CN204130520U - Fixing and the radiator structure of SMD MOSFET pipe - Google Patents
Fixing and the radiator structure of SMD MOSFET pipe Download PDFInfo
- Publication number
- CN204130520U CN204130520U CN201420596074.1U CN201420596074U CN204130520U CN 204130520 U CN204130520 U CN 204130520U CN 201420596074 U CN201420596074 U CN 201420596074U CN 204130520 U CN204130520 U CN 204130520U
- Authority
- CN
- China
- Prior art keywords
- press strip
- heat dissipation
- dissipation base
- mosfet pipe
- smd
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 51
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 229910052751 metal Inorganic materials 0.000 claims abstract description 26
- 239000002184 metal Substances 0.000 claims abstract description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 230000005855 radiation Effects 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 8
- 230000008602 contraction Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 238000002791 soaking Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A kind of fixing and radiator structure of SMD MOSFET pipe, comprise a heat dissipation base, the upside of heat dissipation base is provided with at least one press strip, the two ends of any one press strip are all fixedly connected with heat dissipation base each via screw, the middle part of any one press strip all with the upper side parallel interval of heat dissipation base.Multiple SMD MOSFET pipe is arranged with rectangular array form on metallic substrates and welds on metallic substrates.MOSFET pipe and metal substrate are pressed on heat dissipation base by screw by press strip.In process of expansion and contraction, metal substrate can stretch in the plane or shrink, and metal substrate is contacted with heat dissipation base well, can not cause middle tilting, ensure heat radiation.MOSFET pipe upper surface and press strip lower surface are close to, and heat dispels the heat by press strip, increasing heat radiation area.The heat that multiple MOSFET produces transmits mutually by press strip, reaches the effect of soaking.
Description
Technical field:
The utility model relates to electricity field, particularly relates to electric machine controller, the plug-in type MOSFET tube elements particularly in electric machine controller, particularly a kind of fixing and radiator structure of SMD MOSFET pipe.
Background technology:
Electric machine controller extensively adopts SMD MOSFET to manage (i.e. metal-oxide layer semiconductcor field effect transistor) as power component.In prior art, MOSFET pipe is welded on heat dissipation base, utilizes heat dissipation base to dispel the heat.Heat dissipation base is fixed by screws on the heat dissipation base of electric machine controller, when the generation of MOSFET pipe heating heat dissipation base is expanded with heat and contract with cold, because the existence that screw is fixing, cause heat dissipation base cannot to surrounding plane deformation, can only be out of shape in height space, heat dissipation base and base can be caused like this to there is gap, cause heat dissipation base to tilt and heat dissipation base loose contact, cause heat radiation uneven, severe patient can make local overheating burn components and parts.
Summary of the invention:
The purpose of this utility model is to provide the fixing of a kind of SMD MOSFET pipe and radiator structure, and the fixing and radiator structure of described this SMD MOSFET pipe will solve the technical problem that in prior art, in electric machine controller, SMD MOSFET pipe heat dispersal situations is undesirable.
Fixing and the radiator structure of this SMD MOSFET pipe of the present utility model, comprise a heat dissipation base, wherein, the upside of described heat dissipation base is provided with at least one press strip, the two ends of the press strip described in any one are all fixedly connected with heat dissipation base each via a screw, the middle part of any one press strip all with the upper side parallel interval of heat dissipation base.
Further, the upper side of heat dissipation base is provided with a metal substrate, described metal substrate is between the middle part and the upper side of heat dissipation base of press strip, and metal substrate is welded with SMD MOSFET and manages, MOSFET pipe is positioned at the below of press strip.
Further, heat dissipation base is provided with the press strip of two or more number.
Further, the press strip of two or more number parallel interval distribution on heat dissipation base.
Further, the two ends of any one press strip are all extended to heat dissipation base direction a fixing feet, and described fixing feet directly contacts with heat dissipation base.
Further, any one press strip is formed by copper section bar or aluminium section bar.
Operation principle of the present utility model is: by multiple SMD MOSFET pipe on metallic substrates with the arrangement of rectangular array form, by the welding of MOSFET pipe on metallic substrates.MOSFET pipe and metal substrate are pressed on heat dissipation base by screw by press strip.In process of expansion and contraction, because metal substrate is fixed without screw, so metal substrate can stretch in the plane or shrink, metal substrate is contacted with heat dissipation base and well can not cause middle tilting, ensure heat radiation.MOSFET pipe upper surface and press strip lower surface are close to, and the heat that MOSFET produces in the course of the work dispels the heat by press strip, serve the effect of increasing heat radiation area, have certain benefit to heat radiation.The heat that multiple MOSFET produces transmits mutually by press strip, reaches the effect of soaking.
The utility model is compared with prior art, and its effect is actively with obvious.MOSFET pipe on metallic substrates with the arrangement of rectangular array form, welds on metallic substrates by the utility model by multiple SMD MOSFET pipe.MOSFET pipe and metal substrate are pressed on heat dissipation base by screw by press strip.In process of expansion and contraction, because metal substrate is fixed without screw, so metal substrate can stretch in the plane or shrink, metal substrate is contacted with heat dissipation base and well can not cause middle tilting, ensure heat radiation.MOSFET pipe upper surface and press strip lower surface are close to, and the heat that MOSFET produces in the course of the work dispels the heat by press strip, serve the effect of increasing heat radiation area, have certain benefit to heat radiation.The heat that multiple MOSFET produces transmits mutually by press strip, reaches the effect of soaking.
Accompanying drawing illustrates:
Fig. 1 is the structural representation of the fixing of SMD MOSFET pipe of the present utility model and radiator structure.
Fig. 2 is the plan structure schematic diagram of the fixing of SMD MOSFET pipe of the present utility model and radiator structure.
Fig. 3 is the fixing of SMD MOSFET pipe of the present utility model and radiator structure schematic diagram when being unkitted press strip.
Fig. 4 is that the fixing of SMD MOSFET pipe of the present utility model and radiator structure overlook front view when being unkitted press strip.
Fig. 5 is the schematic diagram of fixing of SMD MOSFET pipe of the present utility model and the press strip in radiator structure.
Fig. 6 is the vertical view of fixing of SMD MOSFET pipe of the present utility model and the press strip in radiator structure.
Embodiment:
Embodiment 1:
As shown in Figure 1, Figure 2, shown in Fig. 3, Fig. 4, Fig. 5 and Fig. 6, fixing and the radiator structure of SMD MOSFET pipe of the present utility model, comprise a heat dissipation base 1, wherein, the upside of described heat dissipation base 1 is provided with at least one press strip 2, the two ends of the press strip 2 described in any one are all fixedly connected with heat dissipation base 1 each via a screw 3, the middle part of any one press strip 2 all with the upper side parallel interval of heat dissipation base 1.
Further, the upper side of heat dissipation base 1 is provided with a metal substrate 4, described metal substrate 4, between the middle part of press strip 2 and the upper side of heat dissipation base 1, metal substrate 4 is welded with the below that SMD MOSFET pipe 5, MOSFET pipe 5 is positioned at press strip 2.
Further, heat dissipation base 1 is provided with the press strip 2 of two or more number.
Further, the press strip 2 of two or more number parallel interval distribution on heat dissipation base 1.
Further, the two ends of any one press strip 2 are all extended to heat dissipation base 1 direction a fixing feet, and described fixing feet directly contacts with heat dissipation base 1.
Further, any one press strip 2 is formed by copper section bar or aluminium section bar.
The operation principle of the present embodiment is: arranged with rectangular array form on metal substrate 4 by multiple SMD MOSFET pipe 5, be welded on metal substrate 4 by MOSFET pipe 5.MOSFET pipe 5 and metal substrate 4 are pressed on heat dissipation base 1 by screw 3 by press strip 2.In process of expansion and contraction, because metal substrate 4 is fixed without screw 3, so metal substrate 4 can stretch in the plane or shrink, metal substrate 4 is contacted with heat dissipation base 1 and well can not cause middle tilting, ensure heat radiation.MOSFET pipe 5 upper surface and press strip 2 lower surface are close to, and the heat that MOSFET produces in the course of the work dispels the heat by press strip 2, serves the effect of increasing heat radiation area, has certain benefit to heat radiation.The heat that multiple MOSFET produces transmits mutually by press strip 2, reaches the effect of soaking.
Claims (6)
1. the fixing and radiator structure of a SMD MOSFET pipe, comprise a heat dissipation base, it is characterized in that: the upside of described heat dissipation base is provided with at least one press strip, the two ends of the press strip described in any one are all fixedly connected with heat dissipation base each via a screw, the middle part of any one press strip all with the upper side parallel interval of heat dissipation base.
2. the fixing and radiator structure of SMD MOSFET pipe as claimed in claim 1, it is characterized in that: the upper side of heat dissipation base is provided with a metal substrate, described metal substrate is between the middle part and the upper side of heat dissipation base of press strip, metal substrate is welded with SMD MOSFET to manage, MOSFET pipe is positioned at the below of press strip.
3. the fixing and radiator structure of SMD MOSFET pipe as claimed in claim 1, is characterized in that: press strip heat dissipation base being provided with two or more number.
4. the fixing and radiator structure of SMD MOSFET pipe as claimed in claim 3, is characterized in that: press strip parallel interval distribution on heat dissipation base of two or more number.
5. the fixing and radiator structure of SMD MOSFET pipe as claimed in claim 1, is characterized in that: the two ends of any one press strip are all extended to heat dissipation base direction a fixing feet, and described fixing feet directly contacts with heat dissipation base.
6. the fixing and radiator structure of SMD MOSFET pipe as claimed in claim 1, is characterized in that: any one press strip is formed by copper section bar or aluminium section bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420596074.1U CN204130520U (en) | 2014-10-15 | 2014-10-15 | Fixing and the radiator structure of SMD MOSFET pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420596074.1U CN204130520U (en) | 2014-10-15 | 2014-10-15 | Fixing and the radiator structure of SMD MOSFET pipe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204130520U true CN204130520U (en) | 2015-01-28 |
Family
ID=52386847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420596074.1U Expired - Lifetime CN204130520U (en) | 2014-10-15 | 2014-10-15 | Fixing and the radiator structure of SMD MOSFET pipe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204130520U (en) |
-
2014
- 2014-10-15 CN CN201420596074.1U patent/CN204130520U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |