CN204314513U - QSFP+ optical module assembly - Google Patents
QSFP+ optical module assembly Download PDFInfo
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- CN204314513U CN204314513U CN201420727454.4U CN201420727454U CN204314513U CN 204314513 U CN204314513 U CN 204314513U CN 201420727454 U CN201420727454 U CN 201420727454U CN 204314513 U CN204314513 U CN 204314513U
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Abstract
The utility model relates to a kind of QSFP+ optical module assembly, and comprise RX and hold optical module and TX to hold optical module, RX holds in optical module and is provided with PD chip array, and TX holds in optical module and is provided with VCSEL chip array; Described RX holds optical module to have a plastic stent unit, and plastic stent unit inside is provided with light path assembled unit; Described light path assembled unit comprises a coated optics assembly, four 45 ° of reflective surfaces and a four-way lens arra, described four 45 ° of reflective surfaces are positioned at immediately below described coated optics assembly, described four-way lens arra is positioned at immediately below described four 45 ° of reflective surfaces, the front of described coated optics assembly is provided with A coating film area and B coating film area, and reverse side is provided with C coating film area, D coating film area, E coating film area and F coating film area successively.Described QSFP+ optical module assembly adopts coated optics assembly to carry out wavelength chooses, thus is greatly simplified by the coupling technique of complexity, and production difficulty reduces, and can effectively enhance productivity.
Description
Technical field
The utility model relates to the combination of a kind of light path and physical construction, particularly relates to a kind of QSFP+ optical module assembly.
Background technology
Along with digitized process, the process of data, storage and transmission obtain development at full speed.The search service of big data quantity and the swift and violent growth of video traffic, greatly driven with supercomputer and the data center market being stored as basis.40G QSFP+ optical module (enhanced edition four-way SFP optical module), as the major product of short distance interconnecting application, has broad application prospects.The purpose of design of this module is by less volume and lower cost, provides higher access density, final raising user access capacity.
The QSFP+ scheme of CWDM, by closing ripple/partial wave assembly accordingly, enters the optically-coupled of λ 1, λ 2, λ 3, λ 4 four wavelength in one-channel optical fiber, or single light with optical fiber is divided into four passages receives.Compared with traditional four-way QSFP+ module, number of fibers greatly reduces, and light channel structure is compacter, is beneficial to optical cable laying and the maintenance of data center.
But conjunction ripple/partial wave assembly that application is more at present, mainly use the scheme of optical waveguide, it is more to there is element in this scheme, complex process, the drawback that production difficulty is large and cost is higher.
Therefore be necessary to design a kind of QSFP+ optical module assembly, to overcome the problems referred to above.
Utility model content
The purpose of this utility model is the defect overcoming prior art, and provide a kind of technique simple QSFP+ optical module assembly, it can be enhanced productivity.
The utility model is achieved in that
The utility model provides a kind of QSFP+ optical module assembly, comprising RX holds optical module and TX to hold optical module, described RX holds in optical module and is provided with PD chip array, and described TX holds in optical module and is provided with VCSEL chip array, and described RX holds optical module and TX to hold optical module to be located on a pcb board; Described RX holds optical module to have a plastic stent unit, and described plastic stent unit inside is provided with light path assembled unit, and the upper end of described plastic stent unit is provided with LC interface, for Fiber connection; Described light path assembled unit comprises a coated optics assembly, four 45 ° of reflective surfaces and a four-way lens arra, described four 45 ° of reflective surfaces are positioned at immediately below described coated optics assembly, described four-way lens arra is positioned at immediately below described four 45 ° of reflective surfaces, the front of described coated optics assembly is provided with A coating film area and B coating film area, and reverse side is provided with C coating film area, D coating film area, E coating film area and F coating film area successively; The light beam of λ 1, λ 2, λ 3 and λ 4 is respectively successively after described coated optics assembly, four described 45 ° of reflective surfaces and described four-way lens arra from four bundle wavelength of fiber exit, enter described PD chip array, wherein, described A coating film area is the long anti-reflection film region of all-wave, and described B coating film area is the long reflector space of all-wave; Described C coating film area is the anti-reflection region of λ 1, λ 2, λ 3 and λ 4 reflector space; Described D coating film area is the anti-reflection region of λ 2, λ 3 and λ 4 reflector space; Described E coating film area is the anti-reflection region of λ 3, λ 4 reflector space; Described F coating film area is the anti-reflection region of λ 4.
Further, described TX holds optical module to hold the structure of the light path assembled unit in optical module identical with described RX.
Further, described RX holds optical module to have collimating lens, and described collimation lens is positioned at the inside of described LC interface.
Further, described PD chip array comprises four PD chips, and the light beam that four bundle wavelength are respectively λ 1, λ 2, λ 3 and λ 4 is assembled respectively on described four PD chips.
Further, described coated optics assembly comprises a dip plane and an optics slide, described optics slide is provided with plated film, and form described A coating film area, B coating film area in its front, reverse side forms described C coating film area, D coating film area, E coating film area and F coating film area, and the light beam that four bundle wavelength are respectively λ 1, λ 2, λ 3 and λ 4 injects described optics slide after the reflection of described dip plane.
Further, described coated optics assembly is a wedge of glass block, described wedge of glass block is provided with plated film, and form described A coating film area, B coating film area in its front, reverse side forms described C coating film area, D coating film area, E coating film area and F coating film area, and the beam orthogonal that four bundle wavelength are respectively λ 1, λ 2, λ 3 and λ 4 injects described wedge of glass block.
Further, described plastic stent unit is provided with reinforcement.
The utility model has following beneficial effect:
The light beam of λ 1, λ 2, λ 3 and λ 4 is respectively successively after described coated optics assembly, four described 45 ° of reflective surfaces and described four-way lens arra from four bundle wavelength of fiber exit, enter described PD chip array, wherein, described A coating film area is the long anti-reflection film region of all-wave, and described B coating film area is the long reflector space of all-wave; Described C coating film area is the anti-reflection region of λ 1, λ 2, λ 3 and λ 4 reflector space; Described D coating film area is the anti-reflection region of λ 2, λ 3 and λ 4 reflector space; Described E coating film area is the anti-reflection region of λ 3, λ 4 reflector space; Described F coating film area is the anti-reflection region of λ 4.Described QSFP+ optical module assembly adopts coated optics assembly to carry out wavelength chooses, thus is greatly simplified by the coupling technique of complexity, and production difficulty reduces, thus can effectively enhance productivity.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
The structural representation of the QSFP+ optical module assembly that Fig. 1 provides for the utility model embodiment;
The structural representation of the RX end optical module that Fig. 2 provides for the utility model embodiment;
The structural representation of light path assembled unit first embodiment that Fig. 3 provides for the utility model embodiment;
The structural representation of the optics slide plated film that Fig. 4 provides for the utility model embodiment;
The structural representation of 45 ° of reflective surfaces that Fig. 5 provides for the utility model embodiment and four-way lens arra;
The light path plane figure of RX end optical module first embodiment that Fig. 6 provides for the utility model embodiment;
The structural representation of light path assembled unit second embodiment that Fig. 7 provides for the utility model embodiment;
The light path schematic diagram of RX end optical module second embodiment that Fig. 8 provides for the utility model embodiment;
The structural representation of light path assembled unit the 3rd embodiment that Fig. 9 provides for the utility model embodiment;
The light path schematic diagram of RX end optical module the 3rd embodiment that Figure 10 provides for the utility model embodiment.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, other embodiments all that those of ordinary skill in the art obtain under the prerequisite not making creative work, all belong to the scope of the utility model protection.
As Fig. 1 and Fig. 2, the utility model embodiment provides a kind of QSFP+ optical module assembly, comprising RX holds optical module 104 and TX to hold optical module 105, described RX holds in optical module 104 and is provided with PD chip array 102, described TX holds in optical module 105 and is provided with VCSEL chip array 103, described RX holds optical module 104(receiving end optical module) and TX end optical module 105(transmitting terminal optical module) be located on a pcb board 106, in this preferred embodiment, described RX holds optical module 104 and TX to hold optical module 105 to be all mounted on same pcb board 106 by high precision patch device, form the light path part of QSFP+ optical module assembly.
As Fig. 1 and Fig. 2, described RX holds optical module 104 to have a plastic stent unit 201, and described plastic stent unit 201 inside is provided with light path assembled unit 202, and the upper end of described plastic stent unit 201 is provided with LC interface, for Fiber connection.Described plastic stent unit 201 is provided with reinforcement, for strengthening integrally-built intensity.Due to the reversibility of light path, described TX holds optical module 105 to hold the light path assembled unit 202 in optical module 104 can adopt identical structure with described RX, only describes the structure that RX holds the light path assembled unit 202 in optical module 104 below.Described RX holds optical module 104 to have collimating lens 601, and described collimation lens 601 is positioned at the inside of described LC interface, for changing light beam into directional light.
As Fig. 1 to Fig. 6, described RX holds the light path assembled unit 202 of optical module 104 to comprise a coated optics assembly, four 45 ° of reflective surfaces 303 and a four-way lens arra 502, described four 45 ° of reflective surfaces 303 are positioned at immediately below described coated optics assembly, and described four-way lens arra 502 is positioned at immediately below described four 45 ° of reflective surfaces 303.The front of described coated optics assembly is provided with A coating film area and B coating film area, and reverse side is provided with C coating film area, D coating film area, E coating film area and F coating film area successively; The light beam of λ 1, λ 2, λ 3 and λ 4 is respectively successively after described coated optics assembly, four described 45 ° of reflective surfaces 303 and described four-way lens arra 502 from four bundle wavelength of fiber exit, enter described PD chip array 102, wherein, described A coating film area is the long anti-reflection film region of all-wave, and the light beam of all wavelengths all can pass through.Described B coating film area is the long reflector space of all-wave, and the light beam of all wavelengths all reflects.Described C coating film area is the anti-reflection region of λ 1, λ 2, λ 3 and λ 4 reflector space, and namely wavelength is that the light beam of λ 1 can be through, and wavelength is λ 2, the light beam of λ 3 and λ 4 then reflects.Described D coating film area is the anti-reflection region of λ 2, λ 3 and λ 4 reflector space, and namely wavelength is that the light beam of λ 2 can be through, and wavelength is that the light beam of λ 3 and λ 4 then reflects.Described E coating film area is the anti-reflection region of λ 3, λ 4 reflector space, and namely wavelength is that the light beam of λ 3 can be through, and wavelength is that the light beam of λ 4 then reflects.Described F coating film area is the anti-reflection region of λ 4, and namely wavelength is that the light beam of λ 4 can be through.Light beam enters from A coating film area, and penetrates from C coating film area, D coating film area, E coating film area and F coating film area successively.
As Fig. 1 to Fig. 6, described PD chip array 102 comprises four PD chips, and the light beam that four bundle wavelength are respectively λ 1, λ 2, λ 3 and λ 4 is assembled respectively on described four PD chips.
As Fig. 1 to Fig. 6, the first embodiment of described coated optics assembly is as follows:
Described coated optics assembly comprises dip plane 301 and an optics slide 302, and the effect of described dip plane 301 is that light path is reflected, outgoing at a certain angle.The pros and cons of described optics slide 302 is equipped with plated film, and forms described A coating film area and B coating film area in its front, and reverse side forms described C coating film area, D coating film area, E coating film area and F coating film area.The light beam that four bundle wavelength are respectively λ 1, λ 2, λ 3 and λ 4 injects described optics slide 302 after described dip plane 301 is reflected, and is transmitted through PD chip through four-way lens arra 502.Detailed process is as follows: comprise four wavelength be the light beam of λ 1, λ 2, λ 3, λ 4 from fiber exit, become parallel beam via collimation lens; The A coating film area of optics slide 302 is entered into through dip plane 301 refraction, the C coating film area of reverse side is projected through the refraction of A coating film area, wavelength is that the light beam of λ 1 transmits optics slide 302, light can be made on 45 ° of reflectings surface by design, bend downwards through reflected light path, then converge to the surface of PD chip through four-way lens arra 502; Comprise wavelength be the folded light beam of λ 2, λ 3, λ 4 through the reflection of slide B coating film area, then project D coating film area, transmit the light beam that wavelength is λ 2; Comprise wavelength be the folded light beam of λ 3, λ 4 through the reflection of slide B coating film area, then project E coating film area, transmit the light beam that wavelength is λ 3; Wavelength is that the folded light beam of λ 4 reflects through slide B coating film area, then projects F coating film area, finally transmits, and converges to the surface of PD chip.
Manufacture and design RX by die sinking and hold optical module 104, by simple technological operation, optical fiber, optics slide 302, four-way lens arra 502 can be fixed together, be easy to like this carry out follow-up coupling operation, and can be fixed by simple adhesion process.And light channel structure is stablized, position and the coupling tolerance of each several part optical module can be ensured by the appropriate design of the precision of die sinking and lens face type.
As Fig. 7 and Fig. 8, second embodiment of described coated optics assembly is as follows: described coated optics assembly is a wedge of glass block 801, described wedge of glass block 801 is provided with plated film, and form described A coating film area, B coating film area in its front, reverse side forms described C coating film area, D coating film area, E coating film area and F coating film area, and the beam orthogonal that four bundle wavelength are respectively λ 1, λ 2, λ 3 and λ 4 injects described wedge of glass block 801.Adopt the mode of wedge of glass block 801 two sides plated film, the light splitting of light path is realized by the angle of inclination of appropriate design glass blocks, coating film area is identical with the coating film area of the first embodiment, its advantage is need not the refraction of dip plane 301 in the first embodiment, light is made to impinge perpendicularly in wedge of glass block 801, can reduce reflection, its effect reached is identical with the first embodiment with principle, is not repeated herein.
As shown in Figure 9, the utility model also comprises the 3rd embodiment, and light path assembled unit 202 comprises: 45 ° of reflectings surface 1001 of design on plastic stent unit 201, are used for light path is totally reflected; 45 ° of ledge structures 1002 of processing on plastic stent unit 202, are used for pasting reflective slide; The optical flat 1003 of processing on plastic stent unit 202, is used for making reflection ray be transmitted to bottom surface.As shown in Figure 10, be illustrated as 45 ° of ledge structures 1002 pasted reflective slide after light channel structure, position plating λ 1 reflectance coating of 1101 in the drawings, λ 2, λ 3 and λ 4 anti-reflection film; Position plating λ 2 reflectance coating of 1102 in the drawings, λ 3 and λ 4 anti-reflection film; Position plating λ 3 reflectance coating of 1103 in the drawings, λ 4 anti-reflection film; Position plating λ 4 reflectance coating of 1104 in the drawings.By pasting in the structure of 1002 by diaphragm, stable light path can be obtained, light beam being opened by wavelength division and converges on chip.The principle that the present embodiment adopts is identical with embodiment above, is not repeated herein.
In sum, described QSFP+ optical module assembly adopts coated optics assembly to carry out wavelength chooses, thus is greatly simplified by the coupling technique of complexity, and production difficulty reduces, thus can effectively enhance productivity.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection domain of the present utility model.
Claims (7)
1. a QSFP+ optical module assembly, it is characterized in that, comprise RX and hold optical module and TX to hold optical module, described RX holds in optical module and is provided with PD chip array, described TX holds in optical module and is provided with VCSEL chip array, and described RX holds optical module and TX to hold optical module to be located on a pcb board;
Described RX holds optical module to have a plastic stent unit, and described plastic stent unit inside is provided with light path assembled unit, and the upper end of described plastic stent unit is provided with LC interface, for Fiber connection;
Described light path assembled unit comprises a coated optics assembly, four 45 ° of reflective surfaces and a four-way lens arra, described four 45 ° of reflective surfaces are positioned at immediately below described coated optics assembly, described four-way lens arra is positioned at immediately below described four 45 ° of reflective surfaces, the front of described coated optics assembly is provided with A coating film area and B coating film area, and reverse side is provided with C coating film area, D coating film area, E coating film area and F coating film area successively;
The light beam of λ 1, λ 2, λ 3 and λ 4 is respectively successively after described coated optics assembly, four described 45 ° of reflective surfaces and described four-way lens arra from four bundle wavelength of fiber exit, enter described PD chip array, wherein, described A coating film area is the long anti-reflection film region of all-wave, and described B coating film area is the long reflector space of all-wave; Described C coating film area is the anti-reflection region of λ 1, λ 2, λ 3 and λ 4 reflector space; Described D coating film area is the anti-reflection region of λ 2, λ 3 and λ 4 reflector space; Described E coating film area is the anti-reflection region of λ 3, λ 4 reflector space; Described F coating film area is the anti-reflection region of λ 4.
2. QSFP+ optical module assembly as claimed in claim 1, is characterized in that: described TX holds optical module to hold the structure of the light path assembled unit in optical module identical with described RX.
3. QSFP+ optical module assembly as claimed in claim 1 or 2, is characterized in that: described RX holds optical module to have collimating lens, and described collimation lens is positioned at the inside of described LC interface.
4. QSFP+ optical module assembly as claimed in claim 1, is characterized in that: described PD chip array comprises four PD chips, and the light beam that four bundle wavelength are respectively λ 1, λ 2, λ 3 and λ 4 is assembled respectively on described four PD chips.
5. QSFP+ optical module assembly as claimed in claim 1, it is characterized in that: described coated optics assembly comprises a dip plane and an optics slide, described optics slide is provided with plated film, and form described A coating film area, B coating film area in its front, reverse side forms described C coating film area, D coating film area, E coating film area and F coating film area, and the light beam that four bundle wavelength are respectively λ 1, λ 2, λ 3 and λ 4 injects described optics slide after the reflection of described dip plane.
6. QSFP+ optical module assembly as claimed in claim 1, it is characterized in that: described coated optics assembly is a wedge of glass block, described wedge of glass block is provided with plated film, and form described A coating film area, B coating film area in its front, reverse side forms described C coating film area, D coating film area, E coating film area and F coating film area, and the beam orthogonal that four bundle wavelength are respectively λ 1, λ 2, λ 3 and λ 4 injects described wedge of glass block.
7. QSFP+ optical module assembly as claimed in claim 1, is characterized in that: described plastic stent unit is provided with reinforcement.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201420727454.4U CN204314513U (en) | 2014-11-28 | 2014-11-28 | QSFP+ optical module assembly |
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| CN201420727454.4U CN204314513U (en) | 2014-11-28 | 2014-11-28 | QSFP+ optical module assembly |
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| CN204314513U true CN204314513U (en) | 2015-05-06 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104516069A (en) * | 2014-11-28 | 2015-04-15 | 武汉电信器件有限公司 | QSFP+ (quad small form-factor pluggable) optical module component |
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- 2014-11-28 CN CN201420727454.4U patent/CN204314513U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104516069A (en) * | 2014-11-28 | 2015-04-15 | 武汉电信器件有限公司 | QSFP+ (quad small form-factor pluggable) optical module component |
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