CN204333038U - Novel piezo-electric ceramic chip architecture - Google Patents
Novel piezo-electric ceramic chip architecture Download PDFInfo
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- CN204333038U CN204333038U CN201420745921.6U CN201420745921U CN204333038U CN 204333038 U CN204333038 U CN 204333038U CN 201420745921 U CN201420745921 U CN 201420745921U CN 204333038 U CN204333038 U CN 204333038U
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- electric ceramic
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Abstract
The utility model discloses a kind of novel piezo-electric ceramic chip architecture, comprise potsherd body, positive pole, negative pole and electrode outlet line, positive pole and negative pole are arranged at the two ends of potsherd body respectively, the end face deviating from potsherd body of positive pole is provided with conductive metal sheet, and one end and the conductive metal sheet of described electrode outlet line are welded and fixed.The utility model has the good feature of structural stability.
Description
Technical field
The utility model relates to a kind of novel piezo-electric ceramic chip architecture.
Background technology
Along with the extensive use of piezoelectric ceramic alarm, the requirement of alarm to piezoelectric ceramic piece is also more and more higher, for the piezoelectric ceramic alarm of increasing high-power, high sound pressure, require, between piezoelectric ceramic piece electrode outlet line and electrode, there is powerful adhesive force, make piezoelectric ceramic piece when strong operational vibration, the unlikely lead-out wire solder joint of stress produced comes off, and avoids occurring during product work bad.
As depicted in figs. 1 and 2, the piezoelectric ceramic piece that applicant produces, this piezoelectric ceramic piece comprises positive pole 1, potsherd body 2 and negative pole 3, positive pole 1 is arranged on one end of potsherd body 2, negative pole 3 is arranged on the other end of potsherd body 2, and one end of electrode outlet line 4 is then connected as one by welding manner and positive pole 1.The electrode outlet line 4 of this kind of ceramic chip structure is attached together by means of only solder joint 5 and positive pole 1, when potsherd body 2 operationally, strong vibration can be produced, vibration produce stress be concentrated on solder joint 5, therefore, very easily make to cause solder joint 5 to come off from positive pole 1.
Summary of the invention
The utility model provides a kind of novel piezo-electric ceramic chip architecture, and the utility model has the good feature of structural stability.
The technical scheme realizing the utility model object is as follows:
Novel piezo-electric ceramic chip architecture, comprise potsherd body, positive pole, negative pole and electrode outlet line, positive pole and negative pole are arranged at the two ends of potsherd body respectively, the end face deviating from potsherd body of positive pole is provided with conductive metal sheet, and one end and the conductive metal sheet of described electrode outlet line are welded and fixed.
Preferably, described conductive metal sheet is bonded on positive pole by glue.
Preferably, described conductive metal sheet is alloy sheet.
Preferably, described alloy sheet is nickel alloy sheet, or is alcu alloy film, or is magnesium alloy.
Preferably, described conductive metal sheet is copper sheet, or iron plate, or is manganese sheet.
Preferably, the thickness of described conductive metal sheet is 0.03-0.06mm.
Preferably, the surface area of described conductive metal sheet is 80-100mm
2.
The utility model has the advantage of: positive pole is connected with electrode outlet line by conductive metal sheet, because the surface area of conductive metal sheet is large, not only substantially increase the adhesive force of electrode outlet line, also avoid piezoelectric ceramic piece when strong operational vibration, electrode outlet line solder joint obscission.Therefore, the stability of pressure ceramic structure is enhanced.
The utility model can be applicable to, in the piezoelectric ceramic alarm of high-power, high sound pressure, can bear the vibration that frequency is higher.
Accompanying drawing explanation
Fig. 1 is the structural representation of piezoelectric ceramic piece of the prior art;
Fig. 2 is the vertical view of Fig. 1;
Fig. 3 is the structural representation of piezoelectric ceramic piece of the present utility model;
Fig. 4 is the vertical view of Fig. 3.
Embodiment
As shown in Figure 3 and Figure 4, novel piezo-electric ceramic chip architecture of the present utility model, comprises potsherd body 2, positive pole 1, negative pole 3 and electrode outlet line 4.Positive pole 1 and negative pole 3 are arranged at the two ends of potsherd body 2 respectively, and positive pole 1 and negative pole 3 are the modes by printing, electrode slurry is printed on potsherd body 2, is formed through high temperature silver ink firing.The end face deviating from potsherd body 2 of positive pole 1 is provided with conductive metal sheet 6, and one end and the conductive metal sheet 6 of described electrode outlet line 4 are welded and fixed, and form solder joint 5 between conductive metal sheet 6 and electrode outlet line 4.Described conductive metal sheet 6 is bonded on positive pole 1 by glue 7.The thickness of described conductive metal sheet 6 is 0.03-0.06mm, and the thickness of conductive metal sheet 6 can be 0.03mm, 0.04mm, 0.05mm, 0.06mm, or any one value between these two numerical value, and the thickness of conductive metal sheet 6 is preferably 0.04mm.The surface area of described conductive metal sheet 6 is 80-100mm
2, preferably, this surface area can be 80mm
2, 90mm
2, 100mm
2, or any one value between these two numerical value, and the surface area preferred value of conductive metal sheet 6 is 90mm
2.The area of the surface area ratio solder joint 5 of conductive metal sheet 6 is obviously much bigger, therefore, when piezoelectric ceramic piece is subject to vibrating, the stress that vibration produces has been dispersed on the larger conductive metal sheet of area 6, avoid and act directly on solder joint 5, thus prevent coming off of the solder joint 5 on electrode outlet line 4.
Conductive metal sheet 6 in the utility model is alloy sheet.Described alloy sheet is nickel alloy sheet, or is alcu alloy film, or is magnesium alloy.Conductive metal sheet 6 is preferably nickel alloy sheet.
Conductive metal sheet 6 is except adopting alloy material making, and can also adopt conventional metal material, such as conductive metal sheet 6 is copper sheet, or iron plate, or is manganese sheet, and as common metal, copper is the preferred material making conductive metal sheet 6.
Claims (7)
1. novel piezo-electric ceramic chip architecture, comprise potsherd body (2), positive pole (1), negative pole (3) and electrode outlet line (4), positive pole (1) and negative pole (3) are arranged at the two ends of potsherd body (2) respectively, it is characterized in that: on the end face deviating from potsherd body (2) of positive pole (1), be provided with conductive metal sheet (6), one end and the conductive metal sheet (6) of described electrode outlet line (4) are welded and fixed.
2. novel piezo-electric ceramic chip architecture according to claim 1, is characterized in that: described conductive metal sheet (6) is bonded on positive pole (1) by glue.
3. novel piezo-electric ceramic chip architecture according to claim 1, is characterized in that: described conductive metal sheet (6) is alloy sheet.
4. novel piezo-electric ceramic chip architecture according to claim 3, is characterized in that: described alloy sheet is nickel alloy sheet, or is alcu alloy film, or is magnesium alloy.
5. novel piezo-electric ceramic chip architecture according to claim 1, is characterized in that: described conductive metal sheet (6) is copper sheet, or iron plate, or is manganese sheet.
6. the novel piezo-electric ceramic chip architecture according to claim 1 to 5 any one, is characterized in that: the thickness of described conductive metal sheet (6) is 0.03-0.06mm.
7. the novel piezo-electric ceramic chip architecture according to claim 1 to 5 any one, is characterized in that: the surface area of described conductive metal sheet (6) is 80-100mm
2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420745921.6U CN204333038U (en) | 2014-12-02 | 2014-12-02 | Novel piezo-electric ceramic chip architecture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420745921.6U CN204333038U (en) | 2014-12-02 | 2014-12-02 | Novel piezo-electric ceramic chip architecture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204333038U true CN204333038U (en) | 2015-05-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420745921.6U Active CN204333038U (en) | 2014-12-02 | 2014-12-02 | Novel piezo-electric ceramic chip architecture |
Country Status (1)
| Country | Link |
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| CN (1) | CN204333038U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106025057A (en) * | 2016-07-07 | 2016-10-12 | 广东捷成科创电子股份有限公司 | Large field strength and high reliability piezoelectric ceramic element and its application |
-
2014
- 2014-12-02 CN CN201420745921.6U patent/CN204333038U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106025057A (en) * | 2016-07-07 | 2016-10-12 | 广东捷成科创电子股份有限公司 | Large field strength and high reliability piezoelectric ceramic element and its application |
| CN106025057B (en) * | 2016-07-07 | 2018-11-02 | 广东捷成科创电子股份有限公司 | A kind of highly reliable piezo ceramic element of big field strength and its application |
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