CN204408843U

CN204408843U - Conducting element is utilized to change the shielding device of resonant resistance and frequency

Info

Publication number: CN204408843U
Application number: CN201420856438.5U
Authority: CN
Inventors: 庄富吉; 黄宇成; 黄建融
Original assignee: Alpha Networks Inc
Current assignee: Alpha Networks Inc
Priority date: 2014-12-30
Filing date: 2014-12-30
Publication date: 2015-06-17
Anticipated expiration: 2024-12-30

Abstract

The utility model provides a kind of shielding device utilizing conducting element to change resonant resistance and frequency, comprise a metal shell and a conducting element, this metal-back physical efficiency is fixedly held on a circuit board, to cover the electronic component on this circuit board, and forms a resonant cavity in this metal shell; One end of this conducting element is welded in the earthed circuit on this circuit board, its other end then extends upward, with against the internal face to this metal shell, so, this metal shell is only utilized dealer, when preventing the running of this electronic component of external electromagnetic wave action, if dealer finds that the resonance frequency of this resonant cavity is identical with the signal frequency on this electronic component, then dealer only needs this conducting element to be welded between the internal face of this earthed circuit and this metal shell, can change resonant resistance and the frequency of this resonant cavity easily.

Description

Conducting element is utilized to change the shielding device of resonant resistance and frequency

Technical field

The utility model is a kind of shielding device utilizing conducting element to change resonant resistance and frequency, espespecially utilizes a conducting element, makes the mutual short circuit of earthed circuit on a metal-back physical efficiency and circuit board, to change the shielding device of resonance frequency by short circuit.

Background technology

Press, in all kinds of electronic devices (as: computer, server), because inside is provided with thousands of electronic components thick and fast, therefore, the signal transmitted between different electronic component is easy to produce electromagnetic interference (Electromagnetic Interference to other electronic components, EMI), the entire lowering of the usefulness of this electronic installation is caused; And in recent years, along with the universalness of mobile electronic installation (as: smart mobile phone, panel computer), " compact " becomes a main trend in market, causes the phenomenon of electromagnetic interference to be more difficult to avoid, and becomes the very important key issue of dealer.

In order to solve the problem of electromagnetic interference, when design electronic products, dealer can use the conductor of high conductivity or high magnetic permeability as " shielding device ", and cover cap lives the part electronic component on circuit board.When meeting with electromagnetic wave, the material of high conductivity can produce induced current, and according to Lenz's law, prevents electromagnetic wave from penetrating shielding device; The material of high magnetic conductivity then can guide the magnetic line of force, thus the magnetic line of force effectively reduced in shielding device, therefore electromagnetic wave constantly will be decayed in the process penetrating shielding device, the degree of decay strengthens along with the increase of the conductivity of material, magnetic permeability and wave frequency, accordingly, can prevent the electronic component in extraneous electromagnetic wave influence shielding device, in like manner, the electromagnetic wave that in shielding device, electronic component produces also cannot affect to other electronic components outside shielding device.

Though shielding device effectively can prevent the problem of electromagnetic interference, but still there is some problem in actual use, because shielding device inside is an enclosure space, therefore one " resonant cavity " structure can be formed, once the clock frequency of signal that the resonance frequency of this resonant cavity and electronic component transmit is identical, then the part energy of signal will be dispersed to resonant cavity, and has a strong impact on the proper efficiency of electronic component.Refer to shown in Fig. 1, if dealer was for solving this problem in the past, must at the multiple dividing plate 10 of shielding device 1 inside installing, to pass through dividing plate 10, shielding device 1 inner space is separated, and then changes its resonance characteristics, but, this mode but significantly can limit the space of configuration electronic component 11 in this shielding device 1, even, dealer must redesign interlock circuit, could install this dividing plate smoothly, thus, the cost of dealer when designing " electromagnetic shielding " will significantly be increased.

In addition, also have dealer to be sticked on shielding device inwall absorbing material, to change the resonance characteristics of shielding device, but the implementation cost of this mode is also too high, therefore cannot popularize use.Therefore, how escape goes out existing mentality of designing, make dealer detect shielding device resonance frequency identical with the signal frequency of electronic component time, can rapidly, expediently in the mode of low cost, shielding device is improved, namely becomes the utility model desires most ardently solution major issue at this.

Utility model content

Because current industry is when designing " electromagnetic shielding ", if for the resonance characteristics in adjustment shielding device, cost needed for the various practice is all too high, causing cannot the problem of facilitated application, creator is by feat of practical experience for many years, and after research repeatedly, test and improvement, finally design a kind of shielding device utilizing conducting element to change resonant resistance and frequency of the present utility model, the phase can provide a kind of shielding device structure being easy to adjust.

An object of the present utility model, for providing a kind of shielding device utilizing conducting element to change resonant resistance and frequency, comprise a metal shell and at least one conducting element, the bottom of this metal shell offers a under shed, the top of this metal shell is closed, to form an accommodation space in this metal shell, the root edge of this metal shell is fixedly held on a circuit board, make electronic component on this circuit board by this under shed, be positioned in this accommodation space, and make this accommodation space become a resonant cavity; One end of each conducting element can be soldered to the earthed circuit on this circuit board, its other end then extends upward, with when the root edge of this metal shell is fixedly held to this circuit board, respectively the other end of this conducting element can against an internal face of this under shed faced by this metal shell, make by the mutual short circuit of this conducting element between this metal shell and this earthed circuit, and then change resonant resistance and the resonance frequency of this resonant cavity entirety.So, find that the frequency of the signal that the resonance frequency of this resonant cavity and electronic component transmit is equal dealer, and by when having influence on electronic component, dealer only needs each conducting element to be mounted to this metal shell in the face of between this internal face and this circuit board of this under shed, the two ends of each conducting element are made to be electrically connected to earthed circuit and this metal shell of this circuit board respectively, the overall impedance of this resonant cavity can be changed easily, and then change the resonance frequency of this resonant cavity.Accordingly, can solve dealer in the past must add absorbing material with making or have much ado in shielding device, or separates this accommodation space with metal partion (metp), begins to change the problem of resonance frequency, allows dealer significantly can reduce cost spent on electromagnetic shielding.

Another object of the present utility model, be that this metal shell still comprises metal-back on metal-back and, the bottom of this lower metal-back offers this under shed, and the top of this lower metal-back then offers a upper shed, this under shed is connected with this upper shed, to form this accommodation space; On this, the configuration of metal-back and this upper shed match, so that the top of this lower metal-back can be positioned at, and covered this upper shed, and formed with this lower metal-back and be electrically connected, make metal-back on this can be assembled into one with this lower metal-back, so, when dealer is for installing this conducting element, only need the top of metal-back on this by this lower metal-back to disassemble, get final product convenient and promptly carry out installation exercise.

In the utility model one embodiment, this lower metal-back is provided with a plurality of first assembled portion, position metal-back corresponding to for this each described first assembled portion is then provided with a plurality of second assembled portion, each described second assembled portion with the first corresponding assembled portion phase inlay card, can be assembled into one to make metal-back and lower metal-back on this.

In the utility model one embodiment, on this, metal-back periphery extends to form a ring wall downward, and each described second assembled portion is located on this ring wall.

In the utility model one embodiment, each first assembled portion is a projection, and each described second assembled portion is then a groove.

Another object of the present utility model is this circuit board is still provided with a naked copper district, one end of this conducting element can be soldered in this naked copper district, and then be grounded function.Accordingly, due to the smooth solder side on this this circuit board of naked copper district, therefore efficiency when can promote welding.In the utility model one embodiment, this conducting element is made up of the part of elastomeric material or tool elastic construction.

The shielding device that the utility model provides can change resonant resistance and the frequency of resonant cavity easily.

For just your auditor can have further understanding and understanding to design principle of the present utility model, architectural feature and object thereof, hereby coordinate graphic for embodiment, be described in detail as follows:

Accompanying drawing explanation

Fig. 1 is existing shielding device schematic diagram;

Fig. 2 a is that the structure of shielding device disassembles schematic diagram;

Fig. 2 b is the schematic equivalent circuit of shielding device;

Fig. 3 is the first preferred embodiment schematic diagram of shielding device of the present utility model;

Fig. 4 a is the installing schematic diagram of shielding device of the present utility model; And

Fig. 4 b is the schematic equivalent circuit of shielding device of the present utility model.

Reference numeral illustrates:

Shielding device ... 1

Dividing plate ... 10

Electronic component ... 11

Shielding device ... 2,3

Metallic plate ... 21

Hollow tube ... 22

Equivalent electric circuit ... 23

Metal shell ... 31

Lower metal-back ... 311

First assembled portion ... 311a

Upper metal-back ... 312

Second assembled portion ... 312a

Ring wall ... 313

Conducting element ... 32

Naked copper district ... 33

Under shed ... C1

Upper shed ... C2

Resonant cavity ... C3

Circuit board ... P

Electronic component ... P1

Inductance ... L

Electric capacity ... C

Short-circuit structure ... S

Embodiment

In the past, if dealer finds that the resonance frequency shielding device is identical with the signal frequency that electronic component transmits, then its adjustment mode all focuses on " space " or " material " aspect, meaning namely, dealer can utilize baffle for separating shield the inner space of device or change resonance characteristics to inhale ripple material, but above-mentioned two kinds of modes all need to expend too much design and production cost, and can the significantly configuration freedom of each electronic component on limiting circuit plate, therefore be difficult to be applied in all electronic installations.Creator, after inquiring into the shielding action principle of device, the assembling flow path of electronic installation and various possible variation pattern in detail, removes adjustment shielding device if find with the angle of " equivalent electric circuit ", then can solve aforementioned problems dexterously simultaneously.

