CN204334933U - Piezoelectric ceramic chip architecture and Microspeaker - Google Patents
Piezoelectric ceramic chip architecture and Microspeaker Download PDFInfo
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- CN204334933U CN204334933U CN201420789933.9U CN201420789933U CN204334933U CN 204334933 U CN204334933 U CN 204334933U CN 201420789933 U CN201420789933 U CN 201420789933U CN 204334933 U CN204334933 U CN 204334933U
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- piezoelectric
- chip architecture
- ceramic chip
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- Piezo-Electric Transducers For Audible Bands (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The utility model relates to piezoelectric ceramic chip architecture and Microspeaker.Piezoelectric ceramic chip architecture, comprise piezoelectric patches, the first electrode, the first electrode is arranged on one end of piezoelectric patches, is provided with the second electrode at the other end of piezoelectric patches, and this second electrode is provided with the spatial accommodation running through this second electrode.The utility model has the good feature of structural stability.
Description
Technical field
The utility model relates to a kind of piezoelectric ceramic chip architecture and Microspeaker.
Background technology
Along with the extensive use of piezoelectric ceramic alarm, the requirement of alarm to piezoelectric ceramic piece is also more and more higher, for the piezoelectric ceramic alarm of increasing high-power, high sound pressure, require, between piezoelectric ceramic piece electrode outlet line and electrode, there is powerful adhesive force, make piezoelectric ceramic piece when strong operational vibration, the unlikely lead-out wire solder joint of stress produced comes off, and avoids occurring during product work bad.
As shown in Figure 1, for a kind of piezoelectric patches that the applicant produces in early days, its concrete structure is: potsherd electrode 4 and potsherd electrode 6 are the modes by printing, electrode slurry is printed on piezoelectric patches 5, formed through high temperature silver ink firing, green oil layer 3 is by mode of printing, is printed on potsherd electrode 4, and vibrating diaphragm 1 is attached together by glue 2 and green oil layer 3.The vibrating diaphragm 1 of this kind of ceramic chip structure is attached together by glue 2 and green oil layer 3, when piezoelectric patches 5 is in strong operational vibration, the stress that vibration produces concentrates on glue 2 with on green oil 3 and potsherd 4 electrode, therefore, very easily cause on the green oil layer 3 of adhering to glue 2 and potsherd electrode 4 piezoelectric patches 5 and come off.Tracing it to its cause, is because the adhesive force between glue and green oil is little, is difficult to the stress produced when bearing piezoelectric patches vibration, finally causes glue 2 and the mould 1 that shakes to come off.
Summary of the invention
The utility model provides a kind of piezoelectric ceramic chip architecture and Microspeaker, and the utility model has the good feature of structural stability.
The technical scheme realizing the utility model object is as follows:
Piezoelectric ceramic chip architecture, comprise piezoelectric patches, the first electrode, the first electrode is arranged on one end of piezoelectric patches, is provided with the second electrode at the other end of piezoelectric patches, and this second electrode is provided with the spatial accommodation running through this second electrode.
Preferably, described spatial accommodation is hole or groove.
Preferably, the area of described spatial accommodation is 80-100mm
2.
Preferably, the surface deviating from piezoelectric patches of described second electrode is provided with green oil layer.
A kind of Microspeaker, comprises vibrating diaphragm, also comprises piezoelectric ceramic piece, and one end of described vibrating diaphragm, through after the spatial accommodation on the second electrode in piezoelectric ceramic piece, is bondd by binding agent and piezoelectric patches fixing.
Preferably, described binding agent is glue.
Advantage of the present utility model is: the utility model, owing to being provided with spatial accommodation on the second electrode, is directly connected with piezoelectric patches after this spatial accommodation passes for vibrating diaphragm.When vibrating diaphragm is by glue directly and after piezoelectric patches is attached together, adhesive force between glue and piezoelectric patches is much larger than the adhesive force between potsherd electrode and piezoelectric patches, therefore piezoelectric patches in strong operational vibration time, adhesive force between glue and piezoelectric patches is enough to the stress bearing vibration generation, thus avoids causing vibrating diaphragm to come off.
Accompanying drawing explanation
Fig. 1 is the structural representation of piezoelectric ceramic piece of the prior art;
Fig. 2 is the structural representation of piezoelectric ceramic chip architecture of the present utility model;
Fig. 3 is the structural representation of Microspeaker of the present utility model;
Embodiment
As shown in Figure 2, for piezoelectric ceramic chip architecture A of the present utility model, comprise one end that piezoelectric patches 5, first electrode 6, first electrode 6 is arranged on piezoelectric patches 5, be provided with the second electrode 4 at the other end of piezoelectric patches, this second electrode 4 is provided with the spatial accommodation 4a running through this second electrode 4.The effect of spatial accommodation 4a is passed for vibrating diaphragm 1, and being vibrating diaphragm 1 provides to allow a bit space.Preferably, described spatial accommodation 4a is hole, and in present embodiment, the shape of the second electrode 4 is circular, after being provided with spatial accommodation 4a on the second electrode 4, and the ringwise shape of whole second electrode 4.Certainly, spatial accommodation 4a also can be the structure of groove.The area of spatial accommodation 4a is 80-100mm
2, the area of spatial accommodation 4a can be 80mm
2, 85mm
2, 90mm
2, 95mm
2, 100mm
2, but the area of spatial accommodation 4a is preferably 80mm
2.The surface deviating from piezoelectric patches 5 of described second electrode 4 is provided with green oil layer 3, and green oil layer 3 is mainly protected the second electrode 4, prevents the second electrode 4 oxidized.
Above-mentioned second electrode 4 and the first electrode 6 are the modes by printing, and electrode slurry is printed on piezoelectric patches 5, is formed through high temperature silver ink firing, green oil layer 3 is by mode of printing, and printing on the second electrode 4.
As shown in Figure 3, for Microspeaker B of the present utility model, comprise vibrating diaphragm 1, also comprise the piezoelectric ceramic piece A in above-mentioned execution mode, one end of described vibrating diaphragm 1, through after the spatial accommodation 4a on the second electrode 4 in piezoelectric ceramic piece A, is bondd by binding agent 2 and piezoelectric patches 5 fixing.Preferably, described binding agent 2 is glue.
Claims (6)
1. piezoelectric ceramic chip architecture, comprise piezoelectric patches (5), the first electrode (6), first electrode (6) is arranged on one end of piezoelectric patches (5), it is characterized in that: be provided with the second electrode (4) at the other end of piezoelectric patches (5), this second electrode (4) is provided with the spatial accommodation running through this second electrode (4).
2. piezoelectric ceramic chip architecture according to claim 1, is characterized in that, described spatial accommodation is hole or groove.
3. piezoelectric ceramic chip architecture according to claim 1 and 2, is characterized in that, the area of described spatial accommodation is 80-100mm
2.
4. piezoelectric ceramic chip architecture according to claim 1, is characterized in that, the surface deviating from piezoelectric patches (5) of described second electrode (4) is provided with green oil layer (3).
5. a Microspeaker, comprise vibrating diaphragm (1), it is characterized in that, also comprise the piezoelectric ceramic chip architecture as described in Claims 1-4, one end of described vibrating diaphragm (1), through after the spatial accommodation on the second electrode (4) in piezoelectric ceramic piece, is bondd by binding agent (2) and piezoelectric patches (5) fixing.
6. Microspeaker according to claim 5, is characterized in that, described binding agent (2) is glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420789933.9U CN204334933U (en) | 2014-12-15 | 2014-12-15 | Piezoelectric ceramic chip architecture and Microspeaker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420789933.9U CN204334933U (en) | 2014-12-15 | 2014-12-15 | Piezoelectric ceramic chip architecture and Microspeaker |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204334933U true CN204334933U (en) | 2015-05-13 |
Family
ID=53171237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420789933.9U Active CN204334933U (en) | 2014-12-15 | 2014-12-15 | Piezoelectric ceramic chip architecture and Microspeaker |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204334933U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105704907A (en) * | 2016-02-22 | 2016-06-22 | 汉得利（常州）电子股份有限公司 | Flexible circuit board for reducing impedance of piezoresonator |
-
2014
- 2014-12-15 CN CN201420789933.9U patent/CN204334933U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105704907A (en) * | 2016-02-22 | 2016-06-22 | 汉得利（常州）电子股份有限公司 | Flexible circuit board for reducing impedance of piezoresonator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |