CN204271049U - Wafer transfer device - Google Patents
Wafer transfer device Download PDFInfo
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- CN204271049U CN204271049U CN201420607470.XU CN201420607470U CN204271049U CN 204271049 U CN204271049 U CN 204271049U CN 201420607470 U CN201420607470 U CN 201420607470U CN 204271049 U CN204271049 U CN 204271049U
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- film
- brace table
- bedplate
- transfer device
- wafer transfer
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Abstract
The utility model discloses a kind of wafer transfer device, it is characterized in that, comprise brace table and lower support platform; Described lower support platform is used for supporting wafer; Described upper brace table is for supporting the first film; Described upper brace table and described lower support platform can relative near and remotely arrange, described upper brace table and described lower support platform near time, on the first film wafer be positioned on described lower support platform being sticked to be positioned on described upper brace table.Wafer transfer device in the utility model, improve the automaticity of wafer transfer, production efficiency improves greatly.
Description
Technical field
The utility model relates to wafer manufacture field, particularly a kind of for by wafer from a slice film transfer to the wafer transfer device another sheet film.
Background technology
Wafer refers to the silicon wafer that Si semiconductor production of integrated circuits is used, because its shape is circular, therefore is called wafer.Wafer can manufacture various circuit component structure, usually the face with circuit component structure is called front, namely on the other side be called the back side.In wafer fabrication processes, in order to various uses often needs to be sticked to by wafer on a film 02.As illustrated in fig. 1 and 2, film 02 is pasted onto and stretches tight on film frame 01.Film 02 has certain tension force usually.Namely wafer 03 sticks on film 02.
In wafer fabrication processes, need to carry out multiple process operation to wafer.In procedure of processing, have plenty of wafer frontside operation, have plenty of and wafer rear is operated.Usually all stick on film during wafer price and carry out.If be to wafer frontside operation in upper one manufacturing procedure, when next process needs for wafer rear process operation, just need after upper one manufacturing procedure completes, by wafer transfer on another film, and make wafer rear outwardly, to process.
Traditional wafer transfer many employings workman manual operations, tears from film by the wafer after upper one manufacturing procedure completes, then is pasted on another film.Adopt manual operation, labour intensity is large, production efficiency is low.The stability that workman shifts wafer is by hand also very poor, very easily because the misoperation of workman damages wafer, causes scrapping, adds production cost.
In addition, even larger-size wafer adopts the difficulty of manual operation transfer still larger.After wafer is cut into multiple chip, then the difficulty shifted will more strengthen, even cannot safety operation because the chip size after cutting is too small.
Utility model content
The purpose of this utility model is to overcome deficiency of the prior art, provides a kind of wafer transfer device efficiently.
For realizing above object, the utility model is achieved through the following technical solutions:
Wafer transfer device, is characterized in that, comprises brace table and lower support platform;
Described lower support platform is used for supporting wafer;
Described upper brace table is for supporting the first film;
Described upper brace table and described lower support platform can relative near and remotely arrange, described upper brace table and described lower support platform near time, on the first film wafer be positioned on described lower support platform being sticked to be positioned on described upper brace table.
Preferably, also comprise the first drive unit, described upper brace table is liftably arranged; Described first drive unit drives described upper brace table or is risen by brace table upper described in the first actuator drives and declined.
Preferably, described first drive unit is the first motor, and described first transmission device is one or more during gear, driving-belt, driving-chain, screw mandrel, feed screw nut and screw mandrel and screw shell combine.
Preferably, also comprise the first bedplate, described upper brace table is installed on below described first bedplate, and can arrange relative to described first bedplate motion; Described first motor is installed on described first bedplate upper surface; Described first transmission device comprises the first screw mandrel and the first screw shell; Described first screw shell coordinates with described first wire rod thread; One of described first screw mandrel and described first screw shell run through described first bedplate and are rotatably installed on described first bedplate, and another is connected with described upper brace table; Described first motor drives described first screw mandrel or the first screw shell to rotate.
Preferably, also comprise the first guider, described first guider is used on the described brace table movement locus relative to brace table on described in described first bedplate motion limit.
Preferably, described first guider comprises the first guide post; Described first guide post passes described first bedplate and is slidably disposed on described first bedplate; Or described first bedplate is provided with the first sleeve, and described first guide post can be inserted in slidably in described first sleeve in described first sleeve.
Preferably, also upper backup pad is comprised; Described upper backup pad can be arranged by relatively described upper brace table movably, and described upper backup pad is used for compressing film, makes film tensioning.
Preferably, described upper brace table is provided with the first through hole; Described upper backup pad, when described upper brace table moves, can compress film through described first through hole.
Preferably, also comprise the second drive unit, described upper backup pad is liftably arranged; Described second drive unit is driven described upper backup pad or is risen by upper backup pad described in the second actuator drives and decline.
Preferably, described second drive unit is the second motor, and described second transmission device is one or more during gear, driving-belt, driving-chain, screw mandrel, feed screw nut and screw mandrel and screw shell combine.
Preferably, also comprise the first bedplate, described upper backup pad is installed on below described first bedplate, and can arrange relative to described first bedplate motion; Described second motor is installed on described first bedplate upper surface; Described second transmission device comprises the second screw mandrel and the second screw shell; Described second screw shell coordinates with described second wire rod thread; One of described second screw mandrel and described second screw shell run through described first bedplate and are rotatably installed on described first bedplate, and another is connected with described upper backup pad; Described second motor drives described second screw mandrel or the second screw shell to rotate.
Preferably, also comprise the second guider, described second guider is used at the movement locus of described upper backup pad relative to upper backup pad described in described first bedplate motion limit.
Preferably, described second guider comprises the second guide post; Described second guide post passes described first bedplate and is slidably disposed on described first bedplate; Or described first bedplate is provided with the second sleeve, and described second guide post can be inserted in slidably in described second sleeve in described second sleeve.
Preferably, also comprise the first wafer carrying frame, described first wafer carrying frame comprises first and to stretch tight film frame and the first film; Described the first film is attached at first and stretches tight on film frame; The described first film frame that stretches tight removably is held on described upper brace table.
Preferably, the 3rd drive unit is also comprised; Described brace table is provided with holder, and described holder matches with described upper brace table, clamps described first and to stretch tight film frame; Described holder can be arranged near described upper brace table and away from upper support tableland; Described 3rd drive unit drive described holder near and away from described upper brace table or by holder described in the 3rd actuator drives near and away from upper brace table.
Preferably, also elasticity reset device is comprised; When described holder is away from described upper brace table, make described elasticity reset device strain, the described elasticity reset device after strain has the trend making described holder near described upper brace table.
Preferably, described 3rd drive unit is the second cylinder; Described holder is set on guide post and also can slides along described guide post; Described in described second air cylinder driven, holder moves; Described elasticity reset device is spring; Described spring housing is loaded on described guide post; When described holder slides along described guide post, described spring is out of shape.
Preferably, lower expansion film bucket and four-drive device is also comprised; Described lower expansion film bucket is arranged movably; Described lower expansion film bucket, for supporting the second film of adhesive silicon wafer, makes the second film tensioning; Described four-drive device is driven described lower expansion film bucket to move or is moved by expansion film bucket lower described in the 4th actuator drives.
Preferably, described lower support platform is provided with the second through hole; Through described second through hole when described lower expansion film bucket moves, support the second film be positioned on described lower support platform, make the second film tensioning.
Preferably, lower supporting plate and the 5th drive unit is also comprised; Described lower supporting plate is arranged movingly; The second film can be propped up during described lower supporting plate motion, support the wafer on the second film; Described 5th drive unit is driven described lower supporting plate to move or is moved by lower supporting plate described in the 5th actuator drives.
Preferably, also comprise UV curing apparatus, described UV curing apparatus is used for emitting ultraviolet light, to irradiate the second film of adhesive silicon wafer, the viscous force of the second film is reduced.
Preferably, described upper brace table can movably be arranged relatively with described lower support platform.
Preferably, also comprise the second wafer carrying frame, described second wafer carrying frame comprises second and to stretch tight film frame and the second film; Described second film is attached at second and stretches tight on film frame; The described second film frame that stretches tight removably is held on described upper brace table.
Preferably, described lower support platform comprises train wheel bridge and lower plate, and described train wheel bridge is provided with through hole, and described lower plate is provided with lower through-hole; Described upper through hole is relative with described lower through-hole position; Described train wheel bridge and described lower plate can close to each other and remotely be arranged; Described train wheel bridge and described lower plate close to each other time jointly clamp down the film frame that stretches tight; Described train wheel bridge and described lower plate mutually away from time, the chucking power to the film frame that stretches tight under described can be removed.
Wafer transfer device in the utility model, improve the automaticity of wafer transfer, production efficiency improves greatly.By the wafer transfer device transfer wafer in the utility model, stability improves greatly compared with the manual operations of transmission, avoids because manual operation is improper, film being scratched, thus avoids wafer carrying frame to scrap.
By the wafer on the former wafer carrying frame of lower supporting plate jack-up, make wafer higher than the film frame that stretches tight of former wafer carrying frame; Use upper backup pad outwards to be ejected by the first film of new wafer carrying frame simultaneously, new the first film can be facilitated to receive wafer and avoid two film frames that stretch tight mutually to interfere volume.Utilize the lower film bucket that expands to support film on former wafer carrying frame, wafer can be made to protrude from stretch tight film frame and keep smooth.Use upper backup pad to compress the first film on new wafer carrying frame, can guarantee that new the first film entirely receives wafer, prevent wafer skewness or film is loose, fold and affect stickup.
Accompanying drawing explanation
Fig. 1 is the structural front view of wafer carrying frame;
Fig. 2 is the structure cutaway view of the wafer carrying frame carrying wafer;
Fig. 3 is the structural front view of the wafer transfer device in embodiment;
Fig. 4 is the structural representation of the upper brace table of wafer transfer device in embodiment;
Another angle schematic diagram that Fig. 5 is structure shown in Fig. 4;
Another angle schematic diagram that Fig. 6 is structure shown in Fig. 4;
Fig. 7 is the structural representation of the holder in embodiment;
Fig. 8 is the structural representation of the lower support platform of wafer transfer device in embodiment;
Fig. 9 is the structural representation after being shifted out by the lower supporting plate in Fig. 8.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in detail:
As shown in figs. 3-9, wafer transfer device, comprises brace table 10 and lower support platform 20.Upper brace table 20 and described lower support platform 30 can relative near and remotely arrange.Upper brace table 10 is for supporting the first film (not shown) needing adhesive silicon wafer, and lower support platform 20 is for supporting wafer.Wafer is positioned on lower support platform 20, and upper brace table 10, near lower support platform 20, makes wafer stick on the first film, is carried by upper brace table 10.
In preferred embodiment of the present utility model, comprise the first bedplate 30.Upper brace table 10 is installed on below the first bedplate 30, and can arrange with moving relative to the first bedplate 30, moves with namely rising and decline.The utility model adopts the first drive unit to drive described upper brace table 10 to rise and decline or risen by the first drive unit by brace table 10 in the first actuator drives and declined.According to preferred implementation of the present utility model, the first drive unit is the first motor 51.First motor 51 is installed on the first bedplate 30 upper surface.First transmission device is the first feed screw nut 61.First feed screw nut 61 comprises the first screw mandrel 611 and the first screw shell 612.First screw mandrel 611 and the first screw shell 612 threaded engagement.First screw mandrel 611 runs through the first bedplate 30 and is rotatably installed on the first bedplate 30, and the end of the first screw mandrel 611 is installed in rotation on brace table 10.First screw shell 612 is connected with the first base 30.First motor drives the first screw mandrel 611 to rotate by Timing Belt 613.For brace table in stable support 10, four the first feed screw nuts can be adopted symmetrical, four the first screw mandrels 611 link and arrange.Also first feed screw nut only can be set, use multiple first guider in addition.First guider is used for supporting brace table 10 when upper brace table 10 rises or declines, and helps to maintain balance.First guider comprises the first guide post 81.First guide post 81 one end is connected on brace table 10, and through the first bedplate 30, and be slidably disposed on the first bedplate 30.Increase the stability of the first guide post 81, the first bedplate 30 arranges the first sleeve 82.First guide post 81 also can slide axially along the first sleeve 82 through the first sleeve 82.
First bedplate 30 lower surface is connected with upper backup pad 40.Upper backup pad 40 relatively can be gone up brace table 30 and arrange movably, namely rises and declines.Upper backup pad 40 is positioned at the first film of upper brace table 10 lower surface for compressing, make the first film tensioning.According to preferred implementation of the present utility model, upper brace table 10 arranges the first through hole 11.When upper backup pad 40 rises and declines, can the first through hole 11 be passed, compress the first film.
The utility model adopts the second drive unit to drive described upper backup pad 40 to move.First drive unit is moved by the second actuator drives upper backup pad 40.According to preferred implementation of the present utility model, the second drive unit is the second motor 52.Second motor 52 is installed on the first bedplate 30 upper surface.Second transmission device is the second feed screw nut 62.Second feed screw nut 62 comprises the second screw mandrel 621 and the second screw shell 622.Second screw mandrel 621 and the second screw shell 622 threaded engagement.Second screw mandrel 621 runs through the first bedplate 30 and is rotatably installed on the first bedplate 30, and the end of the second screw mandrel 621 is installed in rotation on upper backup pad 40.Second screw shell 622 is connected with the first base 30.Second motor drives the second screw mandrel 621 to rotate by Timing Belt 623.For stable support upper backup pad 40, multiple second guider can be used.Second guider is used for supporting upper backup pad 40 when upper backup pad 40 rises or declines, and helps to maintain balance.Second guider comprises the second guide post 83.Second guide post 83 one end is connected on upper backup pad 40, and through the first bedplate 30, and be slidably disposed on the first bedplate 30.Increase the stability of the second guide post 83, the first bedplate 30 arranges the second sleeve 84.Second guide post 83 also can slide axially along the second sleeve 84 through the second sleeve 84.
As preferred embodiment, as illustrated in fig. 1 and 2, the utility model also comprises the first wafer carrying frame, and the first wafer carrying frame comprises first and to stretch tight film frame 01 and the first film 02.The first film 02 is attached at first and stretches tight on film frame 01.The first film frame that stretches tight removably is held on brace table 10.
Upper brace table 10 is provided with holder 12.Holder 12 matches with upper brace table 10, and clamping first is stretched tight film frame 01.Holder 12 can be arranged near upper brace table 10 and away from upper brace table 10 ground.The 3rd drive unit is provided with on first bedplate 30 or on upper brace table 10; 3rd drive unit drive holder 12 near and away from described upper brace table 10, or by holder described in the 3rd actuator drives 12 near and away from upper brace table 10.According to preferred implementation of the present utility model, the 3rd drive unit is the second cylinder 52.Holder 12 is set on guide post 13 and also can slides along guide post 13.Second cylinder 52 drives holder 12 to move.The utility model is provided with elasticity reset device; When holder 12 is away from described upper brace table 10, make described elasticity reset device strain, the elasticity reset device after strain has the trend making described holder 12 near described upper brace table 10.According to preferred implementation of the present utility model, elasticity reset device is spring 14; Described spring 14 is set on described guide post 13.When holder 12 slides along described guide post 13, make described spring 14 by compressing strain.When the second cylinder 52 does not reoffer active force, spring 14 can utilize elasticity to make holder 12 homing, to stretch tight film frame 01 to clamp first near upper brace table 10.
As preferred embodiment, the utility model also arranges the second wafer carrying frame.Second wafer carrying mount structure is identical with the first wafer carrying mount structure, for fixing wafer.Second wafer carrying frame comprises second and to stretch tight film frame and the second film.The utility model also comprises lower expansion film bucket 45 and four-drive device.Lower expansion film bucket 45 is arranged movably, namely rises and declines.Lower expansion film bucket 45, for supporting the second film of adhesive silicon wafer, makes the second film tensioning, to keep the wafer that is pasted on the second film smooth.Four-drive device drives lower expansion film bucket 45 to move or move by expanding film bucket 45 under the 4th actuator drives.Lower support platform 20 is provided with the second through hole 21.Through described second through hole 21 when lower expansion film bucket 45 moves, support the second film be positioned on described lower support platform 20, make the second film tensioning.Four-drive device can select cylinder or motor.
Second wafer carrying frame comprises the second film for adhesive silicon wafer.For providing larger support force, and guarantee the smooth of wafer, the utility model also comprises lower supporting plate 46.Lower supporting plate 46 is arranged movingly, namely rises and declines.Lower supporting plate 46 can prop up the second film after rising, and supports the wafer on the second film.Utilize four-drive device to drive described lower supporting plate 46 to move or moved by lower supporting plate 46 described in the 5th actuator drives by the 5th drive unit.5th drive unit can select cylinder or motor.According to preferred embodiment of the present utility model, the second film is supported in the bucket chamber 451 through lower expansion film bucket 45 when lower supporting plate 46 is elevated.
The utility model is the adhesion of the second film on reduction by second wafer carrying frame, is also provided with UV curing apparatus, and described UV curing apparatus is used for emitting ultraviolet light, to irradiate the second film of adhesive silicon wafer, the viscous force of the second film is reduced.
Described upper brace table can movably be arranged relatively with described lower support platform.
For clamping the second wafer carrying frame, the lower support platform 20 in the utility model comprises train wheel bridge 22 and lower plate 23.Train wheel bridge 22 is provided with through hole, and described lower plate 23 is provided with lower through-hole; Described upper through hole is relative with described lower through-hole position forms the second through hole 21.Train wheel bridge 22 and lower plate 23 can close to each other and remotely be arranged.Train wheel bridge 22 clamps the second wafer carrying frame time close to each other with lower plate 23 jointly; Described train wheel bridge 22 and described lower plate 23 mutually away from time, the chucking power to described second wafer carrying frame can be removed.
The using method of the wafer transfer device in the utility model is as follows:
Second wafer carrying frame adhesive silicon wafer, wafer lower surface sticks on the second film, and wafer upper surface exposes.After front road processing-sliver is processed to form multiple wafer, be clamped on lower support platform 20.Lower expansion film bucket 45 rises and supports the second film, makes the second film tensioning, and protrudes from second and to stretch tight film frame.Use UV-irradiation second film, the viscous force of the second film is reduced.Lower supporting plate 46 rear support that rises is made to live the second film and wafer.
First wafer carrying frame is clamped in upper support platform 10, compresses the first film after upper backup pad 40 is declined, make the first film tensioning.Upper support platform 10 makes the first film contact with wafer upper surface after declining, and is sticked on the first film by wafer.Wafer upper surface contacts with the first film, and lower surface exposes.Make brace table 10 increase, wafer can be moved to the first film from the second film.
Upper and lower, left and right in the utility model, level, being vertically all reference with Fig. 3, for clearly describing the utility model and the relative concept used, not forming the restriction to right.
Embodiment in the utility model, only for being described the utility model, does not form the restriction to right, other equivalent in fact substituting, all in the utility model protection range that those skilled in that art can expect.
Claims (24)
1. wafer transfer device, is characterized in that, comprises brace table and lower support platform;
Described lower support platform is used for supporting wafer;
Described upper brace table is for supporting the first film;
Described upper brace table and described lower support platform can relative near and remotely arrange, described upper brace table and described lower support platform near time, on the first film wafer be positioned on described lower support platform being sticked to be positioned on described upper brace table.
2. wafer transfer device according to claim 1, is characterized in that, also comprises the first drive unit, and described upper brace table is liftably arranged; Described first drive unit drives described upper brace table or is risen by brace table upper described in the first actuator drives and declined.
3. wafer transfer device according to claim 2, it is characterized in that, described first drive unit is the first motor, and described first transmission device is one or more during gear, driving-belt, driving-chain, screw mandrel, feed screw nut and screw mandrel and screw shell combine.
4. wafer transfer device according to claim 3, is characterized in that, also comprises the first bedplate, and described upper brace table is installed on below described first bedplate, and can arrange relative to described first bedplate motion; Described first motor is installed on described first bedplate upper surface; Described first transmission device comprises the first screw mandrel and the first screw shell; Described first screw shell coordinates with described first wire rod thread; One of described first screw mandrel and described first screw shell run through described first bedplate and are rotatably installed on described first bedplate, and another is connected with described upper brace table; Described first motor drives described first screw mandrel or the first screw shell to rotate.
5. wafer transfer device according to claim 4, is characterized in that, also comprises the first guider, and described first guider is used on the described brace table movement locus relative to brace table on described in described first bedplate motion limit.
6. wafer transfer device according to claim 5, is characterized in that, described first guider comprises the first guide post; Described first guide post passes described first bedplate and is slidably disposed on described first bedplate; Or described first bedplate is provided with the first sleeve, and described first guide post can be inserted in slidably in described first sleeve in described first sleeve.
7. wafer transfer device according to claim 1, is characterized in that, also comprises upper backup pad; Described upper backup pad can be arranged by relatively described upper brace table movably, and described upper backup pad is used for compressing film, makes film tensioning.
8. wafer transfer device according to claim 7, is characterized in that, described upper brace table is provided with the first through hole; Described upper backup pad, when described upper brace table moves, can compress film through described first through hole.
9. wafer transfer device according to claim 7, is characterized in that, also comprises the second drive unit, and described upper backup pad is liftably arranged; Described second drive unit is driven described upper backup pad or is risen by upper backup pad described in the second actuator drives and decline.
10. wafer transfer device according to claim 9, it is characterized in that, described second drive unit is the second motor, and described second transmission device is one or more during gear, driving-belt, driving-chain, screw mandrel, feed screw nut and screw mandrel and screw shell combine.
11. wafer transfer device according to claim 10, is characterized in that, also comprise the first bedplate, and described upper backup pad is installed on below described first bedplate, and can arrange relative to described first bedplate motion; Described second motor is installed on described first bedplate upper surface; Described second transmission device comprises the second screw mandrel and the second screw shell; Described second screw shell coordinates with described second wire rod thread; One of described second screw mandrel and described second screw shell run through described first bedplate and are rotatably installed on described first bedplate, and another is connected with described upper backup pad; Described second motor drives described second screw mandrel or the second screw shell to rotate.
12. wafer transfer device according to claim 11, is characterized in that, also comprise the second guider, and described second guider is used at the movement locus of described upper backup pad relative to upper backup pad described in described first bedplate motion limit.
13. wafer transfer device according to claim 12, is characterized in that, described second guider comprises the second guide post; Described second guide post passes described first bedplate and is slidably disposed on described first bedplate; Or described first bedplate is provided with the second sleeve, and described second guide post can be inserted in slidably in described second sleeve in described second sleeve.
14. wafer transfer device according to claim 1, is characterized in that, also comprise the first wafer carrying frame, and described first wafer carrying frame comprises first and to stretch tight film frame and the first film; Described the first film is attached at first and stretches tight on film frame; The described first film frame that stretches tight removably is held on described upper brace table.
15. wafer transfer device according to claim 14, is characterized in that, also comprise the 3rd drive unit; Described brace table is provided with holder, and described holder matches with described upper brace table, clamps described first and to stretch tight film frame; Described holder can be arranged near described upper brace table and away from upper support tableland; Described 3rd drive unit drive described holder near and away from described upper brace table or by holder described in the 3rd actuator drives near and away from upper brace table.
16. wafer transfer device according to claim 15, is characterized in that, also comprise elasticity reset device; When described holder is away from described upper brace table, make described elasticity reset device strain, the described elasticity reset device after strain has the trend making described holder near described upper brace table.
17. wafer transfer device according to claim 16, is characterized in that, described 3rd drive unit is the second cylinder; Described holder is set on guide post and also can slides along described guide post; Described in described second air cylinder driven, holder moves; Described elasticity reset device is spring; Described spring housing is loaded on described guide post; When described holder slides along described guide post, described spring is out of shape.
18. wafer transfer device according to claim 1, is characterized in that, also comprise lower expansion film bucket and four-drive device; Described lower expansion film bucket is arranged movably; Described lower expansion film bucket, for supporting the second film of adhesive silicon wafer, makes the second film tensioning; Described four-drive device is driven described lower expansion film bucket to move or is moved by expansion film bucket lower described in the 4th actuator drives.
19. wafer transfer device according to claim 18, is characterized in that, described lower support platform is provided with the second through hole; Through described second through hole when described lower expansion film bucket moves, support the second film be positioned on described lower support platform, make the second film tensioning.
20. wafer transfer device according to claim 19, is characterized in that, also comprise lower supporting plate and the 5th drive unit; Described lower supporting plate is arranged movingly; The second film can be propped up during described lower supporting plate motion, support the wafer on the second film; Described 5th drive unit is driven described lower supporting plate to move or is moved by lower supporting plate described in the 5th actuator drives.
21. wafer transfer device according to claim 1, is characterized in that, also comprise UV curing apparatus, and described UV curing apparatus is used for emitting ultraviolet light, to irradiate the second film of adhesive silicon wafer, the viscous force of the second film is reduced.
22. wafer transfer device according to claim 1, is characterized in that, described upper brace table can movably be arranged relatively with described lower support platform.
23. wafer transfer device according to claim 1, is characterized in that, also comprise the second wafer carrying frame, and described second wafer carrying frame comprises second and to stretch tight film frame and the second film; Described second film is attached at second and stretches tight on film frame; The described second film frame that stretches tight removably is held on described upper brace table.
24. wafer transfer device according to claim 1, is characterized in that, described lower support platform comprises train wheel bridge and lower plate, and described train wheel bridge is provided with through hole, and described lower plate is provided with lower through-hole; Described upper through hole is relative with described lower through-hole position; Described train wheel bridge and described lower plate can close to each other and remotely be arranged; Described train wheel bridge and described lower plate close to each other time jointly clamp down the film frame that stretches tight; Described train wheel bridge and described lower plate mutually away from time, the chucking power to the film frame that stretches tight under described can be removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420607470.XU CN204271049U (en) | 2014-10-20 | 2014-10-20 | Wafer transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420607470.XU CN204271049U (en) | 2014-10-20 | 2014-10-20 | Wafer transfer device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204271049U true CN204271049U (en) | 2015-04-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420607470.XU Expired - Fee Related CN204271049U (en) | 2014-10-20 | 2014-10-20 | Wafer transfer device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104409383A (en) * | 2014-10-20 | 2015-03-11 | 上海技美电子科技有限公司 | Wafer transfer device |
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2014
- 2014-10-20 CN CN201420607470.XU patent/CN204271049U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104409383A (en) * | 2014-10-20 | 2015-03-11 | 上海技美电子科技有限公司 | Wafer transfer device |
| CN104409383B (en) * | 2014-10-20 | 2017-08-01 | 上海技美电子科技有限公司 | Wafer transfer device |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150415 |