CN202120911U - Frequency conversion interference resisting infrared ray receiving module - Google Patents
Frequency conversion interference resisting infrared ray receiving module Download PDFInfo
- Publication number
- CN202120911U CN202120911U CN2011202374222U CN201120237422U CN202120911U CN 202120911 U CN202120911 U CN 202120911U CN 2011202374222 U CN2011202374222 U CN 2011202374222U CN 201120237422 U CN201120237422 U CN 201120237422U CN 202120911 U CN202120911 U CN 202120911U
- Authority
- CN
- China
- Prior art keywords
- infrared ray
- packaging part
- frequency conversion
- module
- receiving window
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
The utility model relates to a frequency conversion interference resisting infrared ray receiving module, comprising a packaging part and a support, wherein the packaging part comprises a substrate and an internal shielding cover, the substrate is integrated with the internal shielding cover, an infrared receiving window is arranged on the internal shielding cover, and the infrared receiving window is provided with a shielding net. Preferably, the shielding net is shaped as * or +. Because of the shielding net, so no extra outer shielding iron casing needs to be increased to solve the problem of frequency conversion interference resistance. Production technology is simpler, efficiency is improved, and cost is not increased.
Description
Technical field
The utility model relates to a kind of infrared ray and receives module, and the infrared ray that particularly a kind of resistance that is applied in the middle of the frequency conversion equipment disturbs frequently receives module.
Background technology
At present, it is more and more general in the application of household appliance technical field that infrared ray receives module.Extremely shown in Figure 6 like Fig. 1; Common infrared ray receives module and generally includes packaging part 1 ', support 2 ', light-sensitive element 3 ' and Signal Processing Element 4 '; Wherein, This packaging part 1 ' comprises a packaging part body 11 ' and lens 12 ', and these lens 12 ' are formed on the front surface of packaging part body 11 ' projectedly.Support has the packed part 21 ' that is encapsulated in the packaging part body 11 ' and passes the outer pin part 22 ' of packaging part 1 ' by the bottom surface of packaging part body 11 '; Said packed part 21 ' comprises the substrate 23 ' and inner shield lid 24 ' that fuses, and has the infrared receiving window 25 ' that can supply infrared penetration on the said inner shield lid 24 '.Light-sensitive element 3 ' is used for converting light signal to the signal of telecommunication; Signal Processing Element 4 ' is used for the said signal of telecommunication is handled; Light-sensitive element 3 ' and Signal Processing Element 4 ' all are arranged on the installed surface 211 ' of packed part 21 ' of support 2 '; Signal Processing Element 4 ' is connected to output pin 221 ', grounding pin 222 ', power pins 223 ' and light-sensitive element 3 ' respectively through lead-in wire 5 ', forms to be electrically connected.
Along with the continual renovation of household electrical appliance, the promotion and the application of energy-saving and frequency-variable technology receive module to infrared ray and have produced higher requirement.Problems such as common infrared ray receives module reduced distances can occur when being applied to frequency conversion equipment, coding is judged by accident, and remote control is insensitive.In order to overcome the problem that frequency conversion is disturbed; The general at present way that adopts is to receive the module outside at infrared ray to have increased an external shield iron-clad 6 ', has solved interference problem though do like this, makes infrared ray receive the module volume and becomes big; Technology complicates; Production efficiency reduces, and cost increases, and has brought certain difficulty for the design of installing space and circuit board.
The utility model content
The purpose of the utility model is in order to overcome the defective that prior art exists, and the infrared ray that provides a kind of volume is little, technology is simple, production efficiency is high and cost is low resistance to disturb frequently receives module.
For realizing above-mentioned purpose; The utility model has adopted following technical scheme: the infrared ray that provides a kind of resistance to disturb frequently receives module; Comprise: packaging part, have a packaging part body and lens, these lens are formed on the front surface of said packaging part body projectedly; Support; Have and be encapsulated in the intrinsic packed part of said packaging part and pass the outer pin part of said packaging part by the bottom surface of said packaging part body; Said packed part comprises substrate and the inner shield lid that fuses, and said inner shield covers has infrared receiving window; Light-sensitive element and Signal Processing Element are separately positioned on the installed surface of said packed part, and said Signal Processing Element is connected to said pin part and light-sensitive element through lead-in wire; Wherein, said infrared receiving window has gauze screen.
According to the utility model, said gauze screen be shaped as " * " shape or " ╋ " shape.The results showed, adopt the gauze screen of this shape, can obtain more satisfactory shield effectiveness.
Compared with prior art, the utlity model has following advantage and beneficial effect:
1. erroneous judgement and the insensitive problem of remote control can not appear apart from shorten, encode because of the interference that frequency conversion is arranged in the receiving range of infrared ray reception module, and practical effect can satisfy customer requirements fully.
2. owing to be provided with gauze screen at the infrared receiving window place of inner shield lid, therefore not needing to increase the external shield iron-clad more in addition can solve the problem that resistance disturbs frequently, makes that production technology is simpler, efficient improves, cost can not increase.
3. along with the application of SMD original paper, the volume that infrared ray is received module also claims, and the utility model can not increase volume again having increased on the performance that resistance disturbs frequently, has made things convenient for the design of installing space and circuit board.
Description of drawings
Fig. 1 is that traditional resistance disturbs infrared ray to receive the front view of module frequently.
Fig. 2 is the end view that infrared ray shown in Figure 1 receives module.
Fig. 3 is that infrared ray shown in Figure 1 receives the front view of module after having removed the external shield iron-clad.
Fig. 4 is the front view that infrared ray shown in Figure 1 receives the central external shield iron-clad of module.
Fig. 5 is the front view that infrared ray shown in Figure 1 receives the central holder part of module.
Fig. 6 is the deployed condition sketch map of holder part shown in Figure 5.
Fig. 7 is that the resistance of the utility model embodiment one disturbs infrared ray to receive the front view of module frequently.
Fig. 8 is the end view that infrared ray shown in Figure 7 receives module.
Fig. 9 is the front view that infrared ray shown in Figure 7 receives the central holder part of module.
Figure 10 is the deployed condition sketch map of holder part shown in Figure 9.
Figure 11 is that the resistance of the utility model embodiment two disturbs infrared ray to receive the front view of module frequently.
Figure 12 is the end view that infrared ray shown in Figure 11 receives module.
Figure 13 is the front view that infrared ray shown in Figure 11 receives the central holder part of module.
Figure 14 is the deployed condition sketch map of holder part shown in Figure 13.
Embodiment
Below in conjunction with accompanying drawing and embodiment the utility model is described further.
Embodiment one
Referring to Fig. 7 to Figure 10, a kind of infrared ray of the utility model receives module and has comprised packaging part 1, support 2, light-sensitive element 3 and Signal Processing Element 4.
Wherein, this packaging part 1 has a packaging part body 11 and lens 12, and these lens 12 are formed on the front surface 111 of packaging part body 11 projectedly, can play the effect of optically focused.Said packaging part body 11 is cube, and said lens 12 are " ∩ " shape; The bottom surface of these lens 12 is concordant with the bottom surface 112 of packaging part body 11, the Width center line of these lens 12 and the Width central lines of packaging part body 11.
Light-sensitive element 3 is used for converting light signal to the signal of telecommunication, and Signal Processing Element 4 is used for the said signal of telecommunication is handled, and light-sensitive element 3 and Signal Processing Element 4 all are arranged on the installed surface 211 of packed part 21 of support 2.Signal Processing Element 45 is connected to output pin 221, grounding pin 222, power pins 223 and light-sensitive element 3 respectively through going between, and forms to be electrically connected.
Embodiment two
Referring to Figure 11 to Figure 14; The another kind of infrared ray of the utility model receives module; Packaging part 1, support 2, light-sensitive element 3 and Signal Processing Element 4 have been comprised; Wherein, this packaging part 1 comprises that one is cubical packaging part body 11 and one and is hemispheric lens 14, and these lens 14 are formed on the front surface of packaging part body 11 projectedly.Support 2 has the packed part 21 that is encapsulated in the packaging part body 11 and passes packaging part 1 outer output pin 221, grounding pin 222 and power pins 223 by the bottom surface of packaging part body 11.
Said packed part 21 comprises the substrate 23 and inner shield lid 24 that fuses; After these packed part 21 edge first flangings 214 and second flanging 215 bend; Inner shield lid 24 and substrate 23 almost parallels are formed with the spatial accommodation that holds photosensitive components 3 and Signal Processing Element 4 between inner shield lid 24 and the substrate 23.Has the infrared receiving window 25 that roughly is square on the inner shield lid 24, this infrared receiving window 25 by one be " ╋ " shape gauze screen 27 be divided into four little square fenestellas.
It below only is the preferred implementation of the utility model; Should be pointed out that for the person of ordinary skill of the art, under the prerequisite of the inventive concept that does not break away from the utility model; Can also make some distortion and improvement, and not break away from the protection range of the utility model claim.For example, infrared receiving window can also be suitable shapes such as rectangle, circle, ellipse or triangle, and is not limited to the square of the foregoing description; The shape of the gauze screen on the infrared receiving window also be not limited to " * " shape or " ten " font, can also be triangular in shape or latticed etc.
Claims (3)
1. the infrared ray that disturbs frequently of resistance receives module, comprising:
Packaging part has a packaging part body and lens, and these lens are formed on the front surface of said packaging part body projectedly;
Support; Have and be encapsulated in the intrinsic packed part of said packaging part and pass the outer pin part of said packaging part by the bottom surface of said packaging part body; Said packed part comprises substrate and the inner shield lid that fuses, and said inner shield covers has infrared receiving window;
Light-sensitive element and Signal Processing Element are separately positioned on the installed surface of said packed part, and said Signal Processing Element is connected to said pin part and light-sensitive element through lead-in wire;
It is characterized in that:
Said infrared receiving window has gauze screen.
2. infrared ray that resistance according to claim 1 disturbs frequently receives module, it is characterized in that: said gauze screen be shaped as " * " shape.
3. infrared ray that resistance according to claim 1 disturbs frequently receives module, it is characterized in that: said gauze screen be shaped as " ╋ " shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202374222U CN202120911U (en) | 2011-07-07 | 2011-07-07 | Frequency conversion interference resisting infrared ray receiving module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202374222U CN202120911U (en) | 2011-07-07 | 2011-07-07 | Frequency conversion interference resisting infrared ray receiving module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202120911U true CN202120911U (en) | 2012-01-18 |
Family
ID=45461952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202374222U Expired - Fee Related CN202120911U (en) | 2011-07-07 | 2011-07-07 | Frequency conversion interference resisting infrared ray receiving module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202120911U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114783168A (en) * | 2022-04-12 | 2022-07-22 | 胡志山 | Infrared signal processing module |
-
2011
- 2011-07-07 CN CN2011202374222U patent/CN202120911U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114783168A (en) * | 2022-04-12 | 2022-07-22 | 胡志山 | Infrared signal processing module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120118 Termination date: 20180707 |