CN203992852U - The line clamping device that a kind of bonding wire is used - Google Patents
The line clamping device that a kind of bonding wire is used Download PDFInfo
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- CN203992852U CN203992852U CN201420304259.0U CN201420304259U CN203992852U CN 203992852 U CN203992852 U CN 203992852U CN 201420304259 U CN201420304259 U CN 201420304259U CN 203992852 U CN203992852 U CN 203992852U
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- line
- clamping device
- bonding wire
- force application
- application apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
The utility model discloses the line clamping device that a kind of bonding wire is used, comprising: main body, main body comprises left body and right body; Be connected to the wire guide on left body, for the conveying of line; Two line contact plates for clamp, can live wire clamp, and one of them line contact plate is arranged on left body, and another is arranged on right body; Force application apparatus, is connected with the line contact plate on right body, and wherein force application apparatus applies chucking power to line and clamps line in bonding wire process, until line tail just unclamps while cutting off.Force application apparatus of the present utility model can apply chucking power or suction on line in the process of bonding wire, while there is broken string in bonding wire process, two line contact plates can stably be clamped line, or suction channel holds line, do not allow the line of having no progeny move, in case principal vertical line skids off from porcelain mouth.The utility model can effectively improve production efficiency, bonding wire quality and the bonding wire stability of bonding wire.
Description
Technical field
The utility model relates to a kind of wire-soldering device, especially about a kind of in bonding wire process the line clamping device for clamp.
Background technology
Semiconductor fab comprises a series of encapsulated phase, includes, but is not limited to the preparation of chip, the stickup of chip, bonding wire, encapsulation etc.In the bonding wire stage, with line, the pin in the pad of semiconductor chip and leadframe is coupled together and need to use a wire-soldering device.The existing a lot of traditional systems of this respect.
United States Patent (USP) 8191759 discloses a kind of wire-soldering device and method.In this technology, motion together with first clamp and porcelain mouth link, the second clamp is placed on online bearing of trend, and the first clamp is same straight line, and line is through porcelain mouth.
Another previous technology is a kind of wire-soldering device of describing in United States Patent (USP) 7025243.Its soldering tip comprises a tension disk, and the corresponding soldering tip of this tension disk moves together, and line is transported in bonding wire device; The transmission device of a tension disk, drives tension disk to follow soldering tip and does corresponding motion.
Be a kind of wire-soldering device of the prior art as shown in Figure 1, its method of operating is representative.In this wire-soldering device, for the line 120 welding, pass porcelain mouth 104, have suitable line 102 is clamped of clamp 106.Step (a-b) has represented line 102 to link the process on welding target 108.In this process, for the line 102 welding, pass porcelain mouth 104.The end of line 102 has a bead being burnt till by igniter (not shown) 110.In step (a), clamp 106 moves downward on welding target 108 in opened condition together with porcelain mouth 104.As shown in step (b), welding forms the first solder joint 112.
Then in step (c-f), porcelain mouth 104 rises gently, moves together with the clamp 106 of opening to pin.Line 102 is being followed the circuit of regulation and is being walked, and is connected to the second solder joint 114 as shown in step (d-e).After having welded, as shown in step (f), porcelain mouth 104 moves upward in Z-direction, and now line continues to send from the tip of porcelain mouth 104.When porcelain mouth 104 rises to the height of regulation, clamp 106 cuts out, and line 102 is cut off, as shown in step (g).Porcelain mouth 104 and clamp 106 continue to move upward, and make the line tail of one section of regular length stretch out porcelain mouth 104 tips.Then porcelain mouth 104 moves on to the position of electric spark, and line tail is burnt till to ball.And line is welded to next solder joint.Repeat the process of this whole welding, sequentially pad and pin are coupled together.
The shortcoming of this technology is not notice when clamp 106 is under the state of opening above, because line can skid off porcelain mouth 104(step a-f after disconnection suddenly).This may cause line tail too short or there is no line tail, affects bonding wire quality and efficiency.Therefore, in the urgent need to studying a kind of line clamping device, can control line and anti-principal vertical line at the sharp-tongued end of porcelain, disconnect, to guarantee that line is always in porcelain mouth, and can form effective line tail.
Utility model content
The utility model is intended to overcome, or at least improves the deficiencies in the prior art and shortcoming.
An object of the present utility model is to provide a kind of line clamping device, while there is broken string in bonding wire process, can stably clamp line.
Another object of the utility model is that while there is broken string in bonding wire process, this line clamping device can skid off by anti-principal vertical line from porcelain mouth.
Other objects of the present utility model and advantage can display in ensuing explanation, in conjunction with drawing, illustrate and give an example, and show each scheme of this utility model.
The utility model solves the technical scheme that its technical problem adopts:
The line clamping device that bonding wire is used, comprising:
Main body, comprises left body and right body;
Be connected to the wire guide on left body, for the conveying of line;
Two line contact plates for clamp, can live wire clamp, and one of them line contact plate is arranged on left body, and another is arranged on right body;
Force application apparatus, is connected with the line contact plate on right body, and wherein force application apparatus applies chucking power to line and clamps line in bonding wire process, until line tail just unclamps while cutting off.
In one of them scheme of the present utility model, force application apparatus comprises:
Be connected to the Compress Spring of the line contact plate on right body;
Be connected to the vacuum inlet of Compress Spring;
The vacuum generator that is connecting vacuum inlet, when vacuum generator cuts out, floating cylinder, by the line contact plate on right body, applies chucking power to line, and when vacuum generator is opened generation vacuum draw, floating cylinder is inhaled the line contact plate on right body to come.
In another scheme of the present utility model, force application apparatus comprises piezoelectric patches, and when this piezoelectric patches is activated, line contact plate can apply chucking power to line.
In another scheme of the present utility model, force application apparatus comprises piezoelectric board, with the rotation of Control of Voltage piezoelectric board, thereby line is applied and discharges chucking power.
In another scheme of the present utility model, force application apparatus comprises:
Permanent magnet;
Be connected to the coil on permanent magnet;
Coil brace, coil is fixed on coil brace, and coil passes into electric current, under the magnetic fields of permanent magnet, coil brace is axially moved, and then clamps line.
In another scheme of the present utility model, force application apparatus comprises solenoid and be connected to the ferromagnetic piston on this solenoid, and ferromagnetic piston can apply and discharge the chucking power to line.
In another scheme of the present utility model, a kind of line clamping device for bonding wire, comprising:
Main body, comprises left body and right body;
Through hole between left body and right body, in bonding wire process for logical line;
Be connected to the force application apparatus on right body, in whole bonding wire process, force application apparatus can apply confining force, and the line through through hole is held, and only has when line tail is cut off and just decontrols.
In another scheme of the present utility model, force application apparatus comprises:
A plurality of suction channels, these suction channels are connected with through hole;
Vacuum inlet, is connected with suction channel, and while forming vacuum by vacuum inlet, suction channel produces vacuum draw, and force application apparatus just holds line.
The beneficial effects of the utility model are: force application apparatus of the present utility model can apply chucking power or suction on line in the process of bonding wire, little to the pulling force of line during than bonding wire to the chucking power of line or suction, make the line can be by smooth the transferring out of wire guide, while there is broken string in bonding wire process, two line contact plates can stably be clamped line, or suction channel holds line, do not allow the line of having no progeny move, in case principal vertical line skids off from porcelain mouth.The utility model can effectively improve production efficiency, bonding wire quality and the bonding wire stability of bonding wire.
Accompanying drawing explanation
In conjunction with additional drawing, can better understand above summary and the detailed description to each scheme below.In order to illustrate the utility model, exemplary model of the present utility model is displayed in drawing.This disclosed utility model content is not limited to some special Method and kit fors as mentioned herein, can also comprise the quantity of part used.
Fig. 1 represents the wire clamp operating process of traditional wire soldering method and related art;
Fig. 2 (a-g) has shown and has used method and the step of line clamping device of the present utility model in bonding wire process;
Fig. 3 (a-b) has shown the front view about line clamping device of the present utility model;
Fig. 4 (a-b) has shown the front view of the line clamping device in second scheme of the utility model;
Fig. 5 (a-b) has shown the front view of the line clamping device in the 3rd scheme of the utility model;
Fig. 6 (a-b) has shown the front view of the line clamping device in the 4th scheme of the utility model;
Fig. 7 (a-b) has shown the front view of the line clamping device in the 5th scheme of the utility model;
Fig. 8 (a-b) has shown the front view of the line clamping device in the 6th scheme of the utility model.
The specific embodiment
Next with reference to be described with reference to the accompanying drawings each scheme of the present utility model.
The utility model be a kind of in bonding wire process the line clamping device for clamp, the possibility that while having eliminated broken string, line skids off from porcelain mouth.This line clamping device is clamped line with a kind of form of gripping mechanism, and line can slip over easily.This device clips line in bonding wire process, remains closed, until line tail is cut off just, opens, and now just allows bracing wire.Next each scheme of this device is described in conjunction with drawing.
Shown in Fig. 2 (a-b), be a scheme of the present utility model, in bonding wire process, use line clamping device 202.Line 102 is through line clamping device 202, clamp 106 and porcelain mouth 104.In this programme, line clamping device 202 is positioned at the top of clamp 106.In addition, line clamping device 202 also can be placed on the below of clamp 106.Clamp 106 is tension disks that masses know.In the technical program, the position of line clamping device 202 is fixed.Line clamping device 202 is positioned at the fixed position of clamp 106 tops can't limit porcelain mouth 104 motion in vertical direction.Therefore, can not affect the height of line 102 being moved to regulation.Understand for simplicity, the controller moving for control line 102, porcelain mouth 104 and clamp 106 does not show in the drawings.
In the starting stage of bonding wire process, line 102 is through line clamping device 202, clamp 106 and porcelain mouth 104, at the tip of porcelain mouth 104, stretches out a bit of.Line clamping device 202 closures, and clamp 106 is opened.With a heater, such as electric discharge device or electro-discharge device, the tail end of line 102 is burnt till to bead 110.As shown in Fig. 2 (b), porcelain mouth 104 moves downward the position that approaches welding target 108, and line 102 welding form the first solder joint 112.When porcelain mouth 104 continues to move down, clamp 106 in opened condition, simultaneously downward with porcelain mouth 104, and line clamping device 202 is closure state transfixion.
After the first solder joint 112 completes, porcelain mouth 104 rises along z axle, and as shown in Figure 2 (c), clamp 106 is still opened, and line clamping device 202 is still closed.Line 102 has been hauled away one section of curve providing, as shown in Fig. 2 (b).Then porcelain mouth 104 is connected to the second solder joint, as shown in Fig. 2 (e).Subsequently, porcelain mouth 104 and clamp 106 move upward, as shown in Fig. 2 (f).
After the second solder joint completes, line 102 is drawn out the length of regulation from porcelain mouth 104, clamp 106 closures then, and line clamping device 202 is opened, as shown in Fig. 2 (g).Under this state, line 102 is cut off.In this stage, line clamping device 202 stays open state, and clamp 106 is kept closed, and makes clamp 106, porcelain mouth 104 and nipped line 102 rise to the height 116 of regulation, completes burning ball.Then clamp 106 is opened, and line clamping device 202 closures come back to the state of step (a).
This shows, line clamping device 202 remains closed (being clamp position) in step (a-f), only in step (g), just opens.The pulling force when chucking power of line clamping device 202 is not more than bracing wire 102, what make that line 102 can be smooth transfers out from porcelain mouth 104, and when line 102 breaks suddenly, line clamping device 202 also can be clamped line.
Each scheme of line clamping device 202 of the present utility model has been explained in Fig. 3-8.Representative scheme is, this line clamping device 202 comprises the line contact plate of left body and right body, two clamps, and a line contact plate is on left body, and a line contact plate, on right body, also has a force application apparatus to be connected with the line contact plate of right body.In welding process, force application apparatus applies a chucking power to line, when meet accident broken string time, can stop line to slip out from porcelain mouth.This state of line clamping device 202 is exactly said closure state.When bonding wire finishes, force application apparatus removes chucking power.This state is open mode.Several technical schemes of following this force application apparatus are described below.
Fig. 3 (a-b) is the front view of line clamping device 202 in the utility model.In line clamping device 202, have a force application apparatus, this force application apparatus comprises a spring 312, and spring 312 is arranged in its vacuum system.The main body of line clamping device 202 is comprised of two parts, is respectively left body 302 and right body 304, and the material of left body 302 and right body 304 can be aluminium.Line contact plate 306 on left body 302 and right body 304 can be suitable line 102 is clamped.In addition, wire guide 308 is arranged in left main body 302, is guiding line 102 through line clamping device 202.As shown in the figure, wire guide 308 is positioned at the top of left body 302.
Line 102 is sent between left body 302 and right body 304, through wire guide 308, between two line contact plates 306.Line contact plate 306 can be that metal material can be also soft material.Can be for example (but being not limited to) sapphire plate or ruby plate, can be also (but being not limited to) felt plate.The line contact plate 306 on the left side is to be directly connected on left body 302, and the line contact plate 306 on the right is to be connected on unsteady cylinder 301.
The structure of right body 304 is that a spring 312 is installed in a vacuum system.This vacuum system consists of a floating cylinder 310, a Compress Spring 312 and a vacuum air inlet 314.When floating cylinder 310 closure relative with left body 302, line is produced to chucking power, this chucking power is less than the pulling force in effect online 102, therefore can effectively wire clamp be lived and can not be made its distortion.Meanwhile, use spring 312 also to have a sizeable pretightning force.If pretightning force is excessive, may make line 102 produce distortion.With vacuum generator (not shown), by vacuum inlet 314, produce vacuum.
While unclamping line in welding process, as shown in Fig. 2 (g), vacuum generator is opened, and produces vacuum 316(Fig. 3 (a)).Due to the suction (shown in the arrow 318 in Fig. 3 (b)) of vacuum 316, cylinder 310 moves backward, drives the line contact plate 306 on right body 304 to open.Chucking power is removed, and line 102 is free state, does not contact with line contact plate 306.Then line 102 is just hauled as requested.
While suitably clamping line (as shown in Fig. 2 (a-f)), vacuum generator cuts out.Spring 312 extends, and floating cylinder 310 is positioned at initial position, so the pretightning force of spring 312 is clamped line 102 by line contact plate 306.
Fig. 4 (a-b) is the front view of second scheme of line clamping device 202 of the present utility model.In this scheme, the force application apparatus of line clamping device 202 comprises a suction system.Main body is divided into two parts equally: a right body 404 that 402, one of left bodies contain through hole 406.Through hole 406 is for the conveying of line 102.The material of left body 402 and right body 404 can be aluminium.The suction system of right body 404 contains a plurality of suction channels 408, and one end of suction channel 408 is communicated with through hole 406, and one end is communicated with vacuum inlet 410.The free end of vacuum inlet 410 vacuum generator of ining succession.
In bonding wire process, line 102 transfers out by this through hole 406.By suction channel 408, aspirate, as shown in the arrow 412 in vacuum system, vacuum generator is opened generation vacuum.By suitable line 102 is held of vacuum draw.The size of suction depends on that vacuum controller (not shown) is by the vacuum size of suction channel 408.
The device that Fig. 4 (a-b) shows, in Fig. 2 (a-f) step, vacuum generator is opened, and clips line 102.When vacuum generator cuts out, unclamp line 102, cancel thus vacuum draw, line just can freely be drawn or be extended.
Fig. 5 (a-b) is the front view of the 3rd scheme of line clamping device of the present utility model.Force application apparatus in this line clamping device 202 is a piezo-shift system, and the left body 302 of line clamping device 202, right body 304, line contact plate 306 and wire guide 308 are installed as shown in Figure 5.
The line contact plate 306 on the left side is directly connected on left body 302, and the line contact plate 306 on the right is promoted by piezoelectric patches 512.Whole right body 304 and a small actuator of piezoelectric patches 512 pictures.Piezoelectric patches 512, such as pressure ceramic, exists with stacked form.After two line contact plates 306 are positioned, the size of its spacing 514 can be the diameter of single line 102, for example 100 microns (Fig. 5 (b)).During clamp, according to the size of the size of line, thereby control inputs voltage 516 is controlled the different displacement of piezoelectric patches 512.According to the needed displacement bimorph 518 of clamp, thereby correspondingly the size of control inputs voltage 516 reaches the object of controlling chucking power.For example, thick line needs larger displacement bimorph 518 than fine rule.
Therefore, the device in Fig. 5 (a), in bonding wire process shown in Fig. 2 (a-f) in, input voltage 516 is lived wire clamp, 516 of off voltages unclamp line.
Shown in Fig. 6 (a-b) is the 4th scheme of the present utility model.Force application apparatus in this line clamping device 202 has been used piezoelectric transmission systems.This line clamping device 202 comprises a piezoceramic disk 602 that is subject to Control of Voltage and rotates.By power supply 604 control inputs voltages, just can control the rotation of piezoceramic disk 602.Line contact plate 306 on left body 302 is directly connected on left body 302, and right body is comprised of a piezoceramic disk 602 connecting line contact plates 306, and one end 606 use hinges of piezoceramic disk are fixed.In kinds of schemes, piezoceramic disk 602 can be fixed in the mode of hinge one end or the two ends of right body.Line contact plate 306 on left body 302 provides frictional force together with piezoceramic disk 602, and line 102 can be slipped over easily.Left body 302, right body, the details of line contact plate 306 and wire guide 308 can be with reference to figure 3.
In this scheme, in the bonding wire process as shown in Fig. 2 (a-f) step, do not need to piezoceramic disk 602 input voltages.Guarantee like this line clamping device 202 closures, to 102, apply chucking power.In order to open logical line gap 608, input voltage rotates piezoceramic disk 602, and as shown in the arrow 610 of Fig. 6 (b), chucking power is released.
Fig. 7 (a-b) has shown the front view of line clamping device 202 in another scheme of the present utility model.In this device 202, force application apparatus has a calutron, electric energy conversion can be become to mechanical thrust and pulling force.Calutron comprises a pair of permanent magnet 702, coil 704, coil brace 706 and a power connection end 708.Coil brace 706 and line contact plate 306 are clamped line 102 stably, make smooth the passing through of line.Described coil 704 is tubuloses.The details of left body 302, right body 304, line contact plate 306 and wire guide 308 can be with reference to Fig. 3.
In the bonding wire process as shown in Fig. 2 (a-f), line clamping device 202 is closure state, and voltage passes into power connection end 708, and coil brace 706 and line contact plate 306 are clamped line 102.Stressed effect in the magnetic field that hot-wire coil 704 produces at permanent magnet 702, makes coil brace 706 axially move to the direction of clamping line, thereby line 102 is applied to chucking power.The translational speed of chucking power and coil brace 706 can be precisely controlled by the input voltage of adjustment power connection end 708.Such as, input voltage can be low to moderate 0.5V.Change the direction of electric current in coil and just can make coil brace 706 mobile in the other direction, thereby unclamp line 102.
Fig. 8 (a-b) is one of them scheme of the present utility model.In the line clamping device 202 of this scheme, used an o system as force application apparatus.O system is a calutron that can convert electric energy to mechanical thrust, and it is arranged on right body 304.This o system comprises a solenoid 802, piston 804, spring 806 and a power connection end 808.Piston 804 is ferromagnetic materials, is arranged on right body 304.
This line clamping device 202 is under closure state, and piston 804, in initial position, is being tried hard to recommend piston by the pretension of spring line 102 is clamped, and in the bonding wire process as shown in Fig. 2 (a-f), keeps this state always.In Fig. 2 (g) step, this line clamping device 202 is opened.Under the state of opening, power connection end 808 needs input voltage, and now solenoid 802 has electric current to pass through, and is equivalent to an electromagnet and has equally set up a magnetic field, piston 804 is drawn onto to the centre of coil 802, and Compress Spring 806 conversely, as shown in Figure 8 (b) shows.The pressure of this piston 804 and movement velocity depend on the size of the magnetic field intensity that hot-wire coil 802 produces.
In the process shown in Fig. 2 (a-f), input voltage is closed, and coil 802 effects were lost efficacy, and the energy accumulating in Compress Spring 806 promotes piston 804 to its initial position, thereby wire clamp is lived, as shown in Figure 8 (a).
In sum, use line clamping device 202 of the present utility model, confirmed the phenomenon that do not have line to skid off from porcelain mouth, also there is no the situation of broken string.And the utility model has improved the production efficiency of bonding wire, bonding wire quality and bonding wire stability.
Show above and described the line clamping device using in bonding wire process, this device has been realized various objects and advantage.Disclosed model in above explanation and accompanying drawing is taken in, and many variations of the present utility model, transformation, change and other usages and application, be obviously different from those ripe technology at present.All these change, transform, change and other usage and application all do not depart from purport of the present utility model and scope, and are all contained in utility model content, and claims of only being listed limit.
The utility model is considered to the technical scheme of tool practicality and first-selection now, in order to illustrate this utility model, at this, it has been done to detailed description, what must state is, in each details of this exposure, be only that to illustrate the utility model be object, and the utility model content is not limited to these technical schemes, on the contrary, is intended to include in all and claim and has the transformation of identical essence and scope and identical layout.Such as, if the utility model also expects further, extend, the one or more features in any one technical scheme can with another technical scheme in one or more features mutually combine.
Claims (8)
1. the line clamping device that bonding wire is used, is characterized in that: comprising:
Main body, comprises left body and right body;
Be connected to the wire guide on left body, for the conveying of line;
Two line contact plates for clamp, can live wire clamp, and one of them line contact plate is arranged on left body, and another is arranged on right body;
Force application apparatus, is connected with the line contact plate on right body, and wherein force application apparatus applies chucking power to line and clamps line in bonding wire process, until line tail just unclamps while cutting off.
2. a kind of line clamping device according to claim 1, is characterized in that: force application apparatus comprises:
Be connected to the Compress Spring of the line contact plate on right body;
Be connected to the vacuum inlet of Compress Spring;
The vacuum generator that is connecting vacuum inlet, when vacuum generator cuts out, floating cylinder, by the line contact plate on right body, applies chucking power to line, and when vacuum generator is opened generation vacuum draw, floating cylinder is inhaled the line contact plate on right body to come.
3. a kind of line clamping device according to claim 1, is characterized in that: force application apparatus comprises piezoelectric patches, and when this piezoelectric patches is activated, line contact plate can apply chucking power to line.
4. a kind of line clamping device according to claim 1, is characterized in that: force application apparatus comprises piezoelectric board, with the rotation of Control of Voltage piezoelectric board, thereby line is applied and discharges chucking power.
5. a kind of line clamping device according to claim 1, is characterized in that: force application apparatus comprises:
Permanent magnet;
Be connected to the coil on permanent magnet;
Coil brace, coil is fixed on coil brace, and coil passes into electric current, under the magnetic fields of permanent magnet, coil brace is axially moved, and then clamps line.
6. a kind of line clamping device according to claim 1, is characterized in that: force application apparatus comprises solenoid and be connected to the ferromagnetic piston on this solenoid, and ferromagnetic piston can apply and discharge the chucking power to line.
7. for a line clamping device for bonding wire, it is characterized in that: comprising:
Main body, comprises left body and right body;
Through hole between left body and right body, in bonding wire process for logical line;
Be connected to the force application apparatus on right body, in whole bonding wire process, force application apparatus can apply confining force, and the line through through hole is held, and only has when line tail is cut off and just decontrols.
8. a kind of line clamping device according to claim 7, is characterized in that: this force application apparatus comprises:
A plurality of suction channels, these suction channels are connected with through hole;
Vacuum inlet, is connected with suction channel, and while forming vacuum by vacuum inlet, suction channel produces vacuum draw, and force application apparatus just holds line.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SG10201400485PA SG10201400485PA (en) | 2014-03-07 | 2014-03-07 | A wire holding apparatus for wire bonding |
| SG10201400485P | 2014-03-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203992852U true CN203992852U (en) | 2014-12-10 |
Family
ID=51497577
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410253461.XA Expired - Fee Related CN104043918B (en) | 2014-03-07 | 2014-06-09 | A kind of line clamping device of bonding wire and the method using its bonding wire |
| CN201420304259.0U Withdrawn - After Issue CN203992852U (en) | 2014-03-07 | 2014-06-09 | The line clamping device that a kind of bonding wire is used |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410253461.XA Expired - Fee Related CN104043918B (en) | 2014-03-07 | 2014-06-09 | A kind of line clamping device of bonding wire and the method using its bonding wire |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN104043918B (en) |
| SG (1) | SG10201400485PA (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104043918A (en) * | 2014-03-07 | 2014-09-17 | 江门市壹科光电设备有限公司 | Wire clamp device used for wire bonding and wire bonding method by using wire clamp device |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111106021A (en) * | 2019-12-30 | 2020-05-05 | 重庆四联光电科技有限公司 | Semiconductor bonding process based on silver-based bonding wire |
| CN113702202B (en) * | 2021-07-29 | 2022-09-16 | 贵研铂业股份有限公司 | Method and device for testing tensile property of bonding wire heat affected zone |
| CN116135419A (en) * | 2021-11-18 | 2023-05-19 | 广东科杰技术股份有限公司 | Welding method for welding wire clamping-free wire tail of wire welding machine and wire welding machine |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58131744A (en) * | 1982-01-29 | 1983-08-05 | Shinkawa Ltd | Method of passing wire through capillary in wire bonder |
| US7025243B2 (en) * | 2004-06-16 | 2006-04-11 | Asm Technology Singapore Pte. Ltd. | Bondhead for wire bonding apparatus |
| US7240820B2 (en) * | 2004-07-19 | 2007-07-10 | Asm Technology Singapore Pte Ltd. | Clamping device for processing electronic devices |
| JP4467631B1 (en) * | 2009-01-07 | 2010-05-26 | 株式会社新川 | Wire bonding method |
| CN201632794U (en) * | 2009-12-22 | 2010-11-17 | 亿光电子(中国)有限公司 | Welding wire fixture of welding wire machine |
| CN103320997B (en) * | 2013-05-21 | 2014-11-05 | 何建慧 | Automatic needle threading mechanism for grain packaging bag opening seaming assembly line |
| SG10201400485PA (en) * | 2014-03-07 | 2015-10-29 | Kande Private Ltd | A wire holding apparatus for wire bonding |
-
2014
- 2014-03-07 SG SG10201400485PA patent/SG10201400485PA/en unknown
- 2014-06-09 CN CN201410253461.XA patent/CN104043918B/en not_active Expired - Fee Related
- 2014-06-09 CN CN201420304259.0U patent/CN203992852U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104043918A (en) * | 2014-03-07 | 2014-09-17 | 江门市壹科光电设备有限公司 | Wire clamp device used for wire bonding and wire bonding method by using wire clamp device |
| CN104043918B (en) * | 2014-03-07 | 2017-03-15 | 江门市壹科光电设备有限公司 | A kind of line clamping device of bonding wire and the method using its bonding wire |
Also Published As
| Publication number | Publication date |
|---|---|
| SG10201400485PA (en) | 2015-10-29 |
| CN104043918A (en) | 2014-09-17 |
| CN104043918B (en) | 2017-03-15 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170911 Address after: 529000 No. 61 Yongsheng Road, Pengjiang District, Guangdong, Jiangmen Patentee after: Guangdong Kejie Machinery Automation Co., Ltd. Address before: 529000 Pengjiang City, Jiangmen province Yongsheng Road, No. 61 (the 1 workshop) (No.) Patentee before: Jiangmen city Yi Ke optoelectronic device Co., Ltd |
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| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20141210 Effective date of abandoning: 20171114 |
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| AV01 | Patent right actively abandoned |
Granted publication date: 20141210 Effective date of abandoning: 20171114 |