CN204235403U - A kind of diamond-impregnated wheel - Google Patents

A kind of diamond-impregnated wheel Download PDF

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Publication number
CN204235403U
CN204235403U CN201420460717.XU CN201420460717U CN204235403U CN 204235403 U CN204235403 U CN 204235403U CN 201420460717 U CN201420460717 U CN 201420460717U CN 204235403 U CN204235403 U CN 204235403U
Authority
CN
China
Prior art keywords
grinding block
diamond grinding
block
diamond
limbers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420460717.XU
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Chinese (zh)
Inventor
于德怀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JIANGSU MEIJIE ABRASIVE TECHNOLOGY Co Ltd
Original Assignee
JIANGSU MEIJIE ABRASIVE TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JIANGSU MEIJIE ABRASIVE TECHNOLOGY Co Ltd filed Critical JIANGSU MEIJIE ABRASIVE TECHNOLOGY Co Ltd
Priority to CN201420460717.XU priority Critical patent/CN204235403U/en
Application granted granted Critical
Publication of CN204235403U publication Critical patent/CN204235403U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model relates to a kind of diamond-impregnated wheel and comprises abrasive wheel substrate, abrasive wheel substrate central authorities are provided with projecting part, projecting part center is provided with axis hole, projecting part is also provided with several locating holes, circular shaft bore periphery is circumferentially evenly provided with multiple limbers, abrasive wheel substrate is also provided with multiple diamond grinding block, described diamond grinding block is along abrasive wheel substrate circumferential array, diamond grinding block comprises abrading block, side grinding block, with lower abrading block, diamond grinding block is C shape structure, diamond grinding block has eight groups, often organize diamond grinding block to be symmetrical arranged, often each diamond grinding block organized in diamond grinding block is also symmetrical arranged, angle a between upper abrading block and side grinding block is 90 °-100 °, angle b between lower abrading block and side grinding block is 90 °-100 °, limbers is between diamond grinding block group, also a limbers is provided with between the diamond grinding block of each symmetry.The utility model structure is simple, can the article processed of grinding in all directions, and ground effect well and can lower the temperature to emery wheel.

Description

A kind of diamond-impregnated wheel
Technical field
The utility model relates to a kind of emery wheel, particularly a kind of diamond-impregnated wheel.
Background technology
Diamond-impregnated wheel is the one in diamond tool, mainly be applicable to the flat surface grinding processing process of all kinds of refractory surface, product adopts specially designed taper structure of mounting hole, be easy to handling, have processing flatness good, grinding efficiency is high, life-span advantages of higher, but in process, the distribution situation of the diamond grinding block on emery wheel can have an impact to processing article.
Utility model content
Technical problem to be solved in the utility model provides a kind of diamond-impregnated wheel for above drawback.The technical solution of the utility model is:
A kind of diamond-impregnated wheel comprises abrasive wheel substrate, and described abrasive wheel substrate central authorities are provided with projecting part, and described projecting part center is provided with axis hole, and described projecting part is also provided with several locating holes, and described circular shaft bore periphery is circumferentially evenly provided with multiple limbers; Described abrasive wheel substrate is also provided with multiple diamond grinding block, described diamond grinding block is along abrasive wheel substrate circumferential array, described diamond grinding block comprises abrading block, side grinding block and lower abrading block, described diamond grinding block is C shape structure, described diamond grinding block has eight groups, described diamond grinding block of often organizing is symmetrical arranged, the described often each diamond grinding block organized in diamond grinding block is also symmetrical arranged, angle a between upper abrading block and side grinding block is 90 °-100 °, and the angle b between described lower abrading block and side grinding block is 90 °-100 °.
Above-mentioned a kind of diamond-impregnated wheel, wherein, described limbers, between diamond grinding block group, is also provided with a limbers between the diamond grinding block of described each symmetry.
The beneficial effects of the utility model are:
The utility model structure is simple, described diamond grinding block is along abrasive wheel substrate circumferential array, described diamond grinding block is C shape structure, described diamond grinding block has eight groups, described diamond grinding block of often organizing is symmetrical arranged, the described often each diamond grinding block organized in diamond grinding block is also symmetrical arranged, the described often each diamond grinding block organized in diamond grinding block is also symmetrical arranged, angle a between upper abrading block and side grinding block is 90 °-100 °, angle b between described lower abrading block and side grinding block is 90 °-100 °, such structure can the article processed of grinding in all directions, and ground effect is good,
Described abrasive wheel substrate is provided with multiple limbers circumferentially distributed, described limbers is between diamond grinding block group, also be provided with a limbers between the diamond grinding block of described each symmetry to distribute like this chip removal thing can be made to flow out from limbers, and can lower the temperature to emery wheel.
Accompanying drawing explanation
Fig. 1 is structure chart of the present utility model
Detailed description of the invention
Below in conjunction with accompanying drawing, the utility model is described in further detail.
A kind of diamond-impregnated wheel comprises abrasive wheel substrate 1, described abrasive wheel substrate 1 central authorities are provided with projecting part 2, described projecting part 2 center is provided with axis hole 3, described projecting part 2 is also provided with several locating holes 4, and described circular shaft bore 3 periphery is circumferentially evenly provided with multiple limbers 5; Described abrasive wheel substrate 1 is also provided with multiple diamond grinding block 6, described diamond grinding block 6 is along abrasive wheel substrate 1 circumferential array, described diamond grinding block 6 comprises abrading block 61, side grinding block 62 and lower abrading block 63, described diamond grinding block 6 is C shape structure, described diamond grinding block 6 has eight groups, described diamond grinding block 6 of often organizing is symmetrical arranged, the described often each diamond grinding block 6 organized in diamond grinding block 6 is also symmetrical arranged, angle a between upper abrading block and side grinding block is 90 °-100 °, and the angle a between described lower abrading block and side grinding block is 90 °-100 °.
Above-mentioned a kind of diamond-impregnated wheel, wherein, described limbers 5, between diamond grinding block group 6, is also provided with a limbers 5 between the diamond grinding block 6 of described each symmetry.
The utility model structure is simple, described diamond grinding block is along abrasive wheel substrate circumferential array, described diamond grinding block is C shape structure, described diamond grinding block has eight groups, described diamond grinding block of often organizing is symmetrical arranged, the described often each diamond grinding block organized in diamond grinding block is also symmetrical arranged, the described often each diamond grinding block organized in diamond grinding block is also symmetrical arranged, angle a between upper abrading block and side grinding block is 90 °-100 °, angle b between described lower abrading block and side grinding block is 90 °-100 °, such structure can the article processed of grinding in all directions, and ground effect is good,
Described abrasive wheel substrate is provided with multiple limbers circumferentially distributed, described limbers is between diamond grinding block group, also be provided with a limbers between the diamond grinding block of described each symmetry to distribute like this chip removal thing can be made to flow out from limbers, and can lower the temperature to emery wheel.
Here description of the present utility model and application is illustrative; not want by scope restriction of the present utility model in the above-described embodiments; therefore, the utility model is not by the restriction of the present embodiment, and the technical scheme that any employing equivalence replacement obtains is all in the scope of protection of the invention.

Claims (2)

1. a diamond-impregnated wheel comprises abrasive wheel substrate, it is characterized in that, described abrasive wheel substrate central authorities are provided with projecting part, and described projecting part center is provided with axis hole, described projecting part is also provided with several locating holes, and described circular shaft bore periphery is circumferentially evenly provided with multiple limbers; Described abrasive wheel substrate is also provided with multiple diamond grinding block, described diamond grinding block is along abrasive wheel substrate circumferential array, described diamond grinding block comprises abrading block, side grinding block and lower abrading block, described diamond grinding block is C shape structure, described diamond grinding block has eight groups, described diamond grinding block of often organizing is symmetrical arranged, the described often each diamond grinding block organized in diamond grinding block is also symmetrical arranged, angle a between upper abrading block and side grinding block is 90 °-100 °, and the angle b between described lower abrading block and side grinding block is 90 °-100 °.
2. a kind of diamond-impregnated wheel as claimed in claim 1, is characterized in that, described limbers, between diamond grinding block group, is also provided with a limbers between the diamond grinding block of described each symmetry.
CN201420460717.XU 2014-08-14 2014-08-14 A kind of diamond-impregnated wheel Expired - Fee Related CN204235403U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420460717.XU CN204235403U (en) 2014-08-14 2014-08-14 A kind of diamond-impregnated wheel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420460717.XU CN204235403U (en) 2014-08-14 2014-08-14 A kind of diamond-impregnated wheel

Publications (1)

Publication Number Publication Date
CN204235403U true CN204235403U (en) 2015-04-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420460717.XU Expired - Fee Related CN204235403U (en) 2014-08-14 2014-08-14 A kind of diamond-impregnated wheel

Country Status (1)

Country Link
CN (1) CN204235403U (en)

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150401

Termination date: 20150814

EXPY Termination of patent right or utility model