CN203825362U - Optical processing system - Google Patents
Optical processing system Download PDFInfo
- Publication number
- CN203825362U CN203825362U CN201420096365.4U CN201420096365U CN203825362U CN 203825362 U CN203825362 U CN 203825362U CN 201420096365 U CN201420096365 U CN 201420096365U CN 203825362 U CN203825362 U CN 203825362U
- Authority
- CN
- China
- Prior art keywords
- plane
- image beam
- optical processing
- processing system
- image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 132
- 238000012545 processing Methods 0.000 title claims abstract description 128
- 238000003384 imaging method Methods 0.000 claims abstract description 25
- 238000004020 luminiscence type Methods 0.000 claims description 61
- 230000008859 change Effects 0.000 claims description 5
- 230000004044 response Effects 0.000 claims description 2
- 230000001737 promoting effect Effects 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 14
- 239000002184 metal Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000035484 reaction time Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 230000011514 reflex Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007687 exposure technique Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 125000001189 phytyl group Chemical group [H]C([*])([H])/C([H])=C(C([H])([H])[H])/C([H])([H])C([H])([H])C([H])([H])[C@@](C([H])([H])[H])([H])C([H])([H])C([H])([H])C([H])([H])[C@@](C([H])([H])[H])([H])C([H])([H])C([H])([H])C([H])([H])C(C([H])([H])[H])([H])C([H])([H])[H] 0.000 description 1
- 230000007115 recruitment Effects 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Abstract
The utility model provides an optical processing system which is used for generating an image pattern on an image plane. The optical processing system comprises at least one image generation unit and an optical scanning unit, wherein each image generation unit comprises a luminous unit module and an imaging lens; each luminous unit module is used for emitting an image light beam and comprises a plurality of non-linearly arrayed luminous units or a plurality of luminous units arranged in an array; each imaging lens is arranged on a transmission path of the corresponding image light beam and is used for projecting the corresponding image light beam to an image plane; the optical scanning unit is arranged on the transmission path of the image light beam and is used for enabling the image light beam to scan the image plane to generate the image pattern.
Description
Technical field
The utility model relates to a kind of optical device, in particular to a kind of optical processing system.
Background technology
Along with development in science and technology, printed circuit board (PCB) is widely used in electronic product now.And electronic product is now also all towards light, thin, short, little and multi-functional future development, therefore relatively also need more highdensity printed circuit board (PCB) to reach.When the density of P.e.c. improves, the live width of printed circuit board (PCB) also needs to dwindle, and the size of live width is by being determined by exposure machine in exposure process.
In existing exposure machine technology, in order to meet the evolving trend of electronic product, high circuit line width resolution, volume production fast, high contraposition precision, high exposure uniformity coefficient and high-reliability are all the essential condition that high-end exposure sources need to possess, but because being present in production run, the exposure machine of existing use light shield must carry out " light shield contraposition ", meetings such as " light shield cleaned at regular intervals " affect the step of output, and existing can be because of the problem such as a large amount of defective productss of output in volume production of particulate on light shield, therefore developed the technology of photomask-free type exposure machine (maskless lithography).
Although existing photomask-free type exposure machine can provide more accurate contraposition calibration and narrower live width size, but for example, for most of technology (being the direct exposure technique of laser), its film speed and unit interval substrate quantum of output all cannot with the contact exposure machine analogy of traditional employing light shield.Recently also developed and passed through with digital minitype reflector element (Digital Micro-mirror Device, be called for short DMD) form exposing patterns to promote the photomask-free type exposure machine of exposure efficiency, each unit in DMD is made up of a small minute surface, independently control rotation and the upset of each minute surface by mems chip, to control respectively advancing or shielding status of each light beam, expose in the mode that produces pattern on exposure thing.But, under the structural limitations of each minute surface of the prior art because of approximately 15 microns of square minitype reflector of yardstick and micro-cantilever, the duration of oscillation of each minitype reflector of prior art at least takes 44 microseconds, and therefore in DMD, the duration of oscillation of each minitype reflector and reflectivity thereof are all subject to suitable restriction.
Utility model content
The utility model provides a kind of optical processing system, and it has optical processing speed and better optical processing efficiency faster.
