CN204130581U - A kind of ultra thin LED support - Google Patents
A kind of ultra thin LED support Download PDFInfo
- Publication number
- CN204130581U CN204130581U CN201420497407.5U CN201420497407U CN204130581U CN 204130581 U CN204130581 U CN 204130581U CN 201420497407 U CN201420497407 U CN 201420497407U CN 204130581 U CN204130581 U CN 204130581U
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- China
- Prior art keywords
- conducting terminal
- led support
- insulator foot
- ultra thin
- foot
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Abstract
The utility model discloses a kind of ultra thin LED support, this LED support can meet the dimensional requirement of more small dimension, and its dimensions covers the application between 1.0mm to 1.4mm, can meet P1.9 or more Small Distance display screen demand.It is scientific and reasonable for structure, even if package dimension reduces further, the area causing plastic cement to be combined with conducting terminal becomes less, also effectively can prevent the problems such as routing district when bending bending leg upwarps, make the support of this package dimension be achieved volume production.
Description
Technical field
The utility model relates to LED support field.
Background technology
The more concerned topic of display screen industry is exactly Small Distance LED display, and Small Distance display screen can combine with high-tech concepts such as touch, bore hole 3D, intelligent use, cloud Broadcast Controls, has extremely wide range of application.So-called Small Distance LED display, refers to the full-color LED display screen of LED dot spacing at below P2.5, mainly comprises P2.5, P2.0, P1.8, P1.5 so that more closely spaced LED display product.
Along with LED technology is fast-developing, color LED package dimension is more and more less, effectively reduces the arrangement pitches of LED particle, impels electronic display resolution upwards to promote again.Display screen market turns into indoor by open air in addition, and the distance that the common people watch display screen furthers, and manufacturer continues to promote for the demand of Small Distance, high-res display screen.
The color LED support that existing market is comparatively ripe has 5050,3535,3528,3030,2121,1515 etc., and what requires display screen definition along with spectators improves constantly, and the support of more small dimension developed by needs.
Summary of the invention
In order to overcome the deficiencies in the prior art, the utility model provides that a kind of resolution is high, contrast is high, the ultra thin LED support of good stability, low cost of manufacture.
The utility model solves the technical scheme that its technical problem adopts:
A kind of ultra thin LED support, comprise the insulator foot that top is provided with package cavity, and the plural conductive terminal of produced by insert molding in insulator foot, described conducting terminal comprises the first conducting terminal and the second conducting terminal, the upper surface of the first conducting terminal is exposed to package cavity bottom surface and forms die bond portion, the upper surface of the second conducting terminal is exposed to package cavity bottom surface and forms routing district, the lower end of the first conducting terminal and the second conducting terminal is exposed to insulator foot and forms welding foot outward, length between the described LED support left and right sides is between 1.0mm-1.4mm, before and after wide between 1.0mm-1.4mm between both sides.
Further, the periphery in described routing district is provided with the stage portion of sinking.
Further, the length between the described LED support left and right sides is 1.2mm, and wide between both sides, front and back is 1.2mm, and further, the height between upper and lower both sides is 1.0mm.
Further, described LED support is color LED support, it can place red, green, blue three kinds of chips, described plural conductive terminal is four, it comprises the first conducting terminal that has die bond portion, and three second conducting terminals with routing district, and the die bond portion of the first conducting terminal is arranged on the centre of package cavity, its side is provided with the routing district of two the second conducting terminals, and opposite side is provided with the routing district of second conducting terminal.
Further, two the second conducting terminals being positioned at the first side, conducting terminal die bond portion extend to the side of insulator foot and are bent to form the first kink and the first extension downwards, and then the second kink and welding foot is bent to form below insulator foot, first conducting terminal and another second conducting terminal extend to relative insulator foot opposite side and are bent to form the first kink and the first extension downwards, and then are bent to form the second kink and welding foot below insulator foot.
Further, the lateral surface on described insulator foot top is inclined plane, draws in from top to bottom toward middle.
Further, the bottom of described insulator foot also injection mo(u)lding have the projection of being kept apart by welding foot.
