CN204303949U - High frequency signal transmission line and electronic equipment - Google Patents
High frequency signal transmission line and electronic equipment Download PDFInfo
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- CN204303949U CN204303949U CN201490000217.6U CN201490000217U CN204303949U CN 204303949 U CN204303949 U CN 204303949U CN 201490000217 U CN201490000217 U CN 201490000217U CN 204303949 U CN204303949 U CN 204303949U
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- 230000008054 signal transmission Effects 0.000 title claims abstract description 119
- 239000004020 conductor Substances 0.000 claims abstract description 430
- 239000000463 material Substances 0.000 description 84
- 239000000758 substrate Substances 0.000 description 22
- 239000002184 metal Substances 0.000 description 21
- 229910052751 metal Inorganic materials 0.000 description 21
- 238000000034 method Methods 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 230000003746 surface roughness Effects 0.000 description 10
- 239000011241 protective layer Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 7
- 230000007423 decrease Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 6
- 230000004907 flux Effects 0.000 description 6
- 238000009499 grossing Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000007769 metal material Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- BGOFCVIGEYGEOF-UJPOAAIJSA-N helicin Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@H]1OC1=CC=CC=C1C=O BGOFCVIGEYGEOF-UJPOAAIJSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000002562 thickening agent Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005094 computer simulation Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/081—Microstriplines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0073—Printed inductances with a special conductive pattern, e.g. flat spiral
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/203—Strip line filters
- H01P1/20327—Electromagnetic interstage coupling
- H01P1/20354—Non-comb or non-interdigital filters
- H01P1/20363—Linear resonators
Abstract
The utility model provides a kind of miniaturization that can realize inductor, can also obtain high frequency signal transmission line and the electronic equipment of larger inductance value simultaneously.Signal line (20a, 20b) is arranged in dielectric body (12) than the side of earthing conductor (22) closer to the normal direction of dielectric body (12).Inductor conductor (40a, 40b) is arranged in dielectric body (12) than the side of earthing conductor (22) closer to the normal direction of dielectric body (12), to be formed as on the 1st direction the meander-like of back and forth simultaneously advancing on the 2nd direction intersected with the 1st direction, and the multiple line conductors (50a) included respectively along the 1st direction extension and multiple line conductor (50b).Circuit pack (50a, 50b) is adjacent one another are.Inductor conductor (40a, 40b) is connected in series between signal line (20a, 20b) to make the mode flowing through the electric current of equidirectional in adjacent wire portions (50a, 50b).
Description
Technical field
The utility model relates to high frequency signal transmission line and electronic equipment, more specifically, and the high frequency signal transmission line that the transmission relating to high-frequency signal uses and electronic equipment.
Background technology
As the existing invention relevant to high frequency signal transmission line, there will be a known the microwave circuit such as described in patent documentation 1.Figure 14 is the equivalent circuit diagram of the microwave circuit described in patent documentation 1.
Microwave circuit described in patent documentation 1 comprises: substrate, two signal lines, inductor and grounding electrodes.Substrate is laminal insulative substrate.Inductor is arranged at the surface of substrate, is formed as meander-like when overlooking from the normal direction of substrate.Further, inductor is connected between two signal lines.Roughly whole of the grounding electrode covered substrate back side.In above-mentioned microwave circuit, due to two signal lines and inductor relative with grounding electrode across substrate, therefore, as shown in figure 14, two signal lines and inductor and grounding electrode form microstrip line construction.
But, in the microwave circuit described in patent documentation 1, in order to increase the inductance value of inductor, need the length increasing inductor.Therefore, in this microwave circuit, be difficult to realize the miniaturization of inductor simultaneously and obtain larger inductance value.
Prior art document
Patent documentation
Patent documentation 1: Japanese Patent Laid-Open 4-35202 publication
Utility model content
Utility model technical problem to be solved
Therefore, the purpose of this utility model is, provides a kind of miniaturization that can realize inductor, can also obtain high frequency signal transmission line and the electronic equipment of larger inductance value simultaneously.
The technical scheme that technical solution problem adopts
The feature of the high frequency signal transmission line involved by an execution mode of the present utility model is, comprising: the dielectric body of tabular, be arranged at the earthing conductor of described dielectric body, 1st signal line, the 1st signal line is arranged at than the side of described earthing conductor closer to the normal direction of this dielectric body in described dielectric body, thus relative with this earthing conductor, 1st inductor conductor, 1st inductor conductor is arranged in described dielectric body than the side of described earthing conductor closer to the normal direction of this dielectric body, thus it is relative with this earthing conductor, and to be formed as on the 1st direction the meander-like of back and forth simultaneously advancing on the 2nd direction intersected with the 1st direction, described 1st inductor conductor is connected with described 1st signal line, and includes multiple 1st circuit packs extended along the 1st direction, and the 2nd inductor conductor, 2nd inductor conductor is arranged in described dielectric body than the side of described earthing conductor closer to the normal direction of this dielectric body, thus it is relative with this earthing conductor, and be formed as reciprocal meander-like of simultaneously advancing on described 2nd direction on described 1st direction, described 2nd inductor conductor includes multiple 2nd circuit packs extended along the 1st direction, described multiple 1st circuit pack and described multiple 2nd circuit pack adjacent one another are, described 1st inductor conductor and described 2nd inductor conductor are connected in series, to make the electric current flowing through equidirectional in adjacent described 1st circuit pack and described 2nd circuit pack.
The feature of the electronic equipment involved by an execution mode of the present utility model is, comprising: high frequency signal transmission line, and receive the housing of described high frequency signal transmission line, described high frequency signal transmission line comprises: the dielectric body of tabular, be arranged at the earthing conductor of described dielectric body, 1st signal line, the 1st signal line is arranged at than the side of described earthing conductor closer to the normal direction of this dielectric body in described dielectric body, thus relative with this earthing conductor, 1st inductor conductor, 1st inductor conductor is arranged in described dielectric body than the side of described earthing conductor closer to the normal direction of this dielectric body, thus it is relative with this earthing conductor, and to be formed as on the 1st direction the meander-like of back and forth simultaneously advancing on the 2nd direction intersected with the 1st direction, described 1st inductor conductor is connected with described 1st signal line, and includes multiple 1st circuit packs extended along the 1st direction, and the 2nd inductor conductor, 2nd inductor conductor is arranged in described dielectric body than the side of described earthing conductor closer to the normal direction of this dielectric body, thus it is relative with this earthing conductor, and be formed as the meander-like that advance in reciprocal limit simultaneously on described 2nd direction on described 1st direction, described 2nd inductor conductor includes multiple 2nd circuit packs extended along the 1st direction, described multiple 1st circuit pack and described multiple 2nd circuit pack adjacent one another are, described 1st inductor conductor and described 2nd inductor conductor are connected in series, to make the electric current flowing through equidirectional in adjacent described 1st circuit pack and described 2nd circuit pack.
Utility model effect
According to the utility model, while the miniaturization that can realize inductor, larger inductance value can also be obtained.
Accompanying drawing explanation
Fig. 1 is the stereoscopic figure of the high frequency signal transmission line involved by an execution mode.
Fig. 2 is the exploded view of the dielectric body of high frequency signal transmission line involved by an execution mode.