Embodiment of the present utility model provides a kind of optical processing system, for producing a picture pattern one on as plane.Optical processing system comprises at least one image generation unit and a light scanning unit.Image generation unit comprises a luminescence unit module and an imaging lens.Luminescence unit module is used for sending an image beam, and comprise multiple non-linear arrangement or line up the luminescence unit of array, for example light emitting diode (Light Emitting Diode, be called for short LED), superluminescent diode (Superluminescent Diode, be called for short SLD), laser diode (Laser Diode, be called for short LD).Imaging lens is disposed on the bang path of image beam, and for image beam being projeced into picture plane.Light scanning unit is disposed on the bang path of image beam, and for image beam is scanned as plane, to produce picture pattern.
In an embodiment of the present utility model, above-mentioned optical processing system also comprises a control module, and it is electrically connected to image generation unit and light scanning unit.In the time that image beam is moved to a position of picture plane by control module order light scanning unit, image beam is producing an area image as the region in plane, and in the time that image beam is moved to the diverse location of picture plane by control module order light scanning unit, image beam produces respectively multiple area images in the zones of different as in plane, and these area images are overlapped into picture pattern.
In an embodiment of the present utility model, above-mentioned light scanning unit comprises one first galvanometer and one second galvanometer.The first galvanometer is disposed on the bang path of image beam, and is suitable for swinging around a first axle, and the second galvanometer is disposed on the bang path from the image beam of the first galvanometer, and is suitable for around one second axis oscillating.These luminescence units in luminescence unit module are Autoluminescence light source, and the image beam being sent by Autoluminescence light source changes the relative exposure position of image beam in picture plane by the swing of the first galvanometer and the second galvanometer.
In an embodiment of the present utility model, above-mentioned light scanning unit comprises a galvanometer, and it is disposed on the bang path of image beam, and is suitable for swinging in two dimensions.These luminescence units in luminescence unit module are Autoluminescence light source, and the image beam being sent by Autoluminescence light source changes the relative exposure position of image beam in picture plane by the swing of galvanometer.
In an embodiment of the present utility model, above-mentioned optical processing system also comprises a microscope carrier, is positioned at picture plane place, and for carrying a pending thing, microscope carrier is suitable for mobile or by an actuator promotion microscope carrier, image beam is scanned as the pending thing in plane.
Embodiment of the present utility model provides a kind of optical processing system, for producing a picture pattern one on as plane.Optical processing system comprises at least one image generation unit and a microscope carrier.Image generation unit comprises a luminescence unit module and an imaging lens.Luminescence unit module is used for sending an image beam, and comprise multiple non-linear arrangement or line up the luminescence unit of array, for example light emitting diode (Light Emitting Diode, be called for short LED), superluminescent diode (Superluminescent Diode, be called for short SLD), laser diode (Laser Diode, be called for short LD).Imaging lens is disposed on the bang path of image beam, and for image beam being projeced into picture plane.Be positioned on microscope carrier as plane, microscope carrier is used for carrying a question response thing, and microscope carrier is suitable for mobile or promotes as plane by an actuator, image beam is scanned as plane, to produce picture pattern on as plane.
In an embodiment of the present utility model, above-mentioned optical processing system also comprises a control module, and it is electrically connected to image generation unit and microscope carrier or actuator.When control module order microscope carrier or actuator make image beam be irradiated to a position of picture plane, image beam is producing an area image as the region in plane, and in the time that control module order microscope carrier or actuator make image beam be irradiated to the diverse location of picture plane, image beam produces respectively multiple area images in the zones of different as in plane, and these area images are overlapped into picture pattern.
In an embodiment of the present utility model, above-mentioned image beam scans as plane along a first direction, or the second direction that image beam is different from first direction along first direction and scans as plane, wherein first direction and second direction structure imaging plane.
In an embodiment of the present utility model, these luminescence units in above-mentioned luminescence unit module are Autoluminescence light source, comprise light emitting diode, superluminescent diode or laser diode.
In an embodiment of the present utility model, the wavelength of above-mentioned image beam is to drop in the scope of 200 nanometer to 430 nanometers.
Based on above-mentioned, in the optical processing system of embodiment of the present utility model, the image beam that luminescence unit module is sent carries out optical processing to a region by imaging lens on as plane, and light scanning unit scans as plane image beam.Thus, with respect to the single-point type scanning of only a point being made optical processing in the time, the region-type scanning that embodiment of the present utility model adopts is, in a time, synchronous optical processing is carried out in a region in a big way, can significantly shorten whereby the overall optical processing time for the treatment of handled object.
For above-mentioned feature and advantage of the present utility model can be become apparent, special embodiment below, and coordinate accompanying drawing to be described in detail below.
Brief description of the drawings
Figure 1A is the schematic diagram of optical processing system in an embodiment of the present utility model;
Figure 1B is vertical view when picture plane is projected by image beam in Figure 1A;
Fig. 1 C is the vertical view of luminescence unit module in Figure 1A;
Fig. 2 A is the schematic diagram of optical processing system in another embodiment of the present utility model;
Fig. 2 B to Fig. 2 D is vertical view when picture plane is projected by image beam in Fig. 2 A;
Fig. 3 A is the schematic diagram of optical processing system in another embodiment of the present utility model;
Fig. 3 B to Fig. 3 C is vertical view when picture plane is projected by image beam in Fig. 3 A;
Fig. 4 is the schematic diagram of optical processing system in another embodiment of the present utility model;
Fig. 5 A is the schematic diagram of optical processing system in another embodiment of the present utility model;
Fig. 5 B to Fig. 5 E is vertical view when picture plane is projected by image beam in Fig. 5 A;
Fig. 6 is the stereographic map of optical processing system in another embodiment of the present utility model;
Fig. 7 is the schematic diagram of optical processing system in another embodiment of the present utility model;
Fig. 8 is the schematic diagram of optical processing system in another embodiment of the present utility model.
Description of reference numerals:
D1: first direction;
D2: second direction;
D3: third direction;
D4: fourth direction;
L1: first axle;
L2: the second axis;
I1, I2: axis;
100A, 100B, 100C, 100D, 100E, 100F, 100G, 100H: optical processing system;
110: image generation unit;
111: image beam;
112: luminescence unit module;
113,117,119A, 119B, 119D, 119E, 119F, 119G, 119H, 119I, 119J, 119K, 119L, 119M: region;
114: luminescence unit;
116: imaging lens;
130: light scanning unit;
132: the first galvanometers;
134: the second galvanometers;
136: galvanometer;
140: as plane;
150: microscope carrier;
160: pending thing;
170: actuator;
180: control module.
Embodiment
Figure 1A is the schematic diagram of a kind of optical processing system in embodiment of the present utility model.Figure 1B is vertical view when picture plane is projected by image beam in Figure 1A.Fig. 1 C is the vertical view of luminescence unit module in Figure 1A.Please refer to Figure 1A to Fig. 1 C, in the present embodiment, optical processing system 100A comprises image generation unit 110 and light scanning unit 130, and image generation unit 110 for example comprises lines up by multiple luminescence units luminescence unit module 112 and the imaging lens 116 that array forms.Luminescence unit module 112 comprises multiple luminescence units 114, and luminescence unit module 112 is for sending an image beam 111.In embodiment as shown in Figure 1 C, multiple luminescence units 114 are to arrange and form an array of light emitting cells and describe in the mode of array, but the utility model is as limit, and multiple luminescence units 114 also can be arranged in nonlinear mode.Imaging lens 116 and light scanning unit 130 are disposed on the bang path of image beam 111, and wherein light scanning unit 130 can allow image beam 111 scan in picture plane 140.
More particularly, please with reference to Figure 1A and Figure 1B, in the present embodiment, image beam 111 selfluminous cell modules 112 are sent, and after imaging lens 116, then arrive as plane 140 via light scanning unit 130, and are producing area image as plane 140.Wherein, imaging lens 116 is suitable for allowing image beam 111 project and be imaged on picture one pending thing of plane 140, and on the region 117 as plane 140, treat handled thing as the image beam 111 of plane 140 and carry out optical processing by being imaged on, on region 113, do not carry out optical processing, but be not limited to this.In other embodiments, optical processing system 100A can also make not carry out optical processing as region in plane 117, and optical processing is carried out in region 113.In another embodiment, optical processing system 100A can also have to the region 113 as in plane and region 117 optical processing of different light intensity degree.In another embodiment, the image beam that luminescence unit module 112 is sent can also have that different set of wavelengths is incompatible to be suitable for treating handled thing and to carry out optical processing.More particularly, the wavelength of the image beam in the present embodiment is for example to drop in the scope of 200 nanometer to 430 nanometers, but be not limited to this, the image beam 111 that luminescence unit module 112 is sent in other embodiments can be that other are suitable for for example, the light beam with other wavelength to do optical processing (exposure or photoetch) as plane 140.
Furthermore, please refer to Figure 1A and Figure 1B, in the present embodiment, pending thing is for example one to be coated with the metal level of photoresist layer, other layer to be etched or substrates, and optical processing system 100A is for example exposure machine, so that the photoresist layer in region 113 carries out optical processing, it is for example exposure-processed, and exposure after photoresist layer form predetermined pattern by developing manufacture process again, using as etch metal layers next, restraining barrier when other layers to be etched or ion cloth phytyl plate, and then make the metal level in pending thing, other layers to be etched or substrate also have the pattern that corresponds to region 113 and region 117, but be not limited to this.In other embodiments, pending thing can be metal level or the layer to be etched without photoresist layer, and optical processing system is for example an etching machine, its image beam sending directly carries out optical processing to metal level, for example, be that directly optical etching is carried out in the region 117 of metal level produces the metal layer pattern that is similar to the picture pattern shown in Figure 1B.
Please refer to Figure 1A, Figure 1B and Fig. 1 C, in the present embodiment by luminescence unit module 112(shown in Fig. 1 C for example taking 12 × 12 luminescence unit module as example, but the utility model is not as limit) send an image beam 111, allow image beam 111 be imaged in picture plane 140 by imaging lens 116 again, change light path by light scanning unit 130 again and make image beam on as plane, produce picture pattern at imaging lens 116 with between as plane 140, therefore higher luminous energy can be provided.In the present embodiment, directly send light beam by luminescence unit module 112 and the directly imaging on as plane 140 of imaging lens 116 and light scanning unit 130 of arranging in pairs or groups, scan and carry out optical processing, therefore optical processing system 100A directly carries out optical processing to the region as in plane 140, because the image beam 111 that luminescence unit module 112 provides has higher luminous energy, therefore can be lifted at the optical processing efficiency (for example exposure efficiency or photoetch efficiency) in picture plane 140 simultaneously.On the other hand, compared to adopting digital micromirror elements to be used as the optical processing system of image source, the optical processing system 100A of the present embodiment can such as light emitting diode matrix of self luminous luminescence unit module 112(owing to adopting, also be that luminescence unit 114 is for example light emitting diode) image beam 111 is provided, compared to single microcomputer Electronic Speculum (being a micro-reflector in digital micromirror elements) approximately 14 microns of square sizes of size, LED size is uncertain, by optical design, the large I of LED corresponding to pixel is square much larger than 14 microns, therefore can be corresponding to the accessible luminous power of microcomputer Electronic Speculum, therefore more high-intensity optical processing effect can be provided, and then shorten the processing time, recruitment productive rate.Simultaneously because the optical processing system of above-described embodiment can be by controlling the switch of each selfluminous cell 114 in luminescence unit module 112, not only can avoid the loss of the energy that the intensity of light source causes because of the reflex time of micro mirror, luminescence unit module 112 also reduces the loss of energy because driving for a long time whole luminescence units 114.In comparison, the exposure machine that adopts digital micromirror elements, no matter whether a certain micro mirror wants light to reflex to camera lens, and light source all needs to be held open, that is to say, the light utilization ratio of the exposure machine of employing digital micromirror elements is low compared with the light utilization ratio of the optical processing system 100A of the present embodiment.