Refer to shown in Fig. 2 a and Fig. 2 b, with regard to structure, shielding device 2 is three part such as the metallic plate 21 at disassembled one-tenth two ends and hollow tube 22 in fact, if with the viewpoint analysis metallic plate 21 of equivalent electric circuit, hollow tube 22, then hollow tube 22 can be considered a kind of " waveguide " in fact, its equivalent electric circuit is a lc circuit (electric capacity C as shown in figure 2b and inductance L), so, the overall equivalent electric circuit 23 of this shielding device 2 is just just like " waveguides of two terminal shortcircuits ", therefore, if the characteristic of the equivalent electric circuit 23 shown in Fig. 2 b can be changed, the resonance frequency then shielding device 2 inside also can respective change.

Refer to shown in Fig. 3, for the first preferred embodiment utilizing conducting element to change the shielding device 3 of resonant resistance and frequency of the present utility model, this shielding device 3 comprises a metal shell 31 and at least one conducting element 32 (quantity can increase according to design requirement), wherein, this metal shell 31 also can be subdivided into metal-back 312 on metal-back 311 and, open C 1 is offered bottom this lower metal-back 311, its top then offers a upper shed C2, this under shed C1 is connected with this upper shed C2, with can around an accommodation space in this lower metal-back 311, this lower metal-back 311 can with inlay card, welding, the modes such as locking are fixed on a circuit board P, make a plurality of electronic component P1 on this circuit board P by this under shed C1, and be positioned in this accommodation space.

In the schematic diagram that Fig. 3 draws, although the cross sectional configurations of this metal shell 31 is rectangular, in fact not as limit, the shape of metal shell 31 does not affect usefulness of the present utility model, also can be designed to irregularly shaped, close first Chen Ming.

Refer to shown in Fig. 3 and Fig. 4 a, on this, the configuration of metal-back 312 and this upper shed C2 match, so that can (as: inlay card, packing, locking, welding be assembled ... etc. mode) to the top of this lower metal-back 311, and covered this upper shed C2, and then form a resonant cavity C3 in this metal shell 31 inside; One end of this conducting element 32 can be electrically connected to the earthed circuit (not shown) on this circuit board P, its other end then extends towards the direction of this upper shed C2, when being assembled on this lower metal-back 311 with metal-back on this 312, the other end of this conducting element 32 can against the side of metal-back on this 312 in the face of this lower metal-back 311.

Refer to shown in Fig. 3 and Fig. 4 a ~ Fig. 4 b, for this shielding device 3, this conducting element 32 can form a short-circuit structure S (equivalent electric circuit as shown in Figure 4 b) between metal-back 312 and earthed circuit on this, therefore the resonant resistance of this resonant cavity C3, resonance frequency all can change along with adding of this short-circuit structure S.So, when producing electronic installation, dealer can first only use this metal shell 31 as shielding device, and in follow-up test, if dealer finds that the resonance frequency of this resonant cavity C3 is just equal with the frequency of the signal that electronic component P1 transmits, then now dealer only needs the two ends of each conducting element 32 to be connected to respectively the internal face of earthed circuit and this metal shell 31 (such as: one end is welded, the other end against), the resonance frequency (equivalent electric circuit as shown in Figure 4 b) of this resonant cavity C3 can be changed easily.Accordingly, the cost that dealer is spent on electromagnetic shielding can effectively be reduced.

Refer to shown in Fig. 3 and Fig. 4 a ~ Fig. 4 b again, in the first preferred embodiment of the present utility model, this circuit board P is still provided with at least one naked copper district 33 (quantity can adjust arbitrarily according to design requirement), this naked copper district 33 can be the uncoated solder mask of circuit board P lastblock (solder mask) and exposes the flat site of inner copper packing, also can weld a ground copper and form (schematic diagram as Fig. 3) on circuit board P, make dealer can be soldered to one end of this conducting element 32 in this naked copper district 33 easily, to be electrically connected to this earthed circuit.In addition, this conducting element 32 can be made up of the part (as: metal clips etc. of bending) of elastic material (as: spring) or tool elastic construction, so, can guarantee that this conducting element 32 can firmly against the internal face to this metal shell 31 further, and because of vibrations or the scale error of metal shell 31, and can not cannot form short circuit.

Refer to shown in Fig. 3 and Fig. 4 a again, in the present embodiment, the lateral surface of this lower metal-back 311 is provided with a plurality of first assembled portion (as: projection) 311a, and periphery of metal-back 312 extends to form a ring wall 313 downward on this, the position this ring wall 313 corresponding to each first assembled portion 311a is respectively equipped with one second assembled portion 312a (as: groove), the configuration of this first assembled portion 311a and the configuration of this second assembled portion 312a match, when on the top being positioned to this lower metal-back 311 with metal-back on this 312, this ring wall 313 can envelope the lateral surface of this lower metal-back 311, make assembled portion 311a, 312a energy inlay card mutually, be assembled into this metal shell 31.

The relativeness of this first assembled portion 311a and the second assembled portion 312a is not as limit, this first assembled portion 311a also can be located at the internal face of this lower metal-back 311, with when the mutual inlay card of assembled portion 311a, 312a, this ring wall 313 can be coated in this lower metal-back 311, and cover by its lateral surface; In addition, the configuration of this first assembled portion 311a and the second assembled portion 312a also can be designed to the mode such as screw, convex wall, or be designed to pin-jointed structure, make metal-back 312 side on this can be connected to this lower metal-back 311, opposite side then can towards inner rotary, to expose the accommodation space in this lower metal-back 311.

Separately, in the aforementioned embodiment, this metal shell 31 is made up of metal-back on this 312 and lower metal-back 311, therefore dealer is when finding the resonance frequency of resonant cavity C3 equal with the signal frequency on electronic component P1, wish installs this conducting element 32, only need metal-back on this 312 to disassemble by this lower metal-back 311, can assemble.Only, in other preferred embodiments of the present utility model, this metal shell 31 can be designed to integrally formed, meaning namely, the top of this metal shell 31 is closed, then be provided with under shed C1 bottom it, and dealer only needs the root edge Configuration Design of this metal shell 31 to become to match with this circuit board P (such as: this circuit board P is provided with corresponding inlay card groove), can be loaded in this metal shell 31 by conducting element 32 at any time.

The above; be only some preferred embodiments of the present utility model; only; technical characteristic of the present utility model is not limited thereto; all those skilled in the technology concerned; after considering technology contents of the present utility model in light of actual conditions, can think easily and equivalence change, protection category of the present utility model all should not be departed from.

Claims

1. utilize conducting element to change a shielding device for resonant resistance and frequency, it is characterized in that, comprising:

One metal shell, a under shed is offered bottom it, its top is then in closed, to form an accommodation space in this metal shell, the root edge of this metal shell is fixedly held on a circuit board, make electronic component on this circuit board by this under shed, be positioned in this accommodation space, and make this accommodation space become a resonant cavity; And

One conducting element, its one end can be connected to the earthed circuit on this circuit board, its other end then extends upward, with when the root edge of this metal shell is fixedly held on this circuit board, the other end of this conducting element can against an internal face of this under shed faced by this metal shell, make by the mutual short circuit of this conducting element between this metal shell and this earthed circuit, and then change resonant resistance and the resonance frequency of this resonant cavity.

2. shield device as claimed in claim 1, it is characterized in that, this metal shell also comprises:

Metal-back once, the bottom of this lower metal-back offers this under shed, and the top of this lower metal-back then offers a upper shed, and this under shed is connected with this upper shed, to form this accommodation space; And

Metal-back on one, its configuration and this upper shed match, so that the top of this lower metal-back can be positioned to, and covered this upper shed, and formed with this lower metal-back and be electrically connected, at this lower metal-back and on this, metal-back is combined into one when, the other end of this conducting element is against the side of metal-back on this in the face of this lower metal-back.

3. shield device as claimed in claim 2, it is characterized in that, this lower metal-back is provided with a plurality of first assembled portion, position metal-back corresponding to for this each described first assembled portion is then provided with a plurality of second assembled portion, each described second assembled portion with the first corresponding assembled portion phase inlay card, can be assembled into one to make metal-back and lower metal-back on this.

4. shield device as claimed in claim 3, it is characterized in that, on this, metal-back periphery extends to form a ring wall downward, and each described second assembled portion is located on this ring wall.

5. shield device as claimed in claim 4, it is characterized in that, each described first assembled portion is a projection, and each described second assembled portion is then a groove.

6. the shielding device as described in claim 1,2,3,4 or 5, is characterized in that, this circuit board is still provided with a naked copper district, and one end of this conducting element is soldered to this naked copper district, to form ground connection.

7. shield device as claimed in claim 6, it is characterized in that, this conducting element is made up of the part of elastomeric material or tool elastic construction.