CN204209870U - A kind of LED silk mfg. moulding die - Google Patents
A kind of LED silk mfg. moulding die Download PDFInfo
- Publication number
- CN204209870U CN204209870U CN201420570018.0U CN201420570018U CN204209870U CN 204209870 U CN204209870 U CN 204209870U CN 201420570018 U CN201420570018 U CN 201420570018U CN 204209870 U CN204209870 U CN 204209870U
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- Prior art keywords
- arc
- groove
- led silk
- product
- die
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- Expired - Fee Related
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Abstract
A kind of LED silk mfg. moulding die, comprise upper die and lower die, described patrix is provided with some upper arc grooves arranged in parallel, described counterdie is provided with some arc lower grooves arranged in parallel, described upper arc groove and arc lower groove one_to_one corresponding, corresponding upper arc groove and arc lower groove fit are formed into die cavity; The cross section semicircular in shape of described arc lower groove, the cross section of described upper arc groove arcuately.During mould molding LED silk epifluorescence glue, first on the arc lower groove that contact area is larger, spray one deck barrier film, product and counterdie can be made like this to depart from; In addition, the upper arc groove due to patrix is arc, and the contact area of itself and product is less, compares the easier demoulding of counterdie.The utility model utilizes semicircular arc lower groove to coordinate with arc upper arc groove, the easily demoulding after making LED silk product manufacturing out, improves production efficiency and the yields of product.
Description
Technical field
The utility model relates to LED field, especially a kind of LED silk mfg. moulding die.
Background technology
The fluorescent glue that LED silk comprises LED-baseplate, is located at the chip in LED-baseplate and is wrapped in outside LED-baseplate.In order to enable LED silk 360 degree reflective, existing LED-baseplate is transparency carrier, and corresponding fluorescent glue is cylindrical, make the bright dipping of filament evenly.Make columniform LED silk, cavity on the upper die and lower die of its mfg. moulding die also must be semicircle, although this mould can produce columniform LED silk, but shortcoming is, it is when the demoulding, because upper die and lower die are all comparatively large with product contact area, causes product to be difficult to the demoulding, even if by force by product break away from moulds, product also can be made to suffer certain damage.
Summary of the invention
Technical problem to be solved in the utility model is to provide a kind of LED silk mfg. moulding die, is convenient to LED silk product stripping.
For solving the problems of the technologies described above, the technical solution of the utility model is: a kind of LED silk mfg. moulding die, comprise upper die and lower die, described patrix is provided with some upper arc grooves arranged in parallel, described counterdie is provided with some arc lower grooves arranged in parallel, described upper arc groove and arc lower groove one_to_one corresponding, corresponding upper arc groove and arc lower groove fit are formed into die cavity; The cross section semicircular in shape of described arc lower groove, the cross section of described upper arc groove arcuately.During mould molding LED silk epifluorescence glue, first on the arc lower groove that contact area is larger, spray one deck barrier film, product and counterdie can be made like this to depart from; In addition, the upper arc groove due to patrix is arc, and the contact area of itself and product is less, compares the easier demoulding of counterdie.The utility model utilizes semicircular arc lower groove to coordinate with arc upper arc groove, the easily demoulding after making LED silk product manufacturing out, improves production efficiency and the yields of product.Although the forming cavity that arc upper arc groove and semicircular arc lower groove form is not cylindrical, its shape yet subcylindrical, for LED silk product to go out influence of light little.
As improvement, the arc of described arc correspondence is minor arc.
As improvement, the width of described upper arc groove is identical with the width of arc lower groove.
The beneficial effect that the utility model is compared with prior art brought is:
During mould molding LED silk epifluorescence glue, first on the arc lower groove that contact area is larger, spray one deck barrier film, product and counterdie can be made like this to depart from; In addition, the upper arc groove due to patrix is arc, and the contact area of itself and product is less, compares the easier demoulding of counterdie.The utility model utilizes semicircular arc lower groove to coordinate with arc upper arc groove, the easily demoulding after making LED silk product manufacturing out, improves production efficiency and the yields of product.
Accompanying drawing explanation
Fig. 1 be patrix with counterdie coordinate schematic diagram.
Fig. 2 is the partial enlarged drawing of patrix and counterdie.
Detailed description of the invention
Below in conjunction with Figure of description, the utility model is described in further detail.
As shown in Figure 1, 2, a kind of LED silk mfg. moulding die, comprise patrix 1 and counterdie 2, described patrix 1 is provided with some upper arc grooves 3 arranged in parallel, described counterdie 2 is provided with some arc lower grooves 4 arranged in parallel, described upper arc groove 3 and arc lower groove 4 one_to_one corresponding, and corresponding upper arc groove 3 coordinates with arc lower groove 4 and is formed into die cavity, namely mould once can shaping multiple LED silk product, contributes to improving its production efficiency.The cross section semicircular in shape of described arc lower groove 4, the cross section of described upper arc groove 3 is arcuately; The arc of described arc correspondence is minor arc; The width of described upper arc groove 3 is identical with the width of arc lower groove 4.
During mould molding LED silk epifluorescence glue, first on the arc lower groove 4 that contact area is larger, spray one deck barrier film 6, product and counterdie can be made like this to depart from; The LED-baseplate 5 with LED chip is placed in forming cavity; In addition, because the upper arc groove 3 of patrix 1 is arc, the contact area of itself and product is less, compares the easier demoulding of counterdie.The utility model utilizes semicircular arc lower groove 4 to coordinate with arc upper arc groove 3, the easily demoulding after making LED silk product manufacturing out, improves production efficiency and the yields of product.Although the forming cavity that arc upper arc groove 3 and semicircular arc lower groove 4 form is not cylindrical, its shape yet subcylindrical, for LED silk product to go out influence of light little.
Claims (4)
1. a LED silk mfg. moulding die, comprise upper die and lower die, it is characterized in that: described patrix is provided with some upper arc grooves arranged in parallel, described counterdie is provided with some arc lower grooves arranged in parallel, described upper arc groove and arc lower groove one_to_one corresponding, corresponding upper arc groove and arc lower groove fit are formed into die cavity; The cross section semicircular in shape of described arc lower groove, the cross section of described upper arc groove arcuately.
2. a kind of LED silk mfg. moulding die according to claim 1, is characterized in that: the arc of described arc correspondence is minor arc.
3. a kind of LED silk mfg. moulding die according to claim 1, is characterized in that: the width of described upper arc groove is identical with the width of arc lower groove.
4. a kind of LED silk mfg. moulding die according to claim 1, is characterized in that: described arc lower groove is provided with barrier film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420570018.0U CN204209870U (en) | 2014-09-30 | 2014-09-30 | A kind of LED silk mfg. moulding die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420570018.0U CN204209870U (en) | 2014-09-30 | 2014-09-30 | A kind of LED silk mfg. moulding die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204209870U true CN204209870U (en) | 2015-03-18 |
Family
ID=52978575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420570018.0U Expired - Fee Related CN204209870U (en) | 2014-09-30 | 2014-09-30 | A kind of LED silk mfg. moulding die |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204209870U (en) |
-
2014
- 2014-09-30 CN CN201420570018.0U patent/CN204209870U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1 Patentee after: Hongli Newell group Limited by Share Ltd Address before: Huadu District, Guangdong city of Guangzhou Province, 510890 East Town Airport high-tech industrial base and SAST Jingu South Road intersection Patentee before: Guangzhou Hongli Tronic Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150318 Termination date: 20190930 |