CN204335138U - Thermal conductivity flexible wiring board - Google Patents
Thermal conductivity flexible wiring board Download PDFInfo
- Publication number
- CN204335138U CN204335138U CN201420831204.5U CN201420831204U CN204335138U CN 204335138 U CN204335138 U CN 204335138U CN 201420831204 U CN201420831204 U CN 201420831204U CN 204335138 U CN204335138 U CN 204335138U
- Authority
- CN
- China
- Prior art keywords
- wiring board
- thermal conductivity
- flexible wiring
- utility
- conductivity flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000003292 glue Substances 0.000 claims abstract description 12
- 239000004642 Polyimide Substances 0.000 claims abstract description 8
- 229920000297 Rayon Polymers 0.000 claims abstract description 8
- 229920001721 polyimide Polymers 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000010949 copper Substances 0.000 claims abstract description 5
- 229910052802 copper Inorganic materials 0.000 claims abstract description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Laminated Bodies (AREA)
Abstract
A kind of thermal conductivity flexible wiring board, the viscose glue including layers of copper, high heat conduction polyimide layer and they are pasted together.What adopt due to polyimide layer is the material with high-termal conductivity, so just the heat Quick diffusing of components and parts generation rapidly on wiring board can go out, thus can improve the useful life of components and parts, therefore more reasonable structure of the present utility model.
Description
Technical field
The utility model relates to a kind of flexible circuit board.
Background technology
We know, the electronic devices and components on wiring board are numerous, can produce a large amount of heats after powered up, and current flexible circuit board is athermanous substantially, cause the heat on wiring board to fall apart not go out, this not only can bring larger energy consumption, also greatly can reduce the useful life of components and parts.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art, provides a kind of more reasonable structure, tool heat sinking function can improve the thermal conductivity flexible wiring board in electronic devices and components useful life.
In order to solve the technical problem of above-mentioned existence, the utility model adopts following technical proposals:
A kind of thermal conductivity flexible wiring board, the viscose glue including layers of copper, high heat conduction polyimide layer and they are pasted together.
In the improvement project to above-mentioned thermal conductivity flexible wiring board, described viscose glue adopts epoxy resin, acrylic acid or heat-conducting glue.
Compared with prior art, the beneficial effects of the utility model are: the viscose glue including layers of copper, polyimide layer due to it and they be pasted together, and polyimide layer employing is the material with high-termal conductivity, so just can go out by the heat Quick diffusing that produces of the components and parts rapidly on wiring board, thus the useful life of components and parts can be improved, therefore more reasonable structure of the present utility model.
Below in conjunction with accompanying drawing and embodiment, the utility model is described in further detail:
[accompanying drawing explanation]
Fig. 1 is the structural representation of the utility model embodiment.
[embodiment]
The utility model is a kind of thermal conductivity flexible wiring board, as shown in Figure 1, its viscose glue 3 including layers of copper 1, polyimide layer 2 and they are pasted together, due to polyimide layer 2 employing is the material with high-termal conductivity, so just can go out by the heat Quick diffusing that produces of the components and parts rapidly on wiring board, thus the useful life of components and parts can be improved, therefore more reasonable structure of the present utility model.
Described viscose glue 3 adopts the glue or heat-conducting glue etc. of epoxy resin, acrylic acid material.
Although with reference to when embodiment describes principle of the present utility model and the scope of the claim restriction described in this disengaging in detail above; can make a variety of changes the utility model or revise; but be it will be apparent to one skilled in the art that by the disclosure; the detailed description of disclosure embodiment is only used for explaining; instead of be used for limiting the utility model, but be defined by the subject-matter of the claims the scope of protection.
Claims (2)
1. a thermal conductivity flexible wiring board, is characterized in that, the viscose glue including layers of copper, high heat conduction polyimide layer and they be pasted together.
2. thermal conductivity flexible wiring board according to claim 1, is characterized in that, described viscose glue adopts epoxy resin, acrylic acid or heat-conducting glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420831204.5U CN204335138U (en) | 2014-12-24 | 2014-12-24 | Thermal conductivity flexible wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420831204.5U CN204335138U (en) | 2014-12-24 | 2014-12-24 | Thermal conductivity flexible wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204335138U true CN204335138U (en) | 2015-05-13 |
Family
ID=53171442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420831204.5U Active CN204335138U (en) | 2014-12-24 | 2014-12-24 | Thermal conductivity flexible wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204335138U (en) |
-
2014
- 2014-12-24 CN CN201420831204.5U patent/CN204335138U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20151211 Address after: 529000 Guangdong province Jiangmen Jianghai Keyuan Road No. 17 building four floor B2 Patentee after: Jiangmen Jianghai Yong Chong Xin Electronics Co. Ltd. Address before: 529000 Guangdong Province, Jiangmen Jianghai garden Yuanzhi Bay Street six building 1502 Patentee before: Wang Yanxin |