CN204155921U - Heat dissipation of electronic chip plate - Google Patents
Heat dissipation of electronic chip plate Download PDFInfo
- Publication number
- CN204155921U CN204155921U CN201420458853.5U CN201420458853U CN204155921U CN 204155921 U CN204155921 U CN 204155921U CN 201420458853 U CN201420458853 U CN 201420458853U CN 204155921 U CN204155921 U CN 204155921U
- Authority
- CN
- China
- Prior art keywords
- electronic chip
- thermal conductive
- heat dissipation
- conductive pipe
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model relates to a kind of cooling device, specifically a kind of heat dissipation of electronic chip plate, comprise electronic chip installation portion, described electronic chip installation portion is connected with thermal conductive pipe, and the interface of thermal conductive pipe is rectangle, is built-in with refrigerant material, described thermal conductive pipe is the complications of s shape at horizontal plane position, being connected with semiconductor chilling plate of thermal conductive pipe, it is little that the heat dissipation of electronic chip plate of this spline structure has volume, the advantage of good heat dissipation effect.
Description
Technical field
The utility model relates to a kind of cooling device, specifically a kind of heat dissipation of electronic chip plate.
Background technology
Electronic chip in the course of the work, need to distribute a large amount of heats, and the environment of electronic chip work closes in being, be unfavorable for distributing of heat, common heating panel, only by increasing its surperficial area contacted with air to improve heat dispersion, needs the heating panel of larger volume just to possess good performance.In actual applications, the installing space of electronic chip is less, and the volume of heating panel governs the raising of heat dispersion.
Summary of the invention
It is little that the technical problems to be solved in the utility model is to provide a kind of volume, the heat dissipation of electronic chip plate of good heat dissipation effect
For solving the problem, the utility model heat dissipation of electronic chip plate, comprise electronic chip installation portion, described electronic chip installation portion is connected with thermal conductive pipe, the interface of thermal conductive pipe is rectangle, be built-in with refrigerant material, described thermal conductive pipe is the complications of s shape at horizontal plane position, being connected with semiconductor chilling plate of thermal conductive pipe.
In solution technique, heat pipe can contact with air and play thermolysis, and the built-in refrigerant material of heat pipe also can play thermolysis, and semiconductor chilling plate can further improve its heat dispersion.
The beneficial effects of the utility model: it is little that the heat dissipation of electronic chip plate of this spline structure has volume, the advantage of good heat dissipation effect.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Wherein: 1, electronic chip installation portion 2, thermal conductive pipe 3. semiconductor chilling plate.
Embodiment
Below in conjunction with accompanying drawing, the utility model is further described.
As shown in Figure 1, heat dissipation of electronic chip plate, comprise electronic chip installation portion, described electronic chip installation portion is connected with thermal conductive pipe, the interface of thermal conductive pipe is rectangle, be built-in with refrigerant material, described thermal conductive pipe is the complications of s shape at horizontal plane position, being connected with semiconductor chilling plate of thermal conductive pipe.
The utility model is dispelled the heat by air, and refrigerant material dispels the heat, and independently refrigeration source heat radiation, effectively raises the heat dispersion of heating panel.
Claims (1)
1. heat dissipation of electronic chip plate, comprise electronic chip installation portion, it is characterized in that: described electronic chip installation portion is connected with thermal conductive pipe, the interface of thermal conductive pipe is rectangle, be built-in with refrigerant material, described thermal conductive pipe is the complications of s shape at horizontal plane position, being connected with semiconductor chilling plate of thermal conductive pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420458853.5U CN204155921U (en) | 2014-08-15 | 2014-08-15 | Heat dissipation of electronic chip plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420458853.5U CN204155921U (en) | 2014-08-15 | 2014-08-15 | Heat dissipation of electronic chip plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204155921U true CN204155921U (en) | 2015-02-11 |
Family
ID=52514018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420458853.5U Expired - Fee Related CN204155921U (en) | 2014-08-15 | 2014-08-15 | Heat dissipation of electronic chip plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204155921U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106791300A (en) * | 2016-12-09 | 2017-05-31 | 刘洋 | A kind of high resolution optical imaging equipment |
-
2014
- 2014-08-15 CN CN201420458853.5U patent/CN204155921U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106791300A (en) * | 2016-12-09 | 2017-05-31 | 刘洋 | A kind of high resolution optical imaging equipment |
| CN106791300B (en) * | 2016-12-09 | 2019-06-25 | 上饶市众联光电有限公司 | A kind of high resolution optical imaging equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150211 Termination date: 20150815 |
|
| EXPY | Termination of patent right or utility model |