CN203882990U - Wafer cutting device - Google Patents
Wafer cutting device Download PDFInfo
- Publication number
- CN203882990U CN203882990U CN201420325178.9U CN201420325178U CN203882990U CN 203882990 U CN203882990 U CN 203882990U CN 201420325178 U CN201420325178 U CN 201420325178U CN 203882990 U CN203882990 U CN 203882990U
- Authority
- CN
- China
- Prior art keywords
- wafer
- hole
- blade
- blanking
- punch die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 34
- 239000002699 waste material Substances 0.000 claims abstract description 11
- 229910000604 Ferrochrome Inorganic materials 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 abstract description 26
- 239000000463 material Substances 0.000 abstract description 10
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical group [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 abstract 1
- 229910001021 Ferroalloy Inorganic materials 0.000 abstract 1
- 229910052804 chromium Inorganic materials 0.000 abstract 1
- 239000011651 chromium Substances 0.000 abstract 1
- 238000003754 machining Methods 0.000 abstract 1
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 210000001138 tear Anatomy 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The utility model discloses a wafer cutting device. A lower die (2) is provided with a material falling through hole (3). A punch die (1) is provided with a cutter (4) matching the material falling through hole (3). The outer surface of a blade (8) is coated by a wear-proof layer (9) that is a chromium ferroalloy wear-proof layer. A waste material collection device is disposed below the material falling through hole (3). The wafer cutting device utilizes the punch cutting mode, and is simple in structure, reasonable in design, and low in machining cost. The punch die and the lower die are made in line and in row as needed, so that diode wafers on a material disc can be cut in a batch, with high cutting efficiency. The outer surface of the blade is coated by the wear-proof layer, so that wear-proof performance of the blade is improved, and service lifetime of the cutter is improved. The waste material collection device is disposed below the material falling through hole, so as to concentratedly recycle the waste materials generated in the cutting process.
Description
Technical field
The utility model relates to a kind of wafer assembling device, particularly relates to a kind of wafer cutter sweep.
Background technology
In electronic circuit, often use semiconductor diode; it plays an important role in many circuit; be one of the semiconductor device the earliest that is born, be usually used in, in the circuit such as rectification, isolation, voltage stabilizing, polarity protection, coding-control, frequency modulation modulation and noise elimination, applying very extensive.Transistor is that two PN junctions are contained in inside, and has the particular device of enlarging function, and transistor has and amplifies and on-off action signal in circuit, applies also very extensive.
In diode/triode wafer production processes, need to cut the lead-in wire of wafer.The following problem of existing wafer cutter sweep ubiquity: (1) cannot realize cutting in batches, and cutting efficiency is low; (2) waste material forming in cannot centralized recovery cutting process, the problem of waste disposal is perplexing many wafer manufacturer always; (3) cutting knife blade easily weares and teares, and cutting knife is shorter useful life.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, provides the wafer cutter sweep that a kind of cutting efficiency is high, be convenient to reclaim cutting waste material, the long service life of cutting knife.
The purpose of this utility model is achieved through the following technical solutions: wafer cutter sweep, comprise punch die and counterdie, on counterdie, be provided with at least one pair of blanking through hole, the position of the position of blanking through hole and wafer lead-in wire matches, and is provided with the cutting knife matching with blanking through hole on punch die.
On described punch die and counterdie, be provided with and match with wafer body, place the cavity of wafer body when cutting.
Cutting knife on described punch die has six pairs, and the blanking through hole matching with cutting knife on counterdie also has six pairs.
The bottom of described cutting knife is provided with blade.
On the outer surface of described blade, be coated with one deck wearing layer.
Described wearing layer is ferrochrome wearing layer.
The below of described blanking through hole is provided with waste material collection device.
The beneficial effects of the utility model are:
1) adopt die cut mode, simple in structure, reasonable in design, processing cost is low;
2) punch die and counterdie can be made multiple lines and multiple rows as required, can realize the batch cutting to the diode wafer on material disc, and cutting efficiency is high;
3) on the outer surface of blade, be coated with one deck wearing layer, strengthened the wear resistance of blade, increased the useful life of cutting knife;
4) below of blanking through hole is provided with waste material collection device, the waste material producing in can centralized recovery cutting process.
Accompanying drawing explanation
Fig. 1 is the structural representation of wafer on material disc;
Fig. 2 is the utility model punch die, lower die structure schematic diagram;
Fig. 3 is that the utility model is used view;
Fig. 4 is the utility model cutter structure schematic diagram;
In figure, 1-punch die, 2-counterdie, 3-blanking through hole, 4-cutting knife, 5-cavity, 6-wafer body, 7-wafer lead-in wire, 8-blade, 9-wearing layer.
Embodiment
Below in conjunction with accompanying drawing, the technical solution of the utility model is described in further detail, but protection range of the present utility model is not limited to the following stated.
As shown in Figure 1, every row has six wafers to the structure of wafer on material disc, and the wafer body 6 of every wafer is all gone between and 7 is connected on material disc by wafer.
As shown in Figure 2 and Figure 3, wafer cutter sweep, comprises punch die 1 and counterdie 2, is provided with at least one pair of blanking through hole 3 on counterdie 2, and the position of the position of blanking through hole 3 and wafer lead-in wire 7 matches, and is provided with the cutting knife 4 matching with blanking through hole 3 on punch die 1.
On described punch die 1 and counterdie 2, be provided with and match with wafer body 6, place the cavity 5 of wafer body 6 when cutting, cavity 5 also can play the effect of assisting location, and material disc is placed on counterdie 2 stably, avoids breakking away.
Cutting knife 4 on described punch die 1 has six pairs, and the blanking through hole 3 matching with cutting knife 4 on counterdie 2 also has six pairs.
As further improvement of the utility model, the below of described blanking through hole 3 is provided with waste material collection device.
As shown in Figure 4, the bottom of described cutting knife 4 is provided with blade 8, is coated with one deck wearing layer 9 on the outer surface of described blade 8, and described wearing layer 9 is ferrochrome wearing layer.
The above is only preferred implementation of the present utility model, be to be understood that the utility model is not limited to disclosed form herein, should not regard the eliminating to other embodiment as, and can be used for various other combinations, modification and environment, and can, in contemplated scope described herein, by technology or the knowledge of above-mentioned instruction or association area, change.And the change that those skilled in the art carry out and variation do not depart from spirit and scope of the present utility model, all should be in the protection range of the utility model claims.
Claims (7)
1. wafer cutter sweep, it is characterized in that: comprise punch die (1) and counterdie (2), on counterdie (2), be provided with at least one pair of blanking through hole (3), the position of the position of blanking through hole (3) and wafer lead-in wire (7) matches, and is provided with the cutting knife (4) matching with blanking through hole (3) on punch die (1).
2. wafer cutter sweep according to claim 1, is characterized in that: on described punch die (1) and counterdie (2), be provided with and match with wafer body (6), place the cavity (5) of wafer body (6) when cutting.
3. wafer cutter sweep according to claim 1, is characterized in that: the cutting knife (4) on described punch die (1) has six pairs, and the upper blanking through hole (3) matching with cutting knife (4) of counterdie (2) also has six pairs.
4. wafer cutter sweep according to claim 1, is characterized in that: the bottom of described cutting knife (4) is provided with blade (8).
5. wafer cutter sweep according to claim 4, is characterized in that: on the outer surface of described blade (8), be coated with one deck wearing layer (9).
6. wafer cutter sweep according to claim 5, is characterized in that: described wearing layer (9) is ferrochrome wearing layer.
7. wafer cutter sweep according to claim 1, is characterized in that: the below of described blanking through hole (3) is provided with waste material collection device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420325178.9U CN203882990U (en) | 2014-06-18 | 2014-06-18 | Wafer cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420325178.9U CN203882990U (en) | 2014-06-18 | 2014-06-18 | Wafer cutting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203882990U true CN203882990U (en) | 2014-10-15 |
Family
ID=51683464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420325178.9U Expired - Fee Related CN203882990U (en) | 2014-06-18 | 2014-06-18 | Wafer cutting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203882990U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105161461A (en) * | 2015-09-14 | 2015-12-16 | 圆融光电科技股份有限公司 | Ram-type splitting system |
-
2014
- 2014-06-18 CN CN201420325178.9U patent/CN203882990U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105161461A (en) * | 2015-09-14 | 2015-12-16 | 圆融光电科技股份有限公司 | Ram-type splitting system |
| CN105161461B (en) * | 2015-09-14 | 2018-03-23 | 圆融光电科技股份有限公司 | Punching type lobe system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141015 Termination date: 20150618 |
|
| EXPY | Termination of patent right or utility model |