CN204381665U - Laser cutting device - Google Patents
Laser cutting device Download PDFInfo
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- CN204381665U CN204381665U CN201420862611.2U CN201420862611U CN204381665U CN 204381665 U CN204381665 U CN 204381665U CN 201420862611 U CN201420862611 U CN 201420862611U CN 204381665 U CN204381665 U CN 204381665U
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- cutting head
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Abstract
The utility model relates to a kind of laser cutting device, comprise semiconductor laser, cutting head module and laser enclosure, semiconductor laser is encapsulated in laser enclosure, cutting head module is connected with the lower end of laser enclosure by a trapezoidal adjustable connecting components, and the back side of laser enclosure is connected with a Z axis slide carriage; Cutting head module comprises adjustable shell, height tracing device, regulating wheel, pulling type cover glass box, laser nozzle and expands focus lamp assembly; adjustable shell connects the lower end of trapezoidal adjustable connecting components; height tracing device and regulating wheel are located at the both sides of adjustable shell respectively; the lower end of adjustable shell is located at by pulling type cover glass box; expand the inside that adjustable shell is located at by focus lamp assembly; laser nozzle is located at the lower end of pulling type cover glass box, for carrying out laser cutting to workpiece.It is simple that described laser cutting device has structure, integrated height, good airproof performance, and light path is simple, and effectively can prevent the beneficial effects such as dew condensation phenomenon.
Description
Technical field
The utility model relates to a kind of laser cutting device, belongs to technical field of laser processing.
Background technology
Laser cutting machine utilizes laser beam to carry out cut workpiece, its cardinal principle utilizes the energy of laser to be concentrated into a highdensity light beam in the form of light, light beam is delivered to working surface, produce enough energy, material is melted, reach the object of cutting and engraving, laser cutting machine has had that precision is high, cutting speed is fast, be not limited to cutting pattern restriction, Automatic Typesetting can save the features such as the level and smooth and processing cost of material, otch is low.In recent years, the application of carbon dioxide laser, optical fiber laser is more and more extensive, and the application of semiconductor laser cutting also gets more and more.
In laser processing procedure, the bright dipping of laser instrument will arrive cutting head through complicated optic path or Optical Fiber Transmission, and light path is complicated, and sealing is poor, and light modulation workload is large, and maintenance cost is high, and optical fiber cost is high, fragile.Eyeglass is the important component part of cutting head, vital effect is played to whole Laser Processing effect, simultaneously, eyeglass is again very easily contaminated parts, therefore, all need to cutting head nozzle the work carrying out sealing and dustproof from laser instrument bright dipping, laser instrument and cutting head are as two different parts, middle through very long paths, bring difficulty to whole sealing and dustproof work.Laser instrument needs could normally effectively to work under a normal temperature (20 DEG C-25 DEG C) environment, therefore be furnished with water-cooling system, but in the summer of sweltering heat, ambient temperature is higher, facet surface is easy to produce dew condensation phenomenon, and serious words can cause the damage of laser instrument.
Therefore be necessary to design a kind of laser cutting device, to overcome the problems referred to above.
Utility model content
The purpose of this utility model is the defect overcoming prior art, provides a kind of laser cutting device of high integrated high leakproofness, and its structure is simple, integrated height, good airproof performance, and light path is simple, and effectively can prevent dew condensation phenomenon.
The utility model is achieved in that
The utility model provides a kind of laser cutting device, comprise semiconductor laser, cutting head module and laser enclosure, described semiconductor laser is encapsulated in described laser enclosure, described cutting head module is connected with the lower end of described laser enclosure by a trapezoidal adjustable connecting components, and the back side of described laser enclosure is connected with a Z axis slide carriage; Described cutting head module comprises adjustable shell, height tracing device, regulating wheel, pulling type cover glass box, laser nozzle and expands focus lamp assembly; described adjustable shell connects the lower end of described trapezoidal adjustable connecting components; described height tracing device and described regulating wheel are located at the both sides of described adjustable shell respectively; the lower end of described adjustable shell is located at by described pulling type cover glass box; describedly expand the inside that described adjustable shell is located at by focus lamp assembly; described laser nozzle is located at the lower end of described pulling type cover glass box, for carrying out laser cutting to workpiece.
Further, described trapezoidal adjustable connecting components is provided with two groups of regulating wheels for finely tuning in X-axis and Y direction described cutting head module.
Further, described regulating wheel is eccentric wheel.
Further, heat-barrier material and air layer is adopted to separate between described semiconductor laser and described laser enclosure.
Further, the inside of described semiconductor laser and described cutting head module forms a closed chamber.
Further, described laser nozzle is band ceramic ring nozzle.
The utility model has following beneficial effect:
Semiconductor laser realizes integrated with cutting head module by said structure by described laser cutting device, need not use optical fiber, and the shortening of whole light path decreases the loss of power to a certain extent; Whole apparatus structure is simple, and integrated height, can reduce costs.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
The structural representation of the laser cutting device that Fig. 1 provides for the utility model embodiment.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, other embodiments all that those of ordinary skill in the art obtain under the prerequisite not making creative work, all belong to the scope of the utility model protection.
As Fig. 1, the utility model embodiment provides a kind of laser cutting device, comprises semiconductor laser 1, cutting head module 10 and laser enclosure 2.Described semiconductor laser 1 is encapsulated in described laser enclosure 2, wherein, adopts heat-barrier material and air layer to separate, adds heat-proof quality, effectively can prevent dew condensation phenomenon between described semiconductor laser 1 and described laser enclosure 2.
As Fig. 1, described cutting head module 10 is connected with the lower end of described laser enclosure 2 by a trapezoidal adjustable connecting components 5, described trapezoidal adjustable connecting components 5 is provided with two groups of regulating wheels (3 for finely tuning in X-axis and Y direction described cutting head module 10,4), described regulating wheel (3,4) be eccentric wheel, can finely tune in X-axis and Y-axis cutting head module 10 respectively, vertical with the light inlet of described cutting head module 10 to ensure described semiconductor laser 1 light-emitting window.The back side of described laser enclosure 2 is connected with a Z axis slide carriage, and is fixed on lathe bed and realizes described laser cutting device moving up and down at Z axis.Wherein, the inside of described semiconductor laser 1 and described cutting head module 10 forms a closed chamber.Without the need to using the optical path transmission devices such as optical fiber, simplifying light path greatly, saving space, be convenient to installation and debugging, and whole light path system is sealed in a described chamber, can effectively prevent entering of dust.
As Fig. 1, described cutting head module 10 comprises adjustable shell 6, height tracing device 7, regulating wheel 8, pulling type cover glass box 9, laser nozzle 11 and expands focus lamp assembly.In this preferred embodiment, described laser nozzle 11 is band ceramic ring nozzle 11, can increase service life.
As Fig. 1, described adjustable shell 6 connects the lower end of described trapezoidal adjustable connecting components 5, for realizing micro-displacement to laser nozzle 11 in X-direction.Described height tracing device 7 and described regulating wheel 8 are located at the both sides of described adjustable shell 6 respectively, and described height tracing device 7, for the distance in workpiece process at any time between monitoring laser nozzle 11 and workpiece, regulates Z axis height so that timely; Described regulating wheel 8 is for regulating the height of laser spot.The lower end of described adjustable shell 6 is located at by described pulling type cover glass box 9, and it can extract at any time, convenient to cover glass cleaning and replacing.Describedly expand the inside that described adjustable shell 6 is located at by focus lamp assembly, it comprises an arrangement of mirrors sheet and focuses on picture frame, for expanding laser beam and focusing on.Described laser nozzle 11 is located at the lower end of described pulling type cover glass box 9, for carrying out laser cutting to workpiece.
Compared with prior art, the described laser cutting device that provides of the utility model is logical has following beneficial effect:
1, semiconductor laser and cutting head inside modules form a closed chamber, are convenient to sealing, can effectively prevent external dust from entering pollution light path.
2, whole apparatus structure is simple, integrated height, and adopt semiconductor laser and the module-integrated structure of cutting head, need not use optical fiber, the shortening of whole light path decreases the loss of power to a certain extent; Also reduce cost simultaneously.
3, adopt heat-barrier material and air layer to separate between semiconductor laser and laser enclosure, add heat-proof quality, effectively can prevent dew condensation phenomenon.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection domain of the present utility model.
Claims (6)
1. a laser cutting device, it is characterized in that, comprise semiconductor laser, cutting head module and laser enclosure, described semiconductor laser is encapsulated in described laser enclosure, described cutting head module is connected with the lower end of described laser enclosure by a trapezoidal adjustable connecting components, and the back side of described laser enclosure is connected with a Z axis slide carriage;
Described cutting head module comprises adjustable shell, height tracing device, regulating wheel, pulling type cover glass box, laser nozzle and expands focus lamp assembly; described adjustable shell connects the lower end of described trapezoidal adjustable connecting components; described height tracing device and described regulating wheel are located at the both sides of described adjustable shell respectively; the lower end of described adjustable shell is located at by described pulling type cover glass box; describedly expand the inside that described adjustable shell is located at by focus lamp assembly; described laser nozzle is located at the lower end of described pulling type cover glass box, for carrying out laser cutting to workpiece.
2. laser cutting device as claimed in claim 1, is characterized in that: described trapezoidal adjustable connecting components is provided with two groups of regulating wheels for finely tuning in X-axis and Y direction described cutting head module.
3. laser cutting device as claimed in claim 2, is characterized in that: described regulating wheel is eccentric wheel.
4. laser cutting device as claimed in claim 1, is characterized in that: adopt heat-barrier material and air layer to separate between described semiconductor laser and described laser enclosure.
5. laser cutting device as claimed in claim 1, is characterized in that: the inside of described semiconductor laser and described cutting head module forms a closed chamber.
6. laser cutting device as claimed in claim 1, is characterized in that: described laser nozzle is band ceramic ring nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420862611.2U CN204381665U (en) | 2014-12-31 | 2014-12-31 | Laser cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420862611.2U CN204381665U (en) | 2014-12-31 | 2014-12-31 | Laser cutting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204381665U true CN204381665U (en) | 2015-06-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420862611.2U Active CN204381665U (en) | 2014-12-31 | 2014-12-31 | Laser cutting device |
Country Status (1)
| Country | Link |
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| CN (1) | CN204381665U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104607804A (en) * | 2014-12-31 | 2015-05-13 | 武汉华工激光工程有限责任公司 | Laser cutting device |
| CN105015176A (en) * | 2015-07-03 | 2015-11-04 | 宁波科镭仕激光科技有限公司 | Novel rotary marking machine |
| CN106312325A (en) * | 2015-07-07 | 2017-01-11 | 王爱华 | Novel laser cutting device |
-
2014
- 2014-12-31 CN CN201420862611.2U patent/CN204381665U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104607804A (en) * | 2014-12-31 | 2015-05-13 | 武汉华工激光工程有限责任公司 | Laser cutting device |
| CN105015176A (en) * | 2015-07-03 | 2015-11-04 | 宁波科镭仕激光科技有限公司 | Novel rotary marking machine |
| CN106312325A (en) * | 2015-07-07 | 2017-01-11 | 王爱华 | Novel laser cutting device |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |