CN203838347U - Scintillator array preparation mould - Google Patents
Scintillator array preparation mould Download PDFInfo
- Publication number
- CN203838347U CN203838347U CN201420208021.8U CN201420208021U CN203838347U CN 203838347 U CN203838347 U CN 203838347U CN 201420208021 U CN201420208021 U CN 201420208021U CN 203838347 U CN203838347 U CN 203838347U
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- China
- Prior art keywords
- scintillator
- primitive
- host cavity
- substrate
- prepared
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 238000002360 preparation method Methods 0.000 title claims abstract description 43
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 239000000843 powder Substances 0.000 claims abstract description 46
- 238000003491 array Methods 0.000 claims description 38
- 238000003825 pressing Methods 0.000 claims description 35
- 239000000463 material Substances 0.000 claims description 9
- 238000011049 filling Methods 0.000 claims description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 239000010937 tungsten Substances 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 abstract description 11
- 238000003754 machining Methods 0.000 abstract description 4
- 239000002994 raw material Substances 0.000 abstract 1
- 238000005245 sintering Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 238000000465 moulding Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 5
- 238000000227 grinding Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000008676 import Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 208000002925 dental caries Diseases 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000005865 ionizing radiation Effects 0.000 description 1
- 238000011177 media preparation Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- -1 therefore Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Abstract
The utility model discloses a scintillator array preparation mould which comprises a substrate preparation unit and an element preparation unit. The substrate preparation unit comprises a first template and a first pressure plate. The first template is provided with a first accommodating cavity with an opening on one end. The first accommodating cavity accommodates powder which is used for preparing a scintillator substrate. The first pressure plate is used for squeezing the powder which is used for preparing the scintillator substrate in the first accommodating cavity. The element preparation unit comprises a second template and a second pressure plate. A number of second accommodating cavities which are arranged in an array structure are arranged on the second template. The second accommodating cavities are used for accommodating power which is used for preparing a scintillator element. The second pressure plate is used for squeezing the powder which is used for preparing the scintillator element in the second accommodating cavity. When the scintillator array preparation mould is used to prepare a scintillator array, cutting is not needed, thus a cutting device is omitted. The preparation cost of the scintillator array can be greatly reduced. The machining quality and the machining efficiency of the scintillator array are improved. Raw materials are saved.
Description
Technical field
The utility model relates to scintillation detector, particularly relates to a kind of scintillator arrays and prepares mould.
Background technology
Scintillation detector is a kind of ionizing radiation detector, and it is widely used in the fields such as medical treatment, national defence, safety check.Scintillator arrays is the core constituent element of scintillation detector, it can be converted to ultraviolet light or visible ray by high-energy ray (X ray/gamma-rays) or charged particle, and then by photon detection equipment such as photomultipliers, light signal is changed into electric signal, and high-energy ray is presented with the form of digital signal with the information that is detected matter interaction the most at last.
The preparation technology of scintillator arrays is based on block scintillating medium is removed to machining at present, is processed into array by scintillating medium by modes such as cutting, grindings.For obtaining high-quality scintillator, cutting and grinding process are proposed to higher requirement.There is following shortcoming in traditional scintillator arrays technology of preparing:
1. outside scintillating medium Preparation equipment, need purchase high-accuracy cutting equipment, and carry out strict cutting processing, greatly increase production cost; 2. the high rigidity of scintillating medium, high fragility, reduces cutting accuracy and cutting efficiency greatly; The scintillating medium ratio of 3. losing in cutting process is higher, causes great waste.
Utility model content
The utility model provides a kind of and prepares mould without the scintillator arrays that uses cutting equipment.
For reaching above-mentioned technique effect, the utility model adopts following technical scheme:
A kind of scintillator arrays is prepared mould, comprises that substrate is prepared unit and primitive is prepared unit;
Described substrate is prepared unit and is comprised the first template and the first pressing plate, offers the first host cavity of an end opening in described the first template, and described the first host cavity is accommodated the powder for the preparation of scintillator substrate; Described the first pressing plate is for pushing the powder of described the first host cavity for the preparation of scintillator substrate;
Described primitive is prepared unit and is comprised the second template and the second pressing plate, offers multiple the second host cavities that array structure is arranged that are in described the second template, and described the second host cavity is accommodated the powder for the preparation of scintillator primitive; Described the second pressing plate is for pushing the powder of described the second host cavity for the preparation of scintillator primitive.
In an embodiment, on described the first pressing plate, offer multiple the first projections that array structure is arranged that are therein.
In an embodiment, the degree of depth of described the first host cavity is 1mm～5mm therein.
In an embodiment, the height of described the first projection is 1mm～3mm therein, and the cross-sectional area of described the first projection is 0.5mm
2～3mm
2, and the spacing of adjacent two described the first projections is 0.1mm～0.3mm.
In an embodiment, on described the second pressing plate, offer multiple the second projections that array structure is arranged that are therein;
Corresponding described second host cavity of each described the second projection, and the cross-sectional area of the cross-sectional area of each described the second projection and each described the second host cavity matches.
In an embodiment, the degree of depth of described the second host cavity is 5mm～15mm therein, and the cross-sectional area of described the second host cavity is 0.5mm
2～3mm
2.
In an embodiment, the height of described the second projection is 1mm～2mm therein.
Therein in an embodiment, the host cavity that described the second host cavity is both ends open;
The quantity of described the second pressing plate is two, is respectively used at the described powder for the preparation of scintillator primitive of the both ends open place of described the second host cavity extruding.
In an embodiment, described scintillator arrays is prepared mould and is also comprised combined sorting plate therein;
Described combined sorting plate comprises importing plate and base plate, is provided with multiple entrance holes that array structure is arranged that are on described importing plate;
On described base plate, be provided with multiple the 3rd projections that array structure is arranged that are;
Described combined sorting plate comprises importing plate and base plate, offers and be the entrance hole that array structure is arranged on described importing plate; On described base plate, be provided with multiple the 3rd projections that array structure is arranged that are; When described importing plate is embedded on described base plate, entrance hole described in described the 3rd protruding filling part, remaining entrance hole is used for filling scintillator primitive.
Therein in an embodiment, described primitive is prepared unit and substrate and is prepared the material of unit and be tungsten.
The beneficial effects of the utility model are as follows:
Scintillator arrays of the present utility model is prepared mould, puts into the powder for the preparation of scintillator substrate in the first host cavity, by the extruding of the first pressing plate, obtains the scintillator substrate green compact of moulding; In the second host cavity, put into the powder for the preparation of scintillator primitive, by the extruding of the second pressing plate, obtain the scintillator primitive green compact of moulding; Then can obtain scintillator arrays through oversintering and splicing.Compared with traditional ceramic flashing volume array preparation process, utilize this mould make preparation process simple, without machine cuts grinding, thereby without purchasing accurate cutting equipment, have efficient, materials loss rate is little, can greatly reduce the advantage of the preparation cost of scintillator arrays; Meanwhile, this mould is by scintillator primitive and the separately preparation of scintillator substrate, and the freedom that can realize compound scintillator primitive and scintillator substrate is assembled, prepares the scintillator arrays that performance is more excellent.
Brief description of the drawings
Fig. 1 is the structural representation that substrate of the present utility model is prepared unit one embodiment;
Fig. 2 is the structural representation that primitive of the present utility model is prepared unit one embodiment;
Fig. 3 is the structural representation of combined sorting plate one embodiment of the present utility model;
Fig. 4 is the structural representation of importing plate one embodiment of the present utility model.
Embodiment
Describe the utility model in detail below in conjunction with embodiment.It should be noted that, in the situation that not conflicting, the feature in embodiment and embodiment in the application can combine mutually.
The utility model provides a kind of scintillator arrays to prepare mould, be mainly used in the preparation of ceramic flashing volume array, utilizing this scintillator arrays to prepare mould can directly adopt powder to prepare respectively scintillator primitive and scintillator substrate, then will after the two splicing, processing, obtain scintillator arrays, without machine cuts and grinding, save starting material, reduced production cost, improved quality and the working (machining) efficiency of scintillator.
See also Fig. 1 and Fig. 2, scintillator arrays of the present utility model is prepared mould and is comprised that substrate is prepared unit 100 and primitive is prepared unit 200, substrate is prepared compressing for scintillator substrate green compact of unit 100, and primitive is prepared compressing for scintillator arrays primitive green compact of unit 200.
Referring again to Fig. 1, for substrate of the present utility model is prepared the structural representation of unit 100.Substrate is prepared unit 100 and is comprised the first template 110 and the first pressing plate 120.Wherein, in the first template 110, offer the first host cavity 112 of an end opening, the first host cavity 112 is accommodated the powder (being substrate powder) for the preparation of scintillator substrate, and the large I of the first host cavity 112 arranges according to the size of required scintillator substrate; The first pressing plate 120 is for pushing the powder for the preparation of scintillator substrate of the first host cavity 112, by the pressed by powder moulding for the preparation of scintillator substrate.Usually, the shape of the shape of the first pressing plate 120 and the first template 110 matches, and for example, in the time that the profile of the first template 110 is rectangular parallelepiped or square, the first pressing plate 120 is corresponding rectangular slab or square plate.
The preparation process of scintillator substrate is as follows: first, according to the composition and ratio preparation substrate powder of scintillator substrate, grind evenly and be dried; Again dried substrate powder is placed in to the first host cavity 112 of the first template 110; Then cover the opening part of the first host cavity with the first pressing plate 120, under certain pressure, by compressing substrate powder (being generally cold briquetting), obtain scintillator substrate green compact.
In an embodiment, the shape that is provided with multiple the first projection 122, the first projections 122 that are array structure arrangement on the first pressing plate 120 is generally column therein, and xsect can be circle, square or other shapes.As preferably, the spacing of adjacent two the first projections 122 is 0.1mm～0.3mm.The setting of the first projection 122, is not only conducive to the compressing of substrate powder, and can produce and the first protruding corresponding pit array on the substrate green compact that obtain; The effect of pit array is assembling scintillator primitive, in the time that the scintillator primitive sintering is spliced on scintillator substrate green compact, can be by scintillator primitive and pit corresponding placement one by one, then be placed in high temperature furnace and carry out sintering, because sintering process pits is shunk, scintillator primitive is tightly wrapped up, and then realize the splicing of scintillator primitive and scintillator substrate, after annealing in process, obtain scintillator arrays.
It should be noted that, the first projection 122 can be omitted.In the time not arranging first protruding 122 on the first pressing plate 120, scintillator primitive and scintillator substrate can be stitched together by adhesive material such as epoxy resin.In low-intensity ray detector array preparation process, the preparation of scintillator substrate can be omitted, and directly by adhesive material such as epoxy resin, scintillator primitive is stitched together.
In the first above-mentioned pressing plate 120, the cross-sectional area of each the first projection 122 is greater than the cross-sectional area of each scintillator primitive, to ensure that scintillator primitive can be placed in pit array.Preferably, the cross-sectional area of the first projection 122 is 0.5mm
2～3mm
2.Meanwhile, the height of the first projection 122 has determined the degree of depth of the pit of array structure on scintillator substrate, and for ensureing the reliable splicing of scintillator primitive and scintillator substrate, the height of the first projection 122 is preferably 1mm～3mm.
Referring to Fig. 2, for primitive is prepared the structural representation of unit 200.Primitive is prepared unit 200 for by compressing scintillator primitive green compact, comprises the second template 210 and the second pressing plate 220.
Wherein, in the second template 210, offer multiple the second host cavity 212, the second host cavities 212 that are array structure arrangement and accommodate the powder (being primitive powder) for the preparation of scintillator primitive.Usually, the cavity of each the second host cavity 212 is column, and the size of the size of each the second host cavity 212 and single scintillator primitive matches; Because the powder of preparing scintillator primitive can shrink in sintering process, therefore, the volume of each the second host cavity 212 is slightly larger than the volume of single scintillator primitive.Preferably, the degree of depth of the second host cavity 212 is 5mm～15mm, and the cross-sectional area of the second host cavity 212 is 0.5mm
2～3mm
2, in the time carrying out the preparation of scintillator primitive, need to select suitable primitive to prepare the size of unit 200 according to the concrete application of scintillator arrays and related request.
The second pressing plate 220 is for pushing the powder of the second host cavity for the preparation of scintillator primitive, by the pressed by powder moulding for the preparation of scintillator primitive.Usually, the shape of the shape of the second pressing plate 220 and the second template 210 matches, and for example, in the time that the profile of the second template 210 is rectangular parallelepiped or square, the second pressing plate 220 is corresponding rectangular slab or square plate.
In the preparation process of scintillator primitive, first make corresponding primitive powder according to the composition proportion of scintillator primitive, primitive powder is ground, after being dried, evenly put into multiple second host cavities 212 of the second template 210; Then push the primitive powder in the second host cavity 212 with the second pressing plate 220; Make the primitive pressed by powder moulding (being generally cold briquetting) in the second host cavity 212; Finally put into high temperature furnace and carry out sintering, because primitive powder has contraction to a certain degree in sintering process, final sintering is completed after the gap of scintillator primitive and the second host cavity 212 cavitys larger, can realize the smooth demoulding.
As shown in Figure 2, the host cavity that the second host cavity 212 in the second template 210 is both ends open.Accordingly, the second pressing plate 220 quantity are two, are respectively used at the both ends open place of the second host cavity 212 extruding primitive powder.Above-mentioned employing the second template 210 of back cover not up and down, becomes succinctly the demoulding of the scintillator primitive after compacting, quick, has greatly improved work efficiency.In another embodiment, the second host cavity 212 in the second template 210 also can be an end opening, other end sealing, and now, the second pressing plate 220 quantity are one, for push the primitive powder of the second host cavity 212 at the openend of the second template 210.
Continue referring to Fig. 2, on the second pressing plate 220, be provided with multiple the second projections 222 that array structure is arranged that are, in the time that the second pressing plate 220 covers in the second template 210, ensure corresponding second host cavity 212 of each the second projection 222.Carrying out in the process of primitive pressed by powder moulding, each the second protruding 222 correspondences are inserted in each the second host cavity 212, by the primitive powder-compacting in the second host cavity 212, are beneficial to the moulding of primitive powder.Usually, the end face of the second projection 222, the second projection 222 is plane with the surface of contact of primitive powder, ensures that the primitive powder in the second host cavity 212 is stressed evenly, to obtain good pressing result, improves compacting efficiency.
Wherein, the size of the scintillator primitive of the large I basis of the second projection 222 and the size of the second host cavity 212 regulate.Preferably, the height of the second projection 222 is 1mm～2mm; The cross-sectional area of the cross-sectional area of each the second projection 222 and single the second host cavity 212 matches.Preferably, the array structure of the second projection 222 is identical with the array structure of the first projection 122, is convenient to the splicing of scintillator primitive and scintillator substrate.
Be appreciated that in other embodiments, the second projection 222 can be omitted.When the second host cavity 212 middle-high densities while piling up primitive powder, also can realize the cold briquetting of primitive powder at the openend compacting primitive powder of the second host cavity 212 with the second pressing plate 220.
It should be noted that, in the splicing of scintillator primitive and scintillator substrate, can be single scintillator primitive and the splicing of substrate, also can be the splicing of compound scintillator primitive and scintillator substrate, in same scintillator arrays, the kind of scintillator primitive can be one, also can be multiple.The splicing available of compound scintillator primitive and substrate can be more excellent scintillator arrays.
In the time carrying out the splicing of scintillator primitive and scintillator substrate, need first scintillator primitive to be imported on scintillator substrate.Referring to Fig. 3 and Fig. 4, scintillator arrays of the present utility model is prepared mould and is also comprised combined sorting plate 300.Combined sorting plate 300 comprises importing plate 310 and base plate 320, imports plate 310 and base plate 320 and is used in conjunction with, for scintillator primitive is imported to scintillator substrate according to specific arrangement.Wherein, on importing plate 310, be provided with multiple entrance holes 312 that array structure is arranged that are; On base plate 320, be provided with multiple the 3rd projections 322 that array structure is arranged that are.The quantity of entrance hole 312 is greater than the quantity of the 3rd projection 322, when use, first importing plate 310 is embedded on base plate 320, and now, part entrance hole 312 is filled by the 3rd projection 322; Then scintillator primitive is filled in remaining entrance hole 312; Be filled with the importing plate 310 surface coverage layer of plastic film of scintillator primitive afterwards, combined sorting plate 300 is inverted, be positioned on scintillator substrate, again plastic sheeting is extracted out, slightly rock combined sorting plate 300, scintillator primitive drops on scintillator substrate at Action of Gravity Field, completes the importing of scintillator primitive.
Combined sorting plate 300 can, by the design of entrance hole 312 array structures and the 3rd protruding 322 array structures being realized to the array arrangement of scintillator primitive, can be realized the array combination mode of compound scintillator primitive simultaneously; And import the guide effect of plate 310, increased substantially efficiency and accuracy rate that scintillator primitive imports.
Preferably, the size of the size of entrance hole 312 and scintillator primitive matches, and while filling scintillator primitive, underproof scintillator primitive can be filtered out in entrance hole 312, improves the yield of product, thereby improves the performance of scintillator arrays.
Be appreciated that in other embodiments, combined sorting plate 300 can omit.In the time carrying out the splicing of scintillator primitive and scintillator substrate, can directly by the second template 210, scintillator primitive be imported on scintillator substrate, complete assembling process.
Due in the preparation process of scintillator arrays, need to carry out sintering to scintillator primitive and scintillator substrate, therefore, substrate of the present utility model is prepared unit 100 and primitive, and to prepare the material of unit 200 be high temperature resistant material, and under high temperature not with primitive powder, substrate powder or other substance reactions, be preferably tungsten.In addition, substrate is prepared the material that unit 100 and primitive are prepared unit 200 and also can be the high-melting-points such as platinum, difficult volatilization.
Scintillator arrays of the present utility model is prepared mould, utilizes the compacting of powder and sintering to prepare respectively scintillator primitive and scintillator substrate, then the two is spliced and obtains scintillator arrays; Compared with traditional ceramic flashing volume array preparation process, utilize this mould make preparation process simple, without machine cuts grinding, efficient, materials loss rate is little, can greatly reduce the preparation cost of scintillator arrays; Meanwhile, this mould is by primitive and separately preparation of substrate, and the freedom that can realize compound scintillator primitive and scintillator substrate is assembled, prepares the scintillator arrays that performance is more excellent.
The above embodiment has only expressed several embodiment of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.
Claims (10)
1. scintillator arrays is prepared a mould, it is characterized in that, comprises that substrate is prepared unit and primitive is prepared unit;
Described substrate is prepared unit and is comprised the first template and the first pressing plate, offers the first host cavity of an end opening in described the first template, and described the first host cavity is accommodated the powder for the preparation of scintillator substrate; Described the first pressing plate is for pushing the powder of described the first host cavity for the preparation of scintillator substrate;
Described primitive is prepared unit and is comprised the second template and the second pressing plate, offers multiple the second host cavities that array structure is arranged that are in described the second template, and described the second host cavity is accommodated the powder for the preparation of scintillator primitive; Described the second pressing plate is for pushing the powder of described the second host cavity for the preparation of scintillator primitive.
2. scintillator arrays according to claim 1 is prepared mould, it is characterized in that, offers multiple the first projections that array structure is arranged that are on described the first pressing plate.
3. scintillator arrays according to claim 2 is prepared mould, it is characterized in that, the degree of depth of described the first host cavity is 1mm～5mm.
4. scintillator arrays according to claim 3 is prepared mould, it is characterized in that, the height of described the first projection is 1mm～3mm, and the cross-sectional area of described the first projection is 0.5mm
2～3mm
2, and the spacing of adjacent two described the first projections is 0.1mm～0.3mm.
5. scintillator arrays according to claim 1 is prepared mould, it is characterized in that, offers multiple the second projections that array structure is arranged that are on described the second pressing plate;
Corresponding described second host cavity of each described the second projection, and the cross-sectional area of the cross-sectional area of each described the second projection and each described the second host cavity matches.
6. scintillator arrays according to claim 5 is prepared mould, it is characterized in that, the degree of depth of described the second host cavity is 5mm～15mm, and the cross-sectional area of described the second host cavity is 0.5mm
2～3mm
2.
7. scintillator arrays according to claim 6 is prepared mould, it is characterized in that, the height of described the second projection is 1mm～2mm.
8. prepare mould according to the scintillator arrays described in claim 1～7 any one, it is characterized in that, the host cavity that described the second host cavity is both ends open;
The quantity of described the second pressing plate is two, is respectively used at the described powder for the preparation of scintillator primitive of the both ends open place of described the second host cavity extruding.
9. prepare mould according to the scintillator arrays described in claim 1～7 any one, it is characterized in that, also comprise combined sorting plate;
Described combined sorting plate comprises importing plate and base plate, offers multiple entrance holes that array structure is arranged that are on described importing plate;
On described base plate, be provided with multiple the 3rd projections that array structure is arranged that are;
When described importing plate is embedded on described base plate, entrance hole described in described the 3rd protruding filling part, remaining entrance hole is used for filling scintillator primitive.
10. prepare mould according to the scintillator arrays described in claim 1～7 any one, it is characterized in that, described primitive is prepared unit and substrate and is prepared the material of unit and be tungsten.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420208021.8U CN203838347U (en) | 2014-04-25 | 2014-04-25 | Scintillator array preparation mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420208021.8U CN203838347U (en) | 2014-04-25 | 2014-04-25 | Scintillator array preparation mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203838347U true CN203838347U (en) | 2014-09-17 |
Family
ID=51516171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420208021.8U Expired - Lifetime CN203838347U (en) | 2014-04-25 | 2014-04-25 | Scintillator array preparation mould |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105204058A (en) * | 2015-10-23 | 2015-12-30 | 苏州晶特晶体科技有限公司 | Array device of scintillation crystals for high-energy ray detector and production technology of array device |
| CN106154302A (en) * | 2015-03-24 | 2016-11-23 | 中国科学院上海硅酸盐研究所 | A kind of ray detection flat panel detector scintillator panel and preparation method thereof |
| CN107004686A (en) * | 2014-11-13 | 2017-08-01 | 皇家飞利浦有限公司 | The pixelated scintillators of efficiency with optimization |
| CN108107463A (en) * | 2017-12-12 | 2018-06-01 | 宁波虔东科浩光电科技有限公司 | A kind of scintillating ceramic array and preparation method thereof |
| CN111103613A (en) * | 2019-11-08 | 2020-05-05 | 中国科学院福建物质结构研究所 | Scintillation crystal array and preparation method thereof |
| WO2020125139A1 (en) * | 2018-12-19 | 2020-06-25 | 同方威视技术股份有限公司 | Mold and method for manufacturing reflective layer of scintillator |
-
2014
- 2014-04-25 CN CN201420208021.8U patent/CN203838347U/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107004686A (en) * | 2014-11-13 | 2017-08-01 | 皇家飞利浦有限公司 | The pixelated scintillators of efficiency with optimization |
| CN107004686B (en) * | 2014-11-13 | 2021-07-20 | 皇家飞利浦有限公司 | Pixelated scintillator with optimized efficiency |
| CN106154302A (en) * | 2015-03-24 | 2016-11-23 | 中国科学院上海硅酸盐研究所 | A kind of ray detection flat panel detector scintillator panel and preparation method thereof |
| CN106154302B (en) * | 2015-03-24 | 2019-11-19 | 中国科学院上海硅酸盐研究所 | A kind of ray detection flat panel detector scintillator panel and preparation method thereof |
| CN105204058A (en) * | 2015-10-23 | 2015-12-30 | 苏州晶特晶体科技有限公司 | Array device of scintillation crystals for high-energy ray detector and production technology of array device |
| CN105204058B (en) * | 2015-10-23 | 2018-05-25 | 苏州晶特晶体科技有限公司 | A kind of high energy ray detector scintillation crystal array device and its production technology |
| CN108107463A (en) * | 2017-12-12 | 2018-06-01 | 宁波虔东科浩光电科技有限公司 | A kind of scintillating ceramic array and preparation method thereof |
| WO2020125139A1 (en) * | 2018-12-19 | 2020-06-25 | 同方威视技术股份有限公司 | Mold and method for manufacturing reflective layer of scintillator |
| CN111103613A (en) * | 2019-11-08 | 2020-05-05 | 中国科学院福建物质结构研究所 | Scintillation crystal array and preparation method thereof |
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