CN204108084U - A kind of die unit excising semiconductor packages unit pin connection position framework - Google Patents
A kind of die unit excising semiconductor packages unit pin connection position framework Download PDFInfo
- Publication number
- CN204108084U CN204108084U CN201420609288.8U CN201420609288U CN204108084U CN 204108084 U CN204108084 U CN 204108084U CN 201420609288 U CN201420609288 U CN 201420609288U CN 204108084 U CN204108084 U CN 204108084U
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- die
- cut
- cutting edge
- punch
- projection
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Abstract
A kind of die unit excising semiconductor packages unit pin connection position framework, be made up of die-cut punch and die-cut die, its architectural feature is: die-cut punch is made up of die-cut punch cutting edge and punch die body, die-cut punch cutting edge portion shape is symmetrical indent crescent, die die body upper surface edge is symmetrically distributed in along punch die body upper surface length direction, there is a screwed hole at the punch die body back side, die-cut die is by die-cut cutting edge of die, cutting edge of die projection, waste material through hole and die-cut die die body composition, cutting edge of die projection is symmetrically distributed in die-cut die die body upper surface edge along die-cut die die body upper surface length direction, die-cut cutting edge of die is positioned at cutting edge of die projection upper surface, waste material through hole is positioned at through cutting edge of die projection and die-cut die die body under die-cut cutting edge of die, its cross section physical dimension is more bigger than die-cut cutting edge of die physical dimension, so that eliminating waste material.
Description
Technical field
The utility model relates to a kind of equipment of semiconductor packages, is specifically related to a kind of die unit excising semiconductor packages unit pin connection position framework.
Background technology
Current semiconductor packaging industry mainly adopts substrate package and framework to encapsulate two kinds of packaged types.When using framework encapsulation, when with epoxy moulding compound for packaging parcel chip, in order to prevent epoxy moulding compound for packaging from excessively overflowing, cover on pin, so be provided with the framework of vertical pins at pin position.The framework of the vertical pins that pin position is arranged can be cut in successive projects, makes pin become the state of each self-separation.Current excision pin position framework adopts mould convex usually, the method of cutting edge of die cutting is excised, prior art convexity, cutting edge of die profile is all rectangle, cutting pin position frame area is less, and partial encapsulation epoxy molding plastic can remain on pin, after packaging is accomplished, epoxy moulding compound for packaging residual on pin in test process is easily stuck in testing equipment, causes test bad.
Utility model content
The purpose of this utility model is: in order to expand the excision area of semiconductor packages unit pin position framework.Semiconductor packages unit is avoided to occur bad in follow-up test link.
For achieving the above object, the utility model adopts following technical scheme: a kind of die unit excising semiconductor packages unit pin connection position framework, be made up of die-cut punch and die-cut die, its architectural feature is: die-cut punch is made up of die-cut punch cutting edge and punch die body, die-cut punch cutting edge portion shape is symmetrical indent crescent, die die body upper surface edge is symmetrically distributed in along punch die body upper surface length direction, there is a screwed hole at the punch back side, die-cut die is by die-cut cutting edge of die, cutting edge of die projection, waste material through hole and die-cut die die body composition, cutting edge of die projection is symmetrically distributed in die-cut die die body upper surface edge along die-cut die die body upper surface length direction, die-cut cutting edge of die is positioned at cutting edge of die projection upper surface, waste material through hole is positioned at through cutting edge of die projection and die-cut die die body under die-cut cutting edge of die, its cross section physical dimension is more bigger than die-cut cutting edge of die physical dimension, so that eliminating waste material.
The beneficial effects of the utility model are: this die unit by the meniscate blade shape of symmetrical indent when middle part width ensure pin-pitch, by meniscate shape, by maximum outer die-cut semiconductor packages unit pin portions framework, to expand the excision area of semiconductor packages unit pin position framework, semiconductor packages unit is avoided to occur bad in follow-up test link.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is die-cut die top view of the present utility model
Fig. 3 is the cutting edge portion partial enlarged drawing of die-cut die top view
Fig. 4 is die-cut punch cutting edge portion partial enlarged drawing
In figure: 1, die-cut punch cutting edge, 2, punch die body, 3, screwed hole, 4, cutting edge of die projection, 5, waste material through hole, 6, die-cut cutting edge of die, 7, die-cut die die body.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the utility model is described further.
See Fig. 1, Fig. 2, Fig. 3, shown in Fig. 4, a kind of die unit excising semiconductor packages unit pin connection position framework, be made up of die-cut punch and die-cut die, die-cut punch is in directly over die-cut die, die-cut punch is made up of die-cut punch cutting edge 1 and punch die body 2, die-cut punch cutting edge 1 shape is symmetrical indent crescent, die die body upper surface edge is symmetrically distributed in along punch die body 2 upper surface length direction, the punch die body back side has a screwed hole 3 can be connected with forcing press, die-cut die is by die-cut cutting edge of die 6, cutting edge of die projection 4, waste material through hole 5 and die die body 7 form, cutting edge of die projection 4 is symmetrically distributed in die-cut die die body 7 upper surface edge along die-cut die die body 7 upper surface length direction, die-cut cutting edge of die 6 is positioned at cutting edge of die projection 4 upper surface, waste material through hole 5 is positioned at through cutting edge of die projection 4 and die-cut die die body 7 under die-cut cutting edge of die 6, its cross section physical dimension is more bigger than die-cut cutting edge of die 6 physical dimension, so that eliminating waste material.
Above-mentioned explanation illustrate and describes preferred embodiment of the present utility model, but as previously mentioned, be to be understood that the utility model is not limited to the form disclosed by this paper, should not regard the eliminating to other embodiments as, and can be used for other combinations various, amendment and environment, and can in utility model contemplated scope described herein, changed by the technology of above-mentioned instruction or association area or knowledge.And the change that those skilled in the art carry out and change do not depart from spirit and scope of the present utility model, then all should in the protection domain of the utility model claims.
Claims (3)
1. one kind is excised the die unit of semiconductor packages unit pin connection position framework, it is characterized in that this die unit is made up of die-cut punch and die-cut die, die-cut punch is in directly over die-cut die, and die-cut punch and die-cut cutting edge of die partial shape are symmetrical indent crescent.
2. a kind of die unit excising semiconductor packages unit pin connection position framework as claimed in claim 1, it is characterized in that described die-cut punch is made up of die-cut punch cutting edge (1) and punch die body (2), die-cut punch cutting edge (1) is symmetrically distributed in punch die body (2) upper surface edge along punch die body (2) upper surface length direction, and there is a screwed hole (3) at punch die body (2) back side.
3. a kind of die unit excising semiconductor packages unit pin connection position framework as claimed in claim 1, it is characterized in that described die-cut die is by die-cut cutting edge of die (6), cutting edge of die projection (4), waste material through hole (5) and die-cut die die body (7) composition, cutting edge of die projection (4) is symmetrically distributed in die-cut die die body (7) upper surface edge along die-cut die die body (7) upper surface length direction, (60 are positioned at cutting edge of die projection (4) upper surface to die-cut cutting edge of die, waste material through hole (5) is positioned at through cutting edge of die projection (4) and die-cut die die body (7) under die-cut cutting edge of die (6), its cross section physical dimension is more bigger than die-cut cutting edge of die (6) physical dimension, so that eliminating waste material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420609288.8U CN204108084U (en) | 2014-10-21 | 2014-10-21 | A kind of die unit excising semiconductor packages unit pin connection position framework |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420609288.8U CN204108084U (en) | 2014-10-21 | 2014-10-21 | A kind of die unit excising semiconductor packages unit pin connection position framework |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204108084U true CN204108084U (en) | 2015-01-21 |
Family
ID=52325443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420609288.8U Expired - Fee Related CN204108084U (en) | 2014-10-21 | 2014-10-21 | A kind of die unit excising semiconductor packages unit pin connection position framework |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204108084U (en) |
-
2014
- 2014-10-21 CN CN201420609288.8U patent/CN204108084U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150121 Termination date: 20151021 |
|
| EXPY | Termination of patent right or utility model |