CN203868910U - LED projection lamp - Google Patents

LED projection lamp Download PDF

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Publication number
CN203868910U
CN203868910U CN201420329594.6U CN201420329594U CN203868910U CN 203868910 U CN203868910 U CN 203868910U CN 201420329594 U CN201420329594 U CN 201420329594U CN 203868910 U CN203868910 U CN 203868910U
Authority
CN
China
Prior art keywords
lamp housing
integrated chip
control circuit
sensing control
pedestal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420329594.6U
Other languages
Chinese (zh)
Inventor
朱剑军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Heng Jian Electro-Optical Technology Inc (us) 62 Martin Road Concord Massachusetts 017
Original Assignee
Ningbo Heng Jian Electro-Optical Technology Inc (us) 62 Martin Road Concord Massachusetts 017
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ningbo Heng Jian Electro-Optical Technology Inc (us) 62 Martin Road Concord Massachusetts 017 filed Critical Ningbo Heng Jian Electro-Optical Technology Inc (us) 62 Martin Road Concord Massachusetts 017
Priority to CN201420329594.6U priority Critical patent/CN203868910U/en
Application granted granted Critical
Publication of CN203868910U publication Critical patent/CN203868910U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/40Control techniques providing energy savings, e.g. smart controller or presence detection

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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The utility model discloses an LED projection lamp which is further provided with an optical sensing control circuit and a normally on switch circuit. The optical sensing control circuit comprises a sensing signal processing integrated chip and an optical sensor arranged on a lamp housing, wherein the sensing signal processing integrated chip is arranged on a driving circuit board. The optical sensor is electrically connected with the sensing signal processing integrated chip, the normally on switch circuit is in parallel connection with the optical sensing control circuit, and the sensing signal processing integrated chip is U1BISS0001. The LED projection lamp has the advantages that the optical sensing control circuit and the normally on switch circuit which are in parallel connection are added, the optical sensing control circuit comprises the optical sensor arranged on the lamp housing and the sensing signal processing integrated chip U1BISS0001 arranged on the driving circuit board, so that the LED projection lamp can switch between an optical sensing control mode and a normally on state, and part of electric power is saved under the optical sensing control state under normal conditions.

