CN204019773U - Resin gripper shoe is used in semiconductor crystal cutting - Google Patents
Resin gripper shoe is used in semiconductor crystal cutting Download PDFInfo
- Publication number
- CN204019773U CN204019773U CN201420241527.9U CN201420241527U CN204019773U CN 204019773 U CN204019773 U CN 204019773U CN 201420241527 U CN201420241527 U CN 201420241527U CN 204019773 U CN204019773 U CN 204019773U
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- gripper shoe
- semiconductor crystal
- groove
- cutting
- resin
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Abstract
The utility model discloses a kind of semiconductor crystal cutting resin gripper shoe, a side surface of this gripper shoe is circular arc, offers some grooves in the arcuate surface of gripper shoe.Best described groove is strip groove, and extends to the two sides of described gripper shoe along its trench length direction.The utility model by processing groove on curved support plate, effectively reach the order of thinning glue layer thickness, indirectly achieve semiconductor crystal cut quality such as improving silicon chip, avoid cutting away the effect of sheet, for the cutting horizontal improving semiconductor wafer is very helpful.
Description
Technical field
The utility model patent relates to semiconductor crystal cutting technique field, is specifically related to a kind of semiconductor crystal cutting resin gripper shoe.
Background technology
Semiconductor crystal cutting adopts curved support plate to come bonding semiconductor crystal and cutting machine.In cutting process, gripper shoe plays the effect of support, fixing semiconductor crystal.Before cutting, gripper shoe is bonding by glue with the contact surface of semiconductor crystal, forms glue layer, as depicted in figs. 1 and 2; After cutting completes, with degumming agent, glue layer is decomposed, gripper shoe and semiconductor wafer are departed from.Therefore, the parameter such as hardness, temperature tolerance of the thickness of glue layer, hardness, adhesive strength and gripper shoe has cut quality and important impact.
In order to improve cut quality, the technical staff in industry is by repeatedly testing proof, and glue layer is thinning has obvious help to raising chipping qualities.For this reason, glue layer thickness general control is at about 0.2 ~ 0.3mm.If but further thinning glue layer, then can face at least two problems: one is, glue layer is thinning, adhesive strength reduces, and falls sheet, affect chipping qualities in cutting; Two are, glue layer exhaust is uneven, and bonding rear glue layer exists bubble, affects chipping qualities.
Utility model content
The utility model improves semiconductor crystal-cut resin gripper shoe, design a kind of semiconductor crystal cutting new type resin gripper shoe, eliminate the impact of glue layer bubble on adhesive strength, and effectively increase adhesive strength, make thinning glue layer thickness and then improve cut quality to become possibility.
For realizing the purpose of this utility model, the technical solution of the utility model is a kind of semiconductor crystal cutting resin gripper shoe, and a side surface of this gripper shoe is circular arc, offers some grooves in the arcuate surface of gripper shoe.
By the curved surfaces in gripper shoe, groove is set, glue can enter in groove by capillarity, the glue stayed in groove after solidifying is connected with the glue layer pressing close to cambered surface, thus adds the adhesive strength of glue layer, avoids the phenomenon cutting away sheet.On the other hand, bubble contained in glue layer can be risen in groove, overcome gas bubbles left when using conventional semiconductors cutting resin gripper shoe affects the shortcoming of adhesive strength in glue layer.
In order to make the bubble in groove overflow sooner, and then effectively discharge the gas in glue layer, improve the chipping qualities of semiconductor crystal, preferably, described groove is strip groove, and extends to the two sides of described gripper shoe along its trench length direction.
Take into account capillarity generation easiness and wash glue easiness, preferably, described groove width is 2 ~ 10mm, and the quantity of described groove is 3 ~ 10.
Remain to not produce powder in groove after ensureing to slot, avoid residual powder to affect adhesive strength, preferably, described trench wall has round and smooth structure.
For this reason, described groove can be the rectangle groove with arc structure, or is the vee-cut with arc structure.
Advantage of the present utility model and beneficial effect are: the utility model by processing groove on curved support plate, effectively reach the order of thinning glue layer thickness, indirectly achieve semiconductor crystal cut quality such as improving silicon chip, avoid cutting away the effect of sheet, for the cutting horizontal improving semiconductor wafer is very helpful.
Accompanying drawing explanation
Fig. 1 is the cross section structure schematic diagram of traditional semiconductor crystal cutting resin gripper shoe;
Fig. 2 is the using state schematic diagram of traditional semiconductor crystal cutting resin gripper shoe;
Fig. 3 is the cross section structure schematic diagram of the utility model semiconductor crystal cutting resin gripper shoe;
Fig. 4 is the using state schematic diagram of the utility model semiconductor crystal cutting resin gripper shoe;
Fig. 5 is the another kind of cross section structure schematic diagram of the utility model semiconductor crystal cutting resin gripper shoe;
Fig. 6 is another cross section structure schematic diagram of the utility model semiconductor crystal cutting resin gripper shoe.
In figure: 1, gripper shoe; 11, upper surface; 12, groove; 3, glue layer; 4, semiconductor crystal.
Detailed description of the invention
Below in conjunction with accompanying drawing, detailed description of the invention of the present utility model is further described.Following examples only for clearly the technical solution of the utility model being described, and can not limit protection domain of the present utility model with this.
The utility model is a kind of semiconductor crystal cutting resin gripper shoe, and as shown in Figure 3 and Figure 4, a side surface 11 of this gripper shoe 1 is circular arc, offers some grooves 12 at the circular arc upper surface 11 of gripper shoe 1.During for bonding semiconductor crystal 4, glue can enter in groove 12 by capillarity, the glue stayed in groove 12 after solidifying is connected with the glue pressing close to circular arc upper surface 11, thus adds the adhesive strength of glue layer 3, avoids the phenomenon cutting away sheet.In addition, bubble contained in glue layer 3 can rise in groove 12, and overcome gas bubbles left when using conventional semiconductors cutting resin gripper shoe affects the shortcoming of adhesive strength in glue layer 3.
In order to make the bubble in groove 12 overflow sooner, and then effectively discharge the gas in glue layer 3, improve the chipping qualities of semiconductor crystal 4, groove 12 is preferably strip groove, and extends to the two sides of gripper shoe 1 along its trench length direction.Take into account capillarity occur and wash glue easiness, strip groove width is preferably 2 ~ 10mm, and the quantity of strip groove is 3 ~ 10.Remain to not produce powder in groove after ensureing to slot, avoid residual powder to affect adhesive strength, trench wall preferably has round and smooth structure.For this reason, groove can be the rectangle groove with arc structure, as shown in Figure 5, or is the vee-cut with arc structure, as shown in Figure 6.
The above is only preferred embodiment of the present utility model; should be understood that; for those skilled in the art; under the prerequisite not departing from the utility model know-why; can also make some improvements and modifications, these improvements and modifications also should be considered as protection domain of the present utility model.
Claims (6)
1. a resin gripper shoe is used in semiconductor crystal cutting, it is characterized in that: a side surface of described gripper shoe is circular arc, offers some grooves in the arcuate surface of gripper shoe.
2. resin gripper shoe is used in semiconductor crystal cutting as claimed in claim 1, it is characterized in that: described groove is strip groove, and extends to the two sides of described gripper shoe along its trench length direction.
3. resin gripper shoe is used in semiconductor crystal cutting as claimed in claim 2, and it is characterized in that: described groove width is 2 ~ 10mm, the quantity of described groove is 3 ~ 10.
4. resin gripper shoe is used in semiconductor crystal cutting as claimed in claim 3, it is characterized in that: described trench wall has round and smooth structure.
5. resin gripper shoe is used in semiconductor crystal cutting as claimed in claim 4, it is characterized in that: described groove is the rectangle groove with arc structure.
6. resin gripper shoe is used in semiconductor crystal cutting as claimed in claim 4, it is characterized in that: described groove is the vee-cut with arc structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420241527.9U CN204019773U (en) | 2014-05-12 | 2014-05-12 | Resin gripper shoe is used in semiconductor crystal cutting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420241527.9U CN204019773U (en) | 2014-05-12 | 2014-05-12 | Resin gripper shoe is used in semiconductor crystal cutting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204019773U true CN204019773U (en) | 2014-12-17 |
Family
ID=52059680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420241527.9U Expired - Fee Related CN204019773U (en) | 2014-05-12 | 2014-05-12 | Resin gripper shoe is used in semiconductor crystal cutting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204019773U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108355359A (en) * | 2017-06-19 | 2018-08-03 | 全南利鑫工艺有限公司 | Fixed seat structure in music water polo in tumbler |
| CN108705691A (en) * | 2018-07-27 | 2018-10-26 | 江苏美科硅能源有限公司 | A kind of integrated guide rail pad item |
| CN109808271A (en) * | 2018-12-30 | 2019-05-28 | 苏州润德新材料有限公司 | A kind of silicon wafer cutting plastic support board and preparation method thereof |
-
2014
- 2014-05-12 CN CN201420241527.9U patent/CN204019773U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108355359A (en) * | 2017-06-19 | 2018-08-03 | 全南利鑫工艺有限公司 | Fixed seat structure in music water polo in tumbler |
| CN108705691A (en) * | 2018-07-27 | 2018-10-26 | 江苏美科硅能源有限公司 | A kind of integrated guide rail pad item |
| CN109808271A (en) * | 2018-12-30 | 2019-05-28 | 苏州润德新材料有限公司 | A kind of silicon wafer cutting plastic support board and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| DD01 | Delivery of document by public notice |
Addressee: SUZHOU RUNDE NEW MATERIAL Co.,Ltd. Document name: Notification to Go Through Formalities of Registration |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP02 | Change in the address of a patent holder |
Address after: 215600 Jiangsu province Zhangjiagang City Bauhinia Road Economic Development Zone No. 28 Suzhou Red New Material Co. Ltd. Patentee after: SUZHOU RUNDE NEW MATERIAL Co.,Ltd. Address before: Suzhou City, Jiangsu province 215600 Zhangjiagang Yang Tang Village Suzhou Runde New Material Co. Ltd. Patentee before: SUZHOU RUNDE NEW MATERIAL Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141217 |