CN204289416U

CN204289416U - wafer tray structure

Info

Publication number: CN204289416U
Application number: CN201420659630.5U
Authority: CN
Inventors: 陈宜杰; 罗世欣
Original assignee: ADVANCED SYSTEM TECHNOLOGY Co Ltd
Current assignee: ADVANCED SYSTEM TECHNOLOGY Co Ltd
Priority date: 2014-11-05
Filing date: 2014-11-05
Publication date: 2015-04-22
Anticipated expiration: 2024-11-05

Abstract

The utility model is a kind of wafer tray structure, and it comprises: pallet; Multiple crystal wafer platform; Multiple column; And upper cover.Each crystal wafer platform has: accommodating; And edge protuberance.Upper cover has: multiple disposal area; Multiple location hole; And multiple pore.By enforcement of the present utility model, can make wafer tray structure be easier to closely sealed, be easier to wafer location, prevent from leaking gas, the pore of upper cover not easily blocks, what column and corresponding location hole had more that foolproof function makes that upper cover and pallet can be easy and errorless combines closely.

Description

Wafer tray structure

Technical field

The utility model relates to a kind of wafer tray structure, is in particular a kind of wafer tray structure with convenient edge protuberance of locating and the groove preventing gas leakage.

Background technology

In recent years because the application of portable electronic product grows with each passing day, the demand of semiconductor crystal wafer is also along with significantly increasing, and semiconductor technology also just more and more comes into one's own.

But, in semiconductor technology, sometimes because lid and trays defective tightness, so that the etching agent used in technique or other Leakage Gas, and waste the resource of part or produce the doubt of polluting, sometimes even block because the air vent hole of lid or pallet produces and have impact on the yield of wafer output.

Shown in Fig. 1, be the schematic diagram of existing known wafer tray and lid, it mainly has cover body part 401 and disk body section 402, and cover body part 401 is large than disk body section 402, and be cover disk body section 402 in the mode of coated covering.When shown existing known wafer tray and lid use, namely cause gas leakage because easily producing gap between cover body part 401 and disk body section 402.

On the other hand, the pore (not shown) that existing known cover body part 401 uses, often just forms a hole above cover body part 401 each wafer relative, significantly affects the yield of wafer production service time once producing obstruction for a long time.

Therefore, the wafer tray structure of an innovation just has the urgent demand of arising at the historic moment, except lightweight, price cheaply, easily manufacture, more necessary can fool proof, conveniently locate, prevent block and prevent gas leakage, then significantly must increase the overall output of wafer process, for semiconductor industry and the manufacturer using electronic building brick, very large saving cost and the contribution increasing production capacity can be provided.

Because above-mentioned existing wafer tray structure Problems existing, the present inventor is based on being engaged in the practical experience and professional knowledge that this type of product design manufacture enriches for many years, and coordinate the utilization of scientific principle, actively in addition research and innovation, to founding a kind of wafer tray structure of new structure, general existing wafer tray structure can be improved, make it have more practicality.Through constantly research, design, and through repeatedly studying sample and after improving, finally creating the utility model had practical value.

Summary of the invention

Main purpose of the present utility model is, overcome existing wafer tray structure Problems existing, and a kind of wafer tray structure of new structure is provided, technical problem to be solved be make its be easier to closely sealed, be easier to wafer location, prevent from leaking gas, the pore of upper cover not easily blocks, what column and corresponding location hole had more that foolproof function makes that upper cover and pallet can be easy and errorless combines closely.

The purpose of this utility model and solve its technical problem and realize by the following technical solutions.According to a kind of wafer tray structure that the utility model provides, it comprises: pallet, and it is disk body and has first surface, and pallet periphery is the groove being formed with ring-type; Multiple crystal wafer platform, do not protrude in contact and be formed at first surface, wherein each crystal wafer platform has: accommodating; And edge protuberance, the side being formed at accommodating protrudes accommodating; Multiple column, does not protrude in contact and be formed at first surface, and arbitrary column does not contact with arbitrary crystal wafer platform; And upper cover, it is the disk body with second surface, the size of upper cover is the sizableness with pallet, and sealing covers pallet separably, upper cover has again: multiple disposal area, be recessed to form accordingly in second surface one to one with described crystal wafer platform, each disposal area corresponding crystal wafer platform can be contained, a side of each disposal area to form line part corresponding with the edge protuberance of corresponding crystal wafer platform; Multiple location hole, is not recessed to form in second surface in contact, and arbitrary location hole does not contact with arbitrary disposal area; And multiple pore, each pore is recessed to form periphery in disposal area and through to second surface.

The purpose of this utility model and solve its technical problem and also can be applied to the following technical measures to achieve further.

Aforesaid wafer tray structure, wherein this groove is equipped with O type ring (O-Ri ng).

Aforesaid wafer tray structure, wherein this accommodating of each this crystal wafer platform just can accommodating wafer, this wafer also contacts this edge protuberance.

Aforesaid wafer tray structure, wherein the straight line of this wafer trims with this edge protuberance.

Aforesaid wafer tray structure, wherein each this location hole is corresponding with this column and just can this column accommodating.

Aforesaid wafer tray structure, wherein the surface of each this crystal wafer platform has multiple through hole further.

Aforesaid wafer tray structure, wherein each this edge protuberance is be plane with this corresponding accommodating junction, and agrees with mutually with this corresponding line part.

Aforesaid wafer tray structure, wherein this pallet and this upper cover are made by identical metal material or alloy material or metallic compound material.

Aforesaid wafer tray structure, wherein this pallet and this upper cover are made by different metal material or alloy material or metallic compound material.

By enforcement of the present utility model, following advantages and beneficial effect can be reached:

One, wafer tray structure is easier to closely sealed.

Two, be easier to locate wafer.

Three, gas leakage can be prevented when upper cover and pallet cover.

Four, the pore of upper cover not easily blocks.

Five, column has foolproof function with corresponding location hole, and what make that upper cover and pallet can be easy and errorless combines closely.

Above-mentioned explanation is only the general introduction of technical solutions of the utility model, in order to technological means of the present utility model can be better understood, and can be implemented according to the content of specification, and can become apparent to allow above and other object of the present utility model, feature and advantage, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, be described in detail as follows.

Accompanying drawing explanation

Fig. 1 is the cross-sectional schematic for existing known a kind of wafer tray and upper cover.

Fig. 2 is the schematic perspective view of a kind of wafer tray structure for the utility model embodiment.

Fig. 3 is the cross-sectional schematic of a kind of pallet for the utility model embodiment and upper cover.

Fig. 4 is the schematic perspective view of a kind of pallet for the utility model embodiment.

Fig. 5 is the schematic perspective view of a kind of upper cover for the utility model embodiment.

Fig. 6 is for the crystal wafer platform of a kind of pallet of the utility model embodiment has the schematic perspective view of through hole further.

[main element symbol description]

100: wafer tray structure 10: pallet

11: first surface 12: groove

20: crystal wafer platform 21: accommodating

22: edge protuberance 30: column

40: upper cover 41: second surface

42: disposal area 421: line part

43: pore (breach) 44: location hole

50: through hole

Embodiment

For further setting forth the utility model for the technological means reaching predetermined goal of the invention and take and effect, below in conjunction with accompanying drawing and preferred embodiment, to according to its embodiment of wafer tray structure, structure, feature and the effect thereof that the utility model proposes, be described in detail as follows.

As shown in Figure 2, the present embodiment is a kind of wafer tray structure 100, and it includes: pallet 10; Multiple crystal wafer platform 20; Multiple column 30; And upper cover 40.

As shown in Figures 2 and 3, pallet 10, it is disk body have first surface 11, and pallet 10 periphery is also formed with the groove 12 of ring-type, that is groove 12 is recessed to form in pallet 10 periphery.And the material of described pallet 10, can be made by metal, alloy or metallic compound material, and the inside of groove 12 to arrange an O type ring, set O type ring can fill up groove 12 just, and the upper limb being arranged at the O type ring of groove 12 can flush with first surface 11.

As shown in Figure 2, Figure 3 and Figure 4, multiple crystal wafer platform 20, does not protrude in contact and be formed on first surface 11, and each crystal wafer platform 20 has: accommodating face 21; And edge protuberance 22.Edge protuberance 22 be formed at accommodating face 21 a side on and protrude accommodating face 21.Wherein each edge protuberance 22 is to be formed as plane with corresponding junction, accommodating face 21.

The size of each crystal wafer platform 20 is as shown in Figures 2 to 4 that can create just can accommodating wafer, again the straight line of wafer engagement edge protruding 22 and trim with edge protuberance 22, so, is just very easy to the location of wafer.

Again as shown in Figures 2 to 4, multiple column 30, does not protrude in contact and be formed on first surface 11, and arbitrary column 30 does not contact with arbitrary crystal wafer platform 20.Column 30 can be one-body molded with pallet 10, also can pallet 10 formed after set firmly upper at pallet 10 of column 30 again.In addition, the material of column 30 can be identical with pallet 10, also can be made by the hard material of other light weights.

Refer again to as shown in Figures 2 and 3, upper cover 40, it is another disk body with second surface 41, and the size of upper cover 40 is the sizableness with pallet 10, and sealing covers pallet 10 separably.Upper cover 40 is can made by the metal material identical with pallet 10, alloy material or metallic compound material, maybe can made by the metal material different with pallet 10, alloy material or metallic compound material.

As shown in Figures 2 and 3, owing to can arrange an O type ring in the groove 12 of pallet 10, when upper cover 40 covers pallet 10, O type ring can add the sealing effectiveness of strong production, makes the chemical gas of reaction can not produce leakage in process.

As shown in Fig. 2, Fig. 3 and Fig. 5, upper cover 40 has: multiple disposal area 42, multiple location hole 44 and multiple pore 43.Described disposal area 42 is the second surfaces 41 be recessed to form accordingly one to one with described crystal wafer platform 20 in upper cover 40, each disposal area 42 and can contain corresponding crystal wafer platform 20 and crystal wafer platform 20 take advantage of carry wafer, a side of each disposal area 42 is also formed with line part 421, line part 421 is corresponding with the edge protuberance 22 of corresponding crystal wafer platform 20, and can agree with mutually.

As shown in Fig. 2, Fig. 3 and Fig. 5, location hole 44 is not recessed to form the second surface 41 in upper cover 40 in contact, and arbitrary location hole 44 does not contact with the disposal area 42 on arbitrary second surface 41, wherein each location hole 44 is corresponding with the column 30 of pallet 10, and just can accommodating corresponding column 30.So, when upper cover 40 and pallet 10 cover, to be all necessarily each time combined and unlikely generation mistake with column 30 place from corresponding location hole 44, thus there is effect of fool proof.

Same as shown in Fig. 2, Fig. 3 and Fig. 5, upper cover 40 has again multiple pore 43, and each pore 43 to be recessed to form on the periphery of disposal area 42 and through to second surface 41.That is, there is a pore 43 each disposal area 42, is through on second surface 41 from inside, disposal area 42, because pore 43 forms the form as a breach, more not easily produces obstruction, and can guarantee the yield that wafer manufactures in technique is carried out.

Then please refer to as shown in Figure 6, the surface of each crystal wafer platform 20 of wafer tray 10 structure can have multiple through hole 50 further.The function of through hole 50, in technique is carried out, can pass into gas from through hole 50, as the medium of temperature conduction, to improve the efficiency of integrated artistic.The shape of through hole 50 or quantity there is no special restriction, and the material of the gas passed into from through hole 50 or pressure, more can depending on the demand of application.

Generally speaking, as described in above each embodiment, the utility model wafer tray structure 100, the groove 12 with pallet 10 can arrange an O type ring, makes upper cover 40 and pallet 10 be easier to closely sealed, and can strengthen airtight and avoid producing gas leakage; Have column 30 and have foolproof function with corresponding location hole 44, what make that upper cover and pallet can be easy and errorless combines closely; There is edge protuberance 22 and the line part 421 that can agree with mutually, be easier to locate wafer; Each disposal area 42 of upper cover 40 has a pore 43, is through on second surface 41 from inside, disposal area 42, forms the form as a breach, more not easily produces obstruction, and can guarantee the yield that wafer manufactures in technique is carried out.

The above, it is only preferred embodiment of the present utility model, not any pro forma restriction is done to the utility model, although the utility model discloses as above with preferred embodiment, but and be not used to limit the utility model, any those skilled in the art, do not departing within the scope of technical solutions of the utility model, make a little change when the technology contents of above-mentioned announcement can be utilized or be modified to the Equivalent embodiments of equivalent variations, in every case be the content not departing from technical solutions of the utility model, according to any simple modification that technical spirit of the present utility model is done above embodiment, equivalent variations and modification, all still belong in the scope of technical solutions of the utility model.

Claims

1. a wafer tray structure, is characterized in that, it comprises:

Pallet, it is disk body and has first surface, and this pallet periphery is the groove being formed with ring-type;

Multiple crystal wafer platform, do not protrude in contact and be formed at this first surface, wherein each this crystal wafer platform has:

Accommodating; And

Edge protuberance, to be formed on this side of accommodating and to protrude this accommodating;

Multiple column, does not protrude in contact and be formed at this first surface, and this column arbitrary does not contact with this crystal wafer platform arbitrary; And

Upper cover, it is the disk body with second surface, and the size of this upper cover is the sizableness with this pallet, and sealing covers this pallet separably, and this upper cover has again:

Multiple disposal area, be recessed to form accordingly one to one in this second surface with described crystal wafer platform, each this disposal area this corresponding crystal wafer platform can be contained, a side of each this disposal area to form line part corresponding with this edge protuberance of this corresponding crystal wafer platform;

Multiple location hole, is not recessed to form in contact in this second surface, and this location hole arbitrary does not contact with this disposal area arbitrary; And

Multiple pore, each this pore is recessed to form periphery in this disposal area and through to this second surface.

2. wafer tray structure as claimed in claim 1, it is characterized in that, wherein this groove is equipped with O type ring.

3. wafer tray structure as claimed in claim 1, is characterized in that, wherein this accommodating of each this crystal wafer platform just can accommodating wafer, this wafer also contacts this edge protuberance.

4. wafer tray structure as claimed in claim 2, it is characterized in that, wherein the straight line of this wafer trims with this edge protuberance.

5. wafer tray structure as claimed in claim 1, it is characterized in that, wherein each this location hole is corresponding with this column and just can this column accommodating.

6. wafer tray structure as claimed in claim 1, it is characterized in that, wherein the surface of each this crystal wafer platform has multiple through hole further.

7. wafer tray structure as claimed in claim 1, it is characterized in that, wherein each this edge protuberance is be plane with this corresponding accommodating junction, and agrees with mutually with this corresponding line part.

8. wafer tray structure as claimed in claim 1, it is characterized in that, wherein this pallet and this upper cover are made by identical metal material or alloy material or metallic compound material.

9. wafer tray structure as claimed in claim 1, it is characterized in that, wherein this pallet and this upper cover are made by different metal material or alloy material or metallic compound material.