CN204230292U - A kind of chip type white light LED light cure package device - Google Patents
A kind of chip type white light LED light cure package device Download PDFInfo
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- CN204230292U CN204230292U CN201420779554.1U CN201420779554U CN204230292U CN 204230292 U CN204230292 U CN 204230292U CN 201420779554 U CN201420779554 U CN 201420779554U CN 204230292 U CN204230292 U CN 204230292U
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Abstract
The purpose of this utility model is to provide a kind of chip type white light LED light cure package device, this packaging system is included and is arranged on conveyer belt on board, that controlled by conveyer belt buncher by electric cabinet, be arranged on the light-source box above conveyer belt, UV-LED light source is installed in light-source box, and in light-source box, UV optical sensor and temperature sensor is also installed.The utility model adopts high-power deep ultraviolet (UVC) LED light source, matches with light trigger absorbing wavelength in solidification glue, generate heat low, efficiency is high, the life-span is long, irradiated area is large and even.The adjustment of intensity of illumination is realized by adjustment LED operating current.Curing temperature, curing time and solidification light intensity independently stability separately can be kept, improve the optical property consistency of encapsulating products.
Description
Technical field
The utility model belongs to LED package device technical field, is specifically related to a kind of chip type white light LED light cure package device.
Background technology
White light LEDs has that small-power is direct insertion, small-power is SMD and high-power three kinds of packaged types.No matter which kind of mode, the generation of white light all adopts the technique applying yellow fluorescent powder on blue chip, and detailed process is as follows: be first fixed on support by chip, and chip electrode is connected with support with gold thread by ultrasonic bonder; Negative pressure will be utilized after a certain proportion of fluorescent material and silica gel (or epoxy glue) Homogeneous phase mixing in vacuum machine to discharge bubble, then the mixture of powder and glue is coated to chip also heats and makes it solidify.Also need overall embedding for small-power is direct insertion with high-power type, and then make white light LEDs finished product.Hot curing can bring many adverse effects, as low in efficiency, power consumption is large, and what is more important fluorescent material easily precipitates, bisque is uneven, easily aging etc., causes white light uneven and unstable.Because patch type LED structure is simple, only needs phosphor gel once to encapsulate and can complete product, thus its to occupy the market share relatively large.
At present, photocuring generally adopts high-pressure mercury lamp to be UV light source, and wave band is UVA (320-400nm), does not all specially require the light transmittance of solidification light intensity and curing time and solidification glue, to reinforce as principle with the short period.The spectral region that high-pressure mercury lamp sends is wider, for the effective wavelength of UV photocuring less than 1/5 of whole spectral energy, effective rate of utilization is lower, and whole spectrum contains a large amount of infrared spectrums, in use can send a large amount of heats, under high temperature, photocuring can cause fluorescent material to precipitate equally.Because the absorption bands of this kind of glue light trigger is UVA, its cured article is inevitable does not have the better UVA of resistance to sunlight damage capability.And the high grade of transparency and high anti-aging property to be had for the optic-solidified adhesive of white light LEDs, the absorption bands of light trigger should be UVC wave band.Therefore, be necessary that providing a kind of can improve the optical property of white light LEDs cured article and the white light LEDs photocuring packaging system of printing opacity stability.
Utility model content
The purpose of this utility model is to provide a kind of chip type white light LED light cure package device, thus makes up the deficiencies in the prior art.
Chip type white light LED light cure package device of the present utility model, include be arranged on board, by the conveyer belt controlled by conveyer belt buncher of electric cabinet; With the light-source box be arranged on above conveyer belt, UV-LED light source is installed in light-source box, and in light-source box, UV optical sensor and temperature sensor is also installed.
As preferably, UV optical sensor and temperature sensor are arranged on the below of UV-LED light source.
The blower fan and exhaust duct that control by electric cabinet are installed in the upper surface of light-source box;
As preferably, a shadow shield moving up and down is respectively housed in the both sides of light-source box;
In the side of light-source box, light source service port is installed.
Wherein UV-LED light source is high-power deep ultraviolet LED light source, and its spectrum is UVC section.
Compared to existing technology, the utility model has the advantage of:
1, adopt high-power deep ultraviolet (UVC) LED light source, match with light trigger absorbing wavelength in solidification glue, generate heat low, efficiency is high, the life-span is long, irradiated area is large and even.The adjustment of intensity of illumination is realized by adjustment LED operating current.
2, curing temperature, curing time and solidification light intensity independently stability is separately kept, the optical property consistency of raising encapsulating products.
Accompanying drawing explanation
Fig. 1: light curring unit structural representation
Fig. 2: UV-LED light-source box structural representation
In Fig. 1, Fig. 2: 1-board; 2-network chain conveyer belt; 3-conveyer belt buncher; 4-electric cabinet; 5-light-source box; 6-blower fan; 7-exhaust duct; 8-shadow shield; 9-light source service port; 10-UV-LED light source; 11-UV optical sensor; 12-temperature sensor
Embodiment
The deficiency that the utility model exists for the encapsulation of white light LEDs photocuring, a kind of chip type white light LED light cure package technique and device are provided, namely utilize existing fluorescent material and dedicated transparent epoxy optic-solidified adhesive, be in harmonious proportion through certain proportion, stir, vacuumize after inject the adopting surface mounted LED cup groove with blue chip and send into light curring unit solidification.
Below in conjunction with accompanying drawing, photocuring packaging system of the present utility model and packaging technology are specifically described.
Embodiment 1
As shown in Figure 1, board 1 is stainless steel, the conveyer belt 2 of metal network chain driven by buncher 3 and by the Single Chip Microcomputer (SCM) system in electric cabinet 4 control, the speed of conveyer belt 2 can be changed to determine curing time, also conveyer belt 2 can be allowed to be operated in interruption to advance mode, determine that break time is curing time.Be fixed with UV-LED light-source box 5 at the middle part of conveyer belt 2, blower fan 6 and exhaust duct 7 are housed thereon, blower fan 6 regulates and controls the temperature in light-source box 5 by Single Chip Microcomputer (SCM) system adjustment rotating speed.A shadow shield 8 moving up and down is respectively housed in the both sides of light-source box.The maintenance door 9 of easy access is left in the side of light-source box 5.In fig. 2, the inside of light-source box 5 is fixed with high-power deep ultraviolet UV-LED area array light source 10, and be made up of the LED of 100 1W, its peak wavelength is 280nm.In the bottom of light source 10, optical inductor 11 and temperature inductor 12 are installed.Light intensity on the front panel of electric cabinet 4 in real-time show case on close transmission zone face and temperature.When detecting that light intensity and temperature and institute's preset value are not inconsistent, starting control system and automatically adjusting.The adjustment of light intensity is completed by the operating current changing UV-LED light source 10, and the adjustment of temperature is completed by the rotating speed changing blower fan 6.
Embodiment 2
Utilize embodiment 1 device, adjustment conveyer belt 2 speed makes its adopting surface mounted LED that is cured continue stop 180 seconds in light-source box 5, and light intensity is adjusted to 150mW/cm
2, temperature controls at 120 DEG C.3,4,5,6 mass parts light triggers are added respectively in the epoxy glue of 100 mass parts, add 4 mass parts YAG yellow fluorescent powders again, abundant mixing, stirring vacuumizing are removed after bubble, are coated in and fix blue chip and weld in the adopting surface mounted LED cup groove of gold thread, till being coated with brimmer groove.The sample of 4 light trigger ratios makes 10 respectively, the complete LED of cure package is placed in the energising of light aging machine and lights 60 days, the light trigger of 4% ratio as a result, light decay is minimum, and therefore 4% is best mixed ratio at corresponding curing time, intensity of illumination and temperature.
Embodiment 3
Utilize embodiment 1 device, light intensity is adjusted to 150mW/cm
2, temperature controls at 120 DEG C.4 mass parts light triggers are added in the epoxy glue of 100 mass parts, add 4 mass parts YAG yellow fluorescent powders again, abundant mixing, stirring vacuumizing are removed after bubble, are coated in and fix blue chip and weld in the adopting surface mounted LED cup groove of gold thread, till being coated with brimmer groove.Adjustment conveyer belt 2 speed makes its adopting surface mounted LED that is cured in light-source box 5, continue stop and is respectively 120 seconds, 150 seconds, 180 seconds, 210 seconds, 240 seconds, 270 seconds, 6 solidified sample make 10 respectively, the complete LED of cure package is placed in the energising of light aging machine and lights 60 days, determine the curing time of 180 seconds after tested, light decay is minimum, therefore within 180 seconds, is at corresponding intensity of illumination and temperature and the optimum curing time under mixing light trigger ratio.
Embodiment 4
Utilize embodiment 1 device, curing time is 180 seconds; Temperature controls at 120 DEG C.4 mass parts light triggers are added in the epoxy glue of 100 mass parts, add 4 mass parts YAG yellow fluorescent powders again, abundant mixing, stirring vacuumizing are removed after bubble, are coated in and fix blue chip and weld in the adopting surface mounted LED cup groove of gold thread, till being coated with brimmer groove.Light intensity is adjusted to 150mW/cm
2, 160mw/cm
2, 170mw/cm
2, 180mw/cm
2, 4 solidified sample make 10 respectively, and the complete LED of cure package is placed in the energising of light aging machine and lights 60 days, determines 160mw/cm after tested
2light intensity, light decay is minimum.Therefore 160mw/cm
2in corresponding curing time, temperature and the solidification of the best under mixing light trigger ratio intensity of illumination.
Claims (6)
1. a chip type white light LED light cure package device, it is characterized in that, described device includes and is arranged on board (1), the conveyer belt (2) controlled by conveyer belt buncher (3) by electric cabinet (4), with the light-source box (5) being arranged on conveyer belt (2) top, it is characterized in that, in described light-source box (5), UV-LED light source (10) is installed, and UV optical sensor (11) and temperature sensor (12) are also installed in light-source box (5).
2. device as claimed in claim 1, it is characterized in that, described UV optical sensor (11) and temperature sensor (12) are arranged on the below of UV-LED light source (10).
3. device as claimed in claim 1, it is characterized in that, the upper surface of described light-source box (5) is provided with the blower fan (6) and exhaust duct (7) that control by electric cabinet (4).
4. device as claimed in claim 1, it is characterized in that, a shadow shield (8) is respectively equipped with in the both sides of described light-source box (5).
5. device as claimed in claim 1, it is characterized in that, the side of described light-source box (5) is provided with light source service port (9).
6. device as claimed in claim 1, is characterized in that, the high-power deep ultraviolet LED light source of described UV-LED light source (10) to be spectrum be UVC section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420779554.1U CN204230292U (en) | 2014-12-10 | 2014-12-10 | A kind of chip type white light LED light cure package device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420779554.1U CN204230292U (en) | 2014-12-10 | 2014-12-10 | A kind of chip type white light LED light cure package device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204230292U true CN204230292U (en) | 2015-03-25 |
Family
ID=52928352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420779554.1U Expired - Fee Related CN204230292U (en) | 2014-12-10 | 2014-12-10 | A kind of chip type white light LED light cure package device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204230292U (en) |
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2014
- 2014-12-10 CN CN201420779554.1U patent/CN204230292U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150325 Termination date: 20151210 |
|
| EXPY | Termination of patent right or utility model |