CN204005499U - LED street lamp and lamp body thereof - Google Patents

LED street lamp and lamp body thereof Download PDF

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Publication number
CN204005499U
CN204005499U CN201420290397.8U CN201420290397U CN204005499U CN 204005499 U CN204005499 U CN 204005499U CN 201420290397 U CN201420290397 U CN 201420290397U CN 204005499 U CN204005499 U CN 204005499U
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conductive layer
led
led chip
negative
positive
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CN201420290397.8U
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李漫铁
张芳伟
周双龙
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Ledman Optoelectronic Co Ltd
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Ledman Optoelectronic Co Ltd
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Abstract

A LED road lamp body, comprising: cooling stand, has installed surface; Heat conductive insulating glue-line, is located on installed surface; LED chip, is located on heat conductive insulating glue-line; Insulating barrier, is located on installed surface, and is positioned at heat conductive insulating glue-line periphery, and arranges with LED chip interval; Conductive layer group, comprises the positive conductive layer and the negative conductive layer for being connected with the negative electricity of LED chip that for the positive pole with LED chip, are electrically connected to, and positive conductive layer and negative conductive layer are located on insulating barrier, and positive conductive layer and negative conductive layer insulation setting.Above-mentioned LED road lamp body has good heat dispersion.The utility model also provides a kind of LED street lamp that adopts above-mentioned LED road lamp body.

Description

LED street lamp and lamp body thereof
Technical field
The utility model relates to technical field of lamps, particularly relates to a kind of LED street lamp and lamp body thereof.
Background technology
The principle of luminosity of LED light fixture and conventional lamp have difference in essence, LED light fixture is solid-state semiconductor electrode light-emitting, its operating temperature determines working life, and when semiconductor working junction temperature is spent higher than 65, working life significantly reduces, when junction temperature is spent higher than 85, working life is gathered decline, and when junction temperature is spent over 150, LED will lose efficacy, as can be seen here, the temperature of LED light fixture is its lifeblood place.
As shown in Figure 3, traditional LED road lamp body 300 generally include cooling stand 310, by thermal conductive insulation glue 320 stick in aluminium base 330 on cooling stand 310, be located at aluminium base 330 away from the PPA layer (Polyphthalamide, polyphthalamide) 340 of cooling stand 310 1 sides, be located at FR4 flame-resistant insulation layer (FR4 is a kind of code name of flame resistant material grade) 350 on PPA layer 340, by scolding tin 360, be fixed on the copper base 370 on FR4 flame-resistant insulation layer 350 and be located at copper base 370 away from the chip 380 of cooling stand 310 1 sides.
Because the composite bed that above-mentioned traditional LED road lamp body 300 comprises is more, complex structure, its heat dispersion is relatively poor.Research shows, during above-mentioned traditional LED road lamp body 300 normal work, copper base 370 can make the lamp body 20 of LED street lamp produce the temperature rise of 0.5 ℃ of left and right with scolding tin 360, FR4 flame-resistant insulation layer 350 can make it produce the temperature rise of 0.5 ℃ of left and right, PPA layer 340 can make it produce the temperature rise of 2 ℃ of left and right, aluminium base 330 can make its temperature rise that produces 0.5 ℃ of left and right, and thermal conductive insulation glue 320 can make its temperature rise that produces 2 ℃ of left and right, and cooling stand 310 can make it produce the temperature rise of 2 ℃ of left and right.Thereby make above-mentioned LED road lamp body 300 totally have the temperature rise of 7.5 ℃ of left and right, reduce for 50% life-span by the temperature rise of every 20 ℃ of LED, the temperature rise of 7.5 ℃ probably has the life-span reduction of 25% left and right.
Utility model content
Based on this, be necessary to provide a kind of LED street lamp and lamp body thereof of good heat dispersion performance.
A LED road lamp body, comprising:
Cooling stand, has installed surface;
Heat conductive insulating glue-line, is located on described installed surface;
LED chip, is located on described heat conductive insulating glue-line;
Insulating barrier, is located on described installed surface, and is positioned at described heat conductive insulating glue-line periphery, and arranges with described LED chip interval; And
Conductive layer group, comprise the positive conductive layer and the negative conductive layer for being connected with the negative electricity of described LED chip that for the positive pole with described LED chip, are electrically connected to, described positive conductive layer and described negative conductive layer are located at respectively on described insulating barrier, and described positive conductive layer and the setting of described negative conductive layer interval.
Therein in an embodiment, also comprise reflecting layer, described conductive layer group is located at away from a side of described insulating barrier in described reflecting layer, and the described positive conductive layer of part is exposed to outside described reflecting layer away from a side of described insulating barrier, the described negative conductive layer of part is exposed to outside described reflecting layer away from a side of described insulating barrier.
In an embodiment, described positive conductive layer is strip therein, and described negative conductive layer is strip, and described positive conductive layer and described negative conductive layer be arranged in parallel, and described LED chip is between described positive conductive layer and described negative conductive layer.
Therein in an embodiment, one end of described positive conductive layer lays respectively at one end of described negative conductive layer the both sides that described LED chip is relative, described positive conductive layer is exposed to outside described reflecting layer near one end of described LED chip, and described negative conductive layer is exposed to outside described reflecting layer near one end of described LED chip.
Therein in an embodiment, described insulating barrier comprises spaced the first stripes and the second stripes, the outer peripheral edges of described the first stripes overlap with the outer peripheral edges of described positive conductive layer, and the outer peripheral edges of described the second stripes overlap with the outer peripheral edges of described negative conductive layer.
In an embodiment, also comprise wire therein, the positive pole of described LED chip and negative pole are electrically connected to described positive conductive layer and described negative conductive layer by described wire respectively.
In an embodiment, described cooling stand is aluminum cooling stand or copper cooling stand therein;
Or described insulating barrier is PPA layer;
Or described wire is gold thread.
In an embodiment, the outer peripheral edges of described LED chip overlap with the outer peripheral edges of described heat conductive insulating glue-line therein;
Or described cooling stand is pectination away from one end of described installed surface.
A LED street lamp, comprises above-mentioned LED road lamp body.
Therein in an embodiment, also comprise lampshade, described lampshade is located on described installed surface, and coordinates formation airtight cavity with described installed surface, and described heat conductive insulating glue-line, described LED chip, described insulating barrier and described conductive layer group are contained in described airtight cavity.
Above-mentioned LED road lamp body is with respect to traditional LED road lamp body, its LED chip is directly fixed on cooling stand by heat conductive insulating glue-line, pass through in heat conductive insulating glue-line outer peripheral edges simultaneously, arrange and the spaced insulating barrier of LED chip, and conductive layer group is set on insulating barrier, thereby LED road lamp body can be electrically connected to external device.The heat producing due to LED chip can conduct on cooling stand by heat conductive insulating glue-line.Heat is in the process of conduction, and the number of plies of passing through is less, thereby makes above-mentioned LED street lamp have good heat dispersion.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED street lamp of an embodiment;
Fig. 2 is the schematic top plan view of the LED road lamp body in Fig. 1;
Fig. 3 is the structural representation of traditional LED road lamp body.
The specific embodiment
For the ease of understanding the utility model, below with reference to relevant drawings, the utility model is described more fully.In accompanying drawing, provided preferred embodiment of the present utility model.But the utility model can be realized with multiple different form, is not limited to embodiment described herein.On the contrary, providing the object of these embodiment is to make to the understanding of disclosure of the present utility model more thoroughly comprehensively.
It should be noted that, when unit is called as " being fixed on " another unit, can directly can there is unit placed in the middle in it on another unit or also.When a unit is considered to " connection " another unit, it can be directly connected to another unit or may have unit placed in the middle simultaneously.
Unless otherwise defined, all technology of using are herein identical with the implication that belongs to the common understanding of those skilled in the art of the present utility model with scientific terminology.The term using in description of the present utility model herein, just in order to describe the object of specific embodiment, is not intended to be restriction the utility model.Term as used herein " and/or " comprise one or more relevant Listed Items arbitrarily with all combinations.
As shown in Figures 1 and 2, the LED street lamp 10 of an embodiment, comprises LED road lamp body 100 and lampshade 200.
LED road lamp body 100 comprises cooling stand 110, heat conductive insulating glue-line 120, LED chip 130, insulating barrier 140, conductive layer group 150, reflecting layer 160 and wire 170.
Cooling stand 110 has installed surface 112.In the present embodiment, cooling stand 110 is aluminum cooling stand.Installed surface 112 is planar structure.Cooling stand 110 is pectination away from one end of installed surface 112, thereby can dispel the heat preferably.Be appreciated that in other embodiments, cooling stand 110 also can have metal or the plastic heat radiation support of better heat dispersion for copper cooling stand or other.
Heat conductive insulating glue-line 120 is located on installed surface 112.
LED chip 130 is located on heat conductive insulating glue-line 120.In the present embodiment, LED chip 130 is directly fixed on installed surface 112 by heat conductive insulating glue-line 120.Thereby the heat that LED chip 130 produces can conduct on cooling stand 110 by heat conductive insulating glue-line 120.
Further, in the present embodiment, the outer peripheral edges of heat conductive insulating glue-line 120 overlap with the outer peripheral edges of LED chip 130.Heat conductive insulating glue-line 120 makes self to have less surface area when guaranteeing to have maximum contact area with LED chip 130, thereby make above-mentioned installed surface 112 have relatively large space, removes to install miscellaneous part.Be appreciated that in other embodiments, the outer peripheral edges of heat conductive insulating glue-line 120 also can be positioned at outside the outer peripheral edges of LED chip 130.
Insulating barrier 140 is located on installed surface 112, and is positioned at heat conductive insulating glue-line 120 peripheries, and arranges with LED chip 130 intervals.In the present embodiment, insulating barrier 140 is PPA layer.Be appreciated that in other embodiments, also can serve as reasons other insulating materials of insulating barrier 140 prepares.
Conductive layer group 150 comprises positive conductive layer 152 and negative conductive layer 154.Positive conductive layer 152 is for being electrically connected to the positive pole of LED chip 130, and negative conductive layer 154 is for being connected with the negative electricity of LED chip 130.Positive conductive layer 152 is located on insulating barrier 140 with negative conductive layer 154, and positive conductive layer 152 arranges (interval setting) with negative conductive layer 154 insulation.
Conductive layer group 150 is located at away from a side of insulating barrier 140 in reflecting layer 160, and the positive conductive layer 152 of part is exposed to outside reflecting layer 160 away from a side of insulating barrier 140, and the negative conductive layer 154 of part is exposed to outside reflecting layer 160 away from a side of insulating barrier 140.The light that reflecting layer 160 can produce LED chip 130 reflects away, thus the luminous energy loss that improves LED chip 130.Positive conductive layer 152 is respectively used to be connected with negative electricity with the positive pole of LED chip 130 with the part that negative conductive layer 154 is exposed to outside reflecting layer 160.In the present embodiment, reflecting layer 160 is silver layer.Be appreciated that in other embodiments, reflecting layer 160 also can be prepared by other the material of high reflectance.
Further, in the present embodiment, positive conductive layer 152 is strip, and negative conductive layer 154 is also strip, and positive conductive layer 152 be arranged in parallel with negative conductive layer 154, and LED chip 130 is between positive conductive layer 152 and negative conductive layer 154.Make LED chip 130 Jun You reflecting layer, both sides 160, thereby make reflecting layer 160 reach maximum utilization rate.
Further, in the present embodiment, positive one end of conductive layer 152 and one end of negative conductive layer 154 lay respectively at the both sides that LED chip 130 is relative, positive conductive layer 152 is exposed to outside reflecting layer 160 near one end of LED chip 130, and negative conductive layer 154 is exposed to outside reflecting layer 160 near one end of LED chip 130.Thereby when guaranteeing that reflecting layer 160 has larger utilization rate, the use that can also effectively save wire 170.
Further, in the present embodiment, positive conductive layer 152 is design head to head with negative conductive layer 154, by the positive conductive layer 152 of translation, and can be so that the head of positive conductive layer 152 overlaps with the head of negative conductive layer 154.Be appreciated that in other embodiments, positive conductive layer 152 can be also the setting advancing side by side with negative conductive layer 154, by the positive conductive layer 152 of translation, and can be so that positive conductive layer 152 overlaps completely or partially overlaps with negative conductive layer 154.
Further, in the present embodiment, insulating barrier 140 comprises spaced the first stripes (figure is mark not) and the second stripes (figure is mark not).The outer peripheral edges of the first stripes overlap with the outer peripheral edges of positive conductive layer 152, and the outer peripheral edges of the second stripes overlap with the outer peripheral edges of negative conductive layer 154, thereby make the utilization rate of insulating barrier 140 maximum.Be appreciated that in other embodiments, the outer peripheral edges of the first stripes can be positioned at outside the outer peripheral edges of positive conductive layer 152.In other embodiments, the structure that insulating barrier 140 can be formed in one, can meet positive conductive layer 152 and negative conductive layer 154 are set thereon.
The positive pole of LED chip 130 and negative pole are electrically connected to positive conductive layer 152 and negative conductive layer 154 by wire 170 respectively.In the present embodiment, wire 170 is gold thread.Be appreciated that wire 170 can realize conduction.
In the present embodiment, LED road lamp body 100 is applied to LED street lamp 10 (high-power LED lamp has high requirement to cooling stand 110).Be appreciated that LED road lamp body 100 also can be applied in other light fixtures such as Tunnel Lamp.
Lampshade 200 is located on installed surface 112, and coordinates formation airtight cavity 210 with installed surface 112.Heat conductive insulating glue-line 120, LED chip 130, insulating barrier 140, conductive layer group 150, reflecting layer 160 and wire 170 are contained in airtight cavity 210.
Above-mentioned LED road lamp body 100 is with respect to traditional LED road lamp body, its LED chip 130 is directly fixed on cooling stand 110 by heat conductive insulating glue-line 120, pass through in heat conductive insulating glue-line 120 outer peripheral edges simultaneously, arrange and the spaced insulating barrier 140 of LED chip 130, and conductive layer group 150 is set on insulating barrier 140, thereby LED road lamp body 100 can be electrically connected to external device.The heat producing due to LED chip 130 can conduct on cooling stand 110 by heat conductive insulating glue-line 120.Heat is in the process of conduction, and the number of plies of passing through is less, thereby above-mentioned LED road lamp body 100 has good heat dispersion.Therefore, adopt the LED street lamp 10 of above-mentioned LED road lamp body 100 to there is good heat dispersion.
The above embodiment has only expressed several embodiment of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.

Claims (10)

1. a LED road lamp body, is characterized in that, comprising:
Cooling stand, has installed surface;
Heat conductive insulating glue-line, is located on described installed surface;
LED chip, is located on described heat conductive insulating glue-line;
Insulating barrier, is located on described installed surface, and is positioned at described heat conductive insulating glue-line periphery, and arranges with described LED chip interval; And
Conductive layer group, comprise the positive conductive layer and the negative conductive layer for being connected with the negative electricity of described LED chip that for the positive pole with described LED chip, are electrically connected to, described positive conductive layer and described negative conductive layer are located at respectively on described insulating barrier, and described positive conductive layer and the setting of described negative conductive layer interval.
2. LED road lamp body according to claim 1, it is characterized in that, also comprise reflecting layer, described conductive layer group is located at away from a side of described insulating barrier in described reflecting layer, and the described positive conductive layer of part is exposed to outside described reflecting layer away from a side of described insulating barrier, the described negative conductive layer of part is exposed to outside described reflecting layer away from a side of described insulating barrier.
3. LED road lamp body according to claim 2, it is characterized in that, described positive conductive layer is strip, and described negative conductive layer is strip, described positive conductive layer and described negative conductive layer be arranged in parallel, and described LED chip is between described positive conductive layer and described negative conductive layer.
4. LED road lamp body according to claim 3, it is characterized in that, one end of described positive conductive layer lays respectively at one end of described negative conductive layer the both sides that described LED chip is relative, described positive conductive layer is exposed to outside described reflecting layer near one end of described LED chip, and described negative conductive layer is exposed to outside described reflecting layer near one end of described LED chip.
5. LED road lamp body according to claim 3, it is characterized in that, described insulating barrier comprises spaced the first stripes and the second stripes, the outer peripheral edges of described the first stripes overlap with the outer peripheral edges of described positive conductive layer, and the outer peripheral edges of described the second stripes overlap with the outer peripheral edges of described negative conductive layer.
6. LED road lamp body according to claim 2, is characterized in that, also comprises wire, and the positive pole of described LED chip and negative pole are electrically connected to described positive conductive layer and described negative conductive layer by described wire respectively.
7. LED road lamp body according to claim 6, is characterized in that, described cooling stand is aluminum cooling stand or copper cooling stand;
Or described insulating barrier is PPA layer;
Or described wire is gold thread.
8. LED road lamp body according to claim 1, is characterized in that, the outer peripheral edges of described LED chip overlap with the outer peripheral edges of described heat conductive insulating glue-line;
Or described cooling stand is pectination away from one end of described installed surface.
9. a LED street lamp, is characterized in that, comprises the LED road lamp body as described in any one in claim 1-8.
10. LED street lamp according to claim 9, it is characterized in that, also comprise lampshade, described lampshade is located on described installed surface, and coordinating formation airtight cavity with described installed surface, described heat conductive insulating glue-line, described LED chip, described insulating barrier and described conductive layer group are contained in described airtight cavity.
CN201420290397.8U 2014-05-30 2014-05-30 LED street lamp and lamp body thereof Active CN204005499U (en)

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Application Number Priority Date Filing Date Title
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10248372B2 (en) 2013-12-31 2019-04-02 Ultravision Technologies, Llc Modular display panels
US10373535B2 (en) 2013-12-31 2019-08-06 Ultravision Technologies, Llc Modular display panel
US10706770B2 (en) 2014-07-16 2020-07-07 Ultravision Technologies, Llc Display system having module display panel with circuitry for bidirectional communication

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10248372B2 (en) 2013-12-31 2019-04-02 Ultravision Technologies, Llc Modular display panels
US10373535B2 (en) 2013-12-31 2019-08-06 Ultravision Technologies, Llc Modular display panel
US10380925B2 (en) 2013-12-31 2019-08-13 Ultravision Technologies, Llc Modular display panel
US10410552B2 (en) 2013-12-31 2019-09-10 Ultravision Technologies, Llc Modular display panel
US10540917B2 (en) 2013-12-31 2020-01-21 Ultravision Technologies, Llc Modular display panel
US10871932B2 (en) 2013-12-31 2020-12-22 Ultravision Technologies, Llc Modular display panels
US10706770B2 (en) 2014-07-16 2020-07-07 Ultravision Technologies, Llc Display system having module display panel with circuitry for bidirectional communication

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