CN203950872U - A kind of thermal cell modularization structure - Google Patents
A kind of thermal cell modularization structure Download PDFInfo
- Publication number
- CN203950872U CN203950872U CN201420356339.0U CN201420356339U CN203950872U CN 203950872 U CN203950872 U CN 203950872U CN 201420356339 U CN201420356339 U CN 201420356339U CN 203950872 U CN203950872 U CN 203950872U
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- CN
- China
- Prior art keywords
- top board
- thermal cell
- base plate
- base
- plate
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- Expired - Fee Related
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Abstract
The utility model provides a kind of thermal cell modularization structure, the top board and the base plate that are parallel to each other are vertically fixed on susceptor surface, and be connected by some pull bars between top board and base plate, described top board dorsad base plate one side has groove, and be coated with cover plate, thermal cell wire is drawn by groove, the surface that described top board is relative with base plate has some thermal cell location holes, some unit thermal cell is arranged between top board and base plate by thermal cell location hole, between described top board and base plate, away from base one end, connecting plate is installed, on connecting plate with circular hole, for fixing electric connector and connection cable, top board, other surface coverage that base plate and base enclose the space of formation have covering.The utility model intensity is high, and radiating rate is fast, unit thermal cell and surrounding environment effectively can be isolated.
Description
Technical field
The present invention relates to thermal cell modularization technical field.
Background technology
Along with constantly widening of thermal cell application, single thermal cell is more and more difficult to meet the demand of various high-power using electricity systems, and modularization has become the inexorable trend of thermal cell technical field.
The common combining structure of thermal cell comprises bottom plate and pull bar at present, installing hole is distributed on the journal stirrup of bottom plate, easily distortion under harsh mechanical environment, and combining structure is not effectively isolated unit thermal cell and surrounding environment, be applicable to thermal cell that the less demanding system of ambient temperature is installed.
Summary of the invention
In order to overcome the deficiencies in the prior art, the invention provides a kind of thermal cell modularization fixed structure, intensity is high, and radiating rate is fast, unit thermal cell and surrounding environment effectively can be isolated.
The technical solution adopted for the present invention to solve the technical problems is: a kind of thermal cell modularization structure, comprises base, top board, base plate, pull bar, cover plate, covering and connecting plate.The top board and the base plate that are parallel to each other are vertically fixed on susceptor surface, and be connected by some pull bars between top board and base plate, described top board dorsad base plate one side has groove, and be coated with cover plate, thermal cell wire is drawn by groove, the surface that described top board is relative with base plate has some thermal cell location holes, some unit thermal cell is arranged between top board and base plate by thermal cell location hole, between described top board and base plate, away from base one end, connecting plate is installed, on connecting plate with circular hole, for fixing electric connector and connection cable, top board, other surface coverage that base plate and base enclose the space of formation have covering.
On described covering, have some through holes.
On described base, there are some connecting holes for being connected with using electricity system.
The invention has the beneficial effects as follows:
1, the present invention forms one by connecting plate and many pull bar I, pull bar II by top board, base plate, has both ensured the relatively fixing of unit thermal cell, has increased again the fastness of structure;
2, the present invention forms closing structure by covering, base, top board, base plate, and unit thermal cell in thermal cell is effectively isolated with surrounding environment, avoids element around affected by unit thermal cell surface high-temp;
3, when the several exhausting hole structure weight reduction on covering of the present invention and base plate, can increase the radiating rate of unit thermal cell, improve the fail safe of thermal cell assembly.
Brief description of the drawings
Fig. 1 is the schematic perspective view of thermal cell modularization fixed structure;
Fig. 2 is the front view of Fig. 1;
Fig. 3 is the vertical view of Fig. 2;
Fig. 4 is the front view of covering;
Fig. 5 is the left view of Fig. 4;
Fig. 6 is the vertical view of Fig. 4;
Fig. 7 is the front view of base;
Fig. 8 is the front view of connecting plate;
In figure, 1-base; 2-top board; 3-cover plate; 4-pull bar II; 5-pull bar I; 6-connecting plate; 7-covering; 8-base plate.
Embodiment
Below in conjunction with drawings and Examples, the present invention is further described, the present invention includes but be not limited only to following embodiment.
A kind of thermal cell modularization structure, comprises base, top board, base plate, pull bar I, pull bar II, cover plate, covering, connecting plate is combined into one.This structure comprises top board and the base plate with pull bar location hole and thermal cell location hole; Be installed in the cover plate on top board; Be installed in pull bar I, pull bar II, connecting plate between top board and base plate; Be installed in the base of top board, base plate one side; Be installed in top board, the base plate side covering with several exhausting holes.Described top board band is fluted, forms after cavity, for drawing thermal cell wire and loss of weight with cover plate; On described pull bar I, pull bar II, connecting plate with screw, for fixing top board and base plate; On described base, there are 6 connecting holes for being connected with system; On described connecting plate with circular hole, for fixing electric connector and connection cable.
With reference to accompanying drawing 1-Fig. 8: a kind of thermal cell modularization structure, comprises top board 2 and base plate 8 with pull bar location hole and thermal cell location hole; Be installed in the cover plate 3 on top board; Be installed in pull bar I 5, pull bar II 4, connecting plate 6 between top board and base plate; Be installed in the base 1 of top board, base plate one side; Be installed in top board, the base plate side covering 7 with several exhausting holes.
Innovative point of the present invention is: top board 2 and base plate 8 are profiled piece, are processed with pull bar location hole, unit thermal cell location hole on it; The location hole of placing same unit thermal cell or same pull bar is same center line on top board and base plate; The closing structure that covering 7, base 1, top board 2, base plate 8 form, makes unit thermal cell in thermal cell effectively isolate with surrounding environment; When severals exhausting hole structure weight reduction on covering 7 and base plate 1, can increase the radiating rate of unit thermal cell, the fail safe of raising thermal cell assembly.
Claims (3)
1. a thermal cell modularization structure, comprise base, top board, base plate, pull bar, cover plate, covering and connecting plate, it is characterized in that: the top board and the base plate that are parallel to each other are vertically fixed on susceptor surface, and be connected by some pull bars between top board and base plate, described top board dorsad base plate one side has groove, and be coated with cover plate, thermal cell wire is drawn by groove, the surface that described top board is relative with base plate has some thermal cell location holes, some unit thermal cell is arranged between top board and base plate by thermal cell location hole, between described top board and base plate, away from base one end, connecting plate is installed, on connecting plate with circular hole, for fixing electric connector and connection cable, top board, other surface coverage that base plate and base enclose the space of formation have covering.
2. thermal cell modularization structure according to claim 1, is characterized in that: on described covering, have some through holes.
3. thermal cell modularization structure according to claim 1, is characterized in that: on described base, have some connecting holes for being connected with using electricity system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420356339.0U CN203950872U (en) | 2014-06-30 | 2014-06-30 | A kind of thermal cell modularization structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420356339.0U CN203950872U (en) | 2014-06-30 | 2014-06-30 | A kind of thermal cell modularization structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203950872U true CN203950872U (en) | 2014-11-19 |
Family
ID=51892891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420356339.0U Expired - Fee Related CN203950872U (en) | 2014-06-30 | 2014-06-30 | A kind of thermal cell modularization structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203950872U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108091895A (en) * | 2017-12-13 | 2018-05-29 | 贵州梅岭电源有限公司 | A kind of zinc-silver reserve battery and thermal cell parallel operation system |
| CN112615019A (en) * | 2020-12-16 | 2021-04-06 | 北方特种能源集团有限公司西安庆华公司 | Thermal battery combined structure |
-
2014
- 2014-06-30 CN CN201420356339.0U patent/CN203950872U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108091895A (en) * | 2017-12-13 | 2018-05-29 | 贵州梅岭电源有限公司 | A kind of zinc-silver reserve battery and thermal cell parallel operation system |
| CN112615019A (en) * | 2020-12-16 | 2021-04-06 | 北方特种能源集团有限公司西安庆华公司 | Thermal battery combined structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141119 Termination date: 20180630 |