CN204143793U - A kind of integrated pixel encapsulation module of LED and high-definition display screen thereof - Google Patents
A kind of integrated pixel encapsulation module of LED and high-definition display screen thereof Download PDFInfo
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- CN204143793U CN204143793U CN201420578869.XU CN201420578869U CN204143793U CN 204143793 U CN204143793 U CN 204143793U CN 201420578869 U CN201420578869 U CN 201420578869U CN 204143793 U CN204143793 U CN 204143793U
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Abstract
The integrated pixel encapsulation module of a kind of LED, comprise an encapsulation matrix, described encapsulation matrix forms by a diapire and by the vertically extending sidewall of diapire surrounding; LED pixel, LED pixel is three primary colors luminophor, and described LED pixel is installed on the interior corner of the sidewall of described encapsulation matrix respectively; Be located at multiple attachment pins of described wall outer surface, the pin of described LED pixel is electrically connected on described attachment pin; One face shield, described face shield is installed in the gap between described four LED pixels; One heat dissipation bonding pad.The integrated pixel encapsulation module of a kind of LED of the utility model, production efficiency is higher, and cost is lower; PCB layout efficiency is higher; Light source heat radiation is better, longer service life.Particularly can increase the gap between lamp and lamp by the integrated pixel encapsulation module of use, can face shield be put, on the other hand, can encapsulating waterproof after increasing lamp and lamp gap.
Description
Technical field
The utility model relates to LED display technical field, particularly relates to the high-definition display screen of a kind of accessible site encapsulation.
Background technology
Because having, luminosity is strong, colour rendering index is high, high definition, super large are seamless spliced, automatic control and adjustment degree is high and the feature such as energy-conserving and environment-protective for LED display, and recent years, advantage went to the world stage, and was widely used outer photoelectric display field indoors.At present, LED display industry tends to more high definition, more low tone distance, ultra-thin, ultralight development.But traditional single lamp list pixel can not meet the demand for development of the low space distance LED display screen of high definition, simultaneously also for the waterproof requirement of high-definition display screen brings a unavoidable difficult problem.
Utility model content
The technical problems to be solved in the utility model is the deficiency overcoming the existence of above-mentioned prior art, and proposes a kind of integrated package, and production efficiency is higher, shows the integrated pixel encapsulation module of a kind of LED and the high-definition display screen thereof of more high definition.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
The integrated pixel encapsulation module of a kind of LED, it comprises an encapsulation matrix, and described encapsulation matrix forms by a diapire and by the vertically extending sidewall of diapire surrounding, and described diapire is in square; Four LED pixels, described LED pixel is primitive colours LED luminophor, and four described LED pixels are installed on the interior corner of the sidewall of described encapsulation matrix respectively; Be located at multiple attachment pins of described wall outer surface, the pin of described LED pixel is electrically connected on described attachment pin; One face shield, described face shield is installed in the gap between described four LED pixels; One heat dissipation bonding pad, described heat dissipation bonding pad is installed on the bottom of described encapsulation matrix diapire.
Wherein, the sidewall of described encapsulation matrix comprises a first side wall, and the second sidewall protruded out by described the first side wall coboundary, and described second sidewall crosses out the outside surface in described the first side wall.
Wherein, described attachment pin is L-type, and, attachment pin by the second described sidewall and the first side wall junction extending longitudinally and go out, the end of described attachment pin stretches out bottom the diapire of encapsulation matrix.
Wherein, the attachment number of pins that described second wall outer surface is evenly provided with is 16.
Wherein, described four LED pixels adopt common anode pole to connect.
Wherein, the scope of the centre distance between described adjacent LED pixel is 1 millimeter to 3.2 millimeters.
Wherein, when being used to indoor, the scope of the centre distance between adjacent LED pixel is 1 millimeter to 3.2 millimeters; When being used to outdoor, the scope of the centre distance between adjacent LED pixel is 2.2 millimeters to 3.2 millimeters.
Wherein, described face shield is black.
A kind of high-definition display screen, comprise the integrated pixel encapsulation module of multiple above-mentioned LED, the integrated pixel encapsulation module of described multiple LED is evenly installed on a pcb board, and between the integrated pixel encapsulation module of adjacent LED, gap place is installed with a face shield.
Compared with prior art, a kind of integrated pixel encapsulation module of LED of the utility model and display screen thereof, tool has the following advantages: integrated rear production efficiency is higher, and cost of labor is lower; QFN encapsulates, and surrounding has pad, and device fastness is better; PCB layout design efficiency is higher; Location of pixels is more accurate; Large screen splicing gap more easily regulates; Mixed light colour mixture evenly; Display comparison degree is better; Light source heat radiation better effects if, longer service life.By using integrated pixel encapsulation module can increase gap between lamp and lamp, face shield can be put.On the other hand, can encapsulating waterproof after increasing lamp and lamp gap.
Accompanying drawing explanation
Fig. 1 is the front perspective view of the integrated pixel encapsulation module of the utility model LED;
Fig. 2 is the back side perspective view of the integrated pixel encapsulation module of the utility model LED;
Fig. 3 is the vertical view of the integrated pixel encapsulation module of the utility model LED;
Fig. 4 is the explosive view of the integrated pixel encapsulation module of the utility model LED;
Fig. 5 is the partial enlargement structural representation that the utility model adopts the high-definition display screen of the integrated pixel encapsulation module of LED.
Embodiment
The exemplary embodiment embodying the utility model feature & benefits will describe in detail in the following description.Be understood that the utility model can have various changes on different embodiments, it neither departs from scope of the present utility model, and explanation wherein and to be shown in be use when explain in essence, and be not used to limit the utility model.
Accompanying drawings 1 to accompanying drawing 4, the integrated pixel encapsulation module of a kind of LED of the utility model, it comprises, an encapsulation matrix 1, described encapsulation matrix 1 forms by a diapire and by the vertically extending sidewall of this diapire surrounding, and described diapire and sidewall enclose jointly in chamber in the middle part of.Four LED pixels 21,22,23,24, four described LED pixels are installed on four corners of the chamber at the middle part of encapsulation matrix 1 respectively, and namely four LED pixel centers are symmetrical.One face shield 3, described face shield 3 is in cruciform, and this face shield 3 is installed between described four LED pixels.One heat dissipation bonding pad 4, described heat dissipation bonding pad 4 is fixed on the bottom of the diapire of described encapsulation matrix 1.Be uniformly distributed in the attachment pin 11 of described encapsulation matrix surrounding wall outer surface.
Accompanying drawings 1 and accompanying drawing 2, and accompanying drawing 4, this accompanying drawing 1 is the front perspective view of the integrated pixel encapsulation module of a kind of LED of the present utility model, and as seen from the figure, this encapsulation matrix 1 is in cubic, and namely the diapire of encapsulation matrix 1 is in square.Accompanying drawings 2, it is the back perspective view of the integrated pixel encapsulation module of a kind of LED of the utility model, further, the sidewall of described encapsulation matrix 1 comprises the first side wall 102 vertically protruded out by diapire surrounding, and the second sidewall 101 to be protruded out by described the first side wall 102 top edge, the second described sidewall 101 crosses out the outside surface in described the first side wall 102.Described attachment pin 11 is extended with the first side wall 102 junction overhang by the second described sidewall 101, and described attachment pin 11 is four at the number that every avris wall is evenly provided with, and is provided with altogether 16 attachment pins.And described attachment pin 11 vertically extends, and this attachment pin 11 is in L-type, and the end of this attachment pin 11 stretches out the diapire of described encapsulation matrix 1.
Wherein, described face shield 3 is in cruciform.Described four LED pixels 21,22,23 and 24 are individually fixed in the interior corner of described four sidewalls.Further, each LED pixel can send the light of three kinds of colors, i.e. three primary colors.Four described LED pixels are installed on four Ge Nei corners of sidewall, be provided with a criss-cross face shield 3, and the color of this face shield are black between described four LED pixels.The design of face shield 3 is herein that whole display screen is in black state, to obtain good visual effect in order to realize the integrated pixel encapsulation module of this LED when power-off closed condition.Also can improve the resolution of display screen simultaneously.Further, the encapsulation matrix 1 on the top of described each LED pixel is respectively provided with a light hole, for LED pixel 22, its top is provided with a light-emitting window 221, and other three LED dot structures are identical.Wherein, the pin of described each LED pixel is connected on described attachment pin 11, and in the present embodiment, four described LED pixels adopt the encapsulation of common anode pole.
Accompanying drawings 3, this accompanying drawing is the vertical view of the integrated pixel encapsulation module of this LED, with wherein LED pixel 21 and LED pixel 24 apart from illustrate adjacent between distance between LED pixel.As described in Figure, LED pixel 21 is a with the spacing of the three-color light source of LED pixel 24, and above-mentioned spacing a is the distance between same primary color.If three primary colors are R, G, B, then a refers to the distance between the R of R and the LED pixel 24 of luminophor 21.Also with respective central point for starting point, centre distance can be referred to as.The scope of described a is 1 millimeter to 3.2 millimeters.If when wherein the integrated pixel encapsulation module of the LED of utility model is applied to indoor, the magnitude range of a is 1 millimeter to 3.2 millimeters; When the integrated pixel encapsulation module of the utility model LED is applied in outdoor, its magnitude range is 2.2 millimeters to 3.2 millimeters.
Refer to accompanying drawing 4, be wherein welded with a heat dissipation bonding pad 4 at the diapire of encapsulation matrix 1.In the LED light source course of work, due to heat effects, fluorescent powder and chip can be aging gradually, the photoelectric transformation efficiency of chip can reduce, the luminous energy causing fluorescent powder to inspire reduces, LED light source whole lighting efficiency step-down, and employ integrated pixel encapsulation in heat dissipation bonding pad 4 contact pcb board heat radiation, the temperature of LED light source can be reduced.
Accompanying drawings 5, accompanying drawing 5 is the part structure for amplifying schematic diagram of the high-definition display screen of the integrated pixel encapsulation module of employing LED of the present utility model.This high-definition display screen comprises the integrated pixel encapsulation module of multiple LED of even regularly arranged installation, pixel encapsulation module 110,111 and 112 as integrated in LED.The integrated pixel encapsulation module of described multiple LED is fixedly mounted on a pcb board, this pcb board is integrated with the driving circuit of LED pixel.Further, the gap between the integrated pixel encapsulation module of described multiple LED is also installed with a face shield, and further described face shield protrudes from the upper surface of the integrated pixel encapsulation module of described LED, thus prevents the equipped damage in transportation.
Wherein it is important to note that the integrated pixel encapsulation module of a kind of LED of the present utility model, use the module of integrated pixel can increase gap between lamp and lamp, thus can face shield be put.On the other hand, increasing behind lamp and lamp gap can encapsulating waterproof, and solving traditional Small Distance waterproof can not become waterproof.Tradition spacing 1.9mm module uses the lamp of encapsulation 1515; gap between lamp and lamp only has 0.4mm; the too little paster LED lamp that cannot use on face shield protection module in gap; can not solve due to the problems such as LED pixel lamp breaks in production, transport, installation process, cause monoblock module to scrap the heavy losses brought.And integration packaging module will reach outdoor water-proof requirement, first need to ensure that module front-back can waterproof, namely after module, waterproof needs drain pan waterproof, and waterproof needs PCB lamp board to sink in drain pan and lamp and drain pan frame Ju Li≤0.4mm before module, then outdoor water-proof grade can be met lamp face encapsulating is equal with drain pan frame face.Traditional, single led luminophor is directly welded on pcb board, is difficult to reach waterproof requirement.
It should be noted that; these are only better possible embodiments of the present utility model; and unrestricted protection domain of the present utility model, all utilization the utility model instructionss and the change of the equivalent structure done by accompanying drawing content, be all included in protection domain of the present utility model.
Claims (9)
1. the integrated pixel encapsulation module of LED, is characterized in that, comprise an encapsulation matrix, and described encapsulation matrix forms by a diapire and by the vertically extending sidewall of diapire surrounding, and described diapire is in square; Four LED pixels, described LED pixel is primitive colours LED luminophor, and four described LED pixels are installed on the interior corner of the sidewall of described encapsulation matrix respectively; Be located at multiple attachment pins of described wall outer surface, the pin of described LED pixel is electrically connected on described attachment pin; One face shield, described face shield is installed in the gap between described four LED pixels; One heat dissipation bonding pad, described heat dissipation bonding pad is installed on the bottom of described encapsulation matrix diapire.
2. the integrated pixel encapsulation module of LED as claimed in claim 1, it is characterized in that, the sidewall of described encapsulation matrix comprises a first side wall, and the second sidewall protruded out by described the first side wall coboundary, and described second sidewall crosses out the outside surface in described the first side wall.
3. the integrated pixel encapsulation module of LED as claimed in claim 2, it is characterized in that, described attachment pin is L-type, and, attachment pin is extending longitudinally and go out by the second described sidewall and the first side wall junction, and the end mounting pin stretches out bottom the diapire of encapsulation matrix.
4. the integrated pixel encapsulation module of LED as claimed in claim 3, it is characterized in that, the attachment number of pins that described second wall outer surface is evenly provided with is 16.
5. the integrated pixel encapsulation module of LED as claimed in claim 1, is characterized in that, described four LED pixels adopt common anode pole to connect.
6. the integrated pixel encapsulation module of LED as claimed in claim 1, it is characterized in that, the scope of the centre distance between described adjacent LED pixel is 1 millimeter to 3.2 millimeters.
7. the integrated pixel encapsulation module of LED as claimed in claim 6, it is characterized in that, when being used to indoor, the scope of the centre distance between adjacent LED pixel is 1 millimeter to 3.2 millimeters; When being used to outdoor, the scope of the centre distance between adjacent LED pixel is 2.2 millimeters to 3.2 millimeters.
8. the integrated pixel encapsulation module of LED as claimed in claim 1, it is characterized in that, described face shield is black.
9. a high-definition display screen, be characterised in that, comprise the integrated pixel encapsulation module of multiple LED as described in claim 1 to 8 any one, the integrated pixel encapsulation module of described multiple LED is evenly installed on a pcb board, and between the integrated pixel encapsulation module of adjacent LED, gap place is installed with a face shield.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420578869.XU CN204143793U (en) | 2014-09-30 | 2014-09-30 | A kind of integrated pixel encapsulation module of LED and high-definition display screen thereof |
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| CN201420578869.XU CN204143793U (en) | 2014-09-30 | 2014-09-30 | A kind of integrated pixel encapsulation module of LED and high-definition display screen thereof |
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| CN204143793U true CN204143793U (en) | 2015-02-04 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104282237A (en) * | 2014-09-30 | 2015-01-14 | 深圳市创显光电有限公司 | LED integrated pixel packaging module and high-definition display screen thereof |
| CN108230936A (en) * | 2018-03-22 | 2018-06-29 | 深圳市九洲光电科技有限公司 | A kind of encapsulating structure and its processing method for having data-transformation facility |
-
2014
- 2014-09-30 CN CN201420578869.XU patent/CN204143793U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104282237A (en) * | 2014-09-30 | 2015-01-14 | 深圳市创显光电有限公司 | LED integrated pixel packaging module and high-definition display screen thereof |
| CN108230936A (en) * | 2018-03-22 | 2018-06-29 | 深圳市九洲光电科技有限公司 | A kind of encapsulating structure and its processing method for having data-transformation facility |
| CN108230936B (en) * | 2018-03-22 | 2023-10-27 | 深圳市九洲光电科技有限公司 | Packaging structure with data transmission function and processing method thereof |
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