CN204090302U - A kind of integrated ultra-thin PCB of height producing LED silk - Google Patents
A kind of integrated ultra-thin PCB of height producing LED silk Download PDFInfo
- Publication number
- CN204090302U CN204090302U CN201420426828.9U CN201420426828U CN204090302U CN 204090302 U CN204090302 U CN 204090302U CN 201420426828 U CN201420426828 U CN 201420426828U CN 204090302 U CN204090302 U CN 204090302U
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- Prior art keywords
- led silk
- pcb board
- board body
- utility
- model
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Abstract
The utility model discloses a kind of integrated ultra-thin PCB of height producing LED silk, comprise pcb board body, described pcb board body is of a size of 101.9 × 54.9mm, pcb board body is evenly equipped with via, the diameter of via is 0.3mm, be provided with LED silk between via, the spacing between each LED silk is 0.08mm.The beneficial effects of the utility model are: high integrated, and original template adds the finished product yield rate of 25%, and by originally overflowing, glue is bad have dropped 70% to high yield, and overall yield rises 10%.
Description
Technical field
The utility model relates to circuit board technology field, particularly relates to a kind of integrated ultra-thin PCB of height producing LED silk.
background technology
Increasingly competitive along with ultra-thin LED on the market, cost control and process rate become very important, and as the pcb board of one of composition raw material, the improvement for it directly affects above-mentioned 2 points.
Now redesign a kind of wiring board, and the line map of the pcb board redesigned, key is how by the maximized utilization of existing size, guarantee that product is not damaged in processing procedure, in being produced by product line, main bad problem carries out fool-proof design by design layout, thus stops the generation again and again of problem.
Be exactly solve the high and processing procedure of integrated level to overflow the generation of glue problem specifically.
utility model content
In order to overcome above-mentioned the deficiencies in the prior art, the utility model provides a kind of integrated ultra-thin PCB of height producing LED silk.
The technical scheme that the utility model adopts is: a kind of integrated ultra-thin PCB of height producing LED silk, comprise pcb board body, described pcb board body is of a size of 101.9*54.9mm, pcb board body is evenly equipped with via, the diameter of via is 0.3mm, be provided with LED silk between via, the spacing between each LED silk is 0.08mm.
As the preferred embodiment of this programme, described pcb board body is provided with altogether 2912 LED silks.
Compared with prior art, the beneficial effects of the utility model are: high integrated, and original template adds the finished product yield rate of 25%, and by originally overflowing, glue is bad have dropped 70% to high yield, and overall yield rises 10%.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical solution of the utility model, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is unitary construction schematic diagram of the present utility model;
Fig. 2 is partial enlarged drawing of the present utility model.
In figure: 1, pcb board body, 2, via.
Embodiment
In order to more clearly the technical solution of the utility model can be understood, below in conjunction with accompanying drawing, the utility model is further illustrated.
A kind of integrated ultra-thin PCB of height producing LED silk as Figure 1-Figure 2, comprise pcb board body 1, described pcb board body 1 is of a size of 101.9*54.9mm, pcb board body 1 is evenly equipped with via 2, the diameter of via 2 is 0.3mm, LED silk is provided with between via 2, spacing between each LED silk is 0.08mm, concrete, pcb board body 1 is provided with altogether 2912 LED silks, in the size of original pcb board 101.9*54.9mm, add finished product quantity, 2912pcs is added to from original 2400pcs, finished product quantity improves 25%, reduce via size, the aperture of original 0.35mm is contracted to 0.3mm, the excessive glue produced in effective suppression manufacturing process, interiors of products structure is optimized, the product spacing of original 0.1mm is narrowed down to 0.08mm, Ultrathin blade is adopted to cut, guarantee that product appearance size is unchanged.
The above, it is only preferred embodiment of the present utility model, not any pro forma restriction is done to the utility model, although the utility model discloses as above with preferred embodiment, but and be not used to limit the utility model, any those skilled in the art, do not departing within the scope of technical solutions of the utility model, make a little change when the technology contents of above-mentioned announcement can be utilized or be modified to the Equivalent embodiments of equivalent variations, in every case be the content not departing from technical solutions of the utility model, according to any simple modification that technical spirit of the present utility model is done above embodiment, equivalent variations and modification, all still belong in the scope of technical solutions of the utility model.
Claims (2)
1. produce the integrated ultra-thin PCB of height of LED silk for one kind, comprise pcb board body, it is characterized in that: described pcb board body is of a size of 101.9*54.9mm, pcb board body is evenly equipped with via, the diameter of via is 0.3mm, be provided with LED silk between via, the spacing between each LED silk is 0.08mm.
2. a kind of integrated ultra-thin PCB of height producing LED silk according to claim 1, is characterized in that: described pcb board body is provided with altogether 2912 LED silks.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420426828.9U CN204090302U (en) | 2014-07-31 | 2014-07-31 | A kind of integrated ultra-thin PCB of height producing LED silk |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420426828.9U CN204090302U (en) | 2014-07-31 | 2014-07-31 | A kind of integrated ultra-thin PCB of height producing LED silk |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204090302U true CN204090302U (en) | 2015-01-07 |
Family
ID=52182965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420426828.9U Expired - Fee Related CN204090302U (en) | 2014-07-31 | 2014-07-31 | A kind of integrated ultra-thin PCB of height producing LED silk |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204090302U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104810358A (en) * | 2015-04-07 | 2015-07-29 | 绍兴联同电子科技有限公司 | Ultrathin side-emitting efficient SMD (surface-mounted device) PCB (printed circuit board) type LED (light emitting diode) and manufacturing process thereof |
| CN104835811A (en) * | 2015-04-15 | 2015-08-12 | 绍兴联同电子科技有限公司 | Full-spectrum distance-sensing three-in-one light sensing module packaging assembly and preparation technology |
-
2014
- 2014-07-31 CN CN201420426828.9U patent/CN204090302U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104810358A (en) * | 2015-04-07 | 2015-07-29 | 绍兴联同电子科技有限公司 | Ultrathin side-emitting efficient SMD (surface-mounted device) PCB (printed circuit board) type LED (light emitting diode) and manufacturing process thereof |
| CN104835811A (en) * | 2015-04-15 | 2015-08-12 | 绍兴联同电子科技有限公司 | Full-spectrum distance-sensing three-in-one light sensing module packaging assembly and preparation technology |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150107 Termination date: 20180731 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |