CN203849755U - High-frequency low-frequency composite-type intelligent card - Google Patents
High-frequency low-frequency composite-type intelligent card Download PDFInfo
- Publication number
- CN203849755U CN203849755U CN201420248936.1U CN201420248936U CN203849755U CN 203849755 U CN203849755 U CN 203849755U CN 201420248936 U CN201420248936 U CN 201420248936U CN 203849755 U CN203849755 U CN 203849755U
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- frequency
- low
- intelligent card
- mounting groove
- combined intelligent
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Abstract
The utility model discloses a high-frequency low-frequency composite-type intelligent card, which comprises a shell, a high-frequency module and a low-frequency module, wherein the shell is internally provided with a mounting cavity and two opposite mounting faces; the high-frequency module and the low-frequency module are arranged inside the mounting cavity and are fixed on the mounting faces in a bonding mode. Thus, the structure of the high-frequency low-frequency composite-type intelligent card is simple, correspondingly, the production technology is simplified, the reject ratio is reduced, and in addition, the high-frequency low-frequency composite-type intelligent card is not likely to bend as the shell structure is adopted.
Description
Technical field
The utility model relates to a kind of smart card, is specifically related to a kind of low-and high-frequency combined intelligent card.
Background technology
Originally smart card is all generally one working frequency, or be low frequency 125KHZ, high frequency 13.56MHZ, widespread use along with smart card, a kind of smart card that low frequency and two kinds of smart cards of high frequency are united two into one of the market demand, low frequency in the market adds the composite intelligent card of high frequency, is all to adopt the conventional PVC material of 85.5*54mm size to do, yet this composite intelligent card has following shortcoming:
1, manufacture operation many, need to pass through coiling, welding, location, inlay lamination, finished product lamination, several procedures such as die-cut;
2, in production run, fraction defective is high, and after inlay lamination and finished product lamination two procedures, the highest meeting of fraction defective reaches more than 5%, and lamination is a kind of irreversible technique, if find to damage to keep in repair, makes up;
3, easily bending damages.
Utility model content
Fundamental purpose of the present utility model is to provide a kind of low-and high-frequency combined intelligent card, is intended to solve the current smart card complex manufacturing of employing, produces the problem that fraction defective is low and easy bending damages.
For achieving the above object, the low-and high-frequency combined intelligent card that the utility model provides comprises housing, high frequency module and low frequency module, described enclosure interior has installation cavity and two relative installed surfaces, described high frequency module and described low frequency module are placed in described installation cavity, and are fixed on described installed surface by bonding way.
Preferably, described high frequency module comprises radio-frequency coil and high frequency chip, and described radio-frequency coil has 2 first lead-in wires that are positioned at its inner side, and described high frequency chip and described 2 first lead-in wires are electrically connected.
Preferably, described low frequency module comprises low-frequency coil and low frequency chip, and described low-frequency coil has 2 second lead-in wires that are positioned at its inner side, and described low frequency chip and described 2 second lead-in wires are electrically connected.
Preferably, described high frequency module comprises radio-frequency coil and high frequency chip, and described radio-frequency coil has 2 first lead-in wires that are positioned at its inner side, and described high frequency chip and described 2 first lead-in wires are electrically connected, and described low-frequency coil is positioned at the inner side of described radio-frequency coil.
Preferably, the installed surface of described housing offers the annular mounting groove of installing for described radio-frequency coil and the circular mounting groove of installing for described low-frequency coil.
Preferably, described annular mounting groove and described circular mounting groove are located at respectively on described two installed surfaces.
Preferably, the installed surface that described housing is provided with annular mounting groove offers the circular slot to make way of corresponding described low-frequency coil and offers and is communicated with the bit ports that allow of thinking that described 2 first lead-in wires step down for described annular mounting groove and described circular slot to make way, and the corresponding described radio-frequency coil of installed surface that described housing is provided with circular mounting groove offers annular slot to make way.
Preferably, between described annular mounting groove and described circular slot to make way, form the first annular boss, between described annular slot to make way and described circular mounting groove, form the second annular boss, described the first annular boss and described the second annular boss connect.
Preferably, described housing has the perforation hanging for key ring.
Preferably, described housing comprises drain pan and upper cover, and two that described drain pan is relative with described upper cover is described two installed surfaces, and the installed surface of described high frequency module and described drain pan is bonding, and the installed surface of described low frequency module and described upper cover is bonding.
The low-and high-frequency combined intelligent card that the utility model provides comprises housing, high frequency module and low frequency module, described enclosure interior has installation cavity and two relative installed surfaces, described high frequency module and described low frequency module are placed in described installation cavity, and be fixed on described installed surface by bonding way, thereby, described low-and high-frequency combined intelligent card structure is simple, correspondingly, production technology is simplified and fraction defective reduces, in addition, because adopting shell structure, described low-and high-frequency combined intelligent card is difficult for bending.
Accompanying drawing explanation
Fig. 1 is the structural representation of the first embodiment of the low-and high-frequency combined intelligent card that the utility model proposes;
Fig. 2 is the cross-sectional schematic of the low-and high-frequency combined intelligent card shown in Fig. 1;
Fig. 3 is the drain pan of the low-and high-frequency combined intelligent card shown in Fig. 1 and the structural representation of high frequency assembly;
Fig. 4 is the upper cover of low-and high-frequency combined intelligent card shown in Fig. 1 and the structural representation of low frequency assembly.
The realization of the utility model object, functional characteristics and advantage, in connection with embodiment, are described further with reference to accompanying drawing.
Embodiment
Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
The utility model provides a kind of low-and high-frequency combined intelligent card, in one embodiment of the low-and high-frequency combined intelligent card 100 providing in Fig. 1 to Fig. 4 the utility model, described low-and high-frequency combined intelligent card 100 comprises housing 1, high frequency module 2 and low frequency module 3, wherein, described housing 1 inside has installation cavity (not label) and relative two installed surfaces (not label), described high frequency module 2 and described low frequency module 3 are placed in described installation cavity, and be fixed on described installed surface by bonding way (can be bonding by glue or thermosol), thereby, described low-and high-frequency combined intelligent card 100 is simple in structure, correspondingly, production technology is simplified and fraction defective reduces, and, because described low-and high-frequency combined intelligent card 100 adopts shell structure to be difficult for bending.
In the present embodiment, described high frequency module 2 comprises radio-frequency coil 21 and high frequency chip 22, wherein, described radio-frequency coil 21 has 2 first lead-in wires 211 that are positioned at its inner side, described high frequency chip 22 is electrically connected (mode that can pass through welding) with described 2 first lead-in wires 211, described low frequency module 3 comprises low-frequency coil 31 and low frequency chip 32, wherein, described low-frequency coil 31 has 2 second lead-in wires 311 that are positioned at its inner side, and described low frequency chip 32 is electrically connected (can by the mode of welding) with described 2 second lead-in wires 311.Further, in the present embodiment, described low-frequency coil 31 is positioned at the inner side of described radio-frequency coil 21, thereby, described low-frequency coil 31 and described radio-frequency coil 21 can along coil axially on overlap, and reduce described installation cavity along the axial degree of depth of coil, and then, make, described high frequency module 2 and described low frequency module 3 are smaller from the distance of the end face of described housing 1, when responding to electronic induction equipment, less from the distance between electronic induction equipment, thereby, be conducive to described high frequency module 2 and described low frequency module 3 is responded to by electronic induction equipment, conveniently check card.
In the present embodiment, the installed surface of described housing 1 offers the annular mounting groove 13 of installing for described radio-frequency coil 21, and the circular mounting groove 14 of installing for described low-frequency coil 31, thereby make, when the described low-and high-frequency combined intelligent card 100 of assembling, 13 pairs of described radio-frequency coils 21 of described annular mounting groove have pre-determined bit effect, 14 pairs of described low-frequency coils 31 of described circular mounting groove have pre-determined bit effect, facilitate follow-up bonding process, and, in the present embodiment, described annular mounting groove 13 and described circular mounting groove 14 are located at respectively on described two installed surfaces, be that described annular mounting groove 13 and described circular mounting groove 14 are located on different described installed surfaces, thereby, be convenient to offer described annular mounting groove 13 and described circular mounting groove 14, and for the bonding process of described high frequency module 2 and described low frequency module 3 provides independently operating space, and facilitate bonding process.
In addition, in the present embodiment, the corresponding described low-frequency coil 31 of installed surface that described housing 1 is provided with annular mounting groove 13 offers circular slot to make way 15, the installed surface that described housing 1 is provided with annular mounting groove 13 also offers and allows bit port 16 with what think that described 2 first lead-in wires 211 step down, the described bit port 16 that allows is communicated with described annular mounting groove 13 and 15 settings of described circular slot to make way, the corresponding described radio-frequency coil 21 of installed surface that described housing 1 is provided with circular mounting groove 14 offers annular slot to make way 17, described circular slot to make way 15 and described annular slot to make way 17 are respectively described low-frequency coil 31 and described radio-frequency coil 21 is stepped down, and the installed surface that prevents described low-frequency coil 31 and described radio-frequency coil 21 and described housing 1 is conflicted and is damaged by pressure.
Obviously the design is not limited to this, in other embodiment, described radio-frequency coil 21 is positioned at the inner side of described low-frequency coil 31, correspondingly, described annular mounting groove 13 is in order to accommodating described low-frequency coil 31, and described annular slot to make way 17 is stepped down for described low-frequency coil 31, and described circular mounting groove 14 is in order to accommodating described radio-frequency coil 21, described circular slot to make way 15 is stepped down for described radio-frequency coil 21, described in allow bit port 16 step down for described 2 second lead-in wires 311.
Further; in the present embodiment; between described annular mounting groove 13 and described circular slot to make way 15, form the first annular boss 18; between described annular slot to make way 17 and described circular mounting groove 14, form the second annular boss 19; described the first annular boss 18 and described the second annular boss 19 connect; and then, further, described low-frequency coil 31 and described radio-frequency coil 21 are played a protective role.
In the present embodiment, described housing 1 has the perforation 10 hanging for key ring, can connect for key ring, and be easy to carry.
In the present embodiment, described housing 1 comprises drain pan 11 and upper cover 12, two that described drain pan 11 is relative with described upper cover 12 is described two installed surfaces, described high frequency module 2 is bonding with the installed surface of described drain pan 11, described low frequency module 3 is bonding with the installed surface of described upper cover 12, thereby, can be first by described high frequency module 2 and described low frequency module 3 respectively correspondence be adhered on described drain pan 11 and described upper cover 12, yet, again described drain pan 11 and described upper cover 12 are covered, thereby, easy to assembly, obviously the design is not limited to this, in other embodiment, described low frequency module 3 is bonding with the installation of described drain pan 11, described high frequency module 2 is bonding with the installed surface of described upper cover 12.
These are only preferred embodiment of the present utility model; not thereby limit the scope of the claims of the present utility model; every equivalent structure or conversion of equivalent flow process that utilizes the utility model instructions and accompanying drawing content to do; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present utility model.
Claims (10)
1. a low-and high-frequency combined intelligent card, it is characterized in that, it comprises housing, high frequency module and low frequency module, described enclosure interior has installation cavity and two relative installed surfaces, described high frequency module and described low frequency module are placed in described installation cavity, and are fixed on described installed surface by bonding way.
2. low-and high-frequency combined intelligent card as claimed in claim 1, it is characterized in that, described high frequency module comprises radio-frequency coil and high frequency chip, and described radio-frequency coil has 2 first lead-in wires that are positioned at its inner side, and described high frequency chip and described 2 first lead-in wires are electrically connected.
3. low-and high-frequency combined intelligent card as claimed in claim 1, it is characterized in that, described low frequency module comprises low-frequency coil and low frequency chip, and described low-frequency coil has 2 second lead-in wires that are positioned at its inner side, and described low frequency chip and described 2 second lead-in wires are electrically connected.
4. low-and high-frequency combined intelligent card as claimed in claim 3, it is characterized in that, described high frequency module comprises radio-frequency coil and high frequency chip, described radio-frequency coil has 2 first lead-in wires that are positioned at its inner side, described high frequency chip and described 2 first lead-in wires are electrically connected, and described low-frequency coil is positioned at the inner side of described radio-frequency coil.
5. low-and high-frequency combined intelligent card as claimed in claim 4, is characterized in that, the installed surface of described housing offers the annular mounting groove of installing for described radio-frequency coil and the circular mounting groove of installing for described low-frequency coil.
6. low-and high-frequency combined intelligent card as claimed in claim 5, is characterized in that, described annular mounting groove and described circular mounting groove are located at respectively on described two installed surfaces.
7. low-and high-frequency combined intelligent card as claimed in claim 6, it is characterized in that, the installed surface that described housing is provided with annular mounting groove offers the circular slot to make way of corresponding described low-frequency coil and offers and is communicated with the bit ports that allow of thinking that described 2 first lead-in wires step down for described annular mounting groove and described circular slot to make way, and the corresponding described radio-frequency coil of installed surface that described housing is provided with circular mounting groove offers annular slot to make way.
8. low-and high-frequency combined intelligent card as claimed in claim 7, it is characterized in that, between described annular mounting groove and described circular slot to make way, form the first annular boss, between described annular slot to make way and described circular mounting groove, form the second annular boss, described the first annular boss and described the second annular boss connect.
9. low-and high-frequency combined intelligent card as claimed in claim 1, is characterized in that, described housing has the perforation hanging for key ring.
10. the low-and high-frequency combined intelligent card as described in as arbitrary in claim 1 to 9, it is characterized in that, described housing comprises drain pan and upper cover, two that described drain pan is relative with described upper cover is described two installed surfaces, the installed surface of described high frequency module and described drain pan is bonding, and the installed surface of described low frequency module and described upper cover is bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420248936.1U CN203849755U (en) | 2014-05-15 | 2014-05-15 | High-frequency low-frequency composite-type intelligent card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420248936.1U CN203849755U (en) | 2014-05-15 | 2014-05-15 | High-frequency low-frequency composite-type intelligent card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203849755U true CN203849755U (en) | 2014-09-24 |
Family
ID=51562742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420248936.1U Expired - Fee Related CN203849755U (en) | 2014-05-15 | 2014-05-15 | High-frequency low-frequency composite-type intelligent card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203849755U (en) |
-
2014
- 2014-05-15 CN CN201420248936.1U patent/CN203849755U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140924 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |