CN203950019U - 用于集成无源器件的测试板以及测试系统 - Google Patents
用于集成无源器件的测试板以及测试系统 Download PDFInfo
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- CN203950019U CN203950019U CN201420307393.6U CN201420307393U CN203950019U CN 203950019 U CN203950019 U CN 203950019U CN 201420307393 U CN201420307393 U CN 201420307393U CN 203950019 U CN203950019 U CN 203950019U
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- 238000012360 testing method Methods 0.000 title claims abstract description 118
- 239000000523 sample Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 238000013461 design Methods 0.000 abstract description 3
- 230000003071 parasitic effect Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000012827 research and development Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012356 Product development Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000001192 hot extrusion Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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Application Number | Priority Date | Filing Date | Title |
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CN201420307393.6U CN203950019U (zh) | 2014-06-10 | 2014-06-10 | 用于集成无源器件的测试板以及测试系统 |
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CN201420307393.6U CN203950019U (zh) | 2014-06-10 | 2014-06-10 | 用于集成无源器件的测试板以及测试系统 |
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CN203950019U true CN203950019U (zh) | 2014-11-19 |
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CN201420307393.6U Expired - Lifetime CN203950019U (zh) | 2014-06-10 | 2014-06-10 | 用于集成无源器件的测试板以及测试系统 |
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CN (1) | CN203950019U (zh) |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20190517 Address after: 214213 China Sensor Network International Innovation Park D1, 200 Linghu Avenue, Taihu International Science Park, Wuxi New District, Jiangsu Province Patentee after: National Center for Advanced Packaging Co.,Ltd. Address before: 100029 No. 3 Beitucheng West Road, Chaoyang District, Beijing Co-patentee before: National Center for Advanced Packaging Co.,Ltd. Patentee before: Institute of Microelectronics of the Chinese Academy of Sciences |
|
CX01 | Expiry of patent term |
Granted publication date: 20141119 |