CN204116713U - Electrostatic drives MEMS (micro electro mechanical system) two-dimensional scan micro mirror - Google Patents
Electrostatic drives MEMS (micro electro mechanical system) two-dimensional scan micro mirror Download PDFInfo
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- CN204116713U CN204116713U CN201420640709.3U CN201420640709U CN204116713U CN 204116713 U CN204116713 U CN 204116713U CN 201420640709 U CN201420640709 U CN 201420640709U CN 204116713 U CN204116713 U CN 204116713U
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Abstract
The utility model discloses a kind of electrostatic and drives MEMS (micro electro mechanical system) two-dimensional scan micro mirror, it is primarily of the low-resistance silicon base being positioned at the bottom, be positioned at fixed fingers and the comb lead-in wire in middle layer, be positioned at the movable comb of the superiors, two-dimensional scan micromirror group and brace summer group, and mediate layer and top anchor position formed simultaneously; The minute surface turning axle of X-direction is used as by introducing 4 L shape brace summers in X-direction, the lead-in wire of inner fixed fingers is passed through from adjacent two L shape brace summer space central authorities just, such design can either simplify device architecture and processing technology, reduce cost, also make the lead-in wire of micromirror more convenient, so that form extensive micromirror array, the application tool of MEMS (micro electro mechanical system) two-dimensional scan micro mirror is driven to be of great significance to expanding electrostatic.
Description
Technical field
The utility model relates to Micro-Opto-Electro-Mechanical Systems field, is specifically related to a kind of electrostatic and drives MEMS (micro electro mechanical system) two-dimensional scan micro mirror.
Background technology
In Micro-Opto-Electro-Mechanical Systems field, quiet electrically driven (operated) two-dimensional scan MEMS (micro electro mechanical system) micromirror, is the important devices in modern optical communication systems, can be used as photoswitch, optical attenuator and optical multiplexer etc.But existing electrostatic drives MEMS (micro electro mechanical system) two-dimensional scan micro mirror and array thereof mainly to there is following shortcoming: the mirror curvature that (1) unrelieved stress produces can aggravate because of temperature variation, thus causes the change of insertion loss large; (2) device architecture and processing technology complexity, processing cost is high; (3) go between when forming array inconvenient.These shortcomings greatly limit electrostatic and drive applying of MEMS (micro electro mechanical system) two-dimensional scan micro mirror and array thereof.
Utility model content
Technical problem to be solved in the utility model is that existing electrostatic drives that MEMS (micro electro mechanical system) two-dimensional scan micro mirror insertion loss is large, complex process and composition extensive micromirror array time the problem such as lead-in wire difficulty, provide a kind of electrostatic to drive MEMS (micro electro mechanical system) two-dimensional scan micro mirror and manufacture craft thereof.
For solving the problem, the utility model is achieved through the following technical solutions:
A kind of electrostatic drives MEMS (micro electro mechanical system) two-dimensional scan micro mirror, primarily of the low-resistance silicon base being positioned at the bottom, be positioned at fixed fingers and the comb lead-in wire in middle layer, be positioned at the movable comb of the superiors, two-dimensional scan micromirror group and brace summer group, and mediate layer and top anchor position formed simultaneously;
The upper surface of low-resistance silicon base is covered with insulation course;
Fixed fingers is fixed on the upper surface of low-resistance silicon base, and is made up of 2 external stability comb and 2 inner fixed fingers; Wherein 2 external stability comb be symmetricly set on low-resistance silicon base Y-axis namely before and after the edge of both sides, 2 inner fixed fingers are symmetricly set on the X axis of low-resistance silicon base and the middle part of the left and right sides;
Anchor position stands upright on the upper surface of low-resistance silicon base, and extends through top anchor pole by 4 from middle layer and form; Above-mentioned 4 anchor poles are divided into 2 groups, and be separately fixed at the opposite exterior lateral sides of 2 inner fixed fingers, and these 4 anchor poles are be symmetrical arranged between two at the upper surface of low-resistance silicon base, namely 2 anchor poles be positioned on the left of inner fixed fingers are symmetrical, 2 anchor poles be positioned on the right side of inner fixed fingers are symmetrical, and 2 anchor poles be positioned on the left of inner fixed fingers are symmetrical with 2 anchor poles be positioned on the right side of inner fixed fingers;
Movable comb is hung on the top of fixed fingers, and is made up of 2 outer movable comb and 2 inner moveable comb; 2 outer movable comb lay respectively at directly over 2 external stability comb, and the projection of outer movable comb is meshed with external stability comb; 2 inner moveable comb lay respectively at directly over 2 inner fixed fingers, and the projection of inner moveable comb is meshed with inner fixed fingers;
Two-dimensional scan micromirror group is made up of the micromirror of two-dimensional scan platform and the upper surface that is flattened on two-dimensional scan platform; The X axis of two-dimensional scan platform and left and right sidewall is each is directly connected mutually with 1 inner moveable comb, the Y-axis of two-dimensional scan platform and front-rear side walls are respectively connected by a minute surface turning axle and 1 outer movable comb;
Brace summer group comprises 4 L shape brace summers, these 4 L shape brace summers are divided into 2 groups, and be hung on the opposite exterior lateral sides of 2 inner moveable comb respectively, and these 4 anchor poles are be symmetrical arranged between two at the upper surface of low-resistance silicon base, namely the 2 L shape brace summers be positioned on the left of inner moveable comb are symmetrical, the 2 L shape brace summers be positioned on the right side of inner moveable comb are symmetrical, and the 2 L shape brace summers be positioned on the left of inner moveable comb are symmetrical with the 2 L shape brace summers be positioned on the right side of inner moveable comb; One end of every root L shape brace summer is connected with 1 anchor pole, and the other end is connected with outer movable comb;
2 comb lead-in wires are separately fixed at the opposite exterior lateral sides of 2 inner fixed fingers, the comb lead-in wire being wherein positioned at left side passes through from the central authorities immediately below the gap of the 2 L shape brace summers be positioned on the left of inner moveable comb, and the comb lead-in wire being positioned at right side passes through from the central authorities immediately below the gap of the 2 L shape brace summers be positioned on the right side of inner moveable comb.
In such scheme, every root anchor pole inside is equipped with an embedded insulating layer, this embedded insulating layer is horizontally placed in anchor pole, and anchor pole is divided into upper and lower two independences and the part of insulation, the height of its lower middle portion anchor pole is suitable with the height of fixed fingers, and the height of upper part anchor pole is suitable with the height of movable comb.
In such scheme, surperficial metal-plated membrane above and/or under micromirror.
In such scheme, 2 external stability comb are unidirectional comb, and the opening of the teeth groove of 2 external stability comb is all inwardly namely towards the middle part of low-resistance silicon base, and the teeth groove of 2 external stability comb is towards just right; Corresponding with it, 2 outer movable comb are unidirectional comb, and the opening of the teeth groove of 2 outer movable comb is all outside towards namely towards the edge of low-resistance silicon base, and the teeth groove of 2 outer movable comb towards back to.
In such scheme, each inner fixed fingers is by 2 at Y-axis two-way comb composition side by side, and namely the outward opening of the teeth groove of each inner fixed fingers is towards namely towards 2 external stability comb; Corresponding with it, each inner moveable is by being positioned at 1 two-way comb at middle part and being positioned at 2 unidirectional comb compositions of both sides, wherein the outward opening of two-way comb is towards namely towards 2 external stability comb, and the opening of unidirectional comb is inwardly namely towards two-way comb.
In such scheme, described fixed fingers and movable comb are made up of monocrystalline silicon or polysilicon.
The utility model is compared with prior art advantageously: the utility model is used as the minute surface turning axle of X-direction by introducing 4 L shape brace summers in X-direction, the lead-in wire of inner fixed fingers is passed through from adjacent two L shape brace summer space central authorities just, such design can either simplify device architecture and processing technology, reduce cost, also make the lead-in wire of micromirror more convenient, so that form extensive micromirror array, the application tool of MEMS (micro electro mechanical system) two-dimensional scan micro mirror is driven to be of great significance to expanding electrostatic.In addition, the utility model, also by minute surface upper and lower surface metal-coated membrane, eliminates the mirror curvature that unrelieved stress causes, the change of insertion loss reducing the curvature mirror change in radius because temperature variation causes and bring thus.
Accompanying drawing explanation
Fig. 1 is the schematic perspective view that single electrostatic drives MEMS (micro electro mechanical system) two-dimensional scan micro mirror.
Fig. 2 is the vertical view that single electrostatic drives MEMS (micro electro mechanical system) two-dimensional scan micro mirror.
Fig. 3 is that single electrostatic drives the bottom of MEMS (micro electro mechanical system) two-dimensional scan micro mirror and the schematic perspective view in middle layer.
Fig. 4 is the schematic perspective view that single electrostatic drives the superiors of MEMS (micro electro mechanical system) two-dimensional scan micro mirror.
Fig. 5 is the vertical view that 2 × 2 electrostatic drive MEMS (micro electro mechanical system) two-dimensional scan micro mirror array.
Number in the figure: 1, low-resistance silicon base, 2-1, external stability comb, 2-2, inner fixed fingers, 3, comb lead-in wire, 4-1, outer movable comb, 4-2, inner moveable comb, 5-1, two-dimensional scan platform, 5-2, micromirror, 5-3, minute surface turning axle, 6, brace summer group, 7, anchor position; 7-1, embedded insulating layer, 8, insulation course.
Embodiment
A kind of electrostatic drives MEMS (micro electro mechanical system) two-dimensional scan micro mirror, as Figure 1-4, primarily of the low-resistance silicon base 1 being positioned at the bottom, be positioned at fixed fingers and the comb lead-in wire 3 in middle layer, be positioned at the movable comb of the superiors, two-dimensional scan micromirror 5-2 group and brace summer group 6, and mediate layer and top anchor position 7 formed simultaneously.
The upper surface of low-resistance silicon base 1 is covered with insulation course 8.This insulation course 8 to be thickness be 0.1 ~ 10 micron polymkeric substance, silicon dioxide or silicon nitride.
Fixed fingers is fixed on the upper surface of low-resistance silicon base 1, and is made up of 2 external stability comb 2-1 and 2 inner fixed fingers 2-2.Wherein 2 external stability comb 2-1 be symmetricly set on low-resistance silicon base 1 Y-axis namely before and after the edge of both sides, 2 inner fixed fingers 2-2 are symmetricly set on the X axis of low-resistance silicon base 1 and the middle part of the left and right sides.
Anchor position 7 stands upright on the upper surface of low-resistance silicon base 1, and extends through top anchor pole by 4 from middle layer and form.Every root anchor pole inside is equipped with an embedded insulating layer 7-1, this embedded insulating layer 7-1 to be thickness be 0.1 ~ 10 micron polymkeric substance, silicon dioxide or silicon nitride.Embedded insulating layer 7-1 is horizontally placed in anchor pole, and anchor pole is divided into upper and lower two independences and the part of insulation, and the height of its lower middle portion anchor pole is suitable with the height of fixed fingers, and the height of upper part anchor pole is suitable with the height of movable comb.Above-mentioned 4 anchor poles are divided into 2 groups, and be separately fixed at the opposite exterior lateral sides of 2 inner fixed fingers 2-2, and these 4 anchor poles are be symmetrical arranged between two at the upper surface of low-resistance silicon base 1, namely 2 anchor poles be positioned on the left of inner fixed fingers 2-2 are symmetrical, 2 anchor poles be positioned on the right side of inner fixed fingers 2-2 are symmetrical, and 2 anchor poles be positioned on the left of inner fixed fingers 2-2 are symmetrical with 2 anchor poles be positioned on the right side of inner fixed fingers 2-2.
Movable comb is hung on the top of fixed fingers, and is made up of 2 outer movable comb 4-1 and 2 inner moveable comb 4-2.2 outer movable comb 4-1 lay respectively at directly over 2 external stability comb 2-1, and the projection of outer movable comb 4-1 is meshed with external stability comb 2-1.2 inner moveable comb 4-2 lay respectively at directly over 2 inner fixed fingers 2-2, and the projection of inner moveable comb 4-2 is meshed with inner fixed fingers 2-2.
Two-dimensional scan micromirror 5-2 group is made up of the micromirror 5-2 of two-dimensional scan platform 5-1 and the upper surface that is flattened on two-dimensional scan platform 5-1.The equal metal-plated membrane of upper and lower surface of micromirror 5-2, this metal film can be gold, copper or aluminium, and its thickness is 50 ~ 500 nanometers.The X axis of two-dimensional scan platform 5-1 and left and right sidewall is each is directly connected with 1 inner moveable comb 4-2 phase, the Y-axis of two-dimensional scan platform 5-1 and front-rear side walls are respectively connected by a minute surface turning axle 5-3 and 1 outer movable comb 4-1.The width of above-mentioned minute surface turning axle 5-3 is 2 ~ 10 microns.
Brace summer group 6 comprises 4 L shape brace summers, these 4 L shape brace summers are divided into 2 groups, and be hung on the opposite exterior lateral sides of 2 inner moveable comb 4-2 respectively, and these 4 anchor poles are be symmetrical arranged between two at the upper surface of low-resistance silicon base 1, namely the 2 L shape brace summers be positioned on the left of inner moveable comb 4-2 are symmetrical, the 2 L shape brace summers be positioned on the right side of inner moveable comb 4-2 are symmetrical, and the 2 L shape brace summers be positioned on the left of inner moveable comb 4-2 are symmetrical with the 2 L shape brace summers be positioned on the right side of inner moveable comb 4-2.One end of every root L shape brace summer is connected with 1 anchor pole, and the other end is connected with outer movable comb 4-1.Be positioned at the same side and the spacing of two adjacent L shape brace summers is 4 ~ 20 microns.
2 comb lead-in wires 3 are separately fixed at the opposite exterior lateral sides of 2 inner fixed fingers 2-2, the comb lead-in wire 3 being wherein positioned at left side passes through from the central authorities immediately below the gap of the 2 L shape brace summers be positioned on the left of inner moveable comb 4-2, and the comb lead-in wire 3 being positioned at right side passes through from the central authorities immediately below the gap of the 2 L shape brace summers be positioned on the right side of inner moveable comb 4-2.The width of L shape brace summer is 2 ~ 12 microns.
Described fixed fingers and movable comb are made up of monocrystalline silicon or polysilicon.The height of movable comb and fixed fingers is 20 ~ 120 microns.Engage with the projection of outer movable comb 4-1 in order to external stability comb 2-1 can be realized, 2 external stability comb 2-1 are unidirectional comb, the opening of the teeth groove of 2 external stability comb 2-1 is all inwardly namely towards the middle part of low-resistance silicon base 1, and the teeth groove of 2 external stability comb 2-1 is towards just right; Corresponding with it, 2 outer movable comb 4-1 are unidirectional comb, and the opening of the teeth groove of 2 outer movable comb 4-1 is all outside towards namely towards the edge of low-resistance silicon base 1, and the teeth groove of 2 outer movable comb 4-1 towards back to.Engage with the projection of inner moveable comb 4-2 in order to inner fixed fingers 2-2 can be realized, each inner fixed fingers 2-2 is by 2 at Y-axis two-way comb composition side by side, and namely the outward opening of the teeth groove of each inner fixed fingers 2-2 is towards namely towards 2 external stability comb 2-1; Corresponding with it, each inner moveable is by being positioned at 1 two-way comb at middle part and being positioned at 2 unidirectional comb compositions of both sides, wherein the outward opening of two-way comb is towards namely towards 2 external stability comb 2-1, and the opening of unidirectional comb is inwardly namely towards two-way comb.
Electrostatic drives the concrete fabrication processing of MEMS (micro electro mechanical system) two-dimensional scan micro mirror as follows:
1. prepare that soi layer thickness is 45 microns, middle silicon dioxide thickness is 1 micron, substrate thickness be the silicon chip A of 300 microns and soi layer thickness is 80 microns, intermediate oxidation silicon thickness is 1 micron, each a slice of silicon chip B that substrate thickness is 300 microns.
2. on the soi layer of silicon chip A, deposit the gold of 200 nanometer thickness, deep etching silicon chip B, form fixed fingers and the lead-in wire thereof of minimum feature 3 microns.
3. silicon chip A and B is carried out bonding, and at the two-layer middle silicon dioxide insulating layer 8 forming one deck 200 nanometer thickness.
4. the basalis of silicon chip A is removed.
5. etching silicon wafer A, forms mirror surface structure; Finally, adopt Lift off technique at the gold of surface deposition 200 nanometer thickness.
During actual use, this electrostatic drives MEMS (micro electro mechanical system) two-dimensional scan micro mirror to scan around X-axis to realize, as long as the positive and negative electrode of direct supply will be received respectively at outside fixed fingers 2-1 and the outer end points of L shape brace summer, just can form an electric potential difference between outside fixed fingers 2-1 and outer movable comb 4-1, thus drive minute surface to rotate around X-axis.To realize around Y axis scanning, as long as the upper surface of comb lead-in wire 3 and wherein any one anchor position 7 to be received respectively the positive and negative electrode of direct supply, just can form electric potential difference between inner fixed fingers 2-2 and inner moveable comb 4-2, thus drive minute surface to rotate around X-axis.
It is more than the situation that single electrostatic drives MEMS (micro electro mechanical system) two-dimensional scan micro mirror, 2 × 2 electrostatic drive MEMS (micro electro mechanical system) two-dimensional scan micro mirror array structure schematic diagram, as shown in Figure 5, during actual use, as long as corresponding comb is connected by lead-in wire can realizes two-dimensional scan with power positive cathode.Consider that lead-in wire is convenient, between adjacent cells, enough distances will be left.
Claims (6)
1. electrostatic drives MEMS (micro electro mechanical system) two-dimensional scan micro mirror, it is characterized in that: primarily of the low-resistance silicon base (1) being positioned at the bottom, be positioned at fixed fingers and comb lead-in wire (3) in middle layer, be positioned at the movable comb of the superiors, two-dimensional scan micromirror (5-2) group and brace summer group (6), and mediate layer and top anchor position (7) formed simultaneously;
The upper surface of low-resistance silicon base (1) is covered with insulation course (8);
Fixed fingers is fixed on the upper surface of low-resistance silicon base (1), and is made up of 2 external stability comb (2-1) and 2 inner fixed fingers (2-2); Wherein 2 external stability comb (2-1) be symmetricly set on low-resistance silicon base (1) Y-axis namely before and after the edge of both sides, 2 inner fixed fingers (2-2) are symmetricly set on the X axis of low-resistance silicon base (1) and the middle part of the left and right sides;
Anchor position (7) stands upright on the upper surface of low-resistance silicon base (1), and extends through top anchor pole by 4 from middle layer and form; Above-mentioned 4 anchor poles are divided into 2 groups, and be separately fixed at the opposite exterior lateral sides of 2 inner fixed fingers (2-2), and these 4 anchor poles are be symmetrical arranged between two at the upper surface of low-resistance silicon base (1), namely 2 anchor poles being positioned at inner fixed fingers (2-2) left side are symmetrical, 2 anchor poles being positioned at inner fixed fingers (2-2) right side are symmetrical, and 2 anchor poles being positioned at inner fixed fingers (2-2) left side are symmetrical with 2 anchor poles being positioned at inner fixed fingers (2-2) right side;
Movable comb is hung on the top of fixed fingers, and is made up of 2 outer movable comb (4-1) and 2 inner moveable comb (4-2); 2 outer movable comb (4-1) lay respectively at directly over 2 external stability comb (2-1), and the projection of outer movable comb (4-1) is meshed with external stability comb (2-1); 2 inner moveable comb (4-2) lay respectively at directly over 2 inner fixed fingers (2-2), and the projection of inner moveable comb (4-2) is meshed with inner fixed fingers (2-2);
Two-dimensional scan micromirror (5-2) group is made up of the micromirror (5-2) of two-dimensional scan platform (5-1) and the upper surface that is flattened on two-dimensional scan platform (5-1); The X axis of two-dimensional scan platform (5-1) and left and right sidewall is each is directly connected mutually with 1 inner moveable comb (4-2), the Y-axis of two-dimensional scan platform (5-1) and front-rear side walls are respectively connected by a minute surface turning axle (5-3) and 1 outer movable comb (4-1);
Brace summer group (6) comprises 4 L shape brace summers, these 4 L shape brace summers are divided into 2 groups, and be hung on the opposite exterior lateral sides of 2 inner moveable comb (4-2) respectively, and these 4 anchor poles are be symmetrical arranged between two at the upper surface of low-resistance silicon base (1), namely the 2 L shape brace summers being positioned at inner moveable comb (4-2) left side are symmetrical, the 2 L shape brace summers being positioned at inner moveable comb (4-2) right side are symmetrical, and the 2 L shape brace summers being positioned at inner moveable comb (4-2) left side are symmetrical with the 2 L shape brace summers being positioned at inner moveable comb (4-2) right side, one end of every root L shape brace summer is connected with 1 anchor pole, and the other end is connected with outer movable comb (4-1),
2 comb lead-in wire (3) are separately fixed at the opposite exterior lateral sides of 2 inner fixed fingers (2-2), comb lead-in wire (3) on the left of being wherein positioned at passes through from the central authorities immediately below the gap of the 2 L shape brace summers be positioned on the left of inner moveable comb (4-2), and comb lead-in wire (3) being positioned at right side passes through from the central authorities immediately below the gap of the 2 L shape brace summers be positioned on the right side of inner moveable comb (4-2).
2. electrostatic according to claim 1 drives MEMS (micro electro mechanical system) two-dimensional scan micro mirror, it is characterized in that: every root anchor pole inside is equipped with an embedded insulating layer (7-1), this embedded insulating layer (7-1) is horizontally placed in anchor pole, and anchor pole is divided into upper and lower two independences and the part of insulation, the height of its lower middle portion anchor pole is suitable with the height of fixed fingers, and the height of upper part anchor pole is suitable with the height of movable comb.
3. electrostatic according to claim 1 drives MEMS (micro electro mechanical system) two-dimensional scan micro mirror, it is characterized in that: surperficial metal-plated membrane above and/or under micromirror (5-2).
4. electrostatic according to claim 1 drives MEMS (micro electro mechanical system) two-dimensional scan micro mirror, it is characterized in that: 2 external stability comb (2-1) are unidirectional comb, the opening of the teeth groove of 2 external stability comb (2-1) is all inwardly namely towards the middle part of low-resistance silicon base (1), and the teeth groove of 2 external stability comb (2-1) is towards just right; Corresponding with it, 2 outer movable comb (4-1) are unidirectional comb, the opening of the teeth groove of 2 outer movable comb (4-1) is all outside towards namely towards the edge of low-resistance silicon base (1), and the teeth groove of 2 outer movable comb (4-1) towards back to.
5. electrostatic according to claim 1 drives MEMS (micro electro mechanical system) two-dimensional scan micro mirror, it is characterized in that: each inner fixed fingers (2-2) is by 2 at Y-axis two-way comb composition side by side, and namely the outward opening of the teeth groove of each inner fixed fingers (2-2) is towards namely towards 2 external stability comb (2-1); Corresponding with it, each inner moveable is by being positioned at 1 two-way comb at middle part and being positioned at 2 unidirectional comb compositions of both sides, wherein the outward opening of two-way comb is towards namely towards 2 external stability comb (2-1), and the opening of unidirectional comb is inwardly namely towards two-way comb.
6. the electrostatic according to claim 4 or 5 drives MEMS (micro electro mechanical system) two-dimensional scan micro mirror, it is characterized in that: described fixed fingers and movable comb are made up of monocrystalline silicon or polysilicon.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201420640709.3U CN204116713U (en) | 2014-10-30 | 2014-10-30 | Electrostatic drives MEMS (micro electro mechanical system) two-dimensional scan micro mirror |
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| CN201420640709.3U CN204116713U (en) | 2014-10-30 | 2014-10-30 | Electrostatic drives MEMS (micro electro mechanical system) two-dimensional scan micro mirror |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104297922A (en) * | 2014-10-30 | 2015-01-21 | 桂林市光隆光电科技有限公司 | Two-dimensional scanning micromirror of electrostatic drive microelectromechanical system |
| CN105607249A (en) * | 2015-12-21 | 2016-05-25 | 西安励德微系统科技有限公司 | Micro-torsion mirror driven by one-side unequal height comb teeth |
| CN113805158A (en) * | 2020-06-17 | 2021-12-17 | 英飞凌科技股份有限公司 | MEMS scanner suspension system enabling high frequency and high mechanical tilt angle of large mirrors |
-
2014
- 2014-10-30 CN CN201420640709.3U patent/CN204116713U/en not_active Withdrawn - After Issue
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104297922A (en) * | 2014-10-30 | 2015-01-21 | 桂林市光隆光电科技有限公司 | Two-dimensional scanning micromirror of electrostatic drive microelectromechanical system |
| CN105607249A (en) * | 2015-12-21 | 2016-05-25 | 西安励德微系统科技有限公司 | Micro-torsion mirror driven by one-side unequal height comb teeth |
| CN105607249B (en) * | 2015-12-21 | 2018-06-26 | 西安励德微系统科技有限公司 | A kind of torsional micro-mirror of the not contour pivotal quantity in unilateral side |
| CN113805158A (en) * | 2020-06-17 | 2021-12-17 | 英飞凌科技股份有限公司 | MEMS scanner suspension system enabling high frequency and high mechanical tilt angle of large mirrors |
| US11662570B2 (en) | 2020-06-17 | 2023-05-30 | Infineon Technologies Ag | Mems scanner suspension system enabling high frequency and high mechanical tilt angle for large mirrors |
| CN113805158B (en) * | 2020-06-17 | 2024-01-12 | 英飞凌科技股份有限公司 | MEMS scanner suspension system enabling high frequency and high mechanical tilt angle of a macro mirror |
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Address after: 541004 D-08 hi tech park, National Information Industry Park, Chaoyang Road, hi tech Zone, the Guangxi Zhuang Autonomous Region, Guilin Patentee after: GLsun Science and Technology Co., Ltd Address before: 541004 D-08 hi tech park, National Information Industry Park, Chaoyang Road, hi tech Zone, the Guangxi Zhuang Autonomous Region, Guilin Patentee before: Guanglong Photoelectric Science & Technolgoy Co., Ltd., Guilin City |
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Granted publication date: 20150121 Effective date of abandoning: 20160907 |
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