The beneficial effects of the utility model are: this LED support can meet the dimensional requirement of more small dimension, and its dimensions covers the application between 1.0mm to 1.4mm, can meet P1.9 or more Small Distance display screen demand.It is scientific and reasonable for structure, even if package dimension reduces further, the area causing plastic cement to be combined with conducting terminal becomes less, also effectively can prevent the problems such as routing district when bending bending leg upwarps, make the support of this package dimension be achieved volume production.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is further illustrated.
Fig. 1 is structural representation of the present utility model;
Fig. 2 is vertical view of the present utility model;
Fig. 3 is the cutaway view of the utility model along A-A line in Fig. 2;
Fig. 4 is the structural representation of conducting terminal in the utility model;
Fig. 5 is the structural representation of metallic plate in manufacture method of the present utility model.
Embodiment
For convenience of description, in this patent, by LED support by when putting shown in Fig. 1, the one side at its package cavity 11 place is defined as " on ", relative another side is defined as D score, two sides of the first place, extension 214 outer face are defined as on " left side " and " right side " respectively, and just right side is defined as " front ", back to side be defined as " afterwards ".
By through the metallic plate 3 of punching press by when putting shown in Fig. 5, the both sides of horizontal expansion are defined as "up" and "down", and the both sides of longitudinal extension are defined as on " left side " and " right side ", are so not limited to this in actual applications.
Referring to figs. 1 through Fig. 4, a kind of ultra thin LED support, comprises the insulator foot 1 that top is provided with package cavity 11, and the plural conductive terminal 2 of produced by insert molding in insulator foot 1.The lateral surface on described insulator foot 1 top is inclined plane, draws in from top to bottom toward middle.Described conducting terminal 2 comprises the first conducting terminal 21 and the second conducting terminal 22, the upper surface of the first conducting terminal 21 is exposed to package cavity 11 bottom surface and forms die bond portion 211, the upper surface of the second conducting terminal 22 is exposed to package cavity 11 bottom surface and forms routing district 221, the lower end of stage portion 222, first conducting terminal 21 and the second conducting terminal 22 that the periphery in described routing district 221 is provided with sinking is exposed to that insulator foot 1 is outer forms welding foot 212.Stage portion 222 can increase colloid and conducting terminal 2 adhesion, and when this region colloid effectively can prevent the second conducting terminal 22 bending, routing district 221 upwarps.
In this embodiment, described LED support is color LED support, it can place red, green, blue three kinds of chips, described plural conductive terminal 2 is four, it comprises the first conducting terminal 21 that has die bond portion 211, with three, there is second conducting terminal 22 in routing district 221, the die bond portion 211 of the first conducting terminal 21 is arranged on the centre of package cavity 11, its side is provided with the routing district 221 of two the second conducting terminals 22, and opposite side is provided with the routing district 221 of second conducting terminal 22.Two the second conducting terminals 22 being positioned at the first side, conducting terminal 21 die bond portion 211 extend to the side of insulator foot 1 and are bent to form the first kink 213 and the first extension 214 downwards, and then the second kink 215 and welding foot 212 is bent to form below insulator foot 1, first conducting terminal 21 and another second conducting terminal 22 extend to relative insulator foot 1 opposite side and are bent to form the first kink 213 and the first extension 214 downwards, and then are bent to form the second kink 215 and welding foot 212 below insulator foot 1.In addition, in order to make conducting terminal 2 tightr with the combination of insulator foot 1, the die bond portion 211 of the first conducting terminal 21 and the routing district 221 of the second conducting terminal 22 are provided with breach or projection, this breach or projection coordinate with the colloid of insulator foot 1, add the contact area of colloid and conducting terminal 2 to greatest extent, make the adhesion between colloid and conducting terminal 2 more firm, limit the movement in conducting terminal 2 all directions, thus improve product quality.The bottom of insulator foot 1 is provided with the projection 12 of being kept apart by welding foot 212.
Length between the described LED support left and right sides is between 1.0mm-1.4mm, and namely in Fig. 2, a is 1.0mm-1.4mm; Before and after wide between 1.0mm-1.4mm between both sides, namely in Fig. 2, b is 1.0mm-1.4mm.In this embodiment, the length between the described LED support left and right sides is 1.2mm, and namely in Fig. 2, a is 1.2mm; Before and after wide between both sides be 1.2mm, namely in Fig. 2, b is 1.2mm; Height between upper and lower both sides is 1.0mm, and namely in Fig. 3, c is 1.0mm.
With reference to Fig. 5, the manufacture method of this ultra thin LED support, comprises the steps:
A, provide metallic plate 3, metallic plate 3 forms the plural conductive bar 31 and material strip 32 that are connected through punching press, plural conductive bar 31 comprises first bus 33 with die bond portion 211 and bending leg 311, and there is the second bus 34 of routing district 221 and bending leg 311, material strip 32 is formed with projection 321.In this embodiment, as shown in Figure 5, the region this metallic plate 3 being filled with oblique line is the region be stamped, this metallic plate 3 forms many pack supports group through punching press, every pack support group correspondence forms a LED support, every pack support group comprises four buss 31 and two material strips 32 that are connected, four buss 31 comprise the first bus 33 that has die bond portion 211 and bending leg 311, and three second buss 34 with routing district 221 and bending leg 311, the die bond portion 211 of the first bus 33 is arranged on the middle part of metallic plate 3, its side is provided with the routing district 221 of two the second buss 34, opposite side is provided with the routing district 221 of second bus 34, the bending leg 311 of four buss 31 extends respectively to the left and right sides, and be connected with metallic plate 2 main body, material strip 32 is arranged on the both sides up and down of bus 31, material strip 32 is formed with projection 321.
B, stamp out stage portion 222 in the periphery, routing district 221 of the second bus 34;
C, the bus 31 and the plastic cement produced by insert molding that will be connected with material strip 32, the insulator foot 1 of band package cavity 11 is after plastic rubber shaping, now, the upper surface in die bond portion 211 and routing district 221 is exposed to the bottom surface of package cavity 11, and bending leg 311 stretches out in outside insulator foot 1;
D, the bending leg 311 of bus 31 and metallic plate 3 main body to be cut off, then bending leg 311 is carried out first time bending, form the first kink 213 and the first extension 214 of extension below insulator foot 1;
E, the first extension 214 is carried out secondary bending form the second kink 215, its bottom level to insulator foot 1 extends to form welding foot 212, insulator foot 1 now through produced by insert molding is linked together by projection 321 and metallic plate 3, as long as to be excised by material strip 32 along projection 321 and namely obtain single LED support, namely bus 31 forms conducting terminal 2.
If there is no processing step portion 222, because this LED support package dimension reduces further, the area causing plastic cement to be combined with conducting terminal 2 becomes less, when carrying out bending in step D and step e, the power upwards arched upward that routing district 221 transmits when can be subject to bending, thus produce distortion, affect routing.For avoiding this kind of phenomenon to produce, designing stage portion 222, can increase the adhesion of colloid and conducting terminal 2 in routing district 221, when this part colloid effectively can prevent bending, routing district 221 upwarps, and makes the LED support of this package dimension be achieved volume production.
In addition, in order to make conducting terminal 2 tightr with the combination of insulator foot 1, optional position between steps A and step C, punching press can also be carried out in the routing district 221 of the die bond portion 211 of the first bus 33 and the second bus 34 and form breach or projection, after moulding, this breach or projection coordinate with the colloid of insulator foot 1, the contact area of colloid and bus 31 can be added to greatest extent, make the adhesion between colloid and conducting terminal 2 more firm, limit the movement in conducting terminal 2 all directions, thus improve product quality.In addition, the bottom of insulator foot 1 also injection mo(u)lding have the projection of being kept apart by welding foot 212.
As preferred embodiment, the length between the described LED support left and right sides is 1.2mm, and namely in Fig. 2, a is 1.2mm; Before and after wide between both sides be 1.2mm, namely in Fig. 2, b is 1.2mm; Height between the upper and lower both sides of described LED support is 1.0mm, and namely in Fig. 3, c is 1.0mm.
The manufacture method step of this kind of ultra thin LED support is reasonable, be conducive to scale of mass production processing, this process can give job shop of subordinate or manufacturer of subordinate has come " along projection 321, material strip 32 excision to be obtained single LED support " in step e, thus facilitates the transport of the very little LED support of these volumes and process further.
What finally illustrate is, above embodiment is only in order to illustrate the technical solution of the utility model but not to be limited, although be described in detail the utility model with reference to preferred embodiment, but those of ordinary skill in the art is to be understood that, can modify to the technical solution of the utility model or equivalent replacement, and not departing from aim and the scope of the technical program, it all should be encompassed in right of the present utility model.
Claims (8)
1. a ultra thin LED support, comprise the insulator foot (1) that top is provided with package cavity (11), and the plural conductive terminal (2) of produced by insert molding in insulator foot (1), it is characterized in that: described conducting terminal (2) comprises the first conducting terminal (21) and the second conducting terminal (22), the upper surface of the first conducting terminal (21) is exposed to package cavity (11) bottom surface and forms die bond portion (211), the upper surface of the second conducting terminal (22) is exposed to package cavity (11) bottom surface and forms routing district (221), the lower end of the first conducting terminal (21) and the second conducting terminal (22) is exposed to insulator foot (1) and forms welding foot (212) outward, length between the described LED support left and right sides is between 1.0mm-1.4mm, before and after wide between 1.0mm-1.4mm between both sides.
2. a kind of ultra thin LED support according to claim 1, is characterized in that: the periphery of described routing district (221) is provided with the stage portion (222) of sinking.
3. a kind of ultra thin LED support according to claim 1, is characterized in that: the length between the described LED support left and right sides is 1.2mm, and wide between both sides, front and back is 1.2mm.
4. a kind of ultra thin LED support according to claim 3, is characterized in that: the height between the upper and lower both sides of described LED support is 1.0mm.
5. a kind of ultra thin LED support according to claim 1, it is characterized in that: described LED support is color LED support, it can place red, green, blue three kinds of chips, described plural conductive terminal (2) is four, it comprises the first conducting terminal (21) that has die bond portion (211), with three, there is second conducting terminal (22) in routing district (221), the die bond portion (211) of the first conducting terminal (21) is arranged on the centre of package cavity (11), its side is provided with the routing district (221) of two the second conducting terminals (22), opposite side is provided with the routing district (221) of second conducting terminal (22).
6. a kind of ultra thin LED support according to claim 5, it is characterized in that: two the second conducting terminals (22) being positioned at the first conducting terminal (21) die bond portion (211) side extend to the side of insulator foot (1) and are bent to form the first kink (213) and the first extension (214) downwards, and then be bent to form the second kink (215) and welding foot (212) to insulator foot (1) below, first conducting terminal (21) and another second conducting terminal (22) extend to relative insulator foot (1) opposite side and are bent to form the first kink (213) and the first extension (214) downwards, and then be bent to form the second kink (215) and welding foot (212) to insulator foot (1) below.
7. a kind of ultra thin LED support according to any one of claim 1-6, is characterized in that: the lateral surface on described insulator foot (1) top is inclined plane, draws in from top to bottom toward middle.
8. a kind of ultra thin LED support according to any one of claim 1-6, is characterized in that: the projection (12) of being kept apart by welding foot (212) is arranged at the bottom of described insulator foot (1) also injection mo(u)lding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420497407.5U CN204130581U (en) | 2014-08-29 | 2014-08-29 | A kind of ultra thin LED support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420497407.5U CN204130581U (en) | 2014-08-29 | 2014-08-29 | A kind of ultra thin LED support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204130581U true CN204130581U (en) | 2015-01-28 |
Family
ID=52386906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420497407.5U Expired - Fee Related CN204130581U (en) | 2014-08-29 | 2014-08-29 | A kind of ultra thin LED support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204130581U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104167484A (en) * | 2014-08-29 | 2014-11-26 | 深圳市得润电子股份有限公司 | Ultra-thin LED support and manufacturing method thereof |
-
2014
- 2014-08-29 CN CN201420497407.5U patent/CN204130581U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104167484A (en) * | 2014-08-29 | 2014-11-26 | 深圳市得润电子股份有限公司 | Ultra-thin LED support and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150128 Termination date: 20160829 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |