CN205124215U

CN205124215U - Liquid crystal instrument radiator structure

Info

Publication number: CN205124215U
Application number: CN201520835477.1U
Authority: CN
Inventors: 常登龙; 汪治敏
Original assignee: CHONGQING DELCO ELECTRONIC INSTRUMENT Co Ltd; Chongqing Changan Automobile Co Ltd
Current assignee: CHONGQING DELCO ELECTRONIC INSTRUMENT Co Ltd; Chongqing Changan Automobile Co Ltd
Priority date: 2015-10-27
Filing date: 2015-10-27
Publication date: 2016-03-30
Anticipated expiration: 2025-10-27

Abstract

The utility model discloses a liquid crystal instrument radiator structure, include heat -conducting piece of hugging closely with the chip and the fin that contacts with the heat -conducting piece, heat transfer to the fin that the heat -conducting piece gave out the chip, the heat -conducting piece includes heat -conducting plate and one or many heat pipes, the heat -conducting plate has at least the one side to hug closely with the chip, and heat -conducting plate and heat pipe contact, and the heat pipe is arranged in the fin. The utility model discloses use the heat pipe, with the heat conduction that produces in the chip set to the heat pipe in, fin by a large scale install to the rethread on the heat pipe, obtain higher radiating efficiency. The radiating efficiency is high, the noiselessness, and the cost is lower.

Description

A kind of liquid crystal instrument heat spreader structures

Technical field

The utility model belongs to technical field of liquid crystal display, is specifically related to a kind of liquid crystal instrument heat spreader structures.

Background technology

Along with the development of automotive electronic technology, liquid crystal instrument uses more and more extensive with its abundant display capabilities.Liquid crystal instrument is because driving Large-size LCD Screen, and graph processing chips heating is serious, for ensureing that chip normally works, need carry out radiating treatment to chip.Conventional radiating mode for install fin on chip, its radiating efficiency is directly proportional to efficiently radiates heat area and cross-ventilation intensity two factors, because chip package volume is little, heating is concentrated, use large scale fin, because chip heating is concentrated, the fin away from heating region does not have radiating effect, and radiating efficiency is not high; Use fan can increase cross-ventilation intensity, increase radiating efficiency, but there is the problems such as fan turns noise is excessive, heat radiation air holes dust stratification.

Summary of the invention

The purpose of this utility model is to provide a kind of liquid crystal instrument heat spreader structures, solves chip heating serious problems, improves radiating efficiency, ensure that chip normally works.

A kind of liquid crystal instrument heat spreader structures described in the utility model, comprise the heat-conducting piece be close to chip and the fin contacted with heat-conducting piece, the heat that chip gives out by described heat-conducting piece is delivered to fin; Described heat-conducting piece comprises heat-conducting plate and one or more heat pipe; Described heat-conducting plate has at least one side to be close to chip, and heat-conducting plate contacts with heat pipe, and heat pipe is arranged in fin.

Further, one or more heat pipe described is interspersed is arranged in fin.

Further, described heat pipe is " U " shape or " Z " shape or circular or spirality or waveform, increases the contact area of heat pipe and fin.

Further, described heat-conducting plate and heat pipe adopt copper product to make, and thermal conductivity is high, and heat transfer is very fast.

Further, described fin adopts aluminum to make, and cost is lower and lightweight.

The utility model uses heat pipe, by the heat conduction that produces in chipset in heat pipe, then by installing large-area fin on heat pipe, obtains higher radiating efficiency.It is high that the utility model has radiating efficiency, noiselessness, the advantage that cost performance is high.

Accompanying drawing explanation

Fig. 1 is the utility model structural representation.

In figure: 1-heat-conducting plate, 2-fin, 3-heat pipe, 4-chip.

Embodiment

Below in conjunction with accompanying drawing, the utility model is described in further detail.

A kind of liquid crystal instrument heat spreader structures shown in Figure 1, comprise the heat-conducting piece be close to chip 4 and the fin 2 contacted with heat-conducting piece, the heat that chip gives out by described heat-conducting piece is delivered to fin; Described heat-conducting piece comprises heat-conducting plate 1 and one or more heat pipe 3; Described heat-conducting plate 1 has at least one side to be close to chip 4, and heat-conducting plate 1 contacts with heat pipe 3, and heat pipe 3 is arranged in fin 2.

Further, described one or more heat pipe 3 interts and is arranged in fin 2.

Further, described heat pipe 3 is " U " shape or " Z " shape or circular or spirality or waveform, increases the contact area of heat pipe 3 and fin 2.

Further, described heat-conducting plate 1 and heat pipe 3 adopt copper product to make, and thermal conductivity is high, and heat transfer is very fast.

Further, described fin 2 adopts aluminum to make, and cost is lower and lightweight.

Above-described embodiment is only be described preferred implementation of the present utility model; not scope of the present utility model is limited; under the prerequisite not departing from the utility model design spirit; the various distortion that those of ordinary skill in the art make the technical solution of the utility model and improvement, all should fall in protection range that the utility model claims determine.

Claims

1. a liquid crystal instrument heat spreader structures, comprise the heat-conducting piece be close to chip (4) and the fin (2) contacted with heat-conducting piece, the heat that chip gives out by described heat-conducting piece is delivered to fin; It is characterized in that: described heat-conducting piece comprises heat-conducting plate (1) and one or more heat pipe (3); Described heat-conducting plate (1) has at least one side to be close to chip (4), and heat-conducting plate (1) contacts with heat pipe (3), and heat pipe (3) is arranged in fin (2).

2. liquid crystal instrument heat spreader structures according to claim 1, is characterized in that: described one or more heat pipe (3) interting is arranged in fin (2).

3. liquid crystal instrument heat spreader structures according to claim 1 and 2, is characterized in that: described heat pipe (3) is " U " shape or " Z " shape or circular or spirality or waveform.

4. liquid crystal instrument heat spreader structures according to claim 1 and 2, is characterized in that: described heat-conducting plate (1) and heat pipe (3) adopt copper product to make.

5. liquid crystal instrument heat spreader structures according to claim 1, is characterized in that: described fin (2) adopts aluminum to make.