CN203868847U - Sensing type LED projection lamp - Google Patents
Sensing type LED projection lamp Download PDFInfo
- Publication number
- CN203868847U CN203868847U CN201420329420.XU CN201420329420U CN203868847U CN 203868847 U CN203868847 U CN 203868847U CN 201420329420 U CN201420329420 U CN 201420329420U CN 203868847 U CN203868847 U CN 203868847U
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- CN
- China
- Prior art keywords
- lamp housing
- type led
- sensor
- bonnet
- control circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/40—Control techniques providing energy savings, e.g. smart controller or presence detection
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The utility model discloses a sensing type LED projection lamp. The sensing type LED projection lamp has the advantages that an optical sensing control circuit and a time delay circuit are added, the optical sensing control circuit is mainly composed of an optical sensor and a sensing signal processing integrated chip, the illuminance can be preset, an optical sensing control circuit technology is adopted; only when the illuminance sensed by the optical sensor is lower than a preset illuminance value, under the restraint of the time delay circuit, the sensing signal processing integrated chip is controlled to stably improve illuminating brightness of an LED light-emitting unit step by step, starting stability of the LED light-emitting unit is guaranteed while electricity is saved, and the service life is prolonged.
Description
Technical field
The utility model relates to a kind of LED Projecting Lamp, especially relates to a kind of sensor-type LED Projecting Lamp.
Background technology
LED Projecting Lamp is that a kind of brightness is high, few illuminations consumes energy.Because LED Projecting Lamp can aim at any direction, and possesses the structure of the impact of climate condition not, for the illumination in the places such as contour of building, stadium, viaduct, monument, park and flower bed, conventionally, after reaching sometime, just open LED Projecting Lamp and throw light on.Yet because LED Projecting Lamp use amount increases, power consumption is unprecedented soaring, for saving electric energy, reasonably use LED Projecting Lamp, user has proposed LED Projecting Lamp to carry out light-operated demand.
Utility model content
What technical problem to be solved in the utility model was to provide a kind of using electricity wisely controls and opens stable sensor-type LED Projecting Lamp by photoinduction.
The utility model solves the problems of the technologies described above adopted technical scheme: a kind of sensor-type LED Projecting Lamp, it comprises LED luminescence unit, drive circuit board, lampshade, reflection shield, lamp housing and bonnet, LED luminescence unit, drive circuit board and reflection shield are located in lamp housing, the lampshade and the lamp housing that are located at before LED luminescence unit are tightly connected, and lamp housing and bonnet are tightly connected; It is also provided with light sensing control circuit and delay circuit, described delay circuit is electrically connected to external power supply and light sensing control circuit respectively, described smooth sensing control circuit comprises that the transducing signal that is located on drive circuit board processes integrated chip and be located at the optical sensor on lamp housing, and described optical sensor is electrically connected to transducing signal processing integrated chip.
Compared with prior art, the utility model has the advantage of and set up light sensing control circuit and delay circuit, light sensing control circuit is mainly processed integrated chip by optical sensor and transducing signal and is formed, can set in advance illuminance, adopt the technology of light sensing control circuit, the illuminance only sensing at optical sensor lower than set in advance illuminance value time, under the inhibition of delay circuit, control transducing signal and process progressively stable raising LED luminescence unit brightness of illumination of integrated chip, in using electricity wisely, guarantee the unlatching stability of LED luminescence unit, increase the service life.
As improvement, it is NE555 that described transducing signal is processed integrated chip.
As improvement, described reflection shield comprises the cover body that plastics are made and is distributed in successively from the inside to surface prime coat, vacuum plated aluminum film, ultraviolet curing glue-line, the soot layer being coated on cover body inner surface and the protective layer of being made by transparent epoxide-resin glue.The reflecting rate of this reflection shield is high, improves the brightness of lamp, and can reduce temperature gathering on LED luminescence unit, extends the service life of LED luminescence unit.
As improvement, also comprise pedestal, described pedestal is located between lamp housing and bonnet, and described lamp housing and bonnet are tightly connected and refer to, and pedestal is tightly connected with lamp housing and bonnet respectively; In described pedestal, be provided with lithium battery group, lithium battery group is electrically connected to drive circuit board.Make this LED Projecting Lamp there is stand-by power supply, when power system is broken down, can Emergency use.
As improvement, the bottom of described pedestal is provided with circumscription socket groove, and the plug of external power supply is located in circumscription socket groove, and between plug and circumscription socket groove, sealing arranges.Reduce to connect difficulty, install more convenient, and waterproof.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is elevational schematic view of the present utility model.
Fig. 3 is the circuit diagram of the utility model delay circuit and light sensing control circuit.
Fig. 4 is the generalized section of the utility model reflection shield.
Shown in figure: 1, lamp housing, 2, lampshade, 3, LED luminescence unit; 4, reflection shield, 41, cover body, 42, prime coat; 43, vacuum plated aluminum film, 44, ultraviolet curing glue-line, 45, soot layer; 46, protective layer, 5, bonnet, 6, optical sensor; 7, pedestal; 7.1, circumscription socket groove, 7.2, plug, 8, lithium battery group.
The specific embodiment
Below in conjunction with accompanying drawing, embodiment is described in further detail the utility model.
This preferred embodiment is a kind of sensor-type LED Projecting Lamp as depicted in figs. 1 and 2, comprise lamp housing 1, lampshade 2, LED luminescence unit 3, reflection shield 4, drive circuit board and bonnet 5, lamp housing 1 rear portion is provided with the heat radiation fin for lowering the temperature, LED luminescence unit 3, reflection shield 4 and drive circuit board are located in lamp housing 1, the lampshade 2 being located at before LED luminescence unit 3 is connected by sealant sealing with lamp housing 1, and lamp housing 1 is tightly connected with bonnet 5; Also be provided with light sensing control circuit and delay circuit, as shown in Figure 3, delay circuit is electrically connected to external power supply and light sensing control circuit respectively, light sensing control circuit comprises the transducing signal processing integrated chip being located on drive circuit board and is located at optical sensor 6(or the photo resistance on lamp housing 1), optical sensor 6 is processed integrated chip with transducing signal and is electrically connected to.
It is NE555 that transducing signal is processed integrated chip.
As improvement, reflection shield 4 comprises as shown in Figure 4 the cover body 41 that plastics are made and is distributed in successively from the inside to surface prime coat 42, vacuum plated aluminum film 43, ultraviolet curing glue-line 44, the soot layer 45 being coated on cover body 41 inner surfaces and the protective layer 46 of being made by transparent epoxide-resin glue.The reflecting rate of this reflection shield 4 is high, improves the brightness of lamp, and can reduce temperature gathering on LED luminescence unit 3, extends the service life of LED luminescence unit 3.The concrete manufacture method of this reflection shield 4 is: a, by plastics, by Mold Making, be shaped to cover body 41; B,, electrostatic precipitation clean to cover body 41 surfaces externally and internallies; C, at cover body 41 inner surfaces sprayings prime coats 42, then, with after infrared leveling, by irradiating with ultraviolet ray, prime coat 42 is dried; For covering trachoma, the pin hole on cover body 41 inner surfaces, be conducive to adhering to of vacuum plated aluminum film 43; D, by vacuum aluminium plating process, on the surface of prime coat 42, form one deck vacuum plated aluminum film 43; E, then at vacuum plated aluminum film 43 outer surfaces, smear the ultraviolet glue of one deck 10 μ m ~ 20 μ m; F, the glass microballoon that then gathers on ultraviolet curing glue-line 44 again; G, the epoxide-resin glue of then smearing layer of transparent outside soot layer 45 form protective layer 46; H, finally by ultraviolet lamp, irradiate and solidify for 30 ~ 60 seconds.The reflecting rate of this reflection shield is high, improves the brightness of this LED Projecting Lamp, and can reduce temperature gathering on LED luminescence unit, extends the service life of LED luminescence unit.
