CN204271078U - The aobvious LED light source module of SIP high pressure height - Google Patents
The aobvious LED light source module of SIP high pressure height Download PDFInfo
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- CN204271078U CN204271078U CN201420661158.9U CN201420661158U CN204271078U CN 204271078 U CN204271078 U CN 204271078U CN 201420661158 U CN201420661158 U CN 201420661158U CN 204271078 U CN204271078 U CN 204271078U
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- rectification
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- light source
- bottom board
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Abstract
The utility model discloses the aobvious light source module of a kind of SIP high pressure height, comprises fluorescent adhesive layer, luminescence chip, box dam point glue-line, LED ceramic bottom board, rectification alternating current being converted to constant voltage DC electricity and constant current assembly and chip electrode pad; Luminescence chip is fixed on the light-emitting area region of LED ceramic bottom board, box dam point glue-line is fixed on the surrounding of luminescence chip, fluorescent adhesive layer is coated in the upper surface of luminescence chip, chip electrode pad is fixed on the light-emitting area region of LED ceramic bottom board, rectification and constant current assembly are fixed on the outside of ceramic bottom board light-emitting zone, rectification and constant current assembly one end pass into alternating current, and the direct current being converted to constant current is conveyed in chip electrode pad by the other end.The aobvious LED light source module of SIP high pressure height that the utility model provides, can use High Level AC Voltage 220V Direct driver, and installation is extremely convenient, use is simple.The utility model utilizes wafer diode as rectifier bridge, also does constant current process with wafer scale IC to rectification electric current out simultaneously, this ensure that the electric current needed for LED luminescence.
Description
Technical field
The utility model relates to LED illumination light source module technical field, particularly relates to the aobvious LED light source module of a kind of SIP high pressure height.
Background technology
LED light source module technology of today, all wants an additional driving power during use, when this also just makes finished product make, appearance design and overall sight feel that effect is had a greatly reduced quality.
In current product, the white light color rendition index relying on blue light and YAG/TAG/ nitride etc. series phosphor powder to inspire is relatively low, although the rouge and powder of useful nitride or green powder compensate mutually, but the blue light of 450-460nm is very little in the peak luminous wavelength excitation values (penetrance or neutralization ratio) of 620-650nm rouge and powder or the green powder of 518-540nm, so that product brightness is lower, in use procedure simultaneously, also have larger light decay.Adopting blue-ray LED to excite yellow and red two kinds of fluorescent material simultaneously, by improving the content of red fluorescence powder, low colour temperature and White LED with high color rendering property can be obtained.The advantage of this method is that two kinds of fluorescent material mix, and the blue light that LED component is produced, gold-tinted and ruddiness are easier to uniform color mixture at whole space ratio, and the space chromacity uniformity that it is expected to device is better.But its shortcoming is, at present, the quantum efficiency of red fluorescence powder is lower, causes the luminous efficiency of whole device not high, and after adding red fluorescence powder, the luminous efficiency of device almost reduces half.
Utility model content
For the weak point existed in above-mentioned technology, the utility model provides a kind of and adopts alternating current-direct current conversion techniques, merged LED wafer integrated technology, image restoring technology, a whole set of module has high stability, high brightness, high colour developing, the low aobvious LED light source module of SIP high pressure height of dazzling the features such as light.
In order to achieve the above object, the aobvious LED light source module of a kind of SIP high pressure of the utility model height comprises fluorescent adhesive layer, luminescence chip, box dam point glue-line, LED ceramic bottom board, rectification alternating current being converted to constant voltage DC electricity and constant current assembly and chip electrode pad; Described luminescence chip is fixed on the light-emitting area region of LED ceramic bottom board, described box dam point glue-line is fixed on the surrounding of luminescence chip, described fluorescent adhesive layer is coated in the upper surface of luminescence chip, described chip electrode pad is fixed on the light-emitting area region of LED ceramic bottom board, described rectification and constant current assembly are fixed on the outside of ceramic bottom board light-emitting zone, rectification and constant current assembly one end pass into alternating current, and the direct current being converted to constant current is conveyed in chip electrode pad by the other end.
Wherein, described luminescence chip comprises WD450-460nmLED blue chip and WD620-630nmLED red light chips, described LED blue chip and LED red light chips, by being connected wire, are staggeredly connected into straight line, are fixed on the light-emitting area region of LED ceramic bottom board.
