CN203875251U

CN203875251U - Wafer molding device

Info

Publication number: CN203875251U
Application number: CN201420325169.XU
Authority: CN
Inventors: 钟锡全
Original assignee: Sichuan Blue Colour Electronics Technology Co Ltd
Current assignee: Sichuan Blue Colour Electronics Technology Co Ltd
Priority date: 2014-06-18
Filing date: 2014-06-18
Publication date: 2014-10-15
Anticipated expiration: 2024-06-18

Abstract

The utility model discloses a wafer molding device. At least a pair of molding grooves (3) are formed in a lower mold (2), the positions of the molding grooves (3) are matched with the positions of wafer leads (7), and punching pins (4) matched with the molding grooves (3) are arranged on a punching mold (1). The punching mold (1) and the lower mold (2) are provided with cavities (5) matched with wafer bodies (6) respectively. The outer surfaces of the punching pins (4) are wrapped by hard alloy layers, and the inner surfaces of the molding grooves (3) are wrapped by abrasion resistant layers. According to the wafer molding device, the punching molding mode is adopted, and the wafer molding device is simple in structure, reasonable in design and low in processing cost; multiple lines and multiple rows of punching molds and multiple lines and multiple rows of lower molds can be manufactured according to requirements, batch punching molding of diode wafers on material discs can be achieved, and the molding efficiency is high; the hard alloy layers are arranged on the outer surfaces of the punching pins, and the inner surfaces of the molding grooves are wrapped by the abrasion resistant layers, so that the service life of the punching mold and the service life of the lower mold are long.

Description

Wafer shaped device

Technical field

The utility model relates to a kind of wafer assembling device, particularly relates to a kind of wafer shaped device.

Background technology

In electronic circuit, often use semiconductor diode; it plays an important role in many circuit; be one of the semiconductor devices the earliest that is born, be usually used in, in the circuit such as rectification, isolation, voltage stabilizing, polarity protection, coding-control, frequency modulation modulation and noise elimination, applying very extensive.Transistor is that two PN junctions are contained in inside, and has the particular device of enlarging function, and transistor has and amplifies and on-off action signal in circuit, applies also very extensive.

Due to needs such as pcb board welding procedures, conventionally diode to be processed into structure as shown in Figure 1, the lead-in wire at wafer body two ends need to be processed into the shape with crotch.Traditional molding mode is first diode to be cut down from material disc, then singly diode is carried out to punching press, make its lead-in wire strike out hook solid, this traditional molding mode efficiency is extremely low, and for single diode, because of its small volume, so crawl is very difficult, difficulty of processing is larger.

Utility model content

The purpose of this utility model is to overcome the deficiencies in the prior art, provides a kind of shaping efficiency high, effective wafer shaped device, mould long service life.

The purpose of this utility model is achieved through the following technical solutions: wafer shaped device, comprise punch die and counterdie, on counterdie, be provided with at least one pair of shaping groove, the position of the position of shaping groove and wafer lead-in wire matches, and is provided with the drift matching with molding concave die on punch die.

On described punch die and counterdie, be provided with and match with wafer body, during for moulding, place the cavity of wafer body.

Shaping groove on described counterdie has six pairs.

The outer surface of described drift is coated with hard alloy layer.

The inner surface of described shaping groove is coated with wearing course.

The beneficial effects of the utility model are:

1) adopt punch forming mode, simple in structure, reasonable in design, processing cost is low;

2) punch die and counterdie can be made multiple lines and multiple rows as required, can realize the batch punch forming to the diode wafer on material disc, and shaping efficiency is high, effective;

3) drift outer surface is provided with hard alloy layer, has increased the rigidity of drift and the degree of resistance to wearing, and has increased the service life of drift;

4) inner surface of shaping groove is coated with wearing course, has greatly strengthened the anti-wear performance of shaping groove, has increased the service life of counterdie.

Accompanying drawing explanation

Fig. 1 is the chip architecture schematic diagram that needs moulding;

Fig. 2 is the structural representation of wafer on material disc;

Fig. 3 is the utility model punch die, lower die structure schematic diagram;

Fig. 4 is that the utility model is used view;

In figure, 1-punch die, 2-counterdie, 3-shaping groove, 4-drift, 5-cavity, 6-wafer body, 7-wafer lead-in wire.

The specific embodiment

Below in conjunction with accompanying drawing, the technical solution of the utility model is described in further detail, but protection domain of the present utility model is not limited to the following stated.

As shown in Figure 2, every row has six wafers to the structure of wafer on material disc, and the wafer body 6 of every wafer is all gone between and 7 is connected on material disc by wafer.

As shown in Figure 3, Figure 4, wafer shaped device, comprises punch die 1 and counterdie 2, is provided with at least one pair of shaping groove 3 on counterdie 2, and the position of the position of shaping groove 3 and wafer lead-in wire 7 matches, and is provided with the drift 4 matching with molding concave die 3 on punch die 1.

On described punch die 1 and counterdie 2, be provided with and match with wafer body 6, place the cavity 5 of wafer body 6 during for moulding, cavity 5 also can play the effect of assisting location, and material disc is placed on counterdie 2 stably, avoids breakking away.

Shaping groove 3 on described counterdie 2 has six pairs.

The outer surface of described drift 4 is coated with hard alloy layer.

The inner surface of described shaping groove 3 is coated with wearing course.

The above is only preferred embodiment of the present utility model, be to be understood that the utility model is not limited to disclosed form herein, should not regard the eliminating to other embodiment as, and can be used for various other combinations, modification and environment, and can, in contemplated scope described herein, by technology or the knowledge of above-mentioned instruction or association area, change.And the change that those skilled in the art carry out and variation do not depart from spirit and scope of the present utility model, all should be in the protection domain of the utility model claims.

Claims

1. wafer shaped device, it is characterized in that: comprise punch die (1) and counterdie (2), on counterdie (2), be provided with at least one pair of shaping groove (3), the position of the position of shaping groove (3) and wafer lead-in wire (7) matches, and is provided with the drift (4) matching with molding concave die (3) on punch die (1).

2. wafer shaped device according to claim 1, is characterized in that: on described punch die (1) and counterdie (2), be provided with and match with wafer body (6), place the cavity (5) of wafer body (6) during for moulding.

3. wafer shaped device according to claim 1, is characterized in that: the shaping groove (3) on described counterdie (2) has six pairs.

4. wafer shaped device according to claim 1, is characterized in that: the outer surface of described drift (4) is coated with hard alloy layer.

5. wafer shaped device according to claim 1, is characterized in that: the inner surface of described shaping groove (3) is coated with wearing course.