As improvement, the substrate of LED luminescence unit 3 is made by heat conduction reflect type Themoplastic molding materials, described heat conduction reflect type Themoplastic molding materials, mainly by unsaturated polyester resin fusion thermal conductivity filler, reflective filler, curing agent, diffusant, reinforcing agent and light stabilizer, can also add plasticizer and releasing agent in right amount; Heat conduction reflect type Themoplastic molding materials has good thermal diffusivity, reflective and insulating properties, can reduce temperature gathering on substrate, thereby extends the service life of LED luminescence unit 3.
The deal ratio of the formula one of heat conduction reflect type Themoplastic molding materials is:
Unsaturated polyester resin 100g
Thermal conductivity filler 60g
Reflective filler 60g
Methyl ethyl ketone peroxide solution (curing agent) 1ml
Cobalt iso-octoate solution (diffusant) 1ml
Superhigh molecular weight polyethylene fibers (reinforcing agent) 5g
O-hydroxyl-diphenyl ketone-rare earth complex (light stabilizer) 2.5g
After fully stirring, seethe with excitement after 5 minutes in vacuum chamber, be poured into normal temperature cure in mould, the thermal conductivity factor of the substrate made from the heat conduction reflect type Themoplastic molding materials of formula one is 1.7W/m. ℃, whiteness 95, and sheet resistance is greater than 10
12ohm-sq centimetre.
The deal ratio of the formula two of heat conduction reflect type Themoplastic molding materials is:
Unsaturated polyester resin 100g
Thermal conductivity filler 60g
Reflective filler 60g
Methyl ethyl ketone peroxide solution (curing agent) 0.5ml
Cobalt iso-octoate solution (diffusant) 0.5ml
Superhigh molecular weight polyethylene fibers (reinforcing agent) 2g
O-hydroxyl-diphenyl ketone-rare earth complex (light stabilizer) 2g
After fully stirring, seethe with excitement after 5 minutes in vacuum chamber, be poured into normal temperature cure in mould, the thermal conductivity factor of the substrate made from the heat conduction reflect type Themoplastic molding materials of formula two is 1.7W/m. ℃, whiteness 94, and sheet resistance is greater than 10
12ohm-sq centimetre.
The deal ratio of the formula three of heat conduction reflect type Themoplastic molding materials is:
Unsaturated polyester resin 100g
Thermal conductivity filler 80g
Reflective filler 80g
Methyl ethyl ketone peroxide solution (curing agent) 1.5ml
Cobalt iso-octoate solution (diffusant) 1.5ml
Superhigh molecular weight polyethylene fibers (reinforcing agent) 10g
O-hydroxyl-diphenyl ketone-rare earth complex (light stabilizer) 3g
After fully stirring, seethe with excitement after 5 minutes in vacuum chamber, be poured into normal temperature cure in mould, the thermal conductivity factor of the substrate made from the heat conduction reflect type Themoplastic molding materials of formula three is 1.8W/m. ℃, whiteness 96, and sheet resistance is greater than 10
12ohm-sq centimetre.
In above-mentioned three group of formula, thermal conductivity filler is that powder is comprised of aluminium oxide, boron nitride and aluminium nitride, each portion of aluminium oxide, boron nitride and aluminium nitride; Reflective filler is comprised of titanium dioxide, talcum powder and mica powder, titanium dioxide and talcum powder, each portion of mica powder; Superhigh molecular weight polyethylene fibers buying is from Ningbo Dacheng New Material Co., Ltd; O-hydroxyl-diphenyl ketone-rare earth complex is developed by Guangdong University of Technology.
In addition, be also provided with pedestal 7, pedestal 7 is located between lamp housing 1 and bonnet 5, and lamp housing 1 is tightly connected and refers to bonnet 5, and pedestal 7 is tightly connected with lamp housing 1 and bonnet 5 respectively; In pedestal 7, be provided with lithium battery group 8, lithium battery group 8 is electrically connected to drive circuit board, is provided with the thermal insulation board (not shown) of cutting apart lithium battery group 8 and drive circuit board in pedestal 7.The bottom of pedestal 7 is provided with circumscription socket groove 7.1, be connected with external power supply plug 7.2 be located in circumscription socket groove 7.1, between plug 7.2 and circumscription socket groove 7.1, sealing arranges.
In the present embodiment, the input voltage of this LED Projecting Lamp is AC100-240V, and frequency is 50-60Hz; The power of LED luminescence unit 3 is 10W ~ 100W, and luminous flux is greater than 75LM/W, and colour temperature is 4000-4500K or 5000-6500K, and lighting angle is 120 ° (also can adjust reflection shield 4 by real needs); Illuminance is 0 ~ 10Lux(lux) adjustable.
Operation principle:
In light sensing control circuit, by regulator potentiometer voltage, when the magnitude of voltage that the illumination brightness receiving when optical sensor 6 produces surpasses the magnitude of voltage of potentiometer setting, electric current after adjusting by operational amplifier too a little less than, be not enough to start transducing signal and process integrated chip, LED luminescence unit is not lighted, and the magnitude of voltage that the illumination brightness receiving when optical sensor 6 produces is while being less than the magnitude of voltage that potentiometer arranges, current start transducing signal by operational amplifier is processed integrated chip, LED luminescence unit is lighted luminous.
Claims (5)
1. a sensor-type LED Projecting Lamp, it comprises lamp housing (1), lampshade (2), LED luminescence unit (3), reflection shield (4), drive circuit board and bonnet (5), LED luminescence unit (3), reflection shield (4) and drive circuit board are located in lamp housing (1), be located at the front lampshade (2) of LED luminescence unit (3) and be tightly connected with lamp housing (1), lamp housing (1) is tightly connected with bonnet (5); It is characterized in that: it is also provided with light sensing control circuit and delay circuit, described delay circuit is electrically connected to external power supply and light sensing control circuit respectively, described smooth sensing control circuit comprises that the transducing signal that is located on drive circuit board processes integrated chip and be located at the optical sensor (6) on lamp housing (1), and described optical sensor (6) is electrically connected to transducing signal processing integrated chip.
2. sensor-type LED Projecting Lamp according to claim 1, is characterized in that: it is NE555 that described transducing signal is processed integrated chip.
3. sensor-type LED Projecting Lamp according to claim 2, is characterized in that: described reflection shield (4) comprises the cover body (41) that plastics are made and is distributed in successively from the inside to surface prime coat (42), vacuum plated aluminum film (43), ultraviolet curing glue-line (44), the soot layer (45) being coated on cover body (41) inner surface and the protective layer (46) of being made by transparent epoxide-resin glue.
4. sensor-type LED Projecting Lamp according to claim 3, it is characterized in that: also comprise pedestal (7), described pedestal (7) is located between lamp housing (1) and bonnet (5), described lamp housing (1) is tightly connected and refers to bonnet (5), and pedestal (7) is tightly connected with lamp housing (1) and bonnet (5) respectively; In described pedestal (7), be provided with lithium battery group (8), lithium battery group (8) is electrically connected to drive circuit board.
5. sensor-type LED Projecting Lamp according to claim 4, it is characterized in that: the bottom of described pedestal (7) is provided with circumscription socket groove (7.1), be connected with external power supply plug (7.2) be located in circumscription socket groove (7.1), between plug (7.2) and circumscription socket groove (7.1), sealing arranges.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420329420.XU CN203868847U (en) | 2014-06-19 | 2014-06-19 | Sensing type LED projection lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420329420.XU CN203868847U (en) | 2014-06-19 | 2014-06-19 | Sensing type LED projection lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203868847U true CN203868847U (en) | 2014-10-08 |
Family
ID=51649797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420329420.XU Expired - Fee Related CN203868847U (en) | 2014-06-19 | 2014-06-19 | Sensing type LED projection lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203868847U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104033794A (en) * | 2014-06-19 | 2014-09-10 | 宁波恒剑光电科技有限公司 | Sensing type LED (light emitting diode) projection lamp |
-
2014
- 2014-06-19 CN CN201420329420.XU patent/CN203868847U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104033794A (en) * | 2014-06-19 | 2014-09-10 | 宁波恒剑光电科技有限公司 | Sensing type LED (light emitting diode) projection lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141008 Termination date: 20170619 |