Fig. 3 is the exploded perspective view of the inductor vicinity of high frequency signal transmission line.
Fig. 4 is the sectional structure chart of the high frequency signal transmission line at the A-A place of Fig. 2.
Fig. 5 is the stereoscopic figure of connector and connecting portion.
Fig. 6 is the sectional structure chart of connector.
Fig. 7 overlooks the electronic equipment employing high frequency signal transmission line and the figure obtained from y-axis direction.
Fig. 8 overlooks the electronic equipment employing high frequency signal transmission line and the figure obtained from z-axis direction.
Fig. 9 is the exploded view of the dielectric body of high frequency signal transmission line involved by variation.
Figure 10 is the sectional structure chart of the high frequency signal transmission line at the A-A place of Fig. 9.
Figure 11 is the signal line of the 3rd model and the figure of inductor of the high frequency signal transmission line represented involved by the 1st comparative example.
Figure 12 is the signal line of the 4th model and the figure of inductor of the high frequency signal transmission line represented involved by the 2nd comparative example.
Figure 13 is the signal line of the 4th model and the exploded view of inductor.
Figure 14 is the equivalent circuit diagram of the microwave circuit described in patent documentation 1.
Embodiment
Below, with reference to accompanying drawing, the high frequency signal transmission line involved by execution mode of the present utility model and electronic equipment are described.
(structure of high frequency signal transmission line)
Below, be described with reference to the structure of accompanying drawing to the high frequency signal transmission line involved by an execution mode of the present utility model.Fig. 1 is the stereoscopic figure of the high frequency signal transmission line 10 involved by an execution mode.Fig. 2 is the exploded view of the dielectric body 12 of high frequency signal transmission line 10 involved by an execution mode.Fig. 3 is the exploded perspective view near the inductor L of high frequency signal transmission line 10.Fig. 4 is the sectional structure chart of the high frequency signal transmission line 10 at the A-A place of Fig. 2.Below, the normal direction of the stacked direction of high frequency signal transmission line 10 and dielectric body 12 is defined as z-axis direction.In addition, the long side direction of high frequency signal transmission line 10 is defined as x-axis direction, the direction orthogonal with x-axis direction and z-axis direction is defined as y-axis direction.In addition, the equivalent circuit diagram of high frequency signal transmission line 10 quotes Figure 14.
High frequency signal transmission line 10 such as connecting two high-frequency circuits in the electronic equipments such as mobile phone.As shown in Figure 1 to Figure 3, high frequency signal transmission line 10 comprises dielectric body 12, outside terminal 16a, 16b, signal line 20a, 20b, earthing conductor 22, inductor conductor 40a, 40b, bonding conductor 42, via hole conductor b1, b2, b11 ~ b14 and connector 100a, 100b.
Dielectric body 12 has pliability, and when overlooking from z-axis direction, dielectric body 12 is the tabular components extended along the x-axis direction.Dielectric body 12 comprises line part 12a, connecting portion 12b, 12c, is to stack gradually the protective layer 14 shown in Fig. 2 and dielectric sheet material 18a ~ 18c from the positive direction side direction negative direction side in z-axis direction and the duplexer formed.Below, the interarea of the positive direction side in the z-axis direction of dielectric body 12 is called surface, the interarea of the negative direction side in the z-axis direction of dielectric body 12 is called the back side.
Line part 12a is in the band shape extended in the direction of the x axis.Connecting portion 12b, 12c are connected to the negative direction side end in the x-axis direction of line part 12a and the positive direction side end in x-axis direction respectively, and rectangular.The width in the y-axis direction of connecting portion 12b, 12c is wider than the width in the y-axis direction of line part 12a.
When overlooking from z-axis direction, dielectric sheet material 18a ~ 18c extends along the x-axis direction, and is formed as the shape identical with dielectric body 12.Dielectric sheet material 18a ~ 18c has flexual thermoplastic resin by polyimides, liquid crystal polymer etc. and forms.Thickness after dielectric sheet material 18a ~ 18c is stacked is such as 50 μm ~ 200 μm., the interarea of the positive direction side in the z-axis direction of dielectric sheet material 18a ~ 18c is called surface below, the interarea of the negative direction side in the z-axis direction of dielectric sheet material 18a ~ 18c is called the back side.
In addition, dielectric sheet material 18a is made up of line part 18a-a and connecting portion 18a-b, 18a-c.Dielectric sheet material 18b is made up of line part 18b-a and connecting portion 18b-b, 18b-c.Dielectric sheet material 18c is made up of line part 18c-a and connecting portion 18c-b, 18c-c.Line part 18a-a, 18b-a, 18c-a form line part 12a.Connecting portion 18a-b, 18b-b, 18c-b form connecting portion 12b.Connecting portion 18a-c, 18b-c, 18c-c form connecting portion 12c.
Signal line 20a, 20b as shown in Figure 2, are arranged in dielectric body 12, are the linear conductors extended along the x-axis direction.In the present embodiment, signal line 20a, 20b is formed at the surface of dielectric sheet material 18b.When overlooking from z-axis direction, the negative direction side end in the x-axis direction of signal line 20a is positioned at the central authorities of connecting portion 18b-b.The positive direction side end in the x-axis direction of signal line 20a is positioned near the central authorities in x-axis direction of line part 12a.When overlooking from z-axis direction, the positive direction side end in the x-axis direction of signal line 20b is positioned at the central authorities of connecting portion 18b-c.The negative direction side end in the x-axis direction of signal line 20b is positioned near the central authorities in x-axis direction of line part 12a.Signal line 20a is not directly connected with signal line 20b, but is connected via inductor conductor 40a described later, 40b and bonding conductor 42.
Signal line 20a, 20b are made by the metal material that the resistivity being main component with silver, copper is less.Here, the surface that signal line 20a, 20b are formed at dielectric sheet material 18b refers to and forms metal forming on the surface of dielectric sheet material 18b by plating, and pattern is carried out to metal forming form signal line 20a, 20b, or in the surface mount metal forming of dielectric sheet material 18b, and pattern is carried out to metal forming form signal line 20a, 20b.In addition, owing to implementing smoothing techniques to the surface of signal line 20a, 20b, therefore, the surface roughness in the face contacted with dielectric sheet material 18b of signal line 20a, 20b is greater than the surface roughness in the face do not contacted with dielectric sheet material 18b of signal line 20a, 20b.
Earthing conductor 22 as shown in Figure 2, is arranged at dielectric body 12 internal ratio signal line 20a, 20b closer to the positive direction side in z-axis direction, more specifically, is formed at the surface of dielectric sheet material 18a.Thus, signal line 20a, 20b is arranged at the negative direction side of dielectric body 12 internal ratio earthing conductor 22 closer to z-axis direction.Earthing conductor 22 extends along signal line 20a, 20b in the direction of the x axis on the surface of dielectric sheet material 18a, and as shown in Figure 2, relative with signal line 20a, 20b across dielectric sheet material 18a.Thus, signal line 20a, 20b and earthing conductor 22 as shown in figure 14, form microstrip line construction.
Earthing conductor 22 is made by the metal material that the resistivity being main component with silver, copper is less.Here, the surface that earthing conductor 22 is formed at dielectric sheet material 18a refers to and forms metal forming on the surface of dielectric sheet material 18a by plating, and pattern is carried out to metal forming form earthing conductor 22, or in the surface mount metal forming of dielectric sheet material 18a, and pattern is carried out to metal forming form earthing conductor 22.In addition, owing to implementing smoothing techniques to the surface of earthing conductor 22, therefore, the surface roughness in the face contacted with dielectric sheet material 18a of earthing conductor 22 is greater than the surface roughness in the face do not contacted with dielectric sheet material 18a of earthing conductor 22.
Earthing conductor 22 is made up of primary conductor 22a and terminal conductor 22b, 22c.Primary conductor 22a is arranged at the surface of line part 18a-a, in the band shape extended along the x-axis direction.
Terminal conductor 22b is arranged at the surface of connecting portion 18a-b, in the straight-flanked ring surrounding connecting portion 18a-b central authorities.Terminal conductor 22b is connected with the negative direction side end in the x-axis direction of primary conductor 22a.
Terminal conductor 22c is arranged at the surface of connecting portion 18a-c, in the ring-type rectangle surrounding connecting portion 18a-c central authorities.Terminal conductor 22c is connected with the positive direction side end in the x-axis direction of primary conductor 22a.
As shown in Figures 1 and 2, outside terminal 16a is formed in the rectangular-shaped conductor near the central authorities on the surface of connecting portion 18a-b.As shown in Figures 1 and 2, outside terminal 16b is formed in the rectangular-shaped conductor near the central authorities on the surface of connecting portion 18a-c.Outside terminal 16a, 16b are made by the metal material that the resistivity being main component with silver, copper is less.Implement gold-plated on the surface of outside terminal 16a, 16b.Here, the surface that outside terminal 16a, 16b are formed at dielectric sheet material 18a refers to and forms metal forming on the surface of dielectric sheet material 18a by plating, and pattern is carried out to metal forming form outside terminal 16a, 16b, or in the surface mount metal forming of dielectric sheet material 18a, and pattern is carried out to metal forming form outside terminal 16a, 16b.In addition, owing to implementing smoothing techniques to the surface of outside terminal 16a, 16b, therefore, the surface roughness in the face contacted with dielectric sheet material 18a of outside terminal 16a, 16b is greater than the surface roughness in the face do not contacted with dielectric sheet material 18a of outside terminal 16a, 16b.
Via hole conductor b1 runs through the connecting portion 18a-b of dielectric sheet material 18a in the z-axis direction.Via hole conductor b1 connects the negative direction side end in the x-axis direction of outside terminal 16a and signal line 20a.Via hole conductor b2 runs through the connecting portion 18a-c of dielectric sheet material 18a in the z-axis direction.Via hole conductor b2 connects the positive direction side end in the x-axis direction of outside terminal 16b and signal line 20b.
Roughly whole of the surface of protective layer 14 covering dielectric sheet material 18a.Thus, protective layer 14 covers earthing conductor 22.Protective layer 14 is such as made up of pliability resins such as anticorrosive additive materials.
In addition, as shown in Figure 2, protective layer 14 is made up of line part 14a and connecting portion 14b, 14c.Line part 14a covers the whole surface of line part 18a-a, covers primary conductor 22a thus.
Connecting portion 14b is connected with the negative direction side end in the x-axis direction of line part 14a, and covers the surface of connecting portion 18a-b.Wherein, connecting portion 14b is provided with opening Ha ~ Hd.Opening Ha is the rectangular aperture at the substantial middle place being arranged at connecting portion 14b.Outside terminal 16a exposes to outside via opening Ha, plays the effect of outside terminal thus.In addition, opening Hb is the rectangular aperture of the positive direction side in the y-axis direction being arranged on opening Ha.Opening Hc is the rectangular aperture of the negative direction side in the x-axis direction being arranged on opening Ha.Opening Hd is the rectangular aperture of the negative direction side in the y-axis direction being arranged on opening Ha.Terminal conductor 22b exposes to outside via opening Hb ~ Hd, thus plays the effect of outside terminal.
Connecting portion 14c is connected with the positive direction side end in the x-axis direction of line part 14a, and covers the surface of connecting portion 18a-c.Wherein, connecting portion 14c is provided with opening He ~ Hh.Opening He is the rectangular aperture at the substantial middle place being arranged at connecting portion 14c.Outside terminal 16b exposes to outside via opening He, thus plays the effect of outside terminal.In addition, opening Hf is the rectangular aperture of the positive direction side in the y-axis direction being arranged on opening He.Opening Hg is the rectangular aperture of the positive direction side in the x-axis direction being arranged on opening He.Opening Hh is the rectangular aperture of the negative direction side in the y-axis direction being arranged on opening He.Terminal conductor 22c exposes to outside via opening Hf ~ Hh, thus plays the effect of outside terminal.
Inductor conductor 40a, 40b are arranged at than the negative direction side of earthing conductor 22 closer to z-axis direction in dielectric body 12, and are connected in series between signal line 20a and signal line 20b by bonding conductor 42.Thus, inductor conductor 40a, 40b form inductor L.Inductor conductor 40a, 40b such as the adjustment of the characteristic impedance of high frequency signal transmission line 10, as the inductance element etc. in the inductor of the inductor of LC filter, LC resonator, circuit.Below, be described with reference to the structure of Fig. 2 to Fig. 4 to inductor conductor 40a, 40b and bonding conductor 42.
Inductor conductor 40a, 40b are formed on the surface of dielectric sheet material 18c, thus relative with earthing conductor 22 across dielectric sheet material 18a, 18b.Further, inductor conductor 40a, 40b arrange same position (that is, on same dielectric sheet material 18c) in the z-axis direction.
In addition, inductor conductor 40a, 40b are formed as in y-axis direction (direction intersected with x-axis direction) upper meander-like (zigzag) of back and forth advancing in the direction of the x axis simultaneously., the negative direction side end in the x-axis direction of inductor conductor 40a is called end ta below, the positive direction side end in the x-axis direction of inductor conductor 40a is called end tb.The negative direction side end in the x-axis direction of inductor conductor 40b is called end tc, the positive direction side end in the x-axis direction of inductor conductor 40b is called end td.When overlooking from z-axis direction, the end ta of inductor conductor 40a overlaps with the positive direction side end in the x-axis direction of signal line 20a.When overlooking from z-axis direction, the end td of inductor conductor 40b overlaps with the negative direction side end in the x-axis direction of signal line 20b.
Inductor conductor 40a includes multiple line conductor 50a, 52a, 54a.Multiple line conductor 50a is the conductor extended in the y-axis direction, forms a line in the direction of the x axis.Line conductor 52a is the conductor extended in the direction of the x axis, connects the positive direction side end in the y-axis direction of two line conductor 50a adjacent on x-axis direction.Line conductor 54a is the conductor extended in the direction of the x axis, connects the negative direction side end in the y-axis direction of two line conductor 50a adjacent on x-axis direction.Line conductor 52a and line conductor 54a hockets in the direction of the x axis and configures.Therefore, the two line conductor 50a connected by line conductor 52a can not be connected by line conductor 54a.Similarly, the two line conductor 50a connected by line conductor 54a can not be connected by line conductor 52a.Further, the length of line conductor 52a is longer than line conductor 54a.
Inductor conductor 40b includes multiple line conductor 50b, 52b, 54b.Multiple line conductor 50b is the conductor extended in the y-axis direction, forms a line in the direction of the x axis.Line conductor 52b is the conductor extended in the direction of the x axis, connects the negative direction side end in the y-axis direction of two line conductor 50b adjacent on x-axis direction.Line conductor 54b is the conductor extended in the direction of the x axis, connects the positive direction side end in the y-axis direction of two line conductor 50b adjacent on x-axis direction.Line conductor 52b and line conductor 54b hockets in the direction of the x axis and configures.Therefore, the two line conductor 50b connected by line conductor 52b can not be connected by line conductor 54b.Similarly, the two line conductor 50b connected by line conductor 54b can not be connected by line conductor 52b.Further, the length of line conductor 52b is longer than line conductor 54b.
Herein, inductor conductor 40a, 40b keep roughly equally spaced gap over the entire length and walk abreast.More specifically, inductor conductor 40a is arranged at than the positive direction side of inductor conductor 40b closer to y-axis direction, adjacent with this inductor conductor 40b.Line conductor 52a is arranged at than the positive direction side of line conductor 54b closer to y-axis direction, adjacent in the y-axis direction with this line conductor 54b.Thus, line conductor 52a, 54b walks abreast.Line conductor 54a is arranged at than the positive direction side of line conductor 52b closer to y-axis direction, adjacent in the y-axis direction with this line conductor 52b.Thus, line conductor 54a, 52b walks abreast.In addition, multiple line conductor 50a is adjacent in the direction of the x axis with multiple line conductor 50b, walks abreast with the plurality of line conductor 50b.
Inductor conductor 40a, 40b are made by the metal material that the resistivity being main component with silver, copper is less.Here, the surface that inductor conductor 40a, 40b are formed at dielectric sheet material 18c refers to and forms metal forming on the surface of dielectric sheet material 18c by plating, and pattern is carried out to metal forming form inductor conductor 40a, 40b, or in the surface mount metal forming of dielectric sheet material 18c, and pattern is carried out to metal forming form inductor conductor 40a, 40b.In addition, owing to implementing smoothing techniques to the surface of inductor conductor 40a, 40b, therefore, the surface roughness in the face contacted with dielectric sheet material 18c of inductor conductor 40a, 40b is greater than the surface roughness the face do not contacted with dielectric sheet material 18c of inductor conductor 40a, 40b.
Bonding conductor 42 to be arranged in dielectric body 12 than the negative direction side of earthing conductor 22 closer to z-axis direction, more specifically, is formed on the surface of dielectric sheet material 18b.Bonding conductor 42 extends in the direction of the x axis, carries out relaying to the connection of the end tb of inductor conductor 40a and the end tc of inductor conductor 40b.The negative direction side end in the x-axis direction of bonding conductor 42 overlaps with the end tc of inductor conductor 40b.The positive direction side end in the x-axis direction of bonding conductor 42a overlaps with the end tb of inductor conductor 40a.
Bonding conductor 42 is made by the metal material that the resistivity being main component with silver, copper is less.Here, the surface that bonding conductor 42 is formed at dielectric sheet material 18b refers to and form metal forming by plating on the surface of dielectric sheet material 18b, and pattern is carried out to metal forming form bonding conductor 42, or in the surface mount metal forming of dielectric sheet material 18b, and pattern is carried out to metal forming form bonding conductor 42.In addition, owing to implementing smoothing techniques to the surface of bonding conductor 42, therefore, the surface roughness in the face contacted with dielectric sheet material 18b of bonding conductor 42 is greater than the surface roughness in the face do not contacted with dielectric sheet material 18b of bonding conductor 42.
Via hole conductor b11 ~ b14 extends along the normal direction of dielectric body 12 respectively in dielectric body 12.In present embodiment, via hole conductor b11 ~ b14 runs through dielectric sheet material 18b along the z-axis direction.The positive direction side end in x-axis direction of via hole conductor b11 connection signal circuit 20a and the end ta of inductor conductor 40a.Via hole conductor b12 connects the negative direction side end in the end td of inductor conductor 40b and the x-axis direction of signal line 20b.Via hole conductor b13 connects the negative direction side end in x-axis direction and the end tc of inductor conductor 40b of bonding conductor 42.Via hole conductor b14 connects the positive direction side end in x-axis direction and the end tb of inductor conductor 40a of bonding conductor 42.
By connecting inductor conductor 40a, 40b in a manner described, make the electric current flowing through equidirectional in adjacent line conductor 50a, 50b.Enumerate the situation that electric current flows to outside terminal 16b from outside terminal 16a to be exemplarily described.In this situation, in inductor conductor 40a, flow through the electric current from the negative direction side in x-axis direction to positive direction side.Bonding conductor 42 is connected to the end tb of inductor conductor 40a.Therefore, the electric current from the positive direction side in x-axis direction to negative direction side is flow through in bonding conductor 42.The end tc of inductor conductor 40b is connected to the negative direction side end in the x-axis direction of bonding conductor 42.Therefore, identical with inductor conductor 40a, flow through the electric current from the negative direction side in x-axis direction to positive direction side in inductor conductor 40b.
Here, to keep, roughly equally spaced state is mutually parallel advances inductor conductor 40a and inductor conductor 40b.Therefore, as shown in Figure 4, the sense of current flowing through the line conductor 50a of inductor conductor 40a is identical with the sense of current of the line conductor 50b flowing through inductor conductor 40b.Based on identical reason, in high frequency signal transmission line 10, in adjacent lines conductor 52a, 54b, flow through the electric current of equidirectional.Further, in high frequency signal transmission line 10, the electric current of equidirectional in adjacent lines conductor 52b, 54a, is flow through.
Connector 100a, 100b are arranged on the surface of connecting portion 12b, 12c respectively, and are electrically connected with signal line 20a, 20b, inductor L and earthing conductor 22.The structure of connector 100a, 100b is identical, therefore, is described below for the structure of connector 100b.Fig. 5 is the stereoscopic figure of connector 100b and connecting portion 12c.Fig. 6 is the sectional structure chart of connector 100b.
As shown in Figures 5 and 6, connector 100b by connector body 102, outside terminal 104,106, center conductor 108 and external conductor 110 form.The rectangular plate of connector body 102 is linked with the shape of cylinder, is made up of insulating material such as resins.
Outside terminal 104 is arranged on position corresponding with outside terminal 16b in the face of the negative direction side in the z-axis direction of the plate of connector body 102.Outside terminal 106 is arranged on position corresponding with the terminal conductor 22c exposed via opening Hf ~ Hh in the face of the negative direction side, z-axis direction of the plate of connector body 102.
Center conductor 108 is arranged at the center of the cylinder of connector body 102, and is connected with outside terminal 104.Center conductor 108 is the signal terminals inputing or outputing high-frequency signal.External conductor 110 is arranged at the inner peripheral surface of the cylinder of connector body 102, and is connected with outside terminal 106.External conductor 110 is the earth terminals keeping earthing potential.
The mode that the connector 100b with said structure is connected with outside terminal 16b according to outside terminal 104, outside terminal 106 is connected with terminal conductor 22c is arranged on the surface of connecting portion 12c.Thus, signal line 20a, 20b and inductor L is electrically connected with center conductor 108.In addition, earthing conductor 22 is electrically connected with external conductor 110.
High frequency signal transmission line 10 is according to following illustrated using like that.Fig. 7 overlooks the electronic equipment 200 employing high frequency signal transmission line 10 and the figure obtained from y-axis direction.Fig. 8 overlooks the electronic equipment 200 employing high frequency signal transmission line 10 and the figure obtained from z-axis direction.
Electronic equipment 200 comprises high frequency signal transmission line 10, circuit substrate 202a, 202b, socket 204a, 204b, battery pack (metallic object) 206 and housing 210.
High frequency signal transmission line 10, circuit substrate 202a, 202b, socket 204a, 204b and battery pack (metallic object) 206 is accommodated with in housing 210.Circuit substrate 202a is provided with the transtation mission circuit or receiving circuit that such as comprise antenna.Circuit substrate 202b is provided with such as power supply circuits.Battery pack 206 is such as Li-Ion rechargeable battery, has the structure that its surface is covered by metal cover board.Circuit substrate 202a, battery pack 206 and circuit substrate 202b are arranged in order from the negative direction side direction positive direction side in x-axis direction by this order.
Socket 204a, 204b are separately positioned on the interarea of the negative direction side in the z-axis direction of circuit substrate 202a, 202b.Socket 204a, 204b are connected with connector 100a, 100b respectively.Thus, the high-frequency signal such as with 2GHz frequency transmitted between circuit substrate 202a, 202b is applied to the center conductor 108 of connector 100a, 100b via socket 204a, 204b.In addition, via circuit substrate 202a, 202b and socket 204a, 204b, the external conductor 110 of connector 100a, 100b is remained on earthing potential.Thus, high frequency signal transmission line 10 is connected electrically between circuit substrate 202a, 202b.
Here, the surface (being more precisely protective layer 14) of dielectric body 12 contacts with battery pack 206.Further, bonding agent etc. is utilized to be fixed the surface of dielectric body 12 and battery pack 206.
(manufacture method of high frequency signal transmission line)
Below, be described with reference to the manufacture method of Fig. 2 to high frequency signal transmission line 10.Below, be described for the situation making a high frequency signal transmission line 10, but in fact, by large-sized dielectric sheet material being carried out stacked and cutting, multiple high frequency signal transmission line 10 can be made simultaneously.
First, prepare dielectric sheet material 18a ~ 18c, the thermoplastic resin that this dielectric sheet material 18a ~ 18c is formed with Copper Foil by whole surface is formed.By preventing from getting rusty as zinc-plated to the copper foil surface embodiment of dielectric sheet material 18a ~ 18c, thus make its smoothing.The thickness of Copper Foil is 10 μm ~ 20 μm.
Then, by photo-mask process, outside terminal 16a, the 16b shown in Fig. 2 and earthing conductor 22 is formed on the surface of dielectric sheet material 18a.Specifically, the Copper Foil of dielectric sheet material 18a prints outside terminal 16a, the 16b shown in shape with Fig. 2 and the identical resist of earthing conductor 22.Then, etch processes is implemented to Copper Foil, thus remove the Copper Foil of the part do not covered by resist.Then, resist is removed.Thus, outside terminal 16a, 16b as shown in Figure 2 and earthing conductor 22 is formed on the surface of dielectric sheet material 18a.
Then, by photo-mask process, signal line 20a, the 20b shown in Fig. 2 and bonding conductor 42 is formed on the surface of dielectric sheet material 18b.Further, by photo-mask process, the inductor conductor 40a shown in Fig. 2,40b is formed on the surface of dielectric sheet material 18c.Here photo-mask process is identical with photo-mask process when forming outside terminal 16a, 16b and earthing conductor 22, therefore omits the description.
Then, from the position illuminating laser beam that will form via hole conductor b1, b2, b11 ~ b14 of rear side to dielectric sheet material 18a ~ 18c, thus through hole is formed.Then, to the through hole filled conductive thickener being formed at dielectric piece material 18a ~ 18c.
Then, dielectric sheet material 18a ~ 18c is stacked gradually from the positive direction side direction negative direction side in z-axis direction.Then, by heating from the positive direction side in z-axis direction and negative direction side dielectric sheet material 18a ~ 18c and pressurize, make dielectric sheet material 18a ~ 18c softening thus carry out crimping/integration, and make the conductive paste solidification being filled in through hole, thus form via hole conductor b1, b2, the b11 shown in Fig. 2 ~ b14.In addition, also can after making dielectric sheet material 18a ~ 18c integration, form through hole, filled conductive thickener or form plated film in through hole in through hole, forms via hole conductor b1, b2, b11 ~ b14 thus.In addition, for via hole conductor b1, b2, b11 ~ b14, not necessarily with the complete landfill through hole of conductor, such as, also can be formed conductor by the inner peripheral surface only along through hole and be formed.
Then, by coating resin (resist) thickener, dielectric sheet material 18a forms protective layer 14.
Finally, mounted connector 100a, 100b on the surface of connecting portion 12b, 12c.Thus, the high frequency signal transmission line 10 shown in Fig. 1 can be obtained.
(effect)
According to the high frequency signal transmission line 10 with said structure, while the miniaturization that can realize inductor L, larger inductance value can also be obtained.More specifically, in high frequency signal transmission line 10, line conductor 50a, 50b that inductor conductor 40a, 40b are configured to make to extend along the y-axis direction are adjacent.Further, inductor conductor 40a, 40b are connected in series between signal line 20a, 20b to make the mode flowing through the electric current of equidirectional in adjacent lines conductor 50a, 50b.Therefore, as shown in Figure 4, in adjacent lines conductor 50a, 50b, produce the magnetic flux of equidirectional.Thus, inductor conductor 40a and inductor conductor 40b carries out magnetic Field Coupling.Consequently, the inductance value of inductor L is greater than inductor conductor 40a, 40b and arranges in the direction of the x axis and the inductance value of the inductor being connected in series and obtaining.Therefore, in high frequency signal transmission line 10, for inductor L, the length in its x-axis direction can be shortened, and larger inductance value can be obtained.
In addition, according to high frequency signal transmission line 10, the decline of the inductance value of inductor L can be suppressed, and the slimming of high frequency signal transmission line 10 can be realized.More specifically, in the microwave circuit described in patent documentation 1, because inductor is formed as helical form, therefore, the diameter of inductor becomes large.If the diameter of inductor becomes large, though then on the direction that wireline reel extends away from the position of inductor, also can produce the more magnetic flux towards the direction along wireline reel.That is, the magnetic flux running through grounding electrode becomes many.Therefore, in the microwave circuit described in patent documentation 1, the problem causing the inductance value of inductor to decline because of vortex flow is more remarkable.
