CN203881192U - Ultrathin heat conduction pipe high in thermal transfer - Google Patents
Ultrathin heat conduction pipe high in thermal transfer Download PDFInfo
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- CN203881192U CN203881192U CN201320782272.2U CN201320782272U CN203881192U CN 203881192 U CN203881192 U CN 203881192U CN 201320782272 U CN201320782272 U CN 201320782272U CN 203881192 U CN203881192 U CN 203881192U
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- heat
- heat pipe
- structure layer
- capillary structure
- working fluid
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- 239000012530 fluid Substances 0.000 claims abstract description 46
- 238000010521 absorption reaction Methods 0.000 claims abstract description 22
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 238000009434 installation Methods 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 230000009471 action Effects 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 description 12
- 238000000605 extraction Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000002309 gasification Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
An ultrathin heat conduction pipe high in thermal transfer comprises a heat conduction pipe, a capillary structure layer, and a working fluid. The heat conduction pipe is a hollow and sealed pipe body. One end of the heat conduction pipe is a heat absorption end, and the other end of the heat conduction pipe is a heat dissipation end. A heat absorption wall of the heat absorption end is used for being connected with a heating electronic device, and a heat dissipation wall of the heat dissipation end is used for being connected with a heat dissipation device. The capillary structure layer is disposed inside the heat conduction pipe and is connected with the inner wall of the heat absorption wall. The capillary structure layer is shaped like a frustum, and the bottom edge of the cross section is greater than the top edge of the cross section. The capillary structure layer extends along the length of the heat conduction pipe. The bottom edge of the capillary structure layer is connected with the inner wall of the heat absorption wall. The working fluid is arranged inside the heat conduction pipe. The volume of the working fluid enables a gas flowing space to be kept inside the heat conduction pipe, so that the working fluid flows inside the heat conduction pipe when being converted into steam. The working fluid can flow into the capillary structure layer and is conducted through capillary action of the capillary structure layer.
Description
Technical field
The utility model system has about the heat pipe that is connected in electro-heat equipment, and especially a kind of high heat passes ultrathin heat pipe.
Background technology
In recent years because electronic installation moves towards the design of compact dimensional directions gradually, also therefore making that the design of heat abstractor in electronic installation or structure is also essential will be towards compact dimensional directions design.
But because the heat pipe of each design has kind of a multimode, wherein comparatively conventional kenel is, using working fluid to be heated at heat pipe becomes after steam, the working fluid of gaseous state is because of the natural phenomena of calorifics, heat guiding structure is set low to warm heat extraction region, condense afterwards and become after liquid working fluid by the interior capillary layer that arranges, working fluid liquid after condensing is conducted to heat affected zone, so reach continuous circulation.
The above-mentioned shape and structure about capillary layer, each design is all different, but known technology is in order to make the impact that capillarity is strong, can resist gravity, the area of section of capillary layer is done very greatly, but this kind of design can make suitable little of the flowing space of working fluid of the gaseous state in body.Otherwise as the flowing space of the working fluid steam in order to promote gaseous state, can sacrifice capillary intensity, make liquid working fluid cannot be passed to smoothly heat affected zone.
Therefore, inventor of the present utility model is badly in need of thinking deeply a kind of technology and is solved above-mentioned all problems, to promote the radiating efficiency of heat pipe.
Utility model content
So the purpose of this utility model is for solving the problem in above-mentioned prior art, in the utility model, propose a kind of
For reaching above-mentioned object, the utility model proposes a kind of high heat and pass ultrathin heat pipe, its object is, by the capillary structure layer in heat pipe, to be able to gravity to put up a resistance.No matter making this heat pipe is that the liquid working fluid in heat pipe is able to be conducted to heat absorbing end in the time that any angle is used.
Another object is to arrange the capillary structure layer of approximate trapezoid shape in heat pipe, makes overall capillary speed, and liquid working fluid is accelerated by the speed that conducts to heating end of radiating end, indirectly makes the radiating efficiency of heat pipe entirety promote.
Another object is to arrange the capillary structure layer of approximate trapezoid shape in heat pipe, making has larger space to flow to heat dissipation region heat extraction for the working fluid of the rear vaporize of heat absorption in heat pipe, and this heat pipe can have preferably radiating effect thus.
Another object is that the sectional area of the capillary structure layer that is set forth in heat pipe heat absorbing end is large compared to the capillary structure layer of this radiating end, therefore condense in absorption liquid working fluid time, can faster the liquid working fluid of radiating end be directed to heat absorbing end whereby.
For reaching above-mentioned object, the utility model proposes a kind of high heat and pass ultrathin heat pipe, comprise: a heat pipe is the body of hollow and sealing, and this heat pipe one end is heat absorbing end, and the other end is radiating end; Wherein one of this heat absorbing end heat absorption wall is in order to be connected with the electronic installation of heating, and a heat radiation wall of this radiating end is in order to be connected with heat abstractor; One capillary structure layer, is arranged in this heat pipe and is connected with the inwall of this heat absorption wall, and this capillary structure layer is the terrace with edge that the base of a cross section is greater than top margin, and this capillary structure layer is extended along the length of this heat pipe; Wherein this capillary structure layer is that metal powder sintered that make and its base is connected with the inwall of this heat absorption wall; One working fluid, is arranged in this heat pipe, and the volume of this working fluid makes to possess when a gas flow space changes steam into for this working fluid and flow in this heat pipe in this heat pipe; And this working fluid can flow into this capillary structure layer, and conducted because of capillarity in this capillary structure layer.
Preferably, the top margin of this capillary structure layer and the inwall of this heat pipe are in a distance.
Preferably, the cross section of the capillary structure layer in this heat pipe is the isosceles trapezoid that base is greater than top margin.
Preferably, through the cross section of this capillary structure layer upper bottom surface, its cross-sectional area is in the equal formed objects in arbitrary position of heat pipe.
Preferably, the capillary structure layer of this heat pipe is greater than the sectional area of the radiating end of this heat pipe in the sectional area of the heat absorbing end of this heat pipe.
Preferably, the form that the internal face of this heat pipe is even surface.
Preferably, the internal face of this heat pipe is the form that is covered with multiple grooves.
Preferably, the part internal face of this heat pipe is the form that is covered with multiple grooves.
Preferably, this groove is to be distributed in region that this heat pipe contacts with this capillary structure layer and/or this region around.
For reaching above-mentioned object, the utility model also proposes a kind of high heat and passes ultrathin heat pipe, and the straight line of different from technique scheme is this terrace with edge side replaces with the one in symmetrical evagination circular arc or interior concave arc.
The utility model beneficial effect is, by the capillary structure layer that approximate trapezoid shape is set in heat pipe, make overall capillary speed, working fluid is accelerated by the speed that conducts to heating end of radiating end, indirectly makes the radiating efficiency of heat pipe entirety promote.
Can further understand feature of the present utility model and advantage thereof by explanation below, when reading and please refer to accompanying drawing.
Brief description of the drawings
Fig. 1 is schematic perspective view of the present utility model.
Fig. 2 is that the heat pipe of the first embodiment of the present utility model is along the sectional view of A-A in Fig. 1.
Fig. 3 is that the heat pipe of the second embodiment of the present utility model is along the sectional view of A-A in Fig. 1.
Fig. 4 is that the heat pipe of the 3rd embodiment of the present utility model is along the sectional view of A-A in Fig. 1.
Fig. 5 is upper viewing view of the present utility model.
Fig. 6 is that the heat pipe of another embodiment of the present utility model is along the sectional view of A-A in Fig. 1.
Fig. 7 is that the heat pipe of an embodiment more of the present utility model is along the sectional view of A-A in Fig. 1.
[main element meets explanation]
10 heat pipes
11 heat absorbing end
111 heat absorption walls
12 radiating ends
20,20 ' capillary structure layer
201 bases
202 top margins
30 working fluids
60 electronic installations.
Detailed description of the invention
Hereby sincerely with regard to structure of the present utility model composition, and effect and the advantage that can produce, coordinate graphicly, lift a preferred embodiment of the present utility model and be described in detail as follows.
Please refer to Fig. 1 and Fig. 2, high heat of the present utility model passes ultrathin heat pipe, comprises:
One heat pipe 10, is the body of hollow and sealing, and these heat pipe 10 one end are heat absorbing end 11, and the other end is radiating end 12; Wherein one of this heat absorbing end 11 heat absorption wall 111 is in order to be connected with the electronic installation 60 of heating (as computer processor, display card are processed the electronic installation that wafer etc. can generate heat, do not draw), one heat radiation wall of this radiating end 12 is in order to be connected (as radiating fin, not drawing) with heat abstractor; Preferably, this heat pipe is copper metal material, and the thickness of this heat pipe 10 is 0.7mm～2.2mm; One capillary structure layer 20, be arranged in this heat pipe and be connected with the inwall of this heat absorption wall, the base 201 that this capillary structure layer 20 is cross sections is more than or equal to the terrace with edge (bottom surface of pyramid and be parallel to the part between a cross section of bottom surface of top margin 202, be called terrace with edge), and this capillary structure layer 20 is extended along the length of this heat pipe 10, and the direction that wherein this cross section extends along this heat pipe 10 with this capillary structure layer 20 is vertical; Wherein the base of this capillary structure layer 20 is connected with the inwall of this heat absorption wall 111, and the top margin of this capillary structure layer 20 does not contact with the inwall of this heat pipe 10; Preferably, this capillary structure layer 20 is to make with copper metal powder end sintering;
One working fluid 30, is arranged in this heat pipe 10, and the volume of this working fluid 30 makes to possess when a gas flow space 13 changes steam into for this working fluid 30 and flow in this heat pipe 10 is interior in this heat pipe 10; And this working fluid 30 can flow into this capillary structure layer 20, and conducted because of capillarity in this capillary structure layer 20; Preferably, this working fluid 30 is the one of pure water, alcohols, ketone or refrigerant.
By said structure, when the electronic installation (calling processor in the following text) in the time operating of heating can produce a large amount of heats, and the heat that the heat absorption wall of this heat pipe produces this processor passes in this heat pipe; Liquid working fluid corresponding to this processor position (calling heat affected zone in the following text) in this heat pipe changes gaseous state into because be heated, the workflow of gaseous state is known from experience past this heat pipe and is moved (natural phenomena that can move toward low-temperature region by heat) and heat entrained steam is reached to this heat abstractor corresponding to the heat extraction region at this heat abstractor place, and the working fluid of this gaseous state just condenses back liquid afterwards;
Although the heat affected zone (corresponding to the position of processor) in this heat pipe is produced because operative liquid working fluid evaporates the situation that working fluid reduces, the working fluid that this capillary structure layer can be condensed this heat extraction region is directed to heat affected zone in capillary mode;
Therefore the order of the working fluid of this heat pipe in heat conduction is, gasification after heat affected zone heat absorption, liquefaction after the heat extraction of heat extraction region, the repetitive cycling gasifying after being subject to the capillarity of capillary structure layer guide back heat affected zone to absorb heat again.
Capillary structure layer 20 in this heat pipe 10 of the present utility model is greater than the isosceles trapezoid of top margin kenel taking cross section as base presents, in order to make these heat pipe 10 left and right form the gas flow space 13 of equal-sized, efficiency and stability while promoting heat conduction, and the capillarity that the cross section of capillary structure layer 20 is formed in isosceles trapezoid mode is also stronger.
Wherein the width of this capillary structure layer 20 is preferably more than 0.3mm, its objective is as guaranteeing to reach effect powder amounts of particles.Make this capillary structure layer 20 can effectively absorb conductive fluid, and can guarantee that conductive fluid can not be detained in the steam channel of both sides, affect steam transmission action.
As shown in Figure 2, be heat pipe 10 profiles of the first embodiment of the present utility model, the form that the internal face of this heat pipe is even surface.
As shown in Figure 3, be heat pipe 10 profiles of the second embodiment of the present utility model, the internal face of this heat pipe is the form that is covered with multiple grooves 18.
As shown in Figure 4, be heat pipe 10 profiles of the 3rd embodiment of the present utility model, the part internal face of this heat pipe 10 is the form that is covered with multiple grooves 18; In the utility model explanation, preferably this groove 18 is to be distributed in region that this heat pipe 10 contacts with this capillary structure layer 20 and one or its combination around.
The cross section kenel of the capillary structure layer in the heat pipe of above-mentioned first, second and third embodiment is the form of isosceles trapezoid, and the cross section of this capillary structure layer upper bottom surface of process, and its cross-sectional area is in the equal formed objects in the arbitrary position of heat pipe.
As shown in Fig. 2 and Fig. 5, for the 4th embodiment of the present utility model, its feature is except being in even surface at these heat pipe 10 internal faces, and the sectional area of its inner capillary structure layer 20,20 ' can be a certain proportion of reduction to this radiating end 12 along with the heat absorbing end of heat pipe 10 11.
As Fig. 3 and Figure 5 shows that the 5th embodiment of the present utility model, its feature is except being that this heat pipe internal face is for being covered with multiple grooves 18, the sectional area of its inner capillary structure layer 20,20 ' can be a certain proportion of reduction to this radiating end 12 along with the heat absorbing end of heat pipe 11.
As Fig. 3 and Figure 5 shows that the 6th embodiment of the present utility model, its feature is except the part internal face that is this heat pipe and contacts with this capillary structure layer is for being covered with multiple grooves, the sectional area of its inner capillary structure layer 20,20 ' can be a certain proportion of reduction to this radiating end 12 along with the heat absorbing end of heat pipe 11.Above-mentioned the 4th, the 5th and the 6th embodiment, its main purpose is at the sectional area of the capillary structure layer 20 of heat absorbing end 11 large compared to the capillary structure layer 20 ' of this radiating end 12, therefore condense in absorption working fluid 30 time, by having preferably capillary force in the capillary structure layer 20 of first and second embodiment equal-sized, can faster the liquid working fluid 30 of radiating end 12 be directed to heat absorbing end 11.
As shown in FIG. 6 and 7, wherein the straight line of this terrace with edge dual-side replaces with the one in symmetrical evagination circular arc or interior concave arc.
The object of the utility model is, by the capillary structure layer in heat pipe, to be able to gravity to put up a resistance.No matter making this heat pipe is that the working fluid in heat pipe is able to be conducted to heat absorbing end in the time that any angle is used.
Another object is to arrange the capillary structure layer of approximate trapezoid shape in heat pipe, makes overall capillary speed, and working fluid is accelerated by the speed that conducts to heating end of radiating end, indirectly makes the radiating efficiency of heat pipe entirety promote.
Another object is to arrange the capillary structure layer of approximate trapezoid shape in heat pipe, and making has larger space to flow to heat dissipation region heat extraction for the working fluid of the rear gasification of heat absorption in heat pipe, and this heat pipe can have preferably radiating effect thus.
Another object is that the sectional area of the capillary structure layer that is set forth in heat pipe heat absorbing end is large compared to the capillary structure layer of this radiating end, when the working fluid that therefore condenses in absorption, can faster the liquid working fluid of radiating end be directed to heat absorbing end whereby.
Above-listed detailed description is illustrating for a possible embodiments of the present utility model, but this embodiment is not in order to limit the scope of the claims of the present utility model, allly do not depart from the equivalence that the utility model skill spirit does and implement or change, all should be contained in the scope of the claims of the present utility model.
