CN203890483U - High-density interconnect printed circuit board electroplating jig - Google Patents
High-density interconnect printed circuit board electroplating jig Download PDFInfo
- Publication number
- CN203890483U CN203890483U CN201420254776.1U CN201420254776U CN203890483U CN 203890483 U CN203890483 U CN 203890483U CN 201420254776 U CN201420254776 U CN 201420254776U CN 203890483 U CN203890483 U CN 203890483U
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- main shaft
- clip
- connecting rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 13
- 238000003466 welding Methods 0.000 claims abstract description 4
- 238000005452 bending Methods 0.000 abstract 1
- 238000007747 plating Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Landscapes
- Clamps And Clips (AREA)
Abstract
The utility model provides a high-density interconnect printed circuit board electroplating jig. The electroplating jig comprises a receiving portion and two retaining clips and is characterized in that the receiving portion comprises a bottom board and two side boards, the two side boards are respectively arranged vertically at both sides of the base board, two retaining clips are arranged on the left and right side boards in parallel with each other, each of retaining clips comprises a spindle and two boss portions arranged on the spindle, the boss portions are formed by bending the spindle, both ends of the spindle are connected to the left and right side boards by virtue of a shaft, clamping posts are arranged on the portion, protruding over the side boards, of both end of the spindle, clamping posts are vertical to the spindles, clamping slots are formed in the position corresponding to the clamping posts on side boards, the clamping slots are fixed on side boards in a welding manner, after clamping posts are screwed into the clamping slots, the spindles are fixed and the heights of the boss portions are obtained by subtracting the thickness of the printed circuit board from the distance between the spindle and the base board. The jig is simple in structure, the printed circuit board can be effectively clamped and the position at which printed circuit board is clamped does not affect the electroplating.
Description
Technical field
The utility model relates to a kind of plating tool of high density interconnect printed circuit board (PCB), relates in particular to a kind of electroplating clamp of high density interconnect printed circuit board (PCB).
Background technology
In prior art, often to adopt fixture be the stationary fixture of similar pushed together printed circuit board (PCB) is electroplated, and circuit card is clipped between two intermediate plates, will exist easily and come off like this, and by the place of clamp clamps, can be had influence on the effect of plating.Therefore need a kind of novel fixture simple in structure.
Utility model content
In order to solve the problem existing in background technology, the utility model provides a kind of electroplating clamp of high density interconnect printed circuit board (PCB), this clamp structure is simple, can effectively clamp printed circuit board (PCB), and the place of clamping printed circuit board (PCB) can not exert an influence to electroplating.
For achieving the above object, the utility model adopts following technical scheme:
A kind of electroplating clamp of high density interconnect printed circuit board (PCB), comprise carrier and two retaining clips, it is characterized in that, described carrier comprises base plate and two side plates, described two side plates are vertically set on respectively the both sides of base plate, what two retaining clips were parallel to each other is arranged on two side plates in left and right, described retaining clip comprises main shaft and is arranged on two lug bosses on main shaft, lug boss is bent to form by main shaft, main shaft two end axles is connected on two side plates in left and right, the part of the outstanding side plate in main shaft two ends is provided with clip-connecting rod, clip-connecting rod is vertical with main shaft, corresponding with the clip-connecting rod buckling groove that is provided with on side plate, buckling groove is fixed on side plate by the mode of welding, clip-connecting rod rotates into after buckling groove, main shaft is fixed, the height of lug boss is that main shaft deducts the thickness of printed circuit board (PCB) apart from the distance of base plate.
Described buckling groove is fan groove, and clip-connecting rod is fixed after rotating into buckling groove.
Described lug boss is arc convex, v shape projection or semi-circular projection.
The beneficial effects of the utility model are: simple in structure, easy to use, and fixation, difficult drop-off, and because the place of clamping connection circuit card is a point, therefore can not exert an influence to the plating of this part.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the utility model is further illustrated
Fig. 1 is the structural representation of the utility model embodiment 1;
Fig. 2 is the use schematic diagram of the utility model embodiment 1;
Fig. 3 is the clip-connecting rod buckling groove detail drawing of the utility model embodiment 1.
Embodiment
Below in conjunction with accompanying drawing explanation and embodiment, the utility model is further described:
Embodiment 1
As shown in Figure 1, a kind of electroplating clamp of high density interconnect printed circuit board (PCB), comprise carrier and two retaining clips, it is characterized in that, described carrier comprises base plate 1 and two side plates 4, described two side plates 4 are vertically set on respectively the both sides of base plate 1, what two retaining clips were parallel to each other is arranged on two side plates in left and right, described retaining clip comprises main shaft 3 and is arranged on two lug bosses 33 on main shaft 3, lug boss 33 is bent to form by main shaft 3, main shaft 3 two end axles are connected on two side plates 4 in left and right, the part of the outstanding side plate in main shaft 3 two ends is provided with clip-connecting rod 31, clip-connecting rod 31 is vertical with main shaft 3, corresponding with clip-connecting rod 31 buckling groove 44 that is provided with on side plate 4, buckling groove 44 is fixed on side plate 4 by the mode of welding, clip-connecting rod 31 rotates into after buckling groove 44, main shaft 3 is fixed, the height of lug boss 33 is that main shaft 3 deducts the thickness of printed circuit board (PCB) apart from the distance of base plate.
As described in Figure 2, during use, printed circuit board (PCB) is shelved in carrier, by main shaft rotation, makes lug boss 33 downward, at this moment lug boss is just fixed on printed circuit board (PCB) on carrier, at this moment just can electroplate.Described lug boss 33 is arc convex, v shape projection or semi-circular projection.
As shown in Figure 3, access slot 44 is fan groove, and clip-connecting rod is fixed after rotating into buckling groove.
It will be recognized by those skilled in the art, do not departing under the prerequisite of protection scope of the present invention, can carry out various modifications, variation and combination to above-mentioned embodiment, and think that this modification, variation and combination are within the scope of originality thought.
Claims (3)
1. the electroplating clamp of a high density interconnect printed circuit board (PCB), comprise carrier and two retaining clips, it is characterized in that, described carrier comprises base plate and two side plates, described two side plates are vertically set on respectively the both sides of base plate, what two retaining clips were parallel to each other is arranged on two side plates in left and right, described retaining clip comprises main shaft and is arranged on two lug bosses on main shaft, lug boss is bent to form by main shaft, main shaft two end axles is connected on two side plates in left and right, the part of the outstanding side plate in main shaft two ends is provided with clip-connecting rod, clip-connecting rod is vertical with main shaft, corresponding with the clip-connecting rod buckling groove that is provided with on side plate, buckling groove is fixed on side plate by the mode of welding, clip-connecting rod rotates into after buckling groove, main shaft is fixed, the height of lug boss is that main shaft deducts the thickness of printed circuit board (PCB) apart from the distance of base plate.
2. the electroplating clamp of a kind of high density interconnect printed circuit board (PCB) as claimed in claim 1, is characterized in that, described buckling groove is fan groove, and clip-connecting rod is fixed after rotating into buckling groove.
3. the electroplating clamp of a kind of high density interconnect printed circuit board (PCB) as claimed in claim 2, is characterized in that, described lug boss is arc convex, v shape projection or semi-circular projection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420254776.1U CN203890483U (en) | 2014-05-16 | 2014-05-16 | High-density interconnect printed circuit board electroplating jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420254776.1U CN203890483U (en) | 2014-05-16 | 2014-05-16 | High-density interconnect printed circuit board electroplating jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203890483U true CN203890483U (en) | 2014-10-22 |
Family
ID=51716909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420254776.1U Expired - Fee Related CN203890483U (en) | 2014-05-16 | 2014-05-16 | High-density interconnect printed circuit board electroplating jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203890483U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108427019A (en) * | 2018-03-09 | 2018-08-21 | 昆山翰辉电子科技有限公司 | Jig for board failure detection |
-
2014
- 2014-05-16 CN CN201420254776.1U patent/CN203890483U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108427019A (en) * | 2018-03-09 | 2018-08-21 | 昆山翰辉电子科技有限公司 | Jig for board failure detection |
| CN108427019B (en) * | 2018-03-09 | 2020-06-09 | 梅州市展至电子科技有限公司 | A tool for circuit board fault detection |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141022 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |