CN204278669U - A kind of high activity Semi-dry yeast composite package film - Google Patents
A kind of high activity Semi-dry yeast composite package film Download PDFInfo
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- CN204278669U CN204278669U CN201420766827.9U CN201420766827U CN204278669U CN 204278669 U CN204278669 U CN 204278669U CN 201420766827 U CN201420766827 U CN 201420766827U CN 204278669 U CN204278669 U CN 204278669U
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Abstract
A kind of high activity Semi-dry yeast composite package film, this composite package film is made up of outer printing element layer and internal layer hot sealing layer, is connected between outer printing element layer and internal layer hot sealing layer by adhesive layer; Outer printing element layer is the bi-directional synchronization tensile nylon film of polyvinylidene chloride coating, and thickness is 10 ~ 20 microns; Internal layer hot sealing layer is that thickness is 50 ~ 150 microns by three-layer co-extruded blow molding process shaping metallocene modified polyethylene film; Adhesive layer is two-component polyurethane adhesive adhensive layer.A kind of high activity Semi-dry yeast composite package film that the utility model provides, structure is simple, and resistance to freezing, barrier property is high, and mechanical performance is strong, and cost is low, and the effect that can effectively ensure yeast activity and guarantee the quality for a long time, be particularly suitable for the packaging of Semi-dry yeast.
Description
Technical field
The utility model relates to a kind of packaging film, especially a kind of high activity Semi-dry yeast composite package film.
Background technology
The kind of yeast is numerous, and the product special flavour that different yeast does is different, such as, uses high activity dried yeast, and fermentation is stable but slightly inferior in the local flavor of fermentation; And use yeast cake, although have good fermentation local flavor, it is too harsh that it learns cryopreserved condition, is not too user-friendly to.So-called " Semi-dry yeast ", refers to the excellent flavor both with fermentation by living yeast, strong fermentability, is applicable to making freezing flour-dough; There is the good fluidity of dry ferment simultaneously, be applicable to weighing and the long-term high-activity yeast preserving advantage.
Semi-dry yeast has distinct characteristic, and compared with other yeast species, yeast cake requires at frozen state by agent in the short distance transportation of user, but does not slightly notice that temperature can rise comparatively fast, and yeast cake quality be can not be guaranteed.And Semi-dry yeast is comparatively large to 4 degree celsius temperature intervals by-18 degrees Celsius, even if agent adopts the common logistics short time to transport, also can not produce considerable influence to yeast quality, the dispensing and the dispensing radius that facilitate agent like this also can suitably strengthen.But the packaging of Semi-dry yeast is had higher requirement thereupon, domestic Semi-dry yeast great majority adopt the heavy automatic film rolling packaging of 5kg, namely require complete more than 180 DEG C seal filling after, quick-frozen is to-18 DEG C of low temperature environments, therefore, require, in product pouring process, there is good impact strength and fall strength of briquette.For above-mentioned problem, need to design the high-performance automatic packaging composite film of a kind of Semi-dry yeast in packaging, storage, transportation, improve Semi-dry yeast product quality, extend shelf life.
Summary of the invention
Technical problem to be solved in the utility model is to provide a kind of high activity Semi-dry yeast composite package film, the active fresh-keeping problem of Semi-dry yeast can be solved, the effect that can ensure yeast activity and guarantee the quality for a long time, and ensure greatly intact in transportation of packaging bag.
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is: a kind of high activity Semi-dry yeast composite package film, this composite package film is made up of outer printing element layer and internal layer hot sealing layer, is connected between outer printing element layer and internal layer hot sealing layer by adhesive layer;
Outer printing element layer is the bi-directional synchronization tensile nylon film of polyvinylidene chloride coating, and thickness is 10 ~ 20 microns;
Internal layer hot sealing layer is that thickness is 50 ~ 150 microns by three-layer co-extruded blow molding process shaping metallocene modified polyethylene film;
Adhesive layer is two-component polyurethane adhesive adhensive layer.
The thickness of outer printing element layer is 17 microns.
The thickness of internal layer hot sealing layer is 60 microns.
A kind of high activity Semi-dry yeast composite package film that the utility model provides, structure is simple, and resistance to freezing, barrier property is high, and mechanical performance is strong, and cost is low, and the effect that can effectively ensure yeast activity and guarantee the quality for a long time, be particularly suitable for the packaging of Semi-dry yeast; The active fresh-keeping problem of Semi-dry yeast can be solved, compared with packing with high-activity yeast conventional on the market, there is the shock resistance that resistance to low temperature is excellent and good, while can effectively ensureing packaging film high obstructing performance, play again and ensure yeast activity and the effect of guaranteeing the quality for a long time, and ensure intact in transportation of packaging bag greatly.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is described in further detail:
Fig. 1 is the utility model structural representation.
Detailed description of the invention
As shown in Figure 1, a kind of high activity Semi-dry yeast composite package film, this composite package film is made up of outer printing element layer 1 and internal layer hot sealing layer 3, is connected between outer printing element layer 1 and internal layer hot sealing layer 3 by adhesive layer 2;
The bi-directional synchronization tensile nylon film that outer printing element layer 1 is polyvinylidene chloride coating, thickness is 10 ~ 20 microns;
Internal layer hot sealing layer 3 is that thickness is 50 ~ 150 microns by three-layer co-extruded blow molding process shaping metallocene modified polyethylene film;
Adhesive layer 2 is cold-resistant two-component polyurethane adhesive adhensive layer.
The thickness of outer printing element layer 1 is 17 microns.
The thickness of internal layer hot sealing layer 3 is 60 microns.
Printing-ink on outer printing element layer 1 is selected.Ester soluble ink.
The printing of outer printing element layer 1 has printed by electronical line shaft intaglio plate.
Structure is simple, and resistance to freezing, barrier property is high, and mechanical performance is strong, and cost is low, and the effect that can effectively ensure yeast activity and guarantee the quality for a long time, be particularly suitable for the packaging of Semi-dry yeast; The active fresh-keeping problem of Semi-dry yeast can be solved, compared with packing with high-activity yeast conventional on the market, there is the shock resistance that resistance to low temperature is excellent and good, while can effectively ensureing packaging film high obstructing performance, play again the effect ensureing yeast activity and guarantee the quality for a long time, and ensure greatly intact in transportation of packaging bag, be particularly suitable for the packaging of Semi-dry yeast.
Claims (3)
1. a high activity Semi-dry yeast composite package film, is characterized in that: this composite package film is made up of outer printing element layer (1) and internal layer hot sealing layer (3), is connected between outer printing element layer (1) and internal layer hot sealing layer (3) by adhesive layer (2);
The bi-directional synchronization tensile nylon film that outer printing element layer (1) is coated with for polyvinylidene chloride, thickness is 10 ~ 20 microns;
Internal layer hot sealing layer (3) is that thickness is 50 ~ 150 microns by three-layer co-extruded blow molding process shaping metallocene modified polyethylene film;
Adhesive layer (2) is two-component polyurethane adhesive adhensive layer.
2. a kind of high activity Semi-dry yeast composite package film according to claim 1, is characterized in that: the thickness of outer printing element layer (1) is 17 microns.
3. a kind of high activity Semi-dry yeast composite package film according to claim 1, is characterized in that: the thickness of internal layer hot sealing layer (3) is 60 microns.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201420766827.9U CN204278669U (en) | 2014-12-09 | 2014-12-09 | A kind of high activity Semi-dry yeast composite package film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201420766827.9U CN204278669U (en) | 2014-12-09 | 2014-12-09 | A kind of high activity Semi-dry yeast composite package film |
Publications (1)
Publication Number | Publication Date |
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CN204278669U true CN204278669U (en) | 2015-04-22 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201420766827.9U Active CN204278669U (en) | 2014-12-09 | 2014-12-09 | A kind of high activity Semi-dry yeast composite package film |
Country Status (1)
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CN (1) | CN204278669U (en) |
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2014
- 2014-12-09 CN CN201420766827.9U patent/CN204278669U/en active Active
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
CP03 | "change of name, title or address" |
Address after: No.1, Juxiang Avenue, yaqueling Town, Yiling District, Yichang City, Hubei Province Patentee after: HUBEI HONGYU NEW PACKAGING MATERIALS Co.,Ltd. Address before: 443113, No. two, 188 Ring Road, crow crow Town, Yiling District, Hubei, Yichang Patentee before: YICHANG HONGYU PLASTIC Co.,Ltd. |
|
CP03 | "change of name, title or address" |