CN204031083U - A kind of quartz-crystal resonator wafer coating clamp - Google Patents
A kind of quartz-crystal resonator wafer coating clamp Download PDFInfo
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- CN204031083U CN204031083U CN201420417535.4U CN201420417535U CN204031083U CN 204031083 U CN204031083 U CN 204031083U CN 201420417535 U CN201420417535 U CN 201420417535U CN 204031083 U CN204031083 U CN 204031083U
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Abstract
The utility model relates to coating clamp technical field, be specifically related to a kind of quartz-crystal resonator wafer coating clamp, comprise the pressing plate of fitting successively from top to bottom, electric pole plate, central plate, lower electrode plate and base skeleton, pressing plate offers some the first etched holes, the position of corresponding the first etched hole of electric pole plate offers the second etched hole, the position of corresponding the first etched hole of central plate offers the 3rd etched hole for placing wafer, the position of corresponding the first etched hole of lower electrode plate offers the 4th etched hole, the magnetic hole that base skeleton offers, magnetic is embedded with magnet in hole.Operating efficiency of the present utility model is 275% of existing coating clamp, and wafer surface film plating layer is evenly to 99%, and coating raw material service efficiency is high to 200%, and cost is low, and can improve the stability of wafer plated film quality.
Description
Technical field
The utility model relates to coating clamp technical field, is specifically related to a kind of quartz-crystal resonator wafer coating clamp.
Background technology
Quartz-crystal resonator is to utilize the piezoelectric effect of quartz crystal and the resonant element made, and due to quartz-crystal resonator, to have frequency stability high, occupies important status at electronic applications always.The high speed development of IT industry, has impelled the flourish of this crystal resonator especially.It occupies an important position in telecommunication, mobile telephone system, global positioning system, navigation, remote control, Aero-Space, high-speed computer, accurate tester and consumer consumer electronic product.
There is inefficiency in the coating clamp of existing quartz-crystal resonator wafer, wafer surface film plating layer is inhomogeneous, and coating raw material service efficiency is poor, high in cost of production problem.
Summary of the invention
In order to overcome the shortcoming and defect existing in prior art, the purpose of this utility model is to provide a kind of quartz-crystal resonator wafer coating clamp, and this coating clamp operating efficiency is high, and wafer surface film plating layer is even, and coating raw material service efficiency is high, and cost is low.
The purpose of this utility model is achieved through the following technical solutions: a kind of quartz-crystal resonator wafer coating clamp, comprise the pressing plate of fitting successively from top to bottom, electric pole plate, central plate, lower electrode plate and base skeleton, pressing plate offers some the first etched holes, the position of corresponding the first etched hole of electric pole plate offers the second etched hole, the position of corresponding the first etched hole of central plate offers the 3rd etched hole for placing wafer, the position of corresponding the first etched hole of lower electrode plate offers the 4th etched hole, the magnetic hole that base skeleton offers, magnetic is embedded with magnet in hole.
Wherein, described base skeleton is connected to form by skeleton top plate, skeleton la m and base plate of support from top to bottom successively, the position of corresponding described the first etched hole of skeleton top plate, skeleton la m and base plate of support offers respectively the 5th etched hole, the 6th etched hole and the 7th etched hole, and described magnetic hole is opened in base plate of support.
Wherein, described base skeleton is stainless steel base skeleton.
Wherein, described pressing plate is the strong magnetic pressure plate of stainless steel.
Wherein, described electric pole plate is the strong magnetic electric pole plate of stainless steel.
Wherein, described central plate is that stainless steel is without magnetic center plate.
Wherein, described lower electrode plate is the micro-magnetic lower electrode plate of stainless steel.
Wherein, the thickness of described central plate is less than the thickness of described wafer.
Wherein, the little 0.01mm of thickness of wafer described in the Thickness Ratio of described central plate.
Wherein, also comprise two alignment pins, described pressing plate, electric pole plate, central plate, lower electrode plate, skeleton top plate and skeleton la m all offer the fixing hole coordinating with alignment pin, two alignment pins are from top to bottom successively through pressing plate, electric pole plate, central plate, lower electrode plate, skeleton top plate and skeleton la m, and the bottom of alignment pin is connected with described magnet adsorption.
The beneficial effects of the utility model are: operating efficiency of the present utility model is 275% of existing coating clamp, and wafer surface film plating layer is evenly to 99%, and coating raw material service efficiency is high to 200%, and cost is low, and can improve the stability of wafer plated film quality.
Brief description of the drawings
Fig. 1 is partial sectional view of the present utility model.
Fig. 2 is the structural representation of pressing plate described in the utility model.
Fig. 3 is the structural representation of electric pole plate described in the utility model.
Fig. 4 is the structural representation of the second etched hole described in the utility model.
Fig. 5 is the structural representation of central plate described in the utility model.
Fig. 6 is the structural representation of the 3rd etched hole described in the utility model.
Fig. 7 is the structural representation of lower electrode plate described in the utility model.
Fig. 8 is the structural representation of the 4th etched hole described in the utility model.
Fig. 9 is the structural representation of skeleton top plate described in the utility model.
Figure 10 is the structural representation of skeleton la m described in the utility model.
Figure 11 is the structural representation of base plate of support described in the utility model.
Figure 12 is the structural representation after upper wafer surface plated film described in the utility model.
Figure 13 is the structural representation after wafer lower surface plated film described in the utility model.
Reference numeral is: 1-pressing plate, the 11-the first etched hole, 2-electric pole plate, the 21-the second etched hole, 3-central plate, the 31-the three etched hole, 4-lower electrode plate, the 41-the four etched hole, 5-skeleton top plate, the 51-the five etched hole, 6-skeleton la m, the 61-the six etched hole, 7-base plate of support, the 71-the seven etched hole, 72-magnetic hole, 73-magnet, 81-alignment pin, 82-fixing hole, 9-wafer.
Embodiment
For the ease of those skilled in the art's understanding, below in conjunction with embodiment and accompanying drawing 1-13, the utility model is further described, the content that execution mode is mentioned is not to restriction of the present utility model.
See Fig. 1-13, a kind of quartz-crystal resonator wafer coating clamp, comprise the pressing plate 1 of fitting successively from top to bottom, electric pole plate 2, central plate 3, lower electrode plate 4 and base skeleton, pressing plate 1 offers some the first etched holes 11, the position of corresponding the first etched hole 11 of electric pole plate 2 offers the second etched hole 21, the position of corresponding the first etched hole 11 of central plate 3 offers the 3rd etched hole 31 for placing wafer 9, the position of corresponding the first etched hole 11 of lower electrode plate 4 offers the 4th etched hole 41, the magnetic hole 72 that base skeleton offers, in magnetic hole 72, be embedded with magnet 73.Described magnet 73 is high temperature resistant SmCo magnetic patch.
Operating efficiency of the present utility model is 275% of existing coating clamp, and wafer 9 plated surface retes are evenly to 99%, and coating raw material service efficiency is high to 200%, and cost is low, and can improve the stability of wafer 9 plated film qualities.
In the present embodiment, described base skeleton is connected to form by skeleton top plate 5, skeleton la m 6 and base plate of support 7 from top to bottom successively, the position of skeleton top plate 5, skeleton la m 6 and base plate of support 7 corresponding described the first etched holes offers respectively the 5th etched hole 51, the 6th etched hole 61 and the 7th etched hole 71, and described magnetic hole 72 is opened in base plate of support 7.Skeleton top plate 5, skeleton la m 6 and base plate of support 7 adopt thermal diffusion to paste combination, evenness is less than or equal to ± and 0.02, the thickness of described pressing plate 1, electric pole plate 2, central plate 3, lower electrode plate 4, skeleton top plate 5, skeleton la m 6 and base plate of support 7 is followed successively by 0.3mm, 0.07mm, 0.05mm, 0.07mm, 0.5mm, 0.5mm and 0.3mm.
In the present embodiment, described base skeleton is stainless steel base skeleton.
In the present embodiment, described pressing plate 1 is the strong magnetic pressure plate of stainless steel.
In the present embodiment, described electric pole plate 2 is the strong magnetic electric pole plate of stainless steel.
In the present embodiment, described central plate 3 is that stainless steel is without magnetic center plate.
In the present embodiment, described lower electrode plate 4 is the micro-magnetic lower electrode plate of stainless steel.
In the present embodiment, the thickness of described central plate 3 is less than the thickness of described wafer 9.The thickness of central plate 3 is less than the thickness of wafer 9, and the 3rd etched hole 31 that wafer 9 is put into central plate slightly protrudes, and plated film efficiency is high.
In the present embodiment, the little 0.01mm of thickness of wafer 9 described in the Thickness Ratio of described central plate 3.
In the present embodiment, also comprise two alignment pins 81, described pressing plate 1, electric pole plate 2, central plate 3, lower electrode plate 4, skeleton top plate 5 and skeleton la m 6 all offer the fixing hole 82 coordinating with alignment pin 81, two alignment pins 81 are from top to bottom successively through pressing plate 1, electric pole plate 2, central plate 3, lower electrode plate 4, skeleton top plate 5 and skeleton la m 6, and the bottom of alignment pin 81 is connected with described magnet 73 absorption.
Above-described embodiment is preferably implementation of the utility model, and in addition, the utility model can also be realized by alternate manner, and any apparent replacement is all within protection range of the present utility model without departing from the concept of the premise utility.
Claims (10)
1. a quartz-crystal resonator wafer coating clamp, it is characterized in that: comprise from top to bottom pressing plate, electric pole plate, central plate, lower electrode plate and the base skeleton of laminating successively, pressing plate offers some the first etched holes, the position of corresponding the first etched hole of electric pole plate offers the second etched hole, the position of corresponding the first etched hole of central plate offers the 3rd etched hole for placing wafer, the position of corresponding the first etched hole of lower electrode plate offers the 4th etched hole, the magnetic hole that base skeleton offers, magnetic is embedded with magnet in hole.
2. a kind of quartz-crystal resonator wafer coating clamp according to claim 1, it is characterized in that: described base skeleton is connected to form by skeleton top plate, skeleton la m and base plate of support from top to bottom successively, the position of corresponding described the first etched hole of skeleton top plate, skeleton la m and base plate of support offers respectively the 5th etched hole, the 6th etched hole and the 7th etched hole, and described magnetic hole is opened in base plate of support.
3. a kind of quartz-crystal resonator wafer coating clamp according to claim 1, is characterized in that: described base skeleton is stainless steel base skeleton.
4. a kind of quartz-crystal resonator wafer coating clamp according to claim 1, is characterized in that: described pressing plate is the strong magnetic pressure plate of stainless steel.
5. a kind of quartz-crystal resonator wafer coating clamp according to claim 1, is characterized in that: described electric pole plate is the strong magnetic electric pole plate of stainless steel.
6. a kind of quartz-crystal resonator wafer coating clamp according to claim 1, is characterized in that: described central plate is that stainless steel is without magnetic center plate.
7. a kind of quartz-crystal resonator wafer coating clamp according to claim 1, is characterized in that: described lower electrode plate is the micro-magnetic lower electrode plate of stainless steel.
8. a kind of quartz-crystal resonator wafer coating clamp according to claim 1, is characterized in that: the thickness of described central plate is less than the thickness of described wafer.
9. a kind of quartz-crystal resonator wafer coating clamp according to claim 8, is characterized in that: the little 0.01mm of the thickness of wafer described in the Thickness Ratio of described central plate.
10. a kind of quartz-crystal resonator wafer coating clamp according to claim 2, it is characterized in that: also comprise two alignment pins, described pressing plate, electric pole plate, central plate, lower electrode plate, skeleton top plate and skeleton la m all offer the fixing hole coordinating with alignment pin, two alignment pins are from top to bottom successively through pressing plate, electric pole plate, central plate, lower electrode plate, skeleton top plate and skeleton la m, and the bottom of alignment pin is connected with described magnet adsorption.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420417535.4U CN204031083U (en) | 2014-07-28 | 2014-07-28 | A kind of quartz-crystal resonator wafer coating clamp |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420417535.4U CN204031083U (en) | 2014-07-28 | 2014-07-28 | A kind of quartz-crystal resonator wafer coating clamp |
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| CN204031083U true CN204031083U (en) | 2014-12-17 |
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| CN201420417535.4U Active CN204031083U (en) | 2014-07-28 | 2014-07-28 | A kind of quartz-crystal resonator wafer coating clamp |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109326551A (en) * | 2018-11-02 | 2019-02-12 | 江苏海德频率科技有限公司 | A kind of coating clamp and its carrier strip and production method |
| CN111130482A (en) * | 2019-09-30 | 2020-05-08 | 宁波大学 | Processing method of quartz crystal resonator electrode |
| CN111614336A (en) * | 2020-05-27 | 2020-09-01 | 东晶电子金华有限公司 | Magnetic member, coating jig, and method for manufacturing magnetic member |
| CN112547667A (en) * | 2020-12-28 | 2021-03-26 | 成都晶宝时频技术股份有限公司 | Wafer clamp and cleaning method thereof |
-
2014
- 2014-07-28 CN CN201420417535.4U patent/CN204031083U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109326551A (en) * | 2018-11-02 | 2019-02-12 | 江苏海德频率科技有限公司 | A kind of coating clamp and its carrier strip and production method |
| CN111130482A (en) * | 2019-09-30 | 2020-05-08 | 宁波大学 | Processing method of quartz crystal resonator electrode |
| CN111614336A (en) * | 2020-05-27 | 2020-09-01 | 东晶电子金华有限公司 | Magnetic member, coating jig, and method for manufacturing magnetic member |
| CN112547667A (en) * | 2020-12-28 | 2021-03-26 | 成都晶宝时频技术股份有限公司 | Wafer clamp and cleaning method thereof |
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| C14 | Grant of patent or utility model | ||
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| TR01 | Transfer of patent right |
Effective date of registration: 20220309 Address after: 404100 yutianpu high tech Industrial Park, Wansheng Economic Development Zone, Chongqing Patentee after: Huilun crystal (Chongqing) Technology Co.,Ltd. Address before: 523750 No. 36, jitigang section, East Ring Road, Huangjiang Town, Dongguan City, Guangdong Province Patentee before: GUANGDONG FAILONG CRYSTAL TECHNOLOGY Co.,Ltd. |