Wherein, described rectification and constant current assembly comprise the solid welding block of rectification wafer, alternating current are converted to galvanic rectification wafer and rectification electric current are out the rectification wafer IC of crossing current process, the solid welding block of described rectification wafer connects rectification wafer, and rectification wafer connects rectification wafer IC.
Wherein, described chip electrode pad is elongated, two panels chip electrode pad symmetry is fixed on the light-emitting zone edge of LED ceramic bottom board, described first chip electrode pad is connected with positive source and light source positive pole respectively, and the second described wafer electrode pad is connected with power cathode and light source negative pole respectively.
Wherein, the aobvious light source module of described SIP high pressure height also comprises the IC encapsulated layer as protective layer, described IC encapsulated layer be erose be coated in LED ceramic bottom board rectification and constant current assembly on.
Wherein, the aobvious light source module of described SIP high pressure height also comprises ceramic bottom board fixing hole, the marginal position of what two fixing holes were centrosymmetric be arranged on LED ceramic bottom board.
The beneficial effects of the utility model are: compared with prior art, and light source module of the present utility model can use High Level AC Voltage 220V Direct driver, and installation is extremely convenient, use is simple.The utility model utilizes wafer diode as rectifier bridge, also does constant current process with wafer scale IC to rectification electric current out simultaneously, this ensure that the electric current needed for LED luminescence.Spectrum is made up of WD450-460nmLED blue chip, WD620-630nmLED red light chips, when not using Nitride phosphor, too increase red spectrum simultaneously, the color rendering index of product is better promoted, and this novel LED integrated height colour developing module, effectively can improve the luminous efficiency of light source module, by 2000H, this novel LED integrated height colour developing module luminous flux dimension extension rate can reach more than 90%.The utility model adopts alternating current-direct current conversion techniques, has merged LED wafer integrated technology, image restoring technology, and a whole set of module has high stability, high brightness, high colour developing, lowly dazzles the features such as light.
The utility model portion of techniques performance index contrast:
| Sequence number | Technical performance index | Domestic like product | Same kind of products at abroad | This case product |
| 1 | Refer to colour index (RA) | >80 | >80 | >80 |
| 2 | Optical efficiency LM/W | <100LM/W | 90-120LM/W | 120-140LM/W |
| 3 | Luminous flux sustainment rate 2000H | 70% | 85% | 94% |
| 4 | Bonding wire material | Copper cash/gold thread | Gold thread | Gold thread |
| 5 | Gold thread pulling force g | 10g | 12g | 12g |
| 6 | Red spectrum source | Nitride phosphor | Nitride phosphor | Red LED chip |
| 7 | Withstand voltage properties V | 2000V | 2000V | 4000V |
| 8 | Type of drive | DC drives | DC drives | AC drives |
Accompanying drawing explanation
Fig. 1 is the explosive view of the aobvious light source module of the utility model SIP high pressure height;
Fig. 2 is the aobvious light source module light source works schematic diagram of the utility model SIP high pressure height;
Main element symbol description is as follows:
10, fluorescent adhesive layer 11, connection wire
12, luminescence chip 121, LED blue chip
122, LED red light chips 13, box dam point glue-line
14, IC encapsulated layer 15, LED ceramic bottom board
16, chip electrode pad 17, rectification and constant current assembly
171, rectification wafer solid welding block 172, rectification wafer
173, constant current wafer IC 18, ceramic chassis fixing hole.
Embodiment
In order to more clearly state the utility model, below in conjunction with accompanying drawing, the utility model is further described.
Consult Fig. 1, the aobvious LED light source module of a kind of SIP high pressure of the utility model height comprises fluorescent adhesive layer 10, luminescence chip 12, box dam point glue-line 13, LED ceramic bottom board 15, rectification alternating current being converted to constant voltage DC electricity and constant current assembly 17 and chip electrode pad 16; Luminescence chip 12 is fixed on the light-emitting area region of LED ceramic bottom board 15, box dam point glue-line 13 is fixed on the surrounding of luminescence chip 12, fluorescent adhesive layer 10 is coated in the upper surface of luminescence chip 12, chip electrode pad 16 is fixed on the light-emitting area region of LED ceramic bottom board 15, described rectification and constant current assembly 17 are fixed on the outside of ceramic bottom board 15 light-emitting zone, rectification and constant current assembly 17 one end pass into alternating current, and the direct current being converted to constant current is conveyed in chip electrode pad 16 by the other end.
Further consult Fig. 2, the operation principle of the utility model light source is: adopt staggered matrix arrangement technique to be uniformly distributed a pile LED tiny crystal grains, the similar rectifier bridge of LED wafer diode string composition, the two ends of rectifier bridge connect alternating current source respectively, another two ends connect a string LED grain, the LED grain be energized on rear four brachium pontis is luminous by frequency.Can rotate with the frequency of 60 times per second in the interchange of 60Hz and light.The direct current that rectifier bridge obtains is pulsating direct current, the luminescence of LED is also flashed, and LED has power-off twilight sunset to continue the characteristic of light, and twilight sunset can keep tens microseconds, because the memory of human eye convection current moving light spot has inertia, the mode of operation deciphering that the luminescence of result human eye to LED light source adds twilight sunset is continuously in luminescence.LED has half the time in work, has half the time in rest, and thus heating is able to minimizing 40% ~ 20%.Therefore the useful life of this product, comparatively DC LED was longer.
Compared to prior art, the aobvious LED light source module of SIP high pressure height that the utility model provides, can use High Level AC Voltage 220V Direct driver, and installation is extremely convenient, use is simple.The utility model utilizes wafer diode as rectifier bridge, also does constant current process with wafer scale IC to rectification electric current out simultaneously, this ensure that the electric current needed for LED luminescence.The utility model adopts alternating current-direct current conversion techniques, has merged LED wafer integrated technology, image restoring technology, and a whole set of module has high stability, high brightness, high colour developing, lowly dazzles the features such as light.
In the present embodiment, luminescence chip 12 comprises WD450-460nmLED blue chip 121 and WD620-630nmLED red light chips 122, LED blue chip 121 and LED red light chips 122 are by being connected wire 11, staggeredly be connected into straight line, be fixed on the light-emitting area region of LED ceramic bottom board 15.Spectrum is made up of WD450-460nmLED blue chip, WD620-630nmLED red light chips, when not using Nitride phosphor, too increase red spectrum simultaneously, the color rendering index of product is better promoted, and this novel LED integrated height colour developing module, effectively can improve the luminous efficiency of light source module, by 2000H, this novel LED integrated height colour developing module luminous flux dimension extension rate can reach more than 90%.
In the present embodiment, rectification and constant current assembly 17 comprise the solid welding block 171 of rectification wafer, alternating current are converted to galvanic rectification wafer 172 and rectification electric current are out the rectification wafer IC173 of crossing current process, the solid welding block 171 of rectification wafer connects rectification wafer 172, and rectification wafer 172 connects rectification wafer IC173.Under the effect of rectification and constant current assembly, the effect of driving power can be removed from.
In the present embodiment, chip electrode pad 16 is elongated, two panels chip electrode pad 16 symmetry is fixed on the light-emitting zone edge of LED ceramic bottom board 15, first chip electrode pad 16 is connected with positive source and light source positive pole respectively, and the second wafer electrode pad 16 is connected with power cathode and light source negative pole respectively.The profile design of pad can adapt to chip and the IC of different structure.
In the present embodiment, the aobvious light source module of this SIP high pressure height also comprises in the rectification and constant current assembly 17 that IC encapsulated layer 14, the IC encapsulated layer 14 as protective layer is coated in LED ceramic bottom board 15 in erose.Because zener and constant current tube all want bonding wire, IC encapsulated layer just can do protective layer.
In the present embodiment, the aobvious light source module of SIP high pressure height also comprises the marginal position being arranged on LED ceramic bottom board 15 that ceramic bottom board fixing hole 18, two fixing hole is centrosymmetric.Fixing hole be arranged so that this light source module can be fixed easily.
Advantage of the present utility model is:
1, light is brighter.
2, light is softer pleasing.
3, illuminated object color is truer.
4, less (normal ageing 350 hours, luminous flux kept 99% or more in photochromic decay.
5, assembling easier (reduce large volume power supply purple dress, simplify assemble flow, reduce production cost).
Be only several specific embodiment of the present utility model above, but the utility model is not limited thereto, the changes that any person skilled in the art can think of all should fall into protection range of the present utility model.
Claims (6)
1. the aobvious light source module of SIP high pressure height, is characterized in that, comprise fluorescent adhesive layer, luminescence chip, box dam point glue-line, LED ceramic bottom board, rectification alternating current being converted to constant voltage DC electricity and constant current assembly and chip electrode pad; Described luminescence chip is fixed on the light-emitting area region of LED ceramic bottom board, described box dam point glue-line is fixed on the surrounding of luminescence chip, described fluorescent adhesive layer is coated in the upper surface of luminescence chip, described chip electrode pad is fixed on the light-emitting area region of LED ceramic bottom board, described rectification and constant current assembly are fixed on the outside of ceramic bottom board light-emitting zone, rectification and constant current assembly one end pass into alternating current, and the direct current being converted to constant current is conveyed in chip electrode pad by the other end.
2. the aobvious light source module of SIP high pressure height according to claim 1, it is characterized in that, described luminescence chip comprises WD450-460nm LED blue chip and WD620-630nm LED red light chips, described LED blue chip and LED red light chips are by being connected wire, staggeredly be connected into straight line, be fixed on the light-emitting area region of LED ceramic bottom board uniformly.
3. the aobvious light source module of SIP high pressure height according to claim 1, it is characterized in that, described rectification and constant current assembly comprise the solid welding block of rectification wafer, alternating current are converted to galvanic rectification wafer and rectification electric current are out the rectification wafer IC of crossing current process, the solid welding block of described rectification wafer connects rectification wafer, and rectification wafer connects rectification wafer IC.
4. the aobvious light source module of SIP high pressure height according to claim 1, it is characterized in that, described chip electrode pad is elongated, two panels chip electrode pad symmetry is fixed on the light-emitting zone edge of LED ceramic bottom board, first chip electrode pad is connected with positive source and light source positive pole respectively, and the second wafer electrode pad is connected with power cathode and light source negative pole respectively.
5. the aobvious light source module of SIP high pressure height according to claim 1; it is characterized in that; the aobvious light source module of described SIP high pressure height also comprises the IC encapsulated layer as protective layer, described IC encapsulated layer be erose be coated in LED ceramic bottom board rectification and constant current assembly on.
6. the aobvious light source module of SIP high pressure according to claim 1 height, is characterized in that, the described aobvious light source module of SIP high pressure height also comprises ceramic bottom board fixing hole, the marginal position of what two fixing holes were centrosymmetric be arranged on LED ceramic bottom board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420661158.9U CN204271078U (en) | 2014-11-07 | 2014-11-07 | The aobvious LED light source module of SIP high pressure height |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420661158.9U CN204271078U (en) | 2014-11-07 | 2014-11-07 | The aobvious LED light source module of SIP high pressure height |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204271078U true CN204271078U (en) | 2015-04-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420661158.9U Expired - Fee Related CN204271078U (en) | 2014-11-07 | 2014-11-07 | The aobvious LED light source module of SIP high pressure height |
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| Country | Link |
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| CN (1) | CN204271078U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104500995A (en) * | 2014-11-07 | 2015-04-08 | 深圳市新月光电有限公司 | SIP (system in package) high-voltage high-color-rendering LED light source module |
-
2014
- 2014-11-07 CN CN201420661158.9U patent/CN204271078U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104500995A (en) * | 2014-11-07 | 2015-04-08 | 深圳市新月光电有限公司 | SIP (system in package) high-voltage high-color-rendering LED light source module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 518000, Shenzhen District, Guangming District, Guangdong province Gongming Street Community Community stone industry park 12 Patentee after: Crescent Optoelectronics (Shenzhen) Limited by Share Ltd Address before: 518000, Guangdong District, Guangming District, Gongming, Shenzhen village community Stone Industrial Park on the 12 (in Li Songlang community city, Tak Xuan science and Technology Park, H building, five floor, A, with operating venues, engaged in production and management activities) Patentee before: SHENZHEN CRESCENT OPTOELECTRONIC CO., LTD. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150415 Termination date: 20201107 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |