CN203965758U - A kind of backlight module radiator structure - Google Patents
A kind of backlight module radiator structure Download PDFInfo
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- CN203965758U CN203965758U CN201420231375.4U CN201420231375U CN203965758U CN 203965758 U CN203965758 U CN 203965758U CN 201420231375 U CN201420231375 U CN 201420231375U CN 203965758 U CN203965758 U CN 203965758U
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- 238000004804 winding Methods 0.000 claims abstract description 6
- 230000007306 turnover Effects 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 11
- 230000000630 rising effect Effects 0.000 abstract description 2
- 239000011257 shell material Substances 0.000 description 28
- 206010053615 Thermal burn Diseases 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 230000005855 radiation Effects 0.000 description 8
- 230000005142 aphototropism Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000010276 construction Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
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- 230000005540 biological transmission Effects 0.000 description 3
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- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000004304 visual acuity Effects 0.000 description 1
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Abstract
The utility model discloses a kind of formula backlight module and liquid crystal indicator, relate to technical field of liquid crystal display, for solving, in the situation that the resolution of liquid crystal module and refreshing frequency improve, cause COF chip IC temperature to improve, how to reach better radiating effect and can alleviate shell cover local temperature rising problem.For connecting described liquid crystal panel and being arranged on the Source circuit board on described backboard outer wall, and winding is at the COF in described glue frame outside, on described COF, is provided with chip IC; S plate radome, comprise and the first flanging being connected on described backboard outer wall, be arranged on the second flanging of described COF periphery, and described the first flanging covers described Source circuit board, described the second flanging covers the position that chip IC is set on described COF, between described the first flanging and described Source circuit board, is provided with gap.
Description
Technical field
The utility model relates to technical field of liquid crystal display, relates in particular to a kind of backlight module radiator structure and backlight module.
Background technology
Backlight module is different according to light source setting position, be divided into two kinds of side entrance back module and down straight aphototropism mode set, wherein, side entrance back module arranges light source on surrounding side, light spreads even bright dipping through light guide plate, and its advantage is that integral thickness is thinner, and down straight aphototropism mode set light source arranges in the inner chamber of backboard bottom, light is through diffuser plate diffusion and evenly bright dipping, and its advantage is that Integral luminous is even.
Refer to Fig. 1, side entrance back module in prior art, comprise: backboard 6, glue frame 12, diaphragm group 3, light guide plate 4, the light source 11 of LED lamp is set by pcb board, light source assembly 11 is arranged on by LED lamp heat radiator 9 on the inwall of folding edges of back 601 of backboard 6, wherein, the LED lamp heat radiator 9 consisting of L-type aluminium is contained in the inner chamber of backboard 6, the one side of one flanging of the LED lamp heat radiator 9 of L-type connects the pcb board of light source 11, another side connects the folding edges of back 601 of backboard 6, the bottom surface of another flanging is fixed on the inner chamber bottom surface of backboard 6, the end face projection of above-mentioned another flanging is for supporting the bottom surface of light guide plate 4, like this, make the incident from the end face of the surrounding side of light guide plate 4 that emits beam of LED lamp exiting surface on light source assembly 11, enter the end face outgoing of carrying out in light guide plate 4 after scattering from light guide plate 6, emergent ray enters to be arranged on and diaphragm 3 is set in light guide plate 4 further expands and penetrate, think that being arranged on liquid crystal panel 2 on diaphragm 3 provides uniform illumination, wherein, the fixed by snap connection of outer wall of one flanging of glue frame 12 and folding edges of back 601, the bottom surface of another flanging of glue frame 12 is used for compressing diaphragm and moves to prevent diaphragm 3 and light guide plate 4, end face is for supporting and adhesive liquor crystal panel 2, to form backlight module one-piece construction.In addition, in conjunction with Fig. 1, Fig. 2 and Fig. 3 show, the driving circuit 701 of display arranges on the backboard of backlight module conventionally, as: on the back side of backboard 6, when it provides driving to show data for liquid crystal panel 2, need by COF(Chip On Flex, or, Chip On Film, normal title covers brilliant film, IC is fixed in flexible circuit board, using soft additional circuit boards to make packaged chip carrier engages chip and flexible base plate circuit) 7 be connected with liquid crystal panel 2, on each COF 7, be at least packaged with one for the chip IC 702 of computing, due to needs transmission and processing mass data signal, on COF 7, chip IC 702 temperature are higher, conventionally more than 80 degree, like this, chip IC 702 needs very good radiator structure to dispel the heat.By full HD liquid crystal panel, formed in liquid crystal module, as reserved certain space in Fig. 1 between COF 7 and the front shell side wall 101 of fore shell 1, by comprising the passive radiating mode of air transmitted heat radiation and heat loss through radiation, although can not in time chip IC 702 temperature be lowered, this radiator structure also can meet heat radiation requirement substantially, along with the resolution of liquid crystal panel is more and more higher, making provides data volume increasing to it, and liquid crystal panel refreshing frequency is also more and more higher, make chip calculation process speed more and more faster, like this, chip IC 702 deal with data amounts and speed add its power of ambassador and become large, so that temperature uprises.Concrete, inventor finds in implementation process, in the liquid crystal module of high image quality and high refresh rate, chip IC 702 temperature can reach 120 degree left and right conventionally, yet, front shell material is generally ABS or ABS+ glass fiber material is made, its minimum heat distortion temperature is 100 degree left and right, like this, at the fore shell of chip IC 702 positions, very easily scalds user, or deform and affect presentation quality because temperature is high, as passive heat radiation structure in Fig. 1 does not meet heat radiation requirement.Same, down straight aphototropism mode set (not providing view) is arranged on light source assembly 11 in the inner chamber of backboard 6, the LED lamp quantity that light source assembly 11 comprises and position need to arrange according to design, above light source assembly 11, be set to diffuser plate, liquid crystal panel 2 is identical with side entering type module with source circuit-board connecting structure, has equally the problems referred to above.
Further, inventor is in order to solve high resolving power and high refreshing frequency liquid crystal module heat dissipation problem, a kind of new radiator structure is proposed, as Fig. 4 shows (Fig. 4 and Fig. 1 difference are to be pasted with COF heat radiator 8 on front shell side wall 101 madial walls), in conjunction with Fig. 5 and Fig. 6, show again, for chip IC 702 temperature are at least dropped to below 80 degree, have to attach laminar COF heat radiator 8 with chip IC 702 corresponding positions on front shell side wall 101, to expand area of dissipation and to improve radiating effect and accelerate chip IC 702 heat radiations, wherein, diagram comprises 8 chip IC 702, on the inwall of front shell side wall 101, correspondence is pasted with 8 COF heat radiator 8, it is (long that COF heat radiator 8 physical dimension are about 50X10X0.3 conventionally, wide, thick mm), in order to adjust chip IC temperature, can suitably adjust COF heat radiator 8 physical dimension.
In implementing this scheme process, inventor finds again, because COF heat radiator 8 is attached to before plastics on shell side wall 101 inwalls, front shell side wall 101 size restrictions COF heat radiator 8 sizes and affect area of dissipation, and fore shell is that moulding material heat dispersion is poor, affected radiating effect, and owing to being directly attached on shell cover sidewall, the heat overwhelming majority is outwards distributed by the part of fore shell, so that the higher easy scald user of fore shell temperature.
Summary of the invention
The purpose of this utility model is, in the situation that the resolution of liquid crystal module and refreshing frequency improve, causes COF chip IC temperature to improve, and how to reach better radiating effect and can alleviate shell cover local temperature rising problem.
In order to reach above-mentioned utility model object, on the one hand, the present embodiment provides a kind of liquid crystal indicator, by the light source assembly that LED lamp is set on pcb board, comprise that surrounding flanging and base plate surround the backboard of inner chamber, light guide plate, diaphragm unit, liquid crystal panel and glue frame, wherein, described pcb board arranges on the flanging inwall of described backboard, so that described light source assembly is fixed on described backboard, described light guide plate is arranged in the inner chamber of described backboard, and described light guide plate sidewall end face is relative with the LED lamp exiting surface on described light source assembly, described diaphragm unit is arranged in described light guide plate, one flanging of described glue frame is connected with the outer wall of the flanging of described backboard, another flanging of described glue frame is arranged on described diaphragm edge, described liquid crystal panel is arranged on described diaphragm, and surrounding is arranged on described another flanging of described glue frame, also comprise: for connecting described liquid crystal panel and being arranged on the Source circuit board on described backboard outer wall, and winding is at the COF in described glue frame outside, on described COF, be provided with chip IC, S plate radome, comprise and the first flanging being connected on described backboard outer wall, be arranged on the second flanging of described COF periphery, and described the first flanging covers described Source circuit board, described the second flanging covers the position that chip IC is set on described COF.
On the other hand, the present embodiment provides a kind of backlight module, by the light source assembly that LED lamp is set on pcb board, comprise that surrounding flanging and base plate surround the backboard of inner chamber, light guide plate, diaphragm unit, liquid crystal panel and glue frame, wherein, described pcb board arranges on the flanging inwall of described backboard, so that described light source assembly is fixed on described backboard, described light guide plate is arranged in the inner chamber of described backboard, and described light guide plate sidewall end face is relative with the LED lamp exiting surface on described light source assembly, described diaphragm unit is arranged in described light guide plate, one flanging of described glue frame is connected with the outer wall of the flanging of described backboard, another flanging of described glue frame is arranged on described diaphragm edge, described liquid crystal panel is arranged on described diaphragm, and surrounding is arranged on described another flanging of described glue frame, also comprise: for connecting described liquid crystal panel and being arranged on the Source circuit board on described backboard outer wall, and winding is at the COF in described glue frame outside, on described COF, be provided with chip IC, S plate radome, comprise and the first flanging being connected on described backboard outer wall, be arranged on the second flanging of described COF periphery, and described the first flanging covers described Source circuit board, described the second flanging covers the position that chip IC is set on described COF.
In prior art, backlight module arranges in the technical scheme of COF heat radiator on the inwall of front shell side wall, because fore shell side wall dimensions is restricted, the area that makes the COF heat radiator that can arrange is limited and affected the area of dissipation of heat radiator, and be directly attached on the poor plastics fore shell of heat dispersion, affect radiating effect, and most heats of heat radiation outwards distribute by the part of fore shell, fore shell local temperature is higher very easily scalds user.Side entrance back module and liquid crystal indicator that the utility model above-described embodiment provides, it is mainly by arranging S plate radome, comprise and the first flanging being connected on backboard outer wall, be arranged on the second flanging of COF periphery, and the first flanging covers Source circuit board, the second flanging covers the position that chip IC is set on COF, between the first flanging and Source circuit board, be provided with gap, that is to say, the second flanging of S plate radome contacts with COF, the heat that COF is gone up to chip IC is by conducting on the first flanging, and the first flanging is connected with backboard, because backboard and S plate radome all play heating radiator effect, and backboard area is large and backboard is that metal material is made, improve radiating effect, in addition, on the one hand, because S plate radome is not directly attached on housing, reduced between itself and housing and conducted heat, on the other hand, S plate radome comprises side the second flanging, and the first flanging of toward back plate back side extension, relatively strengthen and housing possibility contact area, reduce the too high possibility of housing local temperature.
Further, in the above-described embodiments, on the edge of the second flanging of described S plate radome, be provided with to the flange of the contrary direction turnover of described COF.Compared to existing technology or in above-described embodiment, while unavoidably existing some techniques to manufacture residual cutting edge of a knife or a sword limit or burr due to the second flanging, when the second flanging contacts with COF, very easily scratch COF and cause COF fault, in the present embodiment, at the second flanging, flange is set, with the COF surface of contact arc surface that is flange, like this, reduce the possibility that COF is scratched by the second flanging.
Accompanying drawing explanation
Fig. 1 is the planing surface view of a kind of side entrance back module in prior art;
Fig. 2 is the view of liquid crystal panel and COF in Fig. 1;
The enlarged drawing in Tu3Tu2Zhong A district;
The planing surface view of another kind of side entrance back module in Fig. 4 prior art;
Fig. 5 is the fore shell view of side entrance back module described in Fig. 4;
The enlarged drawing in Tu6Wei Tu5Zhong B district;
Fig. 7 is for providing a kind of planing surface view of side entrance back module in the utility model embodiment;
Fig. 8 is for providing a kind of planing surface view of liquid crystal indicator in the utility model embodiment
Fig. 9 is the view of S plate radome in the utility model embodiment.
Reference numeral:
1-fore shell, 2-liquid crystal panel,
3-diaphragm group, 4-light guide plate,
6-backboard, 7-COF,
701-Source circuit board, 702-chip IC,
8-COF heat radiator, 9-LED lamp heat radiator,
Shell side wall before 101-, the bending of 601-backboard,
5-S plate radome, 51-the second flanging;
511-flange, 52-the first flanging;
12-glue frame, 13-back cover lid
11-light source assembly, d-gap.
embodiment
The down straight aphototropism mode set and the liquid crystal indicator that in order to further illustrate the utility model embodiment, provide, be described in detail below in conjunction with Figure of description.
Embodiment 1:
The present embodiment provides a kind of liquid crystal indicator, as Fig. 7 shows, comprise: surrounding folding edges of back 601 and base plate surround the backboard 6 of inner chamber, glue frame 12, diaphragm unit 3, light guide plate 4, liquid crystal panel 2, and the light source assembly 11 of LED lamp is set by pcb board, light source assembly 11 is arranged on by LED lamp heat radiator 9 on the inwall of folding edges of back 601 of backboard 6, wherein, the LED lamp heat radiator 9 consisting of L-type aluminium is contained in the inner chamber of backboard 6, the one side of one flanging of the LED lamp heat radiator 9 of L-type connects the pcb board of light source 11, another side connects the folding edges of back 601 of backboard 6, the bottom surface of another flanging of the LED lamp heat radiator 9 of L-type is fixed on the inner chamber bottom surface of backboard 6, so that light source assembly 11 is fixed on described backboard 6, light guide plate 4 is arranged in the inner chamber of backboard 6, wherein, the end face projection of LED lamp heat radiator 9 another flangings of L-type is for supporting the bottom surface of light guide plate 4, and light guide plate 4 sidewall end faces are relative with the LED lamp exiting surface on light source assembly 11, diaphragm unit 3 is arranged in described light guide plate 4, one flanging of glue frame 12 is connected with the outer wall of the flanging of backboard 6, another flanging of glue frame 12 is arranged on diaphragm unit 11 edges, liquid crystal panel 2 is arranged on diaphragm unit 11, and surrounding is arranged on another flanging of glue frame 12, like this, make the incident from the end face of the surrounding side of light guide plate 4 that emits beam of LED lamp exiting surface on light source assembly 11, enter the end face outgoing of carrying out in light guide plate 4 after scattering from light guide plate 6, emergent ray enters to be arranged on and diaphragm 3 is set in light guide plate 4 further expands and penetrate, think that being arranged on liquid crystal panel 2 on diaphragm 3 provides uniform illumination, wherein, the fixed by snap connection of outer wall of one flanging of glue frame 12 and folding edges of back 601, the bottom surface of another flanging of glue frame 12 is used for compressing diaphragm and moves to prevent diaphragm 3 and light guide plate 4, end face is for supporting and adhesive liquor crystal panel 2, to form backlight module one-piece construction.In addition, by Fig. 7, Fig. 8, Fig. 9 and showing in conjunction with Fig. 2 and Fig. 3, the source circuit board 701 of display arranges on the backboard outer wall of backlight module conventionally, as: on the back side of backboard 6, when it provides driving to show data for liquid crystal panel 2, need by COF(Chip On Flex, or, Chip On Film, normal title covers brilliant film, IC is fixed in flexible circuit board, using soft additional circuit boards to make packaged chip carrier engages chip and flexible base plate circuit) 7 be connected with liquid crystal panel 2, and COF winding is on the outside of glue frame 12, on each COF 7, be at least packaged with one for the chip IC 702 of computing.
Due to needs transmission and processing mass data signal, on COF 7, chip IC 702 temperature are higher, therefore, at COF, place outward S plate radome 5 is set, S plate radome 5 comprises and the first flanging 51 being connected on backboard 6 base plate outer walls, be arranged on the second flanging 52 of COF 7 peripheries, and first fold 51 limits covers Source circuit board 701, the second flanging 52 covers the position that chip IC 702 is set on COF7, between the first flanging 51 and Source circuit board 701, is provided with gap d.
The liquid crystal indicator that above-described embodiment provides, it is mainly by arranging S plate radome 5, comprise and the first flanging 52 being connected on backboard 6 base plate outer walls, be arranged on the second flanging 51 of COF 7 peripheries, and the first flanging 52 covers Source circuit board 701, the second flanging 51 covers the position that chip IC 702 is set on COF 7, between the first flanging 52 and Source circuit board 701, be provided with gap d, that is to say, the second flanging 51 of S plate radome 5 contacts with COF 7, by the heat of chip IC 702 on COF 7 by conducting on the first flanging 52, and the first flanging 51 is connected with backboard 6, because backboard 6 and S plate radome 5 all play heating radiator effect, and backboard 6 areas are large and backboard 6 is made for metal material, improve radiating effect, in addition, on the one hand, because S plate radome 5 is not directly attached on housing 1, reduced between itself and housing 1 and conducted heat, on the other hand, S plate radome 5 comprises side the second flanging 51, and the first flanging 52 of toward back plate 6 back sides extensions, relatively strengthen and housing 1 possibility contact area, reduce the too high possibility of housing 1 local temperature.Further, between the first flanging and Source circuit board 701, be provided with gap d, reduce S plate radome 5 temperature and uprise scald Source circuit board 701 possibilities, and minimizing Source circuit board 701 be subject to S plate radome 5 extrusion damage possibilities.
As Fig. 7 and Fig. 8 show, on the edge of the second flanging 51 of S plate radome 5, be provided with to the flange 511 of the contrary direction turnover of COF 7, compared to existing technology or in above-described embodiment, while existing some techniques to manufacture residual cutting edge of a knife or a sword limit or burr because the second flanging 51 is inevitable, when the second flanging 51 contacts with COF 7, very easily scratch COF 7 and cause COF 7 faults, in the present embodiment, at the second flanging 51, flange 511 is set, with COF 7 surface of contact be the arc surface of flange 511, like this, reduce the possibility that COF 7 is scratched by the second flanging 51.
Further, in this enforcement, flange 511 is the flanging on the edge of the second flanging 51 and kills structure, its flanging area is less, and to the contrary direction turnover of COF 7, that is: near the direction of housing sidewall 101, like this, flange 511 is for arranging the barrier of comprehensive engagement between housing and the second flanging 51, can avoid the second flanging 51 to contact with housing sidewall large area, and more heat transfer contacts heat loss through conduction possibility by housing on minimizing radiator structure, also reduce housing amount of localized heat, reduce housing distortion or housing and scald user's possibility.
Further, in the present embodiment in liquid crystal indicator assembling process, first, optical module 11 is fixed on the PCB of optical module 11 by LED heat radiator 9 on the flanging of backboard 6 fixing, then, light guide plate 6 is installed in the inner chamber of backboard 6, again diaphragm 3 is placed in light guide plate 4, further again by glue frame 12 and backboard 6 clampings with fixedly diaphragm 3 and light guide plate 4, then, again liquid crystal panel 2 is placed on glue frame upper hem and diaphragm 3, then the COF of liquid crystal panel 2 and Source circuit board 701 is fixing, finally the first flanging 52 of S plate radome 5 is fixedly connected with the back side screw hole of backboard 6 by screw, like this, complete backlight module assembling.Compared with prior art, without the step of assembling COF heat radiator 8 in inner walls, and S plate radome 5 assembling processes do not increase assembling complicacy, like this, in the present embodiment, reduce the step of assembling COF heat radiator 8 in inner walls, simplify assembly technology.
In this enforcement, in conjunction with Fig. 7 and Fig. 8, show, in above-mentioned liquid crystal indicator, also comprise housing, described housing comprises fore shell 1 and back cover lid 13, fore shell 1 is wrapped on the edge of liquid crystal panel 2, and back cover lid 13 covers S plate radome 5 and backboard 6, wherein, between back cover lid 13 and S plate radome 5, be provided with gap, between fore shell 1 and back cover lid 13, on the side of side liquid crystal module, be connected.Wherein, (not shown) in ATR structure, the chase that fore shell 1 can module, back cover lid 13 comprises the cavity body structure that side plate and base plate form, also can Fig. 7 and Fig. 8 shown in structure, fore shell 1 is plastic construction, fore shell 1 is pegged graft on module side with back cover lid 13.
Wherein, owing to being provided with certain interval between back cover lid 13 and S plate radome 5, like this, the heat of S plate radome 5 is mainly by air transmitted and heat loss through radiation, directly do not contact with back cover lid 13, avoid back cover lid 13 local temperatures too high and scald user, and reduce S plate radome 5 that temperature is higher directly contact back cover cause the possibility of housing high temperature deformation.
In the present embodiment, in above-mentioned liquid crystal indicator, as shown in Figure 9, the second flanging 52, for interval arranges 4 sections, by two the second flangings 52 are set, amounts to 8 sections of minor faces identical with upper 8 the chip IC quantity of COF, and the corresponding setting in position.
And the second flanging 52 and the vertical setting of the first flanging 51.
Embodiment 2:
In the present embodiment, a kind of side entrance back module is provided, as Fig. 7 shows, comprise: surrounding folding edges of back 601 and base plate surround the backboard 6 of inner chamber, glue frame 12, diaphragm unit 3, light guide plate 4, liquid crystal panel 2, and the light source assembly 11 of LED lamp is set by pcb board, light source assembly 11 is arranged on by LED lamp heat radiator 9 on the inwall of folding edges of back 601 of backboard 6, wherein, the LED lamp heat radiator 9 consisting of L-type aluminium is contained in the inner chamber of backboard 6, the one side of one flanging of the LED lamp heat radiator 9 of L-type connects the pcb board of light source 11, another side connects the folding edges of back 601 of backboard 6, the bottom surface of another flanging of the LED lamp heat radiator 9 of L-type is fixed on the inner chamber bottom surface of backboard 6, so that light source assembly 11 is fixed on described backboard 6, light guide plate 4 is arranged in the inner chamber of backboard 6, wherein, the end face projection of LED lamp heat radiator 9 another flangings of L-type is for supporting the bottom surface of light guide plate 4, and light guide plate 4 sidewall end faces are relative with the LED lamp exiting surface on light source assembly 11, diaphragm unit 3 is arranged in described light guide plate 4, one flanging of glue frame 12 is connected with the outer wall of the flanging of backboard 6, another flanging of glue frame 12 is arranged on diaphragm unit 11 edges, liquid crystal panel 2 is arranged on diaphragm unit 11, and surrounding is arranged on another flanging of glue frame 12, like this, make the incident from the end face of the surrounding side of light guide plate 4 that emits beam of LED lamp exiting surface on light source assembly 11, enter the end face outgoing of carrying out in light guide plate 4 after scattering from light guide plate 6, emergent ray enters to be arranged on and diaphragm 3 is set in light guide plate 4 further expands and penetrate, think that being arranged on liquid crystal panel 2 on diaphragm 3 provides uniform illumination, wherein, the fixed by snap connection of outer wall of one flanging of glue frame 12 and folding edges of back 601, the bottom surface of another flanging of glue frame 12 is used for compressing diaphragm and moves to prevent diaphragm 3 and light guide plate 4, end face is for supporting and adhesive liquor crystal panel 2, to form backlight module one-piece construction.In addition, by Fig. 7, Fig. 8, Fig. 9 and showing in conjunction with Fig. 2 and Fig. 3, the source circuit board 701 of display arranges on the backboard outer wall of backlight module conventionally, as: on the back side of backboard 6, when it provides driving to show data for liquid crystal panel 2, need by COF(Chip On Flex, or, Chip On Film, normal title covers brilliant film, IC is fixed in flexible circuit board, using soft additional circuit boards to make packaged chip carrier engages chip and flexible base plate circuit) 7 be connected with liquid crystal panel 2, and COF winding is on the outside of glue frame 12, on each COF 7, be at least packaged with one for the chip IC 702 of computing.
Due to needs transmission and processing mass data signal, on COF 7, chip IC 702 temperature are higher, therefore, at COF, place outward S plate radome 5 is set, S plate radome 5 comprises and the first flanging 51 being connected on backboard 6 base plate outer walls, be arranged on the second flanging 52 of COF 7 peripheries, and first fold 51 limits covers Source circuit board 701, the second flanging 52 covers the position that chip IC 702 is set on COF7, between the first flanging 51 and Source circuit board 701, is provided with gap d.
The liquid crystal indicator that above-described embodiment provides, it is mainly by arranging S plate radome 5, comprise and the first flanging 52 being connected on backboard 6 base plate outer walls, be arranged on the second flanging 51 of COF 7 peripheries, and the first flanging 52 covers Source circuit board 701, the second flanging 51 covers the position that chip IC 702 is set on COF 7, between the first flanging 52 and Source circuit board 701, be provided with gap d, that is to say, the second flanging 51 of S plate radome 5 contacts with COF 7, by the heat of chip IC 702 on COF 7 by conducting on the first flanging 52, and the first flanging 51 is connected with backboard 6, because backboard 6 and S plate radome 5 all play heating radiator effect, and backboard 6 areas are large and backboard 6 is made for metal material, improve radiating effect, in addition, on the one hand, because S plate radome 5 is not directly attached on housing 1, reduced between itself and housing 1 and conducted heat, on the other hand, S plate radome 5 comprises side the second flanging 51, and the first flanging 52 of toward back plate 6 back sides extensions, relatively strengthen and housing 1 possibility contact area, reduce the too high possibility of housing 1 local temperature.Further, between the first flanging and Source circuit board 701, be provided with gap d, reduce S plate radome 5 temperature and uprise scald Source circuit board 701 possibilities, and minimizing Source circuit board 701 be subject to S plate radome 5 extrusion damage possibilities.
As Fig. 7 and Fig. 8 show, on the edge of the second flanging 51 of S plate radome 5, be provided with to the flange 511 of the contrary direction turnover of COF 7, compared to existing technology or in above-described embodiment, while existing some techniques to manufacture residual cutting edge of a knife or a sword limit or burr because the second flanging 51 is inevitable, when the second flanging 51 contacts with COF 7, very easily scratch COF 7 and cause COF 7 faults, in the present embodiment, at the second flanging 51, flange 511 is set, with COF 7 surface of contact be the arc surface of flange 511, like this, reduce the possibility that COF 7 is scratched by the second flanging 51.
Further, in this enforcement, flange 511 is the flanging on the edge of the second flanging 51 and kills structure, its flanging area is less, and to the contrary direction turnover of COF 7, that is: near the direction of housing sidewall 101, like this, flange 511 is for arranging the barrier of comprehensive engagement between housing and the second flanging 51, can avoid the second flanging 51 to contact with housing sidewall large area, and more heat transfer contacts heat loss through conduction possibility by housing on minimizing radiator structure, also reduce housing amount of localized heat, reduce housing distortion or housing and scald user's possibility.
Embodiment 3:
In the present embodiment, a kind of down straight aphototropism mode set (not shown) is provided, those skilled in the art are known, and down straight aphototropism mode set is different from side entrance back module, only different from embodiment, light guide plate is replaced with to diffuser plate, and light source assembly 11 is arranged in the inner chamber of backboard 6, diffuser plate is set in inner chamber, and on the base plate of backboard 6, be provided for supporting the bearing support of diffuser plate, other parts are identical with embodiment 2, repeat no more.
It should be noted that, above-mentioned liquid crystal indicator is specifically as follows any product or parts with Presentation Function such as LCD TV, liquid crystal display, digital album (digital photo frame), mobile phone, panel computer.
In the description of the respective embodiments described above, specific features, structure, material or feature can be with suitable mode combinations in any one or more embodiment or example.
The above; it is only embodiment of the present utility model; but protection domain of the present utility model is not limited to this; anyly be familiar with those skilled in the art in the technical scope that the utility model discloses; can expect easily changing or replacing, within all should being encompassed in protection domain of the present utility model.Therefore, protection domain of the present utility model should be as the criterion by the described protection domain with claim.
Claims (5)
1. a backlight module radiator structure, comprise that surrounding flanging and base plate surround the backboard of inner chamber, liquid crystal panel and glue frame, a flanging of described glue frame is connected with the outer wall of the flanging of described backboard, on another flanging of described glue frame, described liquid crystal panel is set, it is characterized in that, also comprise:
For connecting described liquid crystal panel and being arranged on the Source circuit board on described backboard outer wall, and winding is at the COF in described glue frame outside, on described COF, is provided with chip IC;
S plate radome, comprise and the first flanging being connected on described backboard outer wall, be arranged on the second flanging of described COF periphery, and described the first flanging covers described Source circuit board, described the second flanging covers the position that chip IC is set on described COF.
2. backlight module radiator structure according to claim 1, is characterized in that, is provided with to the flange of the contrary direction turnover of described COF on the edge of the second flanging of described S plate radome.
3. according to arbitrary described backlight module radiator structure in claim 1 and 2, it is characterized in that, also comprise, housing, described housing comprises fore shell and back cover lid, and described fore shell is wrapped on the edge of described liquid crystal panel, and described back cover lid covers described S plate radome and described backboard, wherein, between described back cover lid and described S plate radome, be provided with gap.
4. backlight module radiator structure according to claim 3, is characterized in that, described the second flanging is that interval arranges, identical with the above chip IC quantity of described COF.
5. backlight module radiator structure according to claim 4, is characterized in that, described the second flanging is vertical with described the first flanging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420231375.4U CN203965758U (en) | 2014-05-08 | 2014-05-08 | A kind of backlight module radiator structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420231375.4U CN203965758U (en) | 2014-05-08 | 2014-05-08 | A kind of backlight module radiator structure |
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| Publication Number | Publication Date |
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| CN203965758U true CN203965758U (en) | 2014-11-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420231375.4U Expired - Lifetime CN203965758U (en) | 2014-05-08 | 2014-05-08 | A kind of backlight module radiator structure |
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| CN (1) | CN203965758U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105652359A (en) * | 2015-11-06 | 2016-06-08 | 乐视致新电子科技（天津）有限公司 | Light guide module group and display apparatus comprising the light guide module group |
| CN108351544A (en) * | 2015-09-03 | 2018-07-31 | 堺显示器制品株式会社 | Display device |
| CN111090013A (en) * | 2018-10-23 | 2020-05-01 | 锋华科技股份有限公司 | Tape type chip on film testing device with pre-adjusted temperature |
-
2014
- 2014-05-08 CN CN201420231375.4U patent/CN203965758U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108351544A (en) * | 2015-09-03 | 2018-07-31 | 堺显示器制品株式会社 | Display device |
| CN108351544B (en) * | 2015-09-03 | 2021-03-05 | 堺显示器制品株式会社 | Display device |
| CN105652359A (en) * | 2015-11-06 | 2016-06-08 | 乐视致新电子科技（天津）有限公司 | Light guide module group and display apparatus comprising the light guide module group |
| WO2017076008A1 (en) * | 2015-11-06 | 2017-05-11 | 乐视控股（北京）有限公司 | Light guide module and display device comprising light guide module |
| CN111090013A (en) * | 2018-10-23 | 2020-05-01 | 锋华科技股份有限公司 | Tape type chip on film testing device with pre-adjusted temperature |
| CN111090013B (en) * | 2018-10-23 | 2022-04-01 | 锋华科技股份有限公司 | Tape type chip on film testing device with pre-adjusted temperature |
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Address after: 266100 Zhuzhou Road, Laoshan District, Shandong, No. 151, No. Patentee after: Hisense Visual Technology Co., Ltd. Address before: 266100 Zhuzhou Road, Laoshan District, Shandong, No. 151, No. Patentee before: QINGDAO HISENSE ELECTRONICS Co.,Ltd. |
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