Herein, in high frequency signal transmission line 10, inductor conductor 40a, 40b are tortuous.Therefore, for inductor conductor 40a, consider the annulus conductor that formation one is less in line conductor 50a, 52a, 54a.So inductor conductor 40a is connected by multiple less annulus conductor series connection and forms.Similarly, for inductor conductor 40b, consider the annulus conductor that formation one is less in line conductor 50b, 52b, 54b.So inductor conductor 40b is connected by multiple less annulus conductor series connection and forms.Thus, in high frequency signal transmission line 10, the diameter of the coil-conductor of formation inductor conductor 40a, 40b can be made to be less than the diameter of the inductor of the microwave circuit described in patent documentation 1.If the diameter of coil-conductor diminishes, then the magnetic flux towards z-axis direction tails off, thus magnetic flux not easily runs through earthing conductor 22.Therefore, even if the distance shortened between inductor conductor 40a, 40b and earthing conductor 22 in order to the slimming realizing high frequency signal transmission line 10, the vortex flow produced in earthing conductor 22 also not easily increases.Consequently, in high frequency signal transmission line 10, the inductance value of inductor L can be suppressed to decline, and the slimming of high frequency signal transmission line 10 can be realized.
In addition, according to high frequency signal transmission line 10, the deviation of the inductance value of inductor L can be reduced.More specifically, in the microwave circuit described in patent documentation 1, the magnetic flux produced due to inductor easily passes grounding electrode, and therefore, the inductance value of inductor easily declines.So if the thickness of substrate exists deviation, then the slippage of the inductance value of inductor also can produce deviation.Its result causes in microwave circuit, and the inductance value of inductor easily deviation occurs.
On the other hand, in high frequency signal transmission line 10, the decline of the inductance value of inductor L can be suppressed.If the slippage of the inductance value of inductor L diminishes, then the deviation of the slippage of the inductance value of inductor L also diminishes.Consequently, in high frequency signal transmission line 10, the deviation of the inductance value of inductor L can be reduced.
In addition, in high frequency signal transmission line 10, because inductor conductor 40a, 40b are tortuous, therefore, compared with being formed with the high frequency signal transmission line of spiral helicine inductor conductor, high frequency signal transmission line 10 is easy to bending.
(variation)
Below, with reference to accompanying drawing, the high frequency signal transmission line 10a involved by variation is described.Fig. 9 is the exploded view of the dielectric body 12 of high frequency signal transmission line 10a involved by variation.About the stereoscopic figure of high frequency signal transmission line 10a, quote Fig. 1.Figure 10 is the sectional structure chart of the high frequency signal transmission line 10a at the A-A place of Fig. 9.
High frequency signal transmission line 10a is different from high frequency signal transmission line 10 in the structure of inductor conductor 40a, 40b.Below, centered by above-mentioned difference, high frequency signal transmission line 10a is described.In addition, in high frequency signal transmission line 10a, for the structure identical with high frequency signal transmission line 10, mark identical reference number.
More specifically, in high frequency signal transmission line 10a, dielectric body 12 is by stacked guard layer 14 and the dielectric sheet material 18a ~ 18d and form in order of the positive direction side direction negative direction side from z-axis direction.The protective layer 14 of high frequency signal transmission line 10a is identical with dielectric sheet material 18a ~ 18c with the protective layer 14 of high frequency signal transmission line 10 with dielectric sheet material 18a ~ 18c, therefore omits the description.In addition, the structure of dielectric sheet material 18d is identical with the structure of dielectric sheet material 18a ~ 18c, therefore omits the description.
Signal line 20a, 20b are formed on the surface of dielectric sheet material 18c.The structure of signal line 20a, 20b of high frequency signal transmission line 10a is identical with the structure of signal line 20a, 20b of high frequency signal transmission line 10, therefore omits the description.
Inductor conductor 40a is formed on the surface of dielectric sheet material 18d, thus relative with earthing conductor 22 across dielectric sheet material 18a ~ 18c.Inductor conductor 40b is formed on the surface of dielectric sheet material 18c, thus relative with earthing conductor 22 across dielectric sheet material 18a, 18b.Thus, in high frequency signal transmission line 10a, inductor conductor 40a, 40b arrange diverse location in the z-axis direction.
In addition, inductor conductor 40a, 40b be formed as y-axis direction (direction intersected with x-axis direction) upper reciprocal while the meander-like (zigzag) of advancing in the direction of the x axis., the negative direction side end in the x-axis direction of inductor conductor 40a is called end ta below, the positive direction side end in the x-axis direction of inductor conductor 40a is called end tb.The negative direction side end in the x-axis direction of inductor conductor 40b is called end tc, the positive direction side end in the x-axis direction of inductor conductor 40b is called end td.When overlooking from z-axis direction, the end ta of inductor conductor 40a overlaps with the positive direction side end in the x-axis direction of signal line 20a.When overlooking from z-axis direction, the end tb of inductor conductor 40a overlaps with the end td of inductor conductor 40b.
Inductor conductor 40a includes multiple line conductor 50a, 52a, 54a.Multiple line conductor 50a is the linear conductor extended in the y-axis direction, forms a line in the direction of the x axis.Line conductor 52a is the conductor extended in the direction of the x axis, connects the positive direction side end in the y-axis direction of two line conductor 50a adjacent on x-axis direction.Line conductor 54a is the conductor extended in the direction of the x axis, connects the negative direction side end in the y-axis direction of two line conductor 50a adjacent on x-axis direction.Line conductor 52a and line conductor 54a hockets in the direction of the x axis and configures.Therefore, the two line conductor 50a connected by line conductor 52a can not be connected by line conductor 54a.Similarly, the two line conductor 50a connected by line conductor 54a can not be connected by line conductor 52a.Further, the length of line conductor 52a is equal with line conductor 54a.But the length of line conductor 52a, 54a is shorter than the length of line conductor 50a.
Inductor conductor 40b includes multiple line conductor 50b, 52b, 54b.Multiple line conductor 50b is the linear conductor extended in the y-axis direction, forms a line in the direction of the x axis.Line conductor 52b is the conductor extended in the direction of the x axis, connects the positive direction side end in the y-axis direction of two line conductor 50b adjacent on x-axis direction.Line conductor 54b is the conductor extended in the direction of the x axis, connects the negative direction side end in the y-axis direction of two adjacent in the direction of the x axis line conductor 50b.Line conductor 52b and line conductor 54b hockets in the direction of the x axis and configures.Therefore, the two line conductor 50b connected by line conductor 52b can not be connected by line conductor 54b.Similarly, the two line conductor 50b connected by line conductor 54b can not be connected by line conductor 52b.Further, the length of line conductor 52b is equal with line conductor 54b.But the length of line conductor 42b, 54b is shorter than the length of line conductor 50b.
Here, inductor conductor 40a, 40b are configured to when overlooking from z-axis direction, and multiple line conductor 50a and multiple line conductor 50b coincides.Thus, multiple line conductor 50a is adjacent in the z-axis direction and parallel with multiple line conductor 50b.But when overlooking from z-axis direction, multiple line conductor 52a does not overlap with multiple line conductor 52b, and multiple line conductor 54a does not also overlap with multiple line conductor 54b.
Bonding conductor 42 to be arranged in dielectric body 12 than the negative direction side of earthing conductor 22 closer to z-axis direction, more specifically, is formed on the surface of dielectric sheet material 18b.Bonding conductor 42 extends in the direction of the x axis, carries out relaying to the end tc of inductor conductor 40b and the connection of signal line 20b.Therefore, the negative direction side end in the x-axis direction of bonding conductor 42 overlaps with the end tc of inductor conductor 40b.The positive direction side end in the x-axis direction of bonding conductor 42a overlaps with the negative direction side end in the x-axis direction of signal line 20b.
High frequency signal transmission line 10a possesses via hole conductor b21 ~ b24 and carrys out alternative via hole conductor b11 ~ b14.Via hole conductor b21 ~ b24 extends along the normal direction of dielectric body 12 respectively in dielectric body 12.In present embodiment, via hole conductor b21, b24 run through dielectric sheet material 18c along the z-axis direction.The positive direction side end in x-axis direction of via hole conductor b21 connection signal circuit 20a and the end ta of inductor conductor 40a.Via hole conductor b24 connects the end td of inductor conductor 40b and the end tb of inductor conductor 40a.
Via hole conductor b22, b23 run through dielectric sheet material 18b along the z-axis direction.Via hole conductor b22 connects the negative direction side end in x-axis direction and the end tc of inductor conductor 40b of bonding conductor 42.Via hole conductor b23 connects the positive direction side end in x-axis direction of bonding conductor 42 and the negative direction side end in the x-axis direction of signal line 20b.
By connecting inductor conductor 40a, 40b in a manner described, make the electric current flowing through equidirectional in adjacent line conductor 50a, 50b.Enumerate the situation that electric current flows to outside terminal 16b from outside terminal 16a to be exemplarily described.In this situation, in inductor conductor 40a, flow through the electric current from the negative direction side in x-axis direction to positive direction side.The end td of inductor conductor 40b is connected to the end tb of inductor conductor 40a.Therefore, the electric current from the positive direction side in x-axis direction to negative direction side is flow through in inductor conductor 40b.
Here, inductor conductor 40a, 40b are configured to line conductor 52a and do not overlap with line conductor 52b and line conductor 54a does not overlap with line conductor 54b.That is, inductor conductor 40a and inductor conductor 40b departs from half period in the direction of the x axis.Thus, if electric current crosses inductor conductor 40a from the negative direction side direction positive direction effluent in x-axis direction, and electric current crosses inductor conductor 40b from the positive direction side direction negative direction effluent in x-axis direction, then as shown in Figure 10, the sense of current flow through in the sense of current of the line conductor 50a of inductor conductor 40a and the line conductor 50b of inductor conductor 40b is flow through identical.
According to the high frequency signal transmission line 10a with said structure, identical with high frequency signal transmission line 10, while the miniaturization that can realize inductor L, larger inductance value can also be obtained.According to high frequency signal transmission line 10a, identical with high frequency signal transmission line 10, the decline of the inductance value of inductor L can be suppressed, and the slimming of high frequency signal transmission line 10a can be realized.In addition, according to high frequency signal transmission line 10a, identical with high frequency signal transmission line 10, the deviation of the inductance value of inductor L can be reduced.In high frequency signal transmission line 10a, identical with high frequency signal transmission line 10, high frequency signal transmission line 10a can be made to be easy to bending.
(simulation result)
The effect that present inventor plays in order to further clear and definite high frequency signal transmission line 10,10a, has carried out the following Computer Simulation that will illustrate.Figure 11 is the signal line of the 3rd model and the figure of inductor of the high frequency signal transmission line represented involved by the 1st comparative example.Figure 12 is the signal line of the 4th model and the figure of inductor of the high frequency signal transmission line represented involved by the 2nd comparative example.Figure 13 is the signal line of the 4th model and the exploded view of inductor.
First, present inventor has made the 1st model of the structure with high frequency signal transmission line 10 and has had the 2nd model of structure of high frequency signal transmission line 10a.Further, present inventor has made the 3rd model with structure shown in Figure 11 and the 4th model with structure shown in Figure 12 and Figure 13.
As following illustrated, the model that the 3rd model and the 4th model are inductor by the inductor L of high frequency signal transmission line 10 being replaced into Figure 11 and Figure 12 and obtain.More specifically, in the 3rd model, the surface of the dielectric sheet material 18b of Fig. 2 defines the inductor conductor of signal line and meander-like.In 4th model, the surface of the dielectric sheet material 18b of Fig. 2 defines clockwise around dielectric sheet material 1 simultaneously towards the spiral helicine inductor conductor at center, the surface of dielectric sheet material 18c defines counterclockwise around simultaneously towards the spiral helicine inductor conductor at center.Further, the center of two inductor conductor is connected to each other by via hole conductor.The outer circumferential side end of the inductor conductor on the surface of dielectric sheet material 18b is connected with signal line.The outer circumferential side end of the inductor conductor on the surface of dielectric sheet material 18c is connected with signal line by via hole conductor.Below, simulated conditions is described.
1st model is to the inductor dimensions of the 4th model: 3mm × 3mm
1st model is to the inductor live width of the 4th model: 100mm
The line segregation of the inductor of the 4th model: 100mm
1st model is to the width of the line part 12a of the 4th model: 5mm
1st model is to the thickness of the dielectric sheet material 18a ~ 18d of the 4th model: 25 μm
Computing is carried out to the inductance value of inductor during high-frequency signal by 1MHz in the 1st model to the 4th model and the resistance value of inductor.Operation result is shown below.
1st model
Inductance value: 24.7nH
Resistance value: 98m Ω
2nd model
Inductance value: 64.7nH
Resistance value: 220m Ω
3rd model
Inductance value: 23.1nH
Resistance value: 87m Ω
4th model
Inductance value: 62.0nH
Resistance value: 244m Ω
According to simulation result, the inductance value of the 1st model is greater than the inductance value of the 3rd model.On the other hand, the resistance value of the 1st model is only a bit larger tham the resistance value of the 3rd model.It can thus be appreciated that, in high frequency signal transmission line 10, compared with the high frequency signal transmission line involved by the 1st comparative example (the 3rd model), the increase of resistance value can be suppressed, and the decline of inductance value can be suppressed.Similarly, the inductance value of known 2nd model is greater than the inductance value of the 4th model.On the other hand, the resistance value of the 2nd model is only a bit larger tham the resistance value of the 4th model.It can thus be appreciated that, in high frequency signal transmission line 10a, compared with the high frequency signal transmission line involved by the 2nd comparative example (the 4th model), the increase of resistance value can be suppressed, and the decline of inductance value can be suppressed.
Further, in high frequency signal transmission line 10a, owing to being the inductor conductor of meander-like, therefore, compared with the high frequency signal transmission line with spiral helicine inductor conductor involved by the 2nd comparative example, also have and hold flexible advantage.
(other execution mode)
High frequency signal transmission line involved by the utility model is not limited to high frequency signal transmission line 10,10a, can change within the scope of its main idea.
In addition, also can combine the structure of high frequency signal transmission line 10,10a.
Dielectric body 12 also can be do not have flexual hard substrate.
In addition, high frequency signal transmission line 10,10a are not limited to the circuit of flat cable shape, also can be used as the high frequency signal transmission line in the such module substrate of the RF circuit substrates such as antenna front ends module.
In addition, in high frequency signal transmission line 10,10a, also can not pass through connector 100a, 100b, and be connected with other circuit substrate by solder etc. with terminal conductor 22b, 22c via outside terminal 16a, 16b.
In addition, at least one in connector 100a, 100b can be installed on the back side of dielectric body 12.
In high frequency signal transmission line 10,10a, also than signal line 20a, the 20b negative direction side closer to z-axis direction, the earthing conductor relative with this signal line 20a, 20b can be set.
Industrial practicality
As mentioned above, the utility model is useful to high frequency signal transmission line and electronic equipment, can realize inductor miniaturization, simultaneously can also obtain in larger inductance value this point particularly outstanding.
Label declaration
L inductor
10,10a high frequency signal transmission line
12 dielectric body
18a ~ 18d dielectric sheet material
20a, 20b signal line
22 earthing conductors
40a, 40b inductor conductor
50a, 50b, 52a, 52b, 54a, 54b line conductor
Claims (6)
1. a high frequency signal transmission line, is characterized in that, comprising:
The dielectric body of tabular;
Earthing conductor, this earthing conductor is arranged at described dielectric body;
1st signal line, the 1st signal line is arranged at than the side of described earthing conductor closer to the normal direction of this dielectric body in described dielectric body, thus relative with this earthing conductor;
1st inductor conductor, 1st inductor conductor is arranged in described dielectric body than the side of described earthing conductor closer to the normal direction of this dielectric body, thus it is relative with this earthing conductor, and to be formed as on the 1st direction the meander-like of back and forth simultaneously advancing on the 2nd direction intersected with the 1st direction, described 1st inductor conductor is connected with described 1st signal line, and includes multiple 1st circuit packs extended along the 1st direction; And
2nd inductor conductor, 2nd inductor conductor is arranged in described dielectric body than the side of described earthing conductor closer to the normal direction of this dielectric body, thus it is relative with this earthing conductor, and be formed as reciprocal meander-like of simultaneously advancing on described 2nd direction on described 1st direction, described 2nd inductor conductor includes multiple 2nd circuit packs extended along the 1st direction
Described multiple 1st circuit pack and described multiple 2nd circuit pack adjacent one another are,
Described 1st inductor conductor and described 2nd inductor conductor are connected in series, to make the electric current flowing through equidirectional in adjacent described 1st circuit pack and described 2nd circuit pack.
2. high frequency signal transmission line as claimed in claim 1, is characterized in that,
Also comprise the 2nd signal line, the 2nd signal line is arranged at than the side of described earthing conductor closer to the normal direction of this dielectric body in described dielectric body, thus relative with this earthing conductor,
Described 1st inductor conductor and described 2nd inductor conductor are connected in series between described 1st signal line and described 2nd signal line.
3. high frequency signal transmission line as claimed in claim 2, is characterized in that,
Described 1st inductor conductor and described 2nd inductor conductor are arranged on the same position of the normal direction of described dielectric body,
Described 1st signal line is connected to a side end in described 2nd direction of described 1st inductor conductor,
Described 2nd signal line is connected to the end side in described 2nd direction of described 2nd inductor conductor,
Described high frequency signal transmission line also comprises:
Bonding conductor, this bonding conductor connects the end side in described 2nd direction of described 1st inductor conductor and a side end in the 2nd direction of described 2nd inductor conductor.
4. high frequency signal transmission line as claimed in claim 3, is characterized in that,
Described 1st inductor conductor is all adjacent over the entire length with described 2nd inductor conductor.
5. high frequency signal transmission line as claimed in claim 2, is characterized in that,
Described 1st inductor conductor and described 2nd inductor conductor are arranged on the diverse location of the normal direction of described dielectric body,
Described 1st signal line is connected to a side end in described 2nd direction of described 1st inductor conductor,
The end side in described 2nd direction of described 1st inductor conductor is connected with the end side in the 2nd direction of described 2nd inductor conductor,
Described high-frequency signal circuit also comprises:
Bonding conductor, this bonding conductor connects a side end in described 2nd direction of described 2nd inductor conductor and described 2nd signal line.
6. an electronic equipment, is characterized in that, comprising:
High frequency signal transmission line; And
Receive the housing of described high frequency signal transmission line,
Described high frequency signal transmission line comprises:
The dielectric body of tabular;
Earthing conductor, this earthing conductor is arranged at described dielectric body;
1st signal line, the 1st signal line is arranged at than the side of described earthing conductor closer to the normal direction of this dielectric body in described dielectric body, thus relative with this earthing conductor;
1st inductor conductor, 1st inductor conductor is arranged in described dielectric body than the side of described earthing conductor closer to the normal direction of this dielectric body, thus it is relative with this earthing conductor, and to be formed as on the 1st direction the meander-like of back and forth simultaneously advancing on the 2nd direction intersected with the 1st direction, described 1st inductor conductor is connected with described 1st signal line, and includes multiple 1st circuit packs extended along the 1st direction; And
2nd inductor conductor, 2nd inductor conductor is arranged in described dielectric body than the side of described earthing conductor closer to the normal direction of this dielectric body, thus it is relative with this earthing conductor, and be formed as reciprocal meander-like of simultaneously advancing on described 2nd direction on described 1st direction, described 2nd inductor conductor includes multiple 2nd circuit packs extended along the 1st direction
Described multiple 1st circuit pack and described multiple 2nd circuit pack adjacent one another are,
Described 1st inductor conductor and described 2nd inductor conductor are connected in series, to make the electric current flowing through equidirectional in adjacent described 1st circuit pack and described 2nd circuit pack.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-014178 | 2013-01-29 | ||
| JP2013014178 | 2013-01-29 | ||
| PCT/JP2014/050939 WO2014119410A1 (en) | 2013-01-29 | 2014-01-20 | High-frequency-signal transmission line, and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204303949U true CN204303949U (en) | 2015-04-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201490000217.6U Expired - Lifetime CN204303949U (en) | 2013-01-29 | 2014-01-20 | High frequency signal transmission line and electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN204303949U (en) |
| WO (1) | WO2014119410A1 (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62186307U (en) * | 1986-05-19 | 1987-11-27 | ||
| JPH0435202A (en) * | 1990-05-25 | 1992-02-06 | Sharp Corp | Microwave circuit |
| JPH0636932A (en) * | 1992-07-14 | 1994-02-10 | Rohm Co Ltd | Inductor for integrated circuit use |
| JPH1140915A (en) * | 1997-05-22 | 1999-02-12 | Nec Corp | Printed wiring board |
| KR100688858B1 (en) * | 2004-12-30 | 2007-03-02 | 삼성전기주식회사 | Printed circuit board with spiral three dimension inductor |
| EP2456005B1 (en) * | 2009-07-13 | 2014-12-17 | Murata Manufacturing Co., Ltd. | Signal line and circuit board |
| WO2012074100A1 (en) * | 2010-12-03 | 2012-06-07 | 株式会社村田製作所 | High-frequency signal line |
-
2014
- 2014-01-20 WO PCT/JP2014/050939 patent/WO2014119410A1/en active Application Filing
- 2014-01-20 CN CN201490000217.6U patent/CN204303949U/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014119410A1 (en) | 2014-08-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20150429 |
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| CX01 | Expiry of patent term |