Claims (10)
1. high heat passes a ultrathin heat pipe, it is characterized in that, comprises:
A heat pipe, is the body of hollow and sealing, and this heat pipe one end is heat absorbing end, and the other end is radiating end; Wherein the heat absorption wall of this heat absorbing end is in order to be connected with the electronic installation of heating, and the heat radiation wall of this radiating end is in order to be connected with heat abstractor;
One deck capillary structure layer, is arranged in this heat pipe and is connected with the inwall of this heat absorption wall, and this capillary structure layer is the terrace with edge that the base of a cross section is greater than top margin, and this capillary structure layer is extended along the length of this heat pipe; Wherein this capillary structure layer is metal powder sintered that make and be connected with the inwall of this heat absorption wall with its base;
Working fluid, is arranged in this heat pipe, and the volume of this working fluid is possessed when a gas flow space changes steam into for this working fluid and flowed in this heat pipe in this heat pipe for making; And
This workflow physical efficiency flow into this capillary structure layer and in this capillary structure layer because capillarity is conducted.
2. high heat as claimed in claim 1 passes ultrathin heat pipe, it is characterized in that, the top margin of this capillary structure layer and the inwall of this heat pipe are in a distance.
3. high heat as claimed in claim 1 passes ultrathin heat pipe, it is characterized in that, the cross section of the capillary structure layer in this heat pipe is the isosceles trapezoid that base is greater than top margin.
4. high heat as claimed in claim 1 passes ultrathin heat pipe, it is characterized in that, through the cross section of this capillary structure layer upper bottom surface, its cross-sectional area is in the equal formed objects in arbitrary position of heat pipe.
5. high heat as claimed in claim 1 passes ultrathin heat pipe, it is characterized in that, the capillary structure layer of this heat pipe is greater than the sectional area of the radiating end of this heat pipe in the sectional area of the heat absorbing end of this heat pipe.
6. the heat of the height as described in claim 1,4 or 5 passes ultrathin heat pipe, it is characterized in that the form that the internal face of this heat pipe is even surface.
7. the heat of the height as described in claim 1,4 or 5 passes ultrathin heat pipe, it is characterized in that, the internal face of this heat pipe is the form that is covered with multiple grooves.
8. the heat of the height as described in claim 1,4 or 5 passes ultrathin heat pipe, it is characterized in that, the part internal face of this heat pipe is the form that is covered with multiple grooves.
9. high heat as claimed in claim 8 passes ultrathin heat pipe, it is characterized in that, this groove is to be distributed in region that this heat pipe contacts with this capillary structure layer and/or this region around.
10. high heat as claimed in claim 1 passes ultrathin heat pipe, it is characterized in that, the straight line of this terrace with edge side replaces with the one in symmetrical evagination circular arc or interior concave arc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320782272.2U CN203881192U (en) | 2013-03-12 | 2013-11-27 | Ultrathin heat conduction pipe high in thermal transfer |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320110407 | 2013-03-12 | ||
| CN201320110407.0 | 2013-03-12 | ||
| CN201320782272.2U CN203881192U (en) | 2013-03-12 | 2013-11-27 | Ultrathin heat conduction pipe high in thermal transfer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203881192U true CN203881192U (en) | 2014-10-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320782272.2U Expired - Lifetime CN203881192U (en) | 2013-03-12 | 2013-11-27 | Ultrathin heat conduction pipe high in thermal transfer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203881192U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110476032A (en) * | 2017-09-29 | 2019-11-19 | 株式会社村田制作所 | Soaking plate |
-
2013
- 2013-11-27 CN CN201320782272.2U patent/CN203881192U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110476032A (en) * | 2017-09-29 | 2019-11-19 | 株式会社村田制作所 | Soaking plate |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20141015 |
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| CX01 | Expiry of patent term |