CN204346940U - A kind of semiconductor packages appearance delection device - Google Patents
A kind of semiconductor packages appearance delection device Download PDFInfo
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- CN204346940U CN204346940U CN201520006840.9U CN201520006840U CN204346940U CN 204346940 U CN204346940 U CN 204346940U CN 201520006840 U CN201520006840 U CN 201520006840U CN 204346940 U CN204346940 U CN 204346940U
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Abstract
The utility model provides a kind of semiconductor packages appearance delection device, comprising: the first resistance controller, the first resistance light source control box, first camera, the second resistance controller, the second resistance light source control box, secondary light source control enclosure and second camera; Described first resistance controller, the first resistance light source control box, the first light source control box and first camera are connected successively, described second resistance controller, the second resistance light source control box, secondary light source control enclosure and second camera are connected successively, realize the industrial camera of two-way tunable light source, make profile measurement accurate, error is little.
Description
Technical field
The utility model relates to technical field of manufacturing semiconductors, particularly relates to a kind of semiconductor packages appearance delection device.
Background technology
Engineering is detected in encapsulation outward appearance, the yield of equipment glides, too much affect output too to the bad goods, materials and equipments of equipment site operation personnel, equipment loss also excessively (loss Overkill), thus causes being produced product yield because plant issue does not solve in time and declines.
Summary of the invention
The shortcoming of prior art in view of the above, the purpose of this utility model is to provide a kind of semiconductor packages appearance delection device, solves the problem that in above-mentioned prior art, semiconductor packages outward appearance detects.
For realizing above-mentioned target and other related objectives, the utility model provides a kind of semiconductor packages appearance delection device, comprising: the first resistance controller, the first resistance light source control box, first camera, the second resistance controller, the second resistance light source control box, secondary light source control enclosure and second camera; Described first resistance controller, the first resistance light source control box, the first light source control box and first camera are connected successively, described first resistance light source control box produces light modulation electric signal to the first light source control box according to the resistance adjustment of described first resistance controller, and described first light source control box regulates the light-source brightness of first camera according to described light modulation electric signal; Described second resistance controller, the second resistance light source control box, secondary light source control enclosure and second camera are connected successively, described second resistance light source control box produces light modulation electric signal to secondary light source control enclosure according to the resistance adjustment of described second resistance controller, and described secondary light source control enclosure regulates the light-source brightness of second camera according to described light modulation electric signal; Described first camera and second camera are arranged towards chip, for taking the encapsulation outward appearance of semiconductor product.
Optionally, described first resistance controller maximum value is greater than the second resistance controller.
Optionally, described first resistance controller comprises 5 resistance.
Optionally, described second resistance controller comprises 15 resistance.
Optionally, described first resistance controller to be connected the first resistance light source control box, the first light source control box and first camera successively by two first kind data lines.
Optionally, described second resistance controller connects the first resistance light source control box by single Second Type data line, and described second resistance light source controller Second Type data line and a 3rd categorical data line are connected the first light source control box and first camera successively.
Optionally, described first camera and second camera comprise camera lens.
As mentioned above, the utility model provides a kind of semiconductor packages appearance delection device, comprising: the first resistance controller, the first resistance light source control box, first camera, the second resistance controller, the second resistance light source control box, secondary light source control enclosure and second camera; Described first resistance controller, the first resistance light source control box, the first light source control box and first camera are connected successively, described second resistance controller, the second resistance light source control box, secondary light source control enclosure and second camera are connected successively, realize the industrial camera of two-way tunable light source, make profile measurement accurate, error is little.
Accompanying drawing explanation
Fig. 1 is shown as the structural representation of an embodiment of semiconductor packages appearance delection device of the present utility model.
Element numbers illustrates:
1-second resistance controller;
2-first resistance controller;
3-first kind data line;
4-Second Type data line;
5-the 3rd categorical data line;
6-first resistance light source control box;
7-second resistance light source control box;
8-first light source control box;
9-secondary light source control enclosure;
10-first camera;
11-second camera;
12-semiconductor product.
Embodiment
Below by way of specific instantiation, embodiment of the present utility model is described, those skilled in the art the content disclosed by this instructions can understand other advantages of the present utility model and effect easily.The utility model can also be implemented or be applied by embodiments different in addition, and the every details in this instructions also can based on different viewpoints and application, carries out various modification or change not deviating under spirit of the present utility model.It should be noted that, when not conflicting, the embodiment in the application and the feature in embodiment can combine mutually.
As shown in Figure 1, the utility model provides a kind of semiconductor packages appearance delection device, comprising: the first resistance controller 2, first resistance light source control box 4, first light source control box 8, first camera 10, second resistance controller 1, second resistance light source control box 7, secondary light source control enclosure 9 and second camera 11.
As shown in the figure, described semiconductor packages appearance delection device includes two cameras, thus to there being two light modulation circuits.
Article 1, circuit: described first resistance controller 2, first resistance light source control box 6, first light source control box 8 and first camera 10 are connected successively, described first resistance light source control box 6 produces light modulation electric signal to the first light source control box 8 according to the resistance adjustment of described first resistance controller 2, and described first light source control box 8 regulates the light-source brightness of first camera 10 according to described light modulation electric signal.
Article 2 circuit: described second resistance controller 1, second resistance light source control box 7, secondary light source control enclosure 9 and second camera 11 are connected successively, described second resistance light source control box 7 produces light modulation electric signal to secondary light source control enclosure 9 according to the resistance adjustment of described second resistance controller 1, and described secondary light source control enclosure 9 regulates the light-source brightness of second camera 11 according to described light modulation electric signal; Described first camera 10 and second camera 11 are arranged, for taking the encapsulation outward appearance of semiconductor product 12 towards chip.
In one embodiment, described first resistance controller 2 maximum value is greater than the second resistance controller 1; Such as, described first resistance controller 2 comprises 5 resistance, and described second resistance controller 1 comprises 15 resistance, and every resistance is such as X kilo-ohm.
Due to varying in size of the first resistance controller 2 and the second resistance controller 1, therefore the data line connected mode of two circuits and type equally can different (such as wiring radicals, the parameters such as resistance value are different); But data line not necessarily are limited with the size of resistance controller:
In one embodiment, described first resistance controller 2 to be connected the first resistance light source control box 6, first light source control box 8 and first camera 10 successively by two first kind data lines 3.
In one embodiment, described second resistance controller 1 connects the first resistance light source control box 6 by single Second Type data line 4, and described second resistance light source controller Second Type data line 4 and a 3rd categorical data line 5 are connected the first light source control box 8 and first camera 10 successively.
In one embodiment, described first camera 10 and second camera 11 comprise camera lens.
In sum, the utility model provides a kind of semiconductor packages appearance delection device, comprising: the first resistance controller, the first resistance light source control box, first camera, the second resistance controller, the second resistance light source control box, secondary light source control enclosure and second camera; Described first resistance controller, the first resistance light source control box, the first light source control box and first camera are connected successively, described second resistance controller, the second resistance light source control box, secondary light source control enclosure and second camera are connected successively, realize the industrial camera of two-way tunable light source, make profile measurement accurate, error is little.
Above-described embodiment is illustrative principle of the present utility model and effect thereof only, but not for limiting the utility model.Any person skilled in the art scholar all without prejudice under spirit of the present utility model and category, can modify above-described embodiment or changes.Therefore, such as have in art and usually know that the knowledgeable modifies or changes not departing from all equivalences completed under the spirit and technological thought that the utility model discloses, must be contained by claim of the present utility model.
Claims (7)
1. a semiconductor packages appearance delection device, is characterized in that, comprising: the first resistance controller, the first resistance light source control box, first camera, the second resistance controller, the second resistance light source control box, secondary light source control enclosure and second camera;
Described first resistance controller, the first resistance light source control box, the first light source control box and first camera are connected successively, described first resistance light source control box produces light modulation electric signal to the first light source control box according to the resistance adjustment of described first resistance controller, and described first light source control box regulates the light-source brightness of first camera according to described light modulation electric signal;
Described second resistance controller, the second resistance light source control box, secondary light source control enclosure and second camera are connected successively, described second resistance light source control box produces light modulation electric signal to secondary light source control enclosure according to the resistance adjustment of described second resistance controller, and described secondary light source control enclosure regulates the light-source brightness of second camera according to described light modulation electric signal;
Described first camera and second camera are arranged towards chip, for taking the encapsulation outward appearance of semiconductor product.
2. semiconductor packages appearance delection device according to claim 1, is characterized in that, described first resistance controller maximum value is greater than the second resistance controller.
3. semiconductor packages appearance delection device according to claim 2, is characterized in that, described first resistance controller comprises 5 resistance.
4. semiconductor packages appearance delection device according to claim 2, is characterized in that, described second resistance controller comprises 15 resistance.
5. semiconductor packages appearance delection device according to claim 1, is characterized in that, described first resistance controller to be connected the first resistance light source control box, the first light source control box and first camera successively by two first kind data lines.
6. semiconductor packages appearance delection device according to claim 1, it is characterized in that, described second resistance controller connects the first resistance light source control box by single Second Type data line, and described second resistance light source controller Second Type data line and a 3rd categorical data line are connected the first light source control box and first camera successively.
7. semiconductor packages appearance delection device according to claim 1, is characterized in that, described first camera and second camera comprise camera lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520006840.9U CN204346940U (en) | 2015-01-07 | 2015-01-07 | A kind of semiconductor packages appearance delection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520006840.9U CN204346940U (en) | 2015-01-07 | 2015-01-07 | A kind of semiconductor packages appearance delection device |
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| Publication Number | Publication Date |
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| CN204346940U true CN204346940U (en) | 2015-05-20 |
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| CN201520006840.9U Active CN204346940U (en) | 2015-01-07 | 2015-01-07 | A kind of semiconductor packages appearance delection device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108333068A (en) * | 2017-12-18 | 2018-07-27 | 海太半导体（无锡）有限公司 | Method for detecting curing degree of glue |
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2015
- 2015-01-07 CN CN201520006840.9U patent/CN204346940U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108333068A (en) * | 2017-12-18 | 2018-07-27 | 海太半导体（无锡）有限公司 | Method for detecting curing degree of glue |
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