat exchanger and lower between heat on outdoor heat exchanger mutually neutralize utilization, temperature between under reducing on outdoor heat exchanger, temperature between in raising on outdoor heat exchanger, following between the refrigerating efficiency of room semiconductor refrigerating heat-producing machine improve, between upper, the heating efficiency of room semiconductor refrigerating heat-producing machine improves, composite condenser then still makes liquid coolant temperature make liquid coolant temperature lower than the not enough heat of environment temperature higher than the waste heat of environment temperature or after absorbing cold and hot neutralization after dissipating cold and hot neutralization, because composite condenser is made up of one or more individual layer condenser connection, parallel the stacking of usual use two individual layer condensers is communicated with composition, individual layer condenser is greater than with the effective heat exchange area of external environment condition, so be greater than individual layer condenser with the heat exchange efficiency of external environment condition, blower fan can also be installed to improve composite condenser and air heat-exchange efficiency further at composite condenser side place.
Accompanying drawing illustrates: accompanying drawing of the present utility model is described as follows:
Fig. 1 is the sectional structure schematic diagram of embodiment of the present utility model;
Fig. 2 is the structural representation of outer loop heat-exchange system embodiment of the present utility model;
Fig. 3 be upper in the utility model embodiment between outdoor heat exchanger and lower between the front section view of outdoor heat exchanger;
In figure: room between 1-is upper; Room between under 2-; 3-blower fan; Indoor heat exchanger between 4-is upper; Semiconductor refrigerating heat-producing machine in room between 5-is upper; Outdoor heat exchanger between 6-is upper; Indoor heat exchanger between under 7-; Semiconductor refrigerating heat-producing machine in room between under 8-; Outdoor heat exchanger between under 9-; 10-composite condenser; 11-infusion pump; 12-electronic control panel; Between 13-is upper room and lower between outdoor heat exchanger liquid coolant flow passage; Between 14-is upper room and lower between outdoor heat exchanger liquid coolant inflow/outflow mouth.
Detailed description of the invention: the utility model is described further below in conjunction with drawings and Examples:
As Fig. 1, Fig. 2, shown in Fig. 3, make one there is suitable upper room 1 and lower between the multichip semiconductor function two-purpose box body of room 2, be made into suitable upper indoor heat exchanger 4 with the metal material that heat conductivility is good and lower between indoor heat exchanger 7, with suitable material be made into liquid coolant can upper outdoor heat exchanger 6 of internal flow and lower between outdoor heat exchanger 9, make suitable upper room semiconductor refrigerating heat-producing machine 5 and lower between room semiconductor refrigerating heat-producing machine 9, between upper room semiconductor refrigerating heat-producing machine 5 one side with upper between room indoor heat exchanger 4 phase close contact, between upper room semiconductor refrigerating heat-producing machine 5 another side with upper between the interior front phase close contact of outdoor heat exchanger 6, this interior front is made with the metal material that heat conductivility is good, between upper, the inside of outdoor heat exchanger 6 has the flow passage 13 of liquid coolant flowing, room inflow/outflow mouth 14 between on the liquid coolant that the flow passage 13 that between upper, outdoor heat exchanger 6 has the liquid coolant flowing of the same outdoor heat exchanger 6 inside is connected, between lower room semiconductor refrigerating heat-producing machine 8 one side with lower between indoor heat exchanger 7 phase close contact, between lower room semiconductor refrigerating heat-producing machine 8 another side with lower between the interior front phase close contact of outdoor heat exchanger 9, this interior front is made with the metal material that heat conductivility is good, between lower, the inside of outdoor heat exchanger 9 has the flow passage 13 of liquid coolant flowing, between lower outdoor heat exchanger 9 have under the liquid coolant that flow passage 13 that the liquid coolant with lower outdoor heat exchanger 9 inside flows is connected between room inflow/outflow mouth 14, make special electronic control panel 12, electronic control panel 12 with upper between room semiconductor refrigerating heat-producing machine 5 phase be electrically connected, electronic control panel 12 with lower between room semiconductor refrigerating heat-producing machine 8 phase be electrically connected, composite condenser 10 is made into the metal material that heat conductivility is good, composite condenser 10 is communicated with by one or more individual layer condenser and forms, parallel the stacking of usual use two individual layer condensers is communicated with composition, select suitable infusion pump 11, outdoor heat exchanger 6 between upper, outdoor heat exchanger 9 between lower, composite condenser 10 and infusion pump 11 are interconnected to constitute the circulation flow passage of liquid coolant flowing, it is characterized in that: composite condenser 10 is placed on the outer back of multichip semiconductor function two-purpose case.
Operation principle of the present utility model is such, here between heating with upper the room 1 of the multichip semiconductor function two-purpose case of two rooms and descending, room 2 refrigeration illustrates, start working after multifunction semiconductor cold-storage and warm-storage two-purpose box energising, between lower, room semiconductor refrigerating heat-producing machine 8 passes through lower indoor heat exchanger 7 constantly from draw heat in lower room 2, outdoor heat exchanger 9 between heat is passed to down, between lower, in room 2, temperature reduces, reach the object of refrigeration, between upper room semiconductor refrigerating heat-producing machine 6 constantly on clump between outdoor heat exchanger 6 draw heat, indoor heat exchanger 4 between heat is passed to continuously, between again heat being dispersed in room 1, between upper, indoor 1 temperature raises, reach the object heated, due to the work of infusion pump 11, liquid coolant is at so a kind of cold and hot complementary comprehensive heat exchanger internal circulation flow, cold between making on outdoor heat exchanger 6 and lower between heat on outdoor heat exchanger 9 mutually neutralize utilization, temperature between under reducing on outdoor heat exchanger 9, temperature between in raising on outdoor heat exchanger 6, following between the refrigerating efficiency of room semiconductor refrigerating heat-producing machine 8 improve, between upper, the heating efficiency of room semiconductor refrigerating heat-producing machine 5 improves, composite condenser 10 still makes liquid coolant temperature make liquid coolant temperature lower than the not enough heat of environment temperature higher than the waste heat of environment temperature or after absorbing cold and hot neutralization after dissipating cold and hot neutralization, because composite condenser 10 is made up of one or more individual layer condenser connection, parallel the stacking of usual use two individual layer condensers is communicated with composition, individual layer condenser is greater than with the effective heat exchange area of external environment condition, so be greater than individual layer condenser with the heat exchange efficiency of external environment condition, blower fan 3 can also be installed to improve the heat exchange efficiency of composite condenser 10 and air further at composite condenser 10 side place.

Claims (4)

1. an outside strong heat exchange type multichip semiconductor function two-purpose case, it comprise between room (1), room (2) between lower, indoor heat exchanger (4) between upper, room semiconductor refrigerating heat-producing machine (5) between upper, outdoor heat exchanger (6) between upper, indoor heat exchanger (7) between lower, room semiconductor refrigerating heat-producing machine (8) between lower, outdoor heat exchanger (9) between lower, composite condenser (10), infusion pump (11) and electronic control panel (12), between upper room semiconductor refrigerating heat-producing machine (5) one side with upper between indoor heat exchanger (4) phase close contact, between upper room semiconductor refrigerating heat-producing machine (5) another side with upper between outdoor heat exchanger (6) interior front phase close contact, between lower room semiconductor refrigerating heat-producing machine (8) one side with lower between indoor heat exchanger (7) phase close contact, between lower room semiconductor refrigerating heat-producing machine (8) another side with lower between outdoor heat exchanger (9) interior front phase close contact, between upper, room semiconductor refrigerating heat-producing machine (5) is electrically connected mutually with electronic control panel (12), between lower, room semiconductor refrigerating heat-producing machine (8) is electrically connected mutually with electronic control panel (12), outdoor heat exchanger (6) between upper, outdoor heat exchanger (9) between lower, composite condenser (10) and infusion pump (11) are interconnected connection, form the circulation flow passage of liquid coolant, it is characterized in that: composite condenser (10) is placed on the outer back of multichip semiconductor function two-purpose case, composite condenser side place is provided with blower fan.
2. a kind of outside strong heat exchange type multichip semiconductor function two-purpose case as claimed in claim 1, it is characterized in that: between upper outdoor heat exchanger (6) have on liquid coolant that liquid coolant passes through between room inflow/outflow mouth (14), between upper, outdoor heat exchanger (6) inside has the flow passage (13) of liquid coolant flowing.
3. a kind of outside strong heat exchange type multichip semiconductor function two-purpose case as claimed in claim 1, it is characterized in that: between lower outdoor heat exchanger (9) have under the liquid coolant that liquid coolant passes through between room inflow/outflow mouth (14), between lower, outdoor heat exchanger (9) inside has the flow passage (13) of liquid coolant flowing.
4. a kind of outside strong heat exchange type multichip semiconductor function two-purpose case as claimed in claim 1, is characterized in that: composite condenser (10) is communicated with by one or more individual layer condenser and forms.
CN201420874107.4U 2014-12-28 2014-12-28 A kind of outside strong heat exchange type multichip semiconductor function two-purpose case Expired - Fee Related CN204438589U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420874107.4U CN204438589U (en) 2014-12-28 2014-12-28 A kind of outside strong heat exchange type multichip semiconductor function two-purpose case

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420874107.4U CN204438589U (en) 2014-12-28 2014-12-28 A kind of outside strong heat exchange type multichip semiconductor function two-purpose case

Publications (1)

Publication Number Publication Date
CN204438589U true CN204438589U (en) 2015-07-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
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CN (1) CN204438589U (en)

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