CN204053828U - A kind of preform lapping device - Google Patents

A kind of preform lapping device Download PDF

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Publication number
CN204053828U
CN204053828U CN201420545129.6U CN201420545129U CN204053828U CN 204053828 U CN204053828 U CN 204053828U CN 201420545129 U CN201420545129 U CN 201420545129U CN 204053828 U CN204053828 U CN 204053828U
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CN
China
Prior art keywords
diamond particles
preform
lapping device
conical surface
matrix
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420545129.6U
Other languages
Chinese (zh)
Inventor
许荣平
祝芹华
曾宪振
段宏杰
樊文强
徐勤华
史知敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hengtong Optic Electric Co Ltd
Original Assignee
Jiangsu Hengtong Optic Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Hengtong Optic Electric Co Ltd filed Critical Jiangsu Hengtong Optic Electric Co Ltd
Priority to CN201420545129.6U priority Critical patent/CN204053828U/en
Application granted granted Critical
Publication of CN204053828U publication Critical patent/CN204053828U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

The utility model provides a kind of preform lapping device, it is by changing Carborundum wheel topographical structure, its surface is made to become dots structure from face structure, forming runner between points makes its chip in attrition process process remove in time, reduce abrasive dust resistance, thus processing feed speed can be improved, shorten process time, improve working (machining) efficiency.It comprises the matrix of the band conical surface, it is characterized in that: the diamond particles conical surface of described matrix being furnished with evagination, leaves gap, interconnect between adjacent gap between adjacent described diamond particles.

Description

A kind of preform lapping device
Technical field
The utility model relates to the technical field that preform manufactures, and is specially a kind of preform lapping device.
Background technology
Preform needs to do a conehead before wire drawing; conehead is shaping by utilizing special Carborundum wheel to grind at grinding lathe; traditional Carborundum wheel is cone structure; in attrition process process, chip is not easily removed in time; grinding resistance is comparatively large, and process velocity will cause resistance excessive soon and shut down, and can only select slower process velocity; process time is longer, inefficiency.
The abrasive disk of publication number 2715917Y " a kind of abrasive disk of quartz crystal " a kind of quartz crystal is made up of upper and lower mill, the face that upper and lower mill is relative is all provided with quartz sand runner, and described quartz sand runner is interlocked to rotate to arrange by a rule arced flow path and forms.The method can only be applicable to common plane machining and not be suitable for this three-dimension process of preform.
Summary of the invention
For the problems referred to above, the utility model provides a kind of preform lapping device, it is by changing Carborundum wheel topographical structure, its surface is made to become dots structure from face structure, forming runner between points makes its chip in attrition process process remove in time, reduces abrasive dust resistance, thus can improve processing feed speed, shorten process time, improve working (machining) efficiency.
A kind of preform lapping device, its technical scheme is such: it comprises the matrix of the band conical surface, it is characterized in that: the diamond particles conical surface of described matrix being furnished with evagination, leave gap between adjacent described diamond particles, interconnect between adjacent gap.
It is further characterized in that: described diamond particles evagination is identical in the height of the conical surface of described matrix, guarantees that the thickness of grinding is even;
Gap between adjacent diamond particles is 2mm ~ 3mm, guarantees that chip flows out along gap;
The underrun adhesive of described diamond particles is bonded in the conical surface of described matrix;
Described diamond particles is specially the diamond particles of cylindrical-shaped structure, and columned described adamantine rounded bottom surface is adhered to the conical surface of described matrix;
Described diamond particles is specially the diamond particles of class cylindrical-shaped structure, and the similar round bottom surface of the described diamond particles of class cylindrical-shaped structure is adhered to the conical surface of described matrix;
The diamond particles of tiny diamond dust by the described cylindrical-shaped structure of bronze bonding formation or the diamond particles of class cylindrical-shaped structure;
The cylindric shape structure of cylindric or class guarantees that the chip that grinding is formed falls along arc surface, can not produce packing phenomenon, guarantees carrying out smoothly of grinding further;
The closing in anchor ring of described matrix is furnished with silicon carbide layer, and all right rapid stock-removal pure-surface structure of this lapping device being, guarantees the versatility of device;
It is T-shaped mounting groove that the inside of described matrix is provided with cross section, and the shaft of the front end of main shaft is positioned at the sipes position of described mounting groove, and nut sleeve is loaded on described shaft; Guarantee that main shaft, matrix Quick fastening are installed.
After adopting structure of the present utility model, owing to the conical surface of matrix being furnished with the diamond particles of evagination, gap is left between adjacent described diamond particles, interconnect between adjacent gap, preform clamping is in turning attachment, rotate with speed that is clockwise or 60 ~ 150 turns per minute of counter clockwise direction, preform lapping device clamping rotates with speed that is clockwise or 1200 ~ 3000 turns per minute of counter clockwise direction on main shaft, and with the speed feeding grinding of 1 ~ 3mm per minute, final formation conehead, preform lapping device is by changing Carborundum wheel topographical structure, its surface is made to become dots structure from face structure, forming runner between points makes its chip in attrition process process remove in time, reduce abrasive dust resistance, thus processing feed speed can be improved, shorten process time, improve working (machining) efficiency.
Accompanying drawing explanation
Fig. 1 is front view structural representation of the present utility model;
Fig. 2 is the A-A sectional view structural representation of Fig. 1;
Fig. 3 is utility model works status architecture schematic diagram;
Reference name in figure corresponding to each sequence number is as follows:
Matrix 1, the conical surface 2, diamond particles 3, gap 4, closing in anchor ring 5, silicon carbide layer 6, mounting groove 7, main shaft 8, shaft 9, nut 10, preform 11, turning attachment 12.
Detailed description of the invention
A kind of preform lapping device, is shown in Fig. 1 ~ Fig. 3, the conical surface 2 of matrix 1 is furnished with the diamond particles 3 of evagination, leave gap 4 between adjacent diamond particles 3, interconnect between adjacent gap 4.Diamond particles 3 evagination is identical in the height of the conical surface 2 of matrix 1, guarantees that the thickness of grinding is even; Gap L between adjacent diamond particles 3 is 2mm ~ 3mm, guarantees that chip flows out along gap; The underrun adhesive of diamond particles 3 is bonded in the conical surface 2 of matrix 1; The closing in anchor ring 5 of matrix 1 is furnished with silicon carbide layer 6, makes all right rapid stock-removal pure-surface structure of this lapping device, guarantee the versatility of device;
It is T-shaped mounting groove 7 that the inside of matrix 1 is provided with cross section, and the shaft 9 of the front end of main shaft 8 is positioned at the sipes position of mounting groove 7, and nut 10 is set in shaft 9; It guarantees that main shaft 8, matrix 1 Quick fastening are installed.
Diamond particles 3 is specially cylindrical-shaped structure/or class cylindrical-shaped structure, and the rounded bottom surface/of diamond particles 3 or similar round bottom surface are adhered to the conical surface 2 of matrix 1; Tiny diamond dust is by the diamond particles/of the bonding formation cylindrical-shaped structure of bronze binding agent or the diamond particles 3 of class cylindrical-shaped structure; Cylindric/or the cylindric shape structure of class guarantee that the chip that grinding is formed falls along arc surface, can not packing phenomenon be produced, guarantee carrying out smoothly of grinding further.
Its course of work is shown in Fig. 3, preform 11 clamping is in turning attachment 12, rotate with speed that is clockwise or 60 ~ 150 turns per minute of counter clockwise direction, preform lapping device clamping rotates with speed that is clockwise or 1200 ~ 3000 turns per minute of counter clockwise direction on main shaft 8, and with the speed feeding grinding of 1 ~ 3mm per minute, finally form conehead.
These are only preferred embodiment of the present utility model, not in order to limit the utility model, all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection domain of the present utility model.

Claims (9)

1. a preform lapping device, it comprises the matrix of the band conical surface, it is characterized in that: the diamond particles conical surface of described matrix being furnished with evagination, leaves gap, interconnect between adjacent gap between adjacent described diamond particles.
2. a kind of preform lapping device as claimed in claim 1, is characterized in that: described diamond particles evagination is identical in the height of the conical surface of described matrix.
3. a kind of preform lapping device as claimed in claim 1, is characterized in that: the gap between adjacent diamond particles is 2mm ~ 3mm.
4. a kind of preform lapping device as claimed in claim 1, is characterized in that: the underrun adhesive of described diamond particles is bonded in the conical surface of described matrix.
5. a kind of preform lapping device as claimed in claim 1, is characterized in that: described diamond particles is specially the diamond particles of cylindrical-shaped structure, and columned described adamantine rounded bottom surface is adhered to the conical surface of described matrix.
6. a kind of preform lapping device as claimed in claim 1, it is characterized in that: described diamond particles is specially the diamond particles of class cylindrical-shaped structure, the similar round bottom surface of the described diamond particles of class cylindrical-shaped structure is adhered to the conical surface of described matrix.
7. a kind of preform lapping device as described in claim 5 or 6, is characterized in that: the diamond particles of tiny diamond dust by the described cylindrical-shaped structure of bronze bonding formation or the diamond particles of class cylindrical-shaped structure.
8. a kind of preform lapping device as claimed in claim 1, is characterized in that: the closing in anchor ring of described matrix is furnished with silicon carbide layer.
9. a kind of preform lapping device as claimed in claim 1, it is characterized in that: it is T-shaped mounting groove that the inside of described matrix is provided with cross section, the shaft of the front end of main shaft is positioned at the sipes position of described mounting groove, and nut sleeve is loaded on described shaft.
CN201420545129.6U 2014-09-22 2014-09-22 A kind of preform lapping device Expired - Fee Related CN204053828U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420545129.6U CN204053828U (en) 2014-09-22 2014-09-22 A kind of preform lapping device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420545129.6U CN204053828U (en) 2014-09-22 2014-09-22 A kind of preform lapping device

Publications (1)

Publication Number Publication Date
CN204053828U true CN204053828U (en) 2014-12-31

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CN201420545129.6U Expired - Fee Related CN204053828U (en) 2014-09-22 2014-09-22 A kind of preform lapping device

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104260002A (en) * 2014-09-22 2015-01-07 江苏亨通光电股份有限公司 Optical fiber preformed rod grinding device
CN107671752A (en) * 2017-11-01 2018-02-09 青岛百瑞福橡塑有限公司 A kind of polishing Carborundum wheel and device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104260002A (en) * 2014-09-22 2015-01-07 江苏亨通光电股份有限公司 Optical fiber preformed rod grinding device
CN107671752A (en) * 2017-11-01 2018-02-09 青岛百瑞福橡塑有限公司 A kind of polishing Carborundum wheel and device

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20141231

Termination date: 20180922

CF01 Termination of patent right due to non-payment of annual fee