CN203858220U - Device used for testing heat dissipation performances of LED (light emitting diode) superconducting plates - Google Patents
Device used for testing heat dissipation performances of LED (light emitting diode) superconducting plates Download PDFInfo
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- CN203858220U CN203858220U CN201420186159.2U CN201420186159U CN203858220U CN 203858220 U CN203858220 U CN 203858220U CN 201420186159 U CN201420186159 U CN 201420186159U CN 203858220 U CN203858220 U CN 203858220U
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Abstract
The utility model belongs to the technical field of heat testing equipment and in particular relates to a device used for testing heat dissipation performances of LED (light emitting diode) superconducting plates, solving the technical problem that the heat dissipation performances of heat dissipation plates cannot be tested in the prior art. The device comprises a test cabinet with a workbench, wherein the workbench is horizontally arranged; a base and a heat conducting mechanism arranged above the base are arranged on the workbench; the base is made from heat insulating materials; a fixed support is arranged on the workbench; the heat conducting mechanism is arranged on the fixed support and is connected with a cyclic heat exchange mechanism; an installing slot and a heating mechanism arranged in the installing slot are formed in the central area of the upper surface of the base; the heating mechanism is connected with a power line; a line passing slot for leading out the power line is formed in the base; and a temperature sensor is arranged on the heating mechanism. The device has the advantages that the device can test the heat dissipation performances and has strong practicability.
Description
Technical field
The utility model belongs to hot testing apparatus technical field, relates in particular to a kind of for testing the proving installation of LED superconductive plate heat dispersion.
Background technology
LED module is the wider product of application in LED product, aspect configuration aspects and electronics, also there is very large difference, simply with a wiring board that LED is housed, just become a LED module with shell exactly, complicated just add that some control, constant current source and relevant radiating treatment make the LED life-span and luminous intensity better.At present, existing LED module has heat sink (being equal to the LED superconductive plate with the application) on it, and the heat dispersion of this heat sink directly affects the stable of whole LED module; In order to guarantee to have stable heat dispersion after heat sink is installed, existing proving installation can only be the serviceable life of the whole LED module of test or LED product, and it not only cannot measure the thermal diffusivity of heat sink, and testing efficiency is lower; For this reason, people have carried out long-term exploration, have proposed various solutions.
For example, Chinese patent literature discloses a kind of opto-electronic testing apparatus [application number: 200820088089.1], comprises integrating sphere, adjustable vertical rod, probe, spanner, built-up circuit box, heat radiation push rod, tested LED lamp, pressing plate, clamp body, clamping fixture seat, guide rail, spanner is wherein positioned at the right side of device, and clamping fixture seat is Elastic Contact, and clamping fixture seat is arranged on guide rail, clamping fixture seat can slide along guide rail direction on guide rail.
Above-mentioned scheme has been improved prior art to a certain extent, but this scheme still cannot be tested the heat dispersion of LED heat sink, cannot guarantee to have stable heat dispersion after heat sink is installed, thereby use, there is hidden danger, secondly, complex structure and the testing efficiency of complete machine are low, poor practicability.
Summary of the invention
The purpose of this utility model is for the problems referred to above, provides a kind of and can test thermal diffusivity and practical for testing the proving installation of LED superconductive plate heat dispersion.
For achieving the above object, the utility model has adopted following technical proposal: this comprises the test cabinet with worktable for testing the proving installation of LED superconductive plate heat dispersion, worktable level arranges, on worktable, be provided with the base made by thermal insulation material and be arranged on the heat-conducting mechanism above base, on worktable, be provided with fixed support, described heat-conducting mechanism is arranged on fixed support Shang Qieyu cycle heat exchange mechanism and is connected, in base upper surface central area, have mounting groove and be located at the heating arrangements in mounting groove, described heating arrangements is connected with power lead and on base, is provided with the crossed beam trunking that power supply source line is drawn, on heating arrangements, be provided with temperature sensor, described heat-conducting mechanism, cycle heat exchange mechanism, heating arrangements is connected with control gear respectively with temperature sensor.The temperature of temperature sensor for testing LED superconductive plate, control gear comprises any one in PLC and single-chip microcomputer.
In this application, the heat that LED superconductive plate absorbs heating arrangements generation is equivalent to the heat that LED superconductive plate absorbs power supply terminal generation when reality is used, the heat that heat-conducting mechanism absorbs is equivalent to be located at the heat that the LED light source on LED superconductive plate distributes, mode by simulation is tested the heat dispersion of LED superconductive plate by temperature sensor, thereby there is stable heat dispersion after guaranteeing to install, cycle heat exchange mechanism can guarantee the temperature constant of heat-conducting mechanism, further guarantee the accuracy of test structure, guarantee the application's practicality.
Above-mentioned for testing the proving installation of LED superconductive plate heat dispersion, described heat-conducting mechanism comprises horizontally disposed heat-conducting plate and is coated on the aluminium foil layer on heat-conducting plate, between heat-conducting plate and aluminium foil layer, be provided with heat conductive silica gel, on fixed support, be provided with and can drive described heat-conducting plate at the lift cylinder of vertical direction lifting, on heat-conducting plate, be provided with holder, on fixed support, be provided with cylinder positioning seat, described lift cylinder is fixed on cylinder positioning seat and its piston rod is connected with holder, between described holder and cylinder positioning seat, is provided with guide frame.
Above-mentioned, for testing the proving installation of LED superconductive plate heat dispersion, described guide frame comprises the guide pole of some vertical settings, and the lower end of guide pole is fixed on holder, and upper end is located in the orienting sleeve of cylinder positioning seat.
Above-mentioned, for testing the proving installation of LED superconductive plate heat dispersion, described heat-conducting plate is provided with the logical circulation passage of current, the logical circulation passage of described current take the shape of the letter U and S shape in any one.
Above-mentioned for testing the proving installation of LED superconductive plate heat dispersion, described cycle heat exchange mechanism comprises heat-exchanging water tank, on heat-exchanging water tank, be provided with rising pipe and return pipe, described rising pipe water side is connected to the water inlet of the logical circulation passage of current, the water inlet end of return pipe is connected to the water return outlet of the logical circulation passage of current, on rising pipe, be provided with outlet valve, on return pipe, be provided with back-water valve (BWV).
Above-mentioned, for testing the proving installation of LED superconductive plate heat dispersion, described heating arrangements comprises the electric heating body being arranged in mounting groove, at the center, upper surface of electric heating body, is provided with boss, and described temperature sensor is arranged on boss.
Above-mentioned, for testing the proving installation of LED superconductive plate heat dispersion, described electric heating body is square and its upper surface protrudes from the notch of mounting groove.
Compared with prior art, this is for testing the advantage of the proving installation of LED superconductive plate heat dispersion: 1, it is more reasonable to design, the heat that LED superconductive plate absorbs heating arrangements generation is equivalent to the heat that LED superconductive plate absorbs power supply terminal generation when reality is used, the heat that heat-conducting mechanism absorbs is equivalent to be located at the heat that the LED light source on LED superconductive plate distributes, mode by simulation is tested the heat dispersion of LED superconductive plate by temperature sensor, thereby there is stable heat dispersion after guaranteeing to install, cycle heat exchange mechanism can guarantee the temperature constant of heat-conducting mechanism, further guarantee the accuracy of test structure, guarantee the application's practicality, 2, simple in structure and be easy to control.
Accompanying drawing explanation
Fig. 1 is the structural representation that the utility model provides.
Fig. 2 is the heat-conducting plate structure schematic diagram that the utility model provides.
Fig. 3 is the framed structure schematic diagram that the utility model provides.
In figure, test cabinet 1, worktable 1a, base 2, mounting groove 21, crossed beam trunking 22, heat-conducting mechanism 3, heat-conducting plate 31, the logical circulation passage 31a of current, aluminium foil layer 32, heat conductive silica gel 33, lift cylinder 34, holder 35, guide pole 35a, cylinder positioning seat 36, orienting sleeve 36a, fixed support 4, cycle heat exchange mechanism 5, heat-exchanging water tank 51, rising pipe 52, outlet valve 52a, return pipe 53, back-water valve (BWV) 53a, heating arrangements 6, power lead 6a, electric heating body 61, boss 62, temperature sensor 7.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention will be further described in detail.
As Figure 1-3, this comprises the test cabinet 1 with worktable 1a for testing the proving installation of LED superconductive plate heat dispersion, worktable 1a is horizontally disposed with, on worktable 1a, be provided with the base 2 of being made by thermal insulation material and be arranged on the heat-conducting mechanism 3 above base 2, on worktable 1a, be provided with fixed support 4, described heat-conducting mechanism 3 is arranged on fixed support 4 Shang Qieyu cycle heat exchange mechanisms 5 and is connected, in base 2 upper surface central areas, have mounting groove 21 and be located at the heating arrangements 6 in mounting groove 21, described heating arrangements 6 is connected with power lead 6a and on base 2, is provided with the crossed beam trunking 22 that power supply source line 6a draws, on heating arrangements 6, be provided with temperature sensor 7, described heat-conducting mechanism 3, cycle heat exchange mechanism 5, heating arrangements 6 is connected with control gear 8 respectively with temperature sensor 7, control gear 8 comprises any one in PLC and single-chip microcomputer.
The heat-conducting mechanism 3 of the present embodiment comprises horizontally disposed heat-conducting plate 31 and is coated on the aluminium foil layer 32 on heat-conducting plate 31, between heat-conducting plate 31 and aluminium foil layer 32, be provided with heat conductive silica gel 33, on fixed support 4, be provided with and can drive described heat-conducting plate 31 at the lift cylinder 34 of vertical direction lifting, on heat-conducting plate 31, be provided with holder 35, on fixed support 4, be provided with cylinder positioning seat 36, described lift cylinder 34 is fixed on cylinder positioning seat 36 and its piston rod is connected with holder 35, between described holder 35 and cylinder positioning seat 36, is provided with guide frame.
Prioritization scheme, the guide frame of the present embodiment comprises the guide pole 35a of some vertical settings, and the lower end of guide pole 35a is fixed on holder 35, and upper end is located in the orienting sleeve 36a of cylinder positioning seat 36.
On the heat-conducting plate 31 of the present embodiment, be provided with the logical circulation passage 31a of current, the logical circulation passage 31a of described current take the shape of the letter U and S shape in any one.In addition, cycle heat exchange mechanism 5 comprises heat-exchanging water tank 51, on heat-exchanging water tank 51, be provided with rising pipe 52 and return pipe 53, described rising pipe 52 water sides are connected to the water inlet of the logical circulation passage 31a of current, the water inlet end of return pipe 53 is connected to the water return outlet of the logical circulation passage 31a of current, on rising pipe 52, be provided with outlet valve 52a, on return pipe 53, be provided with back-water valve (BWV) 53a.
The heating arrangements 6 of the present embodiment comprises the electric heating body 61 being arranged in mounting groove 21, at the center, upper surface of electric heating body 61, is provided with boss 62, and described temperature sensor 7 is arranged on boss 62.This electric heating body 61 is square and its upper surface protrudes from the notch of mounting groove 21.
The principle of work of the present embodiment is as follows: the heat that LED superconductive plate absorbs heating arrangements generation is equivalent to the heat that LED superconductive plate absorbs power supply terminal generation when reality is used, the heat that heat-conducting mechanism absorbs is equivalent to be located at the heat that the LED light source on LED superconductive plate distributes, mode by simulation is tested the heat dispersion of LED superconductive plate by temperature sensor, thereby there is stable heat dispersion after guaranteeing to install, cycle heat exchange mechanism can guarantee the temperature constant of heat-conducting mechanism, further guarantee the accuracy of test structure, guarantee the application's practicality.
Specific embodiment described herein is only to the explanation for example of the utility model spirit.The utility model person of ordinary skill in the field can make various modifications or supplements or adopt similar mode to substitute described specific embodiment, but can't depart from spirit of the present utility model or surmount the defined scope of appended claims.
Although more used test cabinet 1 herein, worktable 1a, base 2, mounting groove 21, crossed beam trunking 22, heat-conducting mechanism 3, heat-conducting plate 31, current lead to circulation passage 31a, aluminium foil layer 32, heat conductive silica gel 33, lift cylinder 34, holder 35, guide pole 35a, cylinder positioning seat 36, orienting sleeve 36a, fixed support 4, cycle heat exchange mechanism 5, heat-exchanging water tank 51, rising pipe 52, outlet valve 52a, return pipe 53, back-water valve (BWV) 53a, heating arrangements 6, power lead 6a, electric heating body 61, boss 62, temperature sensor 7 terms such as grade, but do not get rid of the possibility of using other term.Use these terms to be only used to describe more easily and explain essence of the present utility model; They are construed to any additional restriction is all contrary with the utility model spirit.
Claims (7)
1. one kind for testing the proving installation of LED superconductive plate heat dispersion, comprise the there is worktable test cabinet (1) of (1a), worktable (1a) is horizontally disposed with, it is characterized in that, described worktable (1a) is provided with the base (2) of being made by thermal insulation material and is arranged on the heat-conducting mechanism (3) of base (2) top, on worktable (1a), be provided with fixed support (4), described heat-conducting mechanism (3) is arranged on fixed support (4) Shang Qieyu cycle heat exchange mechanism (5) and is connected, in base (2) upper surface central area, have mounting groove (21) and be located at the heating arrangements (6) in mounting groove (21), described heating arrangements (6) is connected with power lead (6a) and on base (2), is provided with the crossed beam trunking (22) that power supply source line (6a) is drawn, on heating arrangements (6), be provided with temperature sensor (7), described heat-conducting mechanism (3), cycle heat exchange mechanism (5), heating arrangements (6) is connected with control gear (8) respectively with temperature sensor (7).
2. according to claim 1 for testing the proving installation of LED superconductive plate heat dispersion, it is characterized in that, described heat-conducting mechanism (3) comprises horizontally disposed heat-conducting plate (31) and is coated on the aluminium foil layer (32) on heat-conducting plate (31), between heat-conducting plate (31) and aluminium foil layer (32), be provided with heat conductive silica gel (33), on fixed support (4), be provided with and can drive described heat-conducting plate (31) at the lift cylinder (34) of vertical direction lifting, on heat-conducting plate (31), be provided with holder (35), on fixed support (4), be provided with cylinder positioning seat (36), described lift cylinder (34) is fixed on cylinder positioning seat (36) above and its piston rod is connected with holder (35), between described holder (35) and cylinder positioning seat (36), be provided with guide frame.
3. according to claim 2 for testing the proving installation of LED superconductive plate heat dispersion, it is characterized in that, described guide frame comprises the guide pole (35a) of some vertical settings, it is upper that the lower end of guide pole (35a) is fixed on holder (35), and upper end is located in the orienting sleeve (36a) of cylinder positioning seat (36).
According to described in claim 2 or 3 for testing the proving installation of LED superconductive plate heat dispersion, it is characterized in that, described heat-conducting plate (31) is provided with the logical circulation passage (31a) of current, the logical circulation passage (31a) of described current take the shape of the letter U and S shape in any one.
5. according to claim 4 for testing the proving installation of LED superconductive plate heat dispersion, it is characterized in that, described cycle heat exchange mechanism (5) comprises heat-exchanging water tank (51), on heat-exchanging water tank (51), be provided with rising pipe (52) and return pipe (53), described rising pipe (52) water side is connected to the water inlet of the logical circulation passage (31a) of current, the water inlet end of return pipe (53) is connected to the water return outlet of the logical circulation passage (31a) of current, on rising pipe (52), be provided with outlet valve (52a), on return pipe (53), be provided with back-water valve (BWV) (53a).
According to described in claim 1 or 2 or 3 for testing the proving installation of LED superconductive plate heat dispersion, it is characterized in that, described heating arrangements (6) comprises the electric heating body (61) being arranged in mounting groove (21), at the center, upper surface of electric heating body (61), be provided with boss (62), described temperature sensor (7) is arranged on boss (62).
7. according to claim 6ly for testing the proving installation of LED superconductive plate heat dispersion, it is characterized in that, described electric heating body (61) is square and its upper surface protrudes from the notch of mounting groove (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420186159.2U CN203858220U (en) | 2014-04-17 | 2014-04-17 | Device used for testing heat dissipation performances of LED (light emitting diode) superconducting plates |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420186159.2U CN203858220U (en) | 2014-04-17 | 2014-04-17 | Device used for testing heat dissipation performances of LED (light emitting diode) superconducting plates |
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| CN203858220U true CN203858220U (en) | 2014-10-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420186159.2U Expired - Fee Related CN203858220U (en) | 2014-04-17 | 2014-04-17 | Device used for testing heat dissipation performances of LED (light emitting diode) superconducting plates |
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| CN (1) | CN203858220U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107607850A (en) * | 2017-09-21 | 2018-01-19 | 重庆秉为科技有限公司 | A kind of radiation performance of semiconductor lighting product detection means |
| CN112638124A (en) * | 2020-12-16 | 2021-04-09 | 烟台职业学院 | Integrated circuit heat sink |
| CN116819289A (en) * | 2023-08-29 | 2023-09-29 | 法特迪精密科技（苏州）有限公司 | Chip aging testing device |
-
2014
- 2014-04-17 CN CN201420186159.2U patent/CN203858220U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107607850A (en) * | 2017-09-21 | 2018-01-19 | 重庆秉为科技有限公司 | A kind of radiation performance of semiconductor lighting product detection means |
| CN112638124A (en) * | 2020-12-16 | 2021-04-09 | 烟台职业学院 | Integrated circuit heat sink |
| CN116819289A (en) * | 2023-08-29 | 2023-09-29 | 法特迪精密科技（苏州）有限公司 | Chip aging testing device |
| CN116819289B (en) * | 2023-08-29 | 2023-11-14 | 法特迪精密科技（苏州）有限公司 | Chip aging testing device |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141001 Termination date: 20170417 |
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| CF01 | Termination of patent right due to non-payment of annual fee |