CN204011375U - Binding ring device and consersion unit - Google Patents
Binding ring device and consersion unit Download PDFInfo
- Publication number
- CN204011375U CN204011375U CN201420423515.8U CN201420423515U CN204011375U CN 204011375 U CN204011375 U CN 204011375U CN 201420423515 U CN201420423515 U CN 201420423515U CN 204011375 U CN204011375 U CN 204011375U
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- wafer
- ring device
- binding ring
- flexible member
- pad
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model proposes a kind of binding ring device and consersion unit, for fixing wafer and block wafer and identify, comprise: ring body, be located at ring body inner side pad and shielding plate, be located at the flexible member on shielding plate and wafer apparent surface, the one side that pad contacts with crystal round fringes surface is arc surface.Change pad into arc surface with the one side that crystal round fringes surface contacts, reduced the contact area of pad and wafer, reduce the generation of bonding die phenomenon, in addition, also increased flexible member and contacted with wafer, flexible member has certain elasticity, if there is bonding die phenomenon, wafer can depart from from binding ring device by the elastic force of flexible member, has avoided wafer to be driven the possibility bumping with other parts, guarantees that wafer is not damaged.
Description
Technical field
The utility model relates to field of semiconductor manufacture, relates in particular to a kind of binding ring device and consersion unit.
Background technology
In semiconductor fabrication, need deposit multilayer film, for example dielectric film and metallic film.Generally, dielectric film adopts chemical vapour deposition (CVD) to form, and metallic film adopts physical vapour deposition (PVD) to form, and the film of deposition all can cover the whole surface of wafer.In order to distinguish wafer or to aim at wafer, crystal column surface can be provided with wafer sign (Wafer mark).Therefore in the depositing operation of some film, need to guarantee that wafer sign is not covered by film.
For example, wafer is being carried out in the deposition process of thin film aluminum, in order to guarantee that subsequent etching technique can be identified and be aimed at by wafer, needing to guarantee that wafer sign can not covered by thin film aluminum when deposit film aluminium.Concrete, when deposition, wafer is placed on the heater in reaction chamber conventionally, then by the fixing wafer of binding ring device, avoids it to be offset.
Please refer to Fig. 1 and Fig. 2, Fig. 1 is the vertical view of binding ring device, and Fig. 2 is the fixedly generalized section of wafer of binding ring device.Binding ring device comprises: ring body 10, several pads 30 that are arranged at ring body 10 inner sides and two shielding plates 20, wherein, two shielding plates 20 are located at respectively the two ends of ring body 10 diameters, for wafer sign, several pads 30 are arranged on ring body 10 uniformly, and pad 30 avoids it to be offset with the Surface Contact of wafer 40 to push down the edge of wafer 40.Wherein, the material of pad 30 and shielding plate 20 is aluminium, and pad 30 is cuboid, and the EDGE CONTACT of surface thereof and wafer 40, for fixing wafer 40.
Due to pad 30 and the wafer 40 Surface Contact faces surface that is cuboid, its contact area is larger, therefore when deposit film aluminium, along with the increase of frequency of depositing easily causes wafer 40 to occur bonding die phenomenon, be that thin film aluminum can be formed on the surface that pad 30 and wafer 40 contact, wafer 40 and pad 30 are adhered to each other.When wafer 40 sticks on pad 30, after deposition, when removing, binding ring device can drive wafer 40 to move, and easily make wafer 40 impinge upon on the miscellaneous part in reaction chamber, cause wafer 40 damages even to scrap.
At present, for fear of bonding die phenomenon, cause wafer 40 to scrap, just conventionally change binding ring device after the certain number of times of deposition is as 35 times.This has increased production cost undoubtedly, is unfavorable for carrying out volume production, simultaneously also labor intensive very.
Utility model content
The purpose of this utility model is to provide a kind of binding ring device and consersion unit, can reduce the generation of bonding die phenomenon, guarantees that wafer does not sustain damage.
To achieve these goals, the utility model proposes a kind of binding ring device, for fixing wafer and block wafer and identify, comprise: ring body, pad, shielding plate and flexible member, described pad and shielding plate are all located at the inner side of described ring body, described flexible member is located on the surface that described shielding plate is relative with described wafer, and the one side that described pad contacts with described crystal round fringes surface is arc surface.
Further, in described binding ring device, described shielding plate is provided with groove, and described flexible member is arranged in groove.
Further, in described binding ring device, the sidewall of described groove is provided with the fixedly screens parts of flexible member.
Further, in described binding ring device, described screens parts are 2.
Further, in described binding ring device, described flexible member comprises the bottom of cuboid and is located at the spring head of first spheroid of bottom.
Further, in described binding ring device, the length of described bottom is that scope is 4cm～6cm, and width range is 2cm～4cm, and the radius of described spring head is 1cm～3cm.
Further, in described binding ring device, described pad is 6, is evenly distributed on described ring body.
Further, in described binding ring device, described shielding plate is 2, is located at respectively the two ends of described ring body diameter, relative with described wafer home position.
Further, the invention allows for a kind of consersion unit, comprise reaction chamber and binding ring device as described above, described binding ring device is located in described reaction chamber.
Further, in described consersion unit, also comprise heater, described heater is located in described reaction chamber, and described binding ring device is fixed on described wafer by pad the surface of described heater.
Compared with prior art, the beneficial effects of the utility model are mainly reflected in: change pad into arc surface with the one side that crystal round fringes surface contacts, reduced the contact area of pad and wafer, reduce the generation of bonding die phenomenon, in addition, also contact with wafer having increased flexible member, flexible member has certain elasticity, if there is bonding die phenomenon, wafer can depart from from binding ring device by the elastic force of flexible member, avoided wafer to be driven the possibility bumping with other parts, guaranteed that wafer is not damaged.
Accompanying drawing explanation
Fig. 1 is the vertical view of binding ring device in prior art;
Fig. 2 be in prior art binding ring device along A-A ' in Fig. 1 to generalized section;
Fig. 3 is the vertical view of binding ring device in the utility model one embodiment;
Fig. 4 is the vertical view of shielding plate and flexible member in the utility model one embodiment;
Fig. 5 be in the utility model one embodiment shielding plate along C-C ' in Fig. 4 to cross-sectional view;
Fig. 6 is the cross-sectional view of the utility model one embodiment Elastic element;
Fig. 7 is the utility model one embodiment Intermediate gasket structural representation;
Fig. 8 be in the utility model one embodiment consersion unit along B-B ' in Fig. 3 to cross-sectional view.
Embodiment
Below in conjunction with schematic diagram, binding ring device of the present utility model and consersion unit are described in more detail, wherein represented preferred embodiment of the present utility model, should be appreciated that those skilled in the art can revise the utility model described here, and still realize advantageous effects of the present utility model.Therefore, following description is appreciated that extensively knowing for those skilled in the art, and not as to restriction of the present utility model.
For clear, whole features of practical embodiments are not described.They in the following description, are not described in detail known function and structure, because can make the utility model chaotic due to unnecessary details.Will be understood that in the exploitation of any practical embodiments, must make a large amount of implementation details to realize developer's specific objective, for example, according to the restriction of relevant system or relevant business, by an embodiment, change into another embodiment.In addition, will be understood that this development may be complicated and time-consuming, but be only routine work to those skilled in the art.
In the following passage, with reference to accompanying drawing, with way of example, the utility model is more specifically described.According to the following describes and claims, advantage of the present utility model and feature will be clearer.It should be noted that, accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the object of aid illustration the utility model embodiment lucidly.
Please refer to Fig. 3, in the present embodiment, a kind of binding ring device has been proposed, for fixing wafer and block wafer and identify, binding ring device comprises: ring body 100, a plurality of pad 300, shielding plate 200 and flexible member 210, described pad 300 and shielding plate 200 are all located at the inner side of described ring body 100, and described flexible member 210 is located on the surface that described shielding plate 200 is relative with described wafer, and the one side that described pad 300 contacts with described crystal round fringes surface is arc surface.
Concrete, please refer to Fig. 4 and Fig. 5, described shielding plate 200 is provided with groove 220, the sidewall of described groove 220 is provided with the fixedly screens parts 230 of flexible member 210, and wherein, screens parts 230 are 2, lay respectively on the two side of groove 220, be used for blocking flexible member 210, it is fixed in groove 220, can not come off.Groove 220 is convenient to be positioned at its inner flexible member 210 and is moved up and down.Flexible member 210 can be pushed in groove 220 along the direction of arrow in Fig. 4, and fixing by screens parts 230.
Please refer to Fig. 6, described flexible member 210 comprises the bottom 211 of cuboid and is located at the spring head 212 of the bottom episphere bodily form, the length range of described bottom 211 is 4cm～6cm, for example 5cm, width range is 2cm～4cm, be for example 3cm, the scope of the radius r of described spring head 212 is 1cm～3cm, for example, be 2cm.The face contacting with wafer due to spring head 212 is also circular arc, the contact forming is linear contact, and spring head 212 tops contact (wafer sign is all positioned at dead space) with crystal round fringes dead space, even if there is bonding die phenomenon to occur, also can wafer be flicked by elastic force.Preferably, the material of flexible member 210 can be pottery, adopts Ceramic Art Design to prevent the generation of particle (particle), also can prevent in addition deposit film aluminium on spring head 212.
Please refer to Fig. 7, the one side that pad 300 contacts with described crystal round fringes surface is arc surface, adopts the design of arc surface to make its and the surface of wafer be linearity and contacts, greatly reduce contact area, reduced the generation of bonding die phenomenon.
In the present embodiment, described pad 300 is 6, be evenly distributed on described ring body 100, thereby can be better fixing wafer, avoid wafer to be offset.Described shielding plate 200 is 2, is located at respectively the two ends of described ring body 100 diameters, relative with described wafer home position, blocks wafer sign, avoids wafer sign to be deposited film.
Please refer to Fig. 8, at the present embodiment on the other hand, also gone out a kind of consersion unit, comprise binding ring device and reaction chamber (scheming not shown) as described above, described binding ring device is located in described reaction chamber.
Concrete, described consersion unit also comprises heater 410, described heater 410 is located in described reaction chamber, described binding ring device is fixed on described wafer 400 by pad 300 surface of described heater 410, and, the EDGE CONTACT of the top of described flexible member 210 and described wafer 400.
After completing aluminium thin film deposition, if there is bonding die phenomenon, wafer 400 can be by the elastic force effect of flexible member 210, by under bullet gently, can make wafer 400 depart from from binding ring device wafer 400, has greatly reduced the scrappage of wafer 400.
To sum up, in the binding ring device and consersion unit providing at the utility model embodiment, change pad into arc surface with the one side that crystal round fringes surface contacts, reduced the contact area of pad and wafer, reduce the generation of bonding die phenomenon, in addition, also contact with wafer having increased flexible member, flexible member has certain elasticity, if there is bonding die phenomenon, wafer can depart from from binding ring device by the elastic force of flexible member, has avoided wafer to be driven the possibility bumping with other parts, guarantees that wafer is not damaged.
Above are only preferred embodiment of the present utility model, the utility model is not played to any restriction.Any person of ordinary skill in the field; within not departing from the scope of the technical solution of the utility model; the technical scheme that the utility model is disclosed and technology contents are made any type of changes such as replacement or modification that are equal to; all belong to the content that does not depart from the technical solution of the utility model, within still belonging to protection range of the present utility model.
Claims (10)
1. a binding ring device, for fixing wafer and block wafer and identify, it is characterized in that, comprise: ring body, pad, shielding plate and flexible member, described pad and shielding plate are all located at the inner side of described ring body, described flexible member is located on the surface that described shielding plate is relative with described wafer, and the one side that described pad contacts with described crystal round fringes surface is arc surface.
2. binding ring device as claimed in claim 1, is characterized in that, described shielding plate is provided with groove, and described flexible member is arranged in groove.
3. binding ring device as claimed in claim 2, is characterized in that, the sidewall of described groove is provided with the fixedly screens parts of flexible member.
4. binding ring device as claimed in claim 3, is characterized in that, described screens parts are 2.
5. binding ring device as claimed in claim 1, is characterized in that, described flexible member comprises the bottom of cuboid and is located at the spring head of first spheroid of bottom.
6. binding ring device as claimed in claim 5, is characterized in that, the length range of described bottom is 4cm～6cm, and width range is 2cm～4cm, and the radius of described spring head is 1cm～3cm.
7. binding ring device as claimed in claim 1, is characterized in that, described pad is 6, is evenly distributed on described ring body.
8. binding ring device as claimed in claim 1, is characterized in that, described shielding plate is 2, is located at respectively the two ends of described ring body diameter, relative with described wafer home position.
9. a consersion unit, is characterized in that, comprises reaction chamber and the binding ring device as described in any one in claim 1 to 8, and described binding ring device is located in described reaction chamber.
10. consersion unit as claimed in claim 9, is characterized in that, also comprises heater, and described heater is located in described reaction chamber, and described binding ring device is fixed on described wafer by pad the surface of described heater.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420423515.8U CN204011375U (en) | 2014-07-29 | 2014-07-29 | Binding ring device and consersion unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420423515.8U CN204011375U (en) | 2014-07-29 | 2014-07-29 | Binding ring device and consersion unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204011375U true CN204011375U (en) | 2014-12-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420423515.8U Expired - Fee Related CN204011375U (en) | 2014-07-29 | 2014-07-29 | Binding ring device and consersion unit |
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| Country | Link |
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| CN (1) | CN204011375U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107579033A (en) * | 2016-07-05 | 2018-01-12 | 北京北方华创微电子装备有限公司 | A kind of pressure ring, reaction chamber and semiconductor processing equipment |
| CN112382602A (en) * | 2020-10-26 | 2021-02-19 | 上海芯承电子科技有限公司 | Wafer anti-sticking device |
-
2014
- 2014-07-29 CN CN201420423515.8U patent/CN204011375U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107579033A (en) * | 2016-07-05 | 2018-01-12 | 北京北方华创微电子装备有限公司 | A kind of pressure ring, reaction chamber and semiconductor processing equipment |
| CN112382602A (en) * | 2020-10-26 | 2021-02-19 | 上海芯承电子科技有限公司 | Wafer anti-sticking device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141210 Termination date: 20190729 |