CN204404128U - High thermal conductive silicon film - Google Patents
High thermal conductive silicon film Download PDFInfo
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- CN204404128U CN204404128U CN201520078580.6U CN201520078580U CN204404128U CN 204404128 U CN204404128 U CN 204404128U CN 201520078580 U CN201520078580 U CN 201520078580U CN 204404128 U CN204404128 U CN 204404128U
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- silica gel
- lamellar body
- gel lamellar
- led chip
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Abstract
The utility model discloses a kind of high thermal conductive silicon film, it comprises employing silica gel lamellar body and the laminating separation layer in this silica gel lamellar body upper and lower surface, the appearance profile of described silica gel lamellar body is circular, the outer peripheral edge of this silica gel lamellar body is that the center of circle is arranged with three radial protrusions, and the middle part of this radial protrusion is provided with radial recess.The utility model smart structural design, rationally, effectively utilize the flexible nature of silica gel lamellar body, fill the gap between LED chip and radiator preferably, reduce surface contact thermal resistance, improve heat-conducting effect, effectively can reduce the temperature of LED chip, improve its reliability and service life; Effectively can reduce the damage of external vibrations to LED chip again simultaneously, improve the security performance of LED chip; Client's quick position can be facilitated by radial protrusion and radial recess and operation is installed, avoiding tearing material itself, convenient working; The utility model terminal with compact integral structure in addition, is easy to realize, be beneficial to wide popularization and application.
Description
Technical field
The utility model relates to heat conduction technical field, particularly a kind of high thermal conductive silicon film.
Background technology
LED light source occupies more and more consequence as a kind of new type light source in lighting field, the feature such as it has, and volume is little, life-span length, high brightness, low in calories, environmental protection and energy saving, low, sturdy and durable, the photochromic change of power consumption are many.
At present, the mainly Aluminium Radiator of the heat radiator for LED lamp on market, it generally adopts the manufacture of aluminium extrusion process, or uses the Vehicle Processing of section bar aluminium to manufacture.Then LED chip is fixed on a heat sink.Owing to easily having gap between LED chip and radiator, cause the cooperation between LED chip and radiator not to be very tight, have influence on the heat radiation of LED chip.If heat dissipation problem solves bad, heat concentrates in small-sized LED chip, makes LED chip internal temperature more and more higher.The too high meeting of LED chip temperature brings many problems, as accelerated device aging, accelerating the speed that LED light declines, reduction of service life, chip even also can be caused to burn.
Utility model content
For above-mentioned deficiency, the utility model provides a kind of reasonable in design, ingenious, fills the gap between LED chip and radiator preferably, and rapid heat dissipation, the high thermal conductive silicon film that handled easily is installed.
For achieving the above object, technical scheme provided by the utility model is: a kind of high thermal conductive silicon film, it comprises employing silica gel lamellar body and the laminating separation layer in this silica gel lamellar body upper and lower surface, the appearance profile of described silica gel lamellar body is circular, the outer peripheral edge of this silica gel lamellar body is that the center of circle is arranged with three radial protrusions, the middle part of this radial protrusion is provided with radial recess, and described silica gel piece body thickness is 0.5 ~ 5mm; The lower surface of described silica gel lamellar body is provided with many ventilation slots, and the degree of depth of this ventilation slot is 0.2 ~ 2mm.
Improve as one of the present utility model, described separation layer is PE barrier film.
Improve as one of the present utility model, described ventilation slot is spaced and parallel and come the lower surface of described silica gel lamellar body.
Improve as one of the present utility model, the lower surface of described silica gel lamellar body is laminating aluminium foil or Copper Foil, can promote heat-conducting effect further.
The beneficial effects of the utility model are: the utility model smart structural design, rationally, effectively utilize the flexible nature of silica gel lamellar body, fill the gap between LED chip and radiator preferably, reduce surface contact thermal resistance, improve heat-conducting effect, effectively can reduce the temperature of LED chip, improve its reliability and service life; Effectively can reduce the damage of external vibrations to LED chip again simultaneously, improve the security performance of LED chip; And ventilation slot can be convenient to air circulation, effective improving radiating effect; Client's quick position can be facilitated by radial protrusion and radial recess and operation is installed, avoiding tearing material itself, convenient working; Also can play when radiator and LED chip relative sliding, heat-conducting silica gel sheet can not produce position skew simultaneously, and good operating stability ensures high thermal conductivity; Separation layer effectively can keep the heat conductivility of silica gel lamellar body; The utility model terminal with compact integral structure in addition, is easy to realize, be beneficial to wide popularization and application.
Accompanying drawing explanation
Fig. 1 is main TV structure schematic diagram of the present utility model.
Fig. 2 is the A-A sectional structure schematic diagram of Fig. 1.
Detailed description of the invention
Embodiment: see Fig. 1 and Fig. 2, the utility model embodiment provides a kind of high thermal conductive silicon film, it comprises employing silica gel lamellar body 1 and the laminating separation layer 2 in this silica gel lamellar body 1 upper and lower surface, the appearance profile of described silica gel lamellar body 1 is circular, the outer peripheral edge of this silica gel lamellar body 1 is that the center of circle is arranged with three radial protrusions 3, the middle part of this radial protrusion 3 is provided with radial recess 4, client's quick position can be facilitated by radial protrusion 3 and radial recess 4 and operation is installed, avoid tearing material itself, convenient working; Described silica gel lamellar body 1 thickness is 0.5 ~ 5mm; The lower surface of described silica gel lamellar body 1 is provided with many ventilation slots 5, and the degree of depth of this ventilation slot 5 is 0.2 ~ 2mm.Preferably, described ventilation slot 5 is spaced and parallel and come the lower surface of described silica gel lamellar body 1.Ventilation slot 5 can be convenient to air circulation, effective improving radiating effect; For promoting heat-conducting effect further, aluminium foil or Copper Foil (not looking in figure) can be had the lower surface of described silica gel lamellar body 1 is laminating.
Preferably, described separation layer 2 is PE barrier film.Separation layer 2 can protect silica gel lamellar body 1 before the use not by foreign substance pollution or damage, effectively keeps the heat conductivility of silica gel lamellar body 1;
During use, the utility model is placed between LED chip and radiator, can quick position be realized by radial protrusion 3, then LED chip is drawn close mutually with radiator, by screw successively through LED chip, radial recess 4 and radiator, and lock, realize fixing object; After assembling, under the card of screw and radial recess 4 is joined, even if when radiator and LED chip relative sliding, heat-conducting silica gel sheet can not produce position skew, and good operating stability ensures high thermal conductivity; The utility model effectively utilizes the flexible nature of silica gel lamellar body 1, fills the gap between LED chip and radiator preferably, reduces surface contact thermal resistance, improve heat-conducting effect, effectively can reduce the temperature of LED chip, improve its reliability and service life; Effectively can reduce the damage of external vibrations to LED chip again simultaneously, improve the security performance of LED chip.
The announcement of book and instruction according to the above description, the utility model those skilled in the art can also change above-mentioned embodiment and revise.Therefore, the utility model is not limited to detailed description of the invention disclosed and described above, also should fall in the protection domain of claim of the present utility model modifications and changes more of the present utility model.In addition, although employ some specific terms in this description, these terms just for convenience of description, do not form any restriction to the utility model.As described in the utility model above-described embodiment, adopt structure same or analogous with it and the silica gel piece of other structure obtained, all in the utility model protection domain.
Claims (4)
1. a high thermal conductive silicon film, it is characterized in that, it comprises employing silica gel lamellar body and the laminating separation layer in this silica gel lamellar body upper and lower surface, the appearance profile of described silica gel lamellar body is circular, the outer peripheral edge of this silica gel lamellar body is that the center of circle is arranged with three radial protrusions, and the middle part of this radial protrusion is provided with radial recess, and described silica gel piece body thickness is 0.5 ~ 5mm, the lower surface of described silica gel lamellar body is provided with many ventilation slots, and the degree of depth of this ventilation slot is 0.2 ~ 2mm.
2. high thermal conductive silicon film according to claim 1, is characterized in that, described separation layer is PE barrier film.
3. high thermal conductive silicon film according to claim 1, is characterized in that, described ventilation slot is spaced and parallel and come the lower surface of described silica gel lamellar body.
4. high thermal conductive silicon film according to claim 1, is characterized in that, the lower surface of described silica gel lamellar body is laminating aluminium foil or Copper Foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520078580.6U CN204404128U (en) | 2015-02-04 | 2015-02-04 | High thermal conductive silicon film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520078580.6U CN204404128U (en) | 2015-02-04 | 2015-02-04 | High thermal conductive silicon film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204404128U true CN204404128U (en) | 2015-06-17 |
Family
ID=53427980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520078580.6U Expired - Fee Related CN204404128U (en) | 2015-02-04 | 2015-02-04 | High thermal conductive silicon film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204404128U (en) |
-
2015
- 2015-02-04 CN CN201520078580.6U patent/CN204404128U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150617 Termination date: 20180204 |