Description

LED Projecting Lamp
Technical field
The utility model relates to a kind of LED Projecting Lamp.
Background technology
LED Projecting Lamp is that a kind of brightness is high, few illuminations consumes energy.Because LED Projecting Lamp can aim at any direction, and possesses the structure of the impact of climate condition not, for the illumination in the places such as contour of building, stadium, viaduct, monument, park and flower bed, conventionally, after reaching sometime, just open LED Projecting Lamp and throw light on.But because LED Projecting Lamp use amount increases, power consumption is unprecedented soaring, for saving electric energy, reasonably use LED Projecting Lamp, proposed LED Projecting Lamp to carry out the demand of light sensing control, and requirement can Chang Liang in the special occasions such as party.
Utility model content
Technical problem to be solved in the utility model be to provide a kind of can be at light sensing control and the normal LED Projecting Lamp switching between bright.
The utility model solves the problems of the technologies described above adopted technical scheme: a kind of LED Projecting Lamp, it comprises LED luminescence unit, drive circuit board, lampshade, reflection shield, lamp housing and bonnet, LED luminescence unit, drive circuit board and reflection shield are located in lamp housing, the lampshade and the lamp housing that are located at before LED luminescence unit are tightly connected, and lamp housing and bonnet are tightly connected; It is also provided with light sensing control circuit and normal bright on-off circuit; Described smooth sensing control circuit comprises that the transducing signal that is located on drive circuit board processes integrated chip and be located at the optical sensor on lamp housing, and described optical sensor is electrically connected with transducing signal processing integrated chip; Described normal bright on-off circuit is in parallel with light sensing control circuit.
As preferably, it is U1 BISS0001 that described transducing signal is processed integrated chip; Can delay switch function be set at the peripheral circuit of integrated chip U1 BISS0001, prevent from occurring the situation of light fixture flicker in the time of critical point, improve the stability of light fixture.
Compared with prior art, the utility model has the advantage of and set up the light sensing control circuit and the normal bright on-off circuit that are arranged in parallel, light sensing control circuit comprises the optical sensor being located on lamp housing and is located at the transducing signal processing integrated chip U1 BISS0001 on drive circuit board, thereby can between light sensing control and normal bright two kinds of patterns, switch, under the state for light sensing control, save part electric power under normal conditions.
As improvement, be also provided with infrared control circuit, comprise infrared human body sensor, described infrared human body sensor is processed integrated chip with transducing signal and is electrically connected.Carry out low-light level illumination personnel without out-of-date, in the time sensing personnel through infrared human body sensor senses scope, improve brightness of illumination, in the time that the personnel of sensing leave infrared human body sensor senses scope, recover low-light level illumination, thereby save electric energy.
As improvement, also comprise pedestal, described pedestal is located between lamp housing and bonnet, and described lamp housing and bonnet are tightly connected and refer to, and pedestal is tightly connected with lamp housing and bonnet respectively; In described pedestal, be provided with lithium battery group, lithium battery group is electrically connected with drive circuit board.Make this LED Projecting Lamp there is stand-by power supply, in the time that power system is broken down, can Emergency use.
As improvement, the bottom of described pedestal is provided with circumscription socket groove, and the plug of external power supply is located in circumscription socket groove, and between plug and circumscription socket groove, sealing arranges.Reduce and connect difficulty, install more convenient, and waterproof.
As improvement, described reflection shield comprises the cover body that plastics are made and is distributed in successively from the inside to surface prime coat, vacuum plated aluminum film, ultraviolet curing glue-line, the soot layer being coated on cover body inner surface and the protective layer of being made up of transparent epoxide-resin glue.The reflecting rate of this reflection shield is high, improves the brightness of lamp, and can reduce temperature gathering on LED luminescence unit, extends the service life of LED luminescence unit.
Brief description of the drawings
Fig. 1 is perspective view of the present utility model.
Fig. 2 is elevational schematic view of the present utility model.
Fig. 3 is circuit diagram of the present utility model.
Fig. 4 is the generalized section of the utility model reflection shield.
Shown in figure: 1, lamp housing, 2, lampshade, 3, LED luminescence unit; 4, reflection shield, 41, cover body, 42, prime coat; 43, vacuum plated aluminum film, 44, ultraviolet curing glue-line, 45, soot layer; 46, protective layer, 5, bonnet, 6, optical sensor; 7, pedestal, 7.1, circumscription socket groove, 7.2, plug; 8, lithium battery group, 9, infrared human body sensor.
Detailed description of the invention
Below in conjunction with accompanying drawing, embodiment is described in further detail the utility model.
This preferred embodiment is a kind of LED Projecting Lamp as depicted in figs. 1 and 2, it comprises lamp housing 1, lampshade 2, LED luminescence unit 3, reflection shield 4, drive circuit board (not shown) and bonnet 5, lamp housing 1 is provided with heat radiation fin, LED luminescence unit 3, reflection shield 4 and drive circuit board are located in lamp housing 1, the lampshade 2 being located at before LED luminescence unit 3 is tightly connected with lamp housing 1, and lamp housing 1 is tightly connected with bonnet 5; It is also provided with light sensing control circuit and normal bright on-off circuit, specifically as shown in Figure 3; Light sensing control circuit comprises that the transducing signal that is located on drive circuit board processes integrated chip and be located at the optical sensor 6 on lamp housing 1, and optical sensor 6 is electrically connected with transducing signal processing integrated chip; Normal bright on-off circuit is in parallel with light sensing control circuit.
It is U1 BISS0001 that transducing signal is processed integrated chip.
Also be provided with infrared control circuit, comprise infrared human body sensor 9, infrared human body sensor 9 is processed integrated chip with transducing signal and is electrically connected.
In addition, also comprise pedestal 7, pedestal 7 is located between lamp housing 1 and bonnet 5, and lamp housing 1 is tightly connected and refers to bonnet 5, and pedestal 7 is tightly connected with lamp housing 1 and bonnet 5 respectively; In pedestal 7, be provided with lithium battery group 8, lithium battery group 8 is electrically connected (not shown) with drive circuit board, is provided with the thermal insulation board (not shown) of cutting apart lithium battery group 8 and drive circuit board in pedestal 6; Infrared human body sensor 9 is located at the bottom of pedestal 7.The bottom of pedestal 7 is provided with circumscription socket groove 7.1, and the plug 7.2 of external power supply is located in circumscription socket groove 7.1, and between plug 7.2 and circumscription socket groove 7.1, sealing arranges.
As improvement, the substrate of LED luminescence unit 3 is made up of heat conduction reflect type Themoplastic molding materials, described heat conduction reflect type Themoplastic molding materials, mainly by unsaturated polyester resin fusion thermal conductivity filler, reflective filler, curing agent, diffusant, reinforcing agent and light stabilizer, can also add plasticizer and releasing agent in right amount; Heat conduction reflect type Themoplastic molding materials has good thermal diffusivity, reflective and insulating properties, can reduce temperature gathering on substrate, thereby extends the service life of LED luminescence unit 3.
The deal ratio of the formula one of heat conduction reflect type Themoplastic molding materials is:
Unsaturated polyester resin 100g
Thermal conductivity filler 60g
Reflective filler 60g
Methyl ethyl ketone peroxide solution (curing agent) 1ml
Cobalt iso-octoate solution (diffusant) 1ml
Superhigh molecular weight polyethylene fibers (reinforcing agent) 5g
O-hydroxyl-diphenyl ketone-rare earth complex (light stabilizer) 2.5g
After fully stirring, seethe with excitement after 5 minutes in vacuum chamber, be poured into normal temperature cure in mould, the thermal conductivity factor of the substrate made from the heat conduction reflect type Themoplastic molding materials of formula one is 1.7W/m. DEG C, whiteness 95, and sheet resistance is greater than 10 12ohm-sq centimetre.
The deal ratio of the formula two of heat conduction reflect type Themoplastic molding materials is:
Unsaturated polyester resin 100g
Thermal conductivity filler 60g
Reflective filler 60g
Methyl ethyl ketone peroxide solution (curing agent) 0.5ml
Cobalt iso-octoate solution (diffusant) 0.5ml
Superhigh molecular weight polyethylene fibers (reinforcing agent) 2g
O-hydroxyl-diphenyl ketone-rare earth complex (light stabilizer) 2g
After fully stirring, seethe with excitement after 5 minutes in vacuum chamber, be poured into normal temperature cure in mould, the thermal conductivity factor of the substrate made from the heat conduction reflect type Themoplastic molding materials of formula two is 1.7W/m. DEG C, whiteness 94, and sheet resistance is greater than 10 12ohm-sq centimetre.
The deal ratio of the formula three of heat conduction reflect type Themoplastic molding materials is:
Unsaturated polyester resin 100g
Thermal conductivity filler 80g
Reflective filler 80g
Methyl ethyl ketone peroxide solution (curing agent) 1.5ml
Cobalt iso-octoate solution (diffusant) 1.5ml
Superhigh molecular weight polyethylene fibers (reinforcing agent) 10g
O-hydroxyl-diphenyl ketone-rare earth complex (light stabilizer) 3g
After fully stirring, seethe with excitement after 5 minutes in vacuum chamber, be poured into normal temperature cure in mould, the thermal conductivity factor of the substrate made from the heat conduction reflect type Themoplastic molding materials of formula three is 1.8W/m. DEG C, whiteness 96, and sheet resistance is greater than 10 12ohm-sq centimetre.
In above-mentioned three group of formula, thermal conductivity filler is powder, is made up of the each portion of aluminium oxide, boron nitride and aluminium nitride aluminium oxide, boron nitride and aluminium nitride; Reflective filler is also powder, is made up of titanium dioxide and talcum powder, the each portion of mica powder titanium dioxide, talcum powder and mica powder; Superhigh molecular weight polyethylene fibers is purchased from Ningbo Dacheng New Material Co., Ltd; O-hydroxyl-diphenyl ketone-rare earth complex is developed by Guangdong University of Technology.
As improvement, reflection shield 4 comprises as shown in Figure 4 the cover body 41 that plastics are made and is distributed in successively from the inside to surface prime coat 42, vacuum plated aluminum film 43, ultraviolet curing glue-line 44, the soot layer 45 being coated on cover body 41 inner surfaces and the protective layer 46 of being made up of transparent epoxide-resin glue.The reflecting rate of this reflection shield 4 is high, improves the brightness of lamp, and can reduce temperature gathering on LED luminescence unit 3, extends the service life of LED luminescence unit 3.The concrete manufacture method of this reflection shield 4 is: a, be shaped to cover body 41 by plastics by Mold Making; B,, electrostatic precipitation clean to cover body 41 surfaces externally and internallies; C, at cover body 41 inner surfaces sprayings prime coats 42, then, with after infrared leveling, by irradiating with ultraviolet ray, prime coat 42 is dried; For covering trachoma, the pin hole on cover body 41 inner surfaces, be conducive to adhering to of vacuum plated aluminum film 43; D, form one deck vacuum plated aluminum film 43 on the surface of prime coat 42 by vacuum aluminium plating process; E, then smear the ultraviolet glue of one deck 10 μ m ~ 20 μ m at vacuum plated aluminum film 43 outer surfaces; F, the glass microballoon that then gathers on ultraviolet curing glue-line 44 again; G, then outside soot layer 45, smear layer of transparent epoxide-resin glue form protective layer 46; H, finally by ultraviolet lamp irradiate 30 ~ 60 seconds solidify.The reflecting rate of this reflection shield is high, improves the brightness of this LED Projecting Lamp, and can reduce temperature gathering on LED luminescence unit, extends the service life of LED luminescence unit.
In the present embodiment, the input voltage of this LED Projecting Lamp is AC100-240V, and frequency is 50-60Hz; Lithium battery group 8 is composed in series by 16 joints or 32 joint lithium ion batteries, and the charging voltage of lithium battery group 8 is AC100-240V, and frequency is 50-60Hz, and capacity is 32Ah or 64Ah; The power of LED luminescence unit 3 is 10W ~ 100W, and luminous flux is greater than 75LM/W, and colour temperature is 4000-4500K or 5000-6500K, and lighting angle is 120 ° (also can adjust reflection shield 4 by real needs); The induction range of infrared control circuit is that 5-10 rice is adjustable, and the default illuminance of light sensing control circuit is 0 ~ 10Lux(lux) adjustable.

Claims (6)

1. a LED Projecting Lamp, it comprises lamp housing (1), lampshade (2), LED luminescence unit (3), reflection shield (4), drive circuit board and bonnet (5), LED luminescence unit (3), reflection shield (4) and drive circuit board are located in lamp housing (1), be located at the front lampshade (2) of LED luminescence unit (3) and be tightly connected with lamp housing (1), lamp housing (1) is tightly connected with bonnet (5); It is characterized in that: it is also provided with light sensing control circuit and normal bright on-off circuit; Described smooth sensing control circuit comprises that the transducing signal that is located on drive circuit board processes integrated chip and be located at the optical sensor (6) on lamp housing (1), and described optical sensor (6) is electrically connected with transducing signal processing integrated chip; Described normal bright on-off circuit is in parallel with light sensing control circuit.
2. LED Projecting Lamp according to claim 1, is characterized in that: it is U1 BISS0001 that described transducing signal is processed integrated chip.
3. LED Projecting Lamp according to claim 2, is characterized in that: be also provided with infrared control circuit, comprise infrared human body sensor (9), described infrared human body sensor (9) is processed integrated chip with transducing signal and is electrically connected.
4. LED Projecting Lamp according to claim 3, it is characterized in that: also comprise pedestal (7), described pedestal (7) is located between lamp housing (1) and bonnet (5), described lamp housing (1) is tightly connected and refers to bonnet (5), and pedestal (7) is tightly connected with lamp housing (1) and bonnet (5) respectively; In described pedestal (7), be provided with lithium battery group (8), lithium battery group (8) is electrically connected with drive circuit board; Described infrared human body sensor (9) is located at the bottom of pedestal (7).
5. LED Projecting Lamp according to claim 4, it is characterized in that: the bottom of described pedestal (7) is provided with circumscription socket groove (7.1), the plug (7.2) of external power supply is located in circumscription socket groove (7.1), and between plug (7.2) and circumscription socket groove (7.1), sealing arranges.
6. LED Projecting Lamp according to claim 1, is characterized in that: described reflection shield (4) comprises the cover body (41) that plastics are made and is distributed in successively from the inside to surface prime coat (42), vacuum plated aluminum film (43), ultraviolet curing glue-line (44), the soot layer (45) being coated on cover body (41) inner surface and the protective layer (46) of being made up of transparent epoxide-resin glue.
CN201420329594.6U 2014-06-19 2014-06-19 LED projection lamp Expired - Fee Related CN203868910U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420329594.6U CN203868910U (en) 2014-06-19 2014-06-19 LED projection lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420329594.6U CN203868910U (en) 2014-06-19 2014-06-19 LED projection lamp

Publications (1)

Publication Number Publication Date
CN203868910U true CN203868910U (en) 2014-10-08

Family

ID=51649859

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420329594.6U Expired - Fee Related CN203868910U (en) 2014-06-19 2014-06-19 LED projection lamp

Country Status (1)

Country Link
CN (1) CN203868910U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104121539A (en) * 2014-06-19 2014-10-29 宁波恒剑光电科技有限公司 LED projection lamp

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104121539A (en) * 2014-06-19 2014-10-29 宁波恒剑光电科技有限公司 LED projection lamp

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20141008

Termination date: 20170619

CF01 Termination of patent right due to non-payment of annual fee