In addition, the micro mirror in digital micromirror elements be mechanical swing as flowing mode, its luminescence-producing reaction time compared to light emitting diode is slower.Therefore, the employing of the present embodiment can self luminous luminescence unit module 112 the light scanning unit 130 of optical processing system 100A can use velocity sweeping faster (because of the reaction time of luminescence unit module 112 short, and the luminous power providing is high), and then shorten the bulk treatment time.Illustrate, when the light emitting diode matrix using 100 × 100 is during as luminescence unit module 112, due to sweep velocity reason faster, the complete individual time as plane of optical processing system 100A scanning also has the time of complete the picture plane of optical processing system scanning of the digital micromirror elements of 1024 × 768 micro mirrors lower than employing.In addition, the image beam 111 sending due to luminescence unit module 112 can carry out optical processing to the region as plane 140, reduce the distance of image beam 111 required movement in picture plane 140, therefore in the optical processing system 100A of above-described embodiment, can utilize light scanning unit 130 to scanning as the pending thing in plane, and can utilize microscope carrier to move to make pending thing to move and scan.In simple terms, the framework of the optical processing system 100A of the present embodiment can comparatively be simplified, so can have less volume and lower cost.
In addition, illustrate, coordinate suitable drives, the reaction time of LED can be controlled in 10 nanosecond (nanosecond, be called for short ns) below, (microsecond, is called for short μ reaction time s), and the present embodiment has had soon the technique effect of approximately 4000 times to compare 44 microseconds that existing DMD has.In addition, DMD makes DMD can bear light intensity about 20W(watt because being limited to the wherein reflectivity of minitype reflector).For the LED taking 375 nano wave lengths, 280 square microns, as example, its luminous power is 5.5mW(milliwatt).In other words, in the time that the luminescence unit module row in the optical processing system of an embodiment of the present utility model is classified 100 × 100 array as, light intensity is 55W, compared to the light intensity using DMD as optical processing system, the optical processing system of embodiment of the present utility model has the technique effect of the multiple growth of 2.8 times in the performance of light intensity compared to prior art.Therefore compared to DMD, utilize optical processing system of the present utility model (taking 100 × 100LED array chip as example) in the performance of processing speed, also can bring into play effect of fast approximately 3 times of processing speed.
But in other embodiments, luminescence unit 114 can be Organic Light Emitting Diode (Organic Light Emitting Diode is called for short OLED), laser diode, superluminescent diode or other suitable luminous elements.In other embodiments, the luminescence unit in luminescence unit module also can be being for example to arrange with honeycomb, concentric circles, radial arrangement or other staggered or nonlinear modes.
Should be noted that at this, following embodiment continues to use element numbers and the partial content of previous embodiment, wherein adopts identical label to represent identical or approximate element, and has omitted the explanation of constructed content.Explanation about clipped can be with reference to previous embodiment, and it is no longer repeated for following embodiment.
Fig. 2 A is the schematic diagram of optical processing system in another embodiment of the present utility model, and Fig. 2 B to Fig. 2 D is vertical view when picture plane is projected by image beam in Fig. 2 A.Please refer to Fig. 2 A to Fig. 2 D, optical processing system 100A in embodiment shown in optical processing system 100B and Figure 1A in the present embodiment is similar, difference is that the optical processing system 100B in the present embodiment also comprises a microscope carrier 150, be used for carrying pending thing 160, and light scanning unit 130 in the present embodiment can allow image beam 111 along first direction d1 to scanning as plane 140.
More particularly, please refer to Fig. 2 B, optical processing system 100B in the present embodiment for example can utilize an optical processing to form area image at the region 119A of picture plane 140 in the very first time, and light scanning unit 130 can allow image beam 111 move along first direction d1 in the position that forms area image as plane 140.Please refer to Fig. 2 B and Fig. 2 C, in the present embodiment, when light scanning unit 130 makes image beam 111 move along first direction d1, image generation unit 110 also changes area image according to the variation of position simultaneously, therefore can optical processing of the second time utilization or scanning as plane 140 in the 119B of region, synchronously part or all of region 119A is carried out unceasingly optical processing and is overlapped into picture pattern, in other words, the region 119A that has formed picture pattern in the very first time strengthens the irradiation amount of part or all of pattern can carry out two degree optical processing in the second time time, so as to strengthening optical processing degree.Please refer to Fig. 2 B to Fig. 2 D, in the present embodiment, optical processing system 100B has sequentially scanned to be positioned at the picture pattern on the picture pending thing 160 of plane 140 by above-mentioned mode along first direction d1, therefore higher treatment effeciency can be provided and process preferably quality, and can on as plane 140, control different irradiation amounts according to the design such as pattern, live width.In the present embodiment, above-mentioned optical processing is for example that a photoresist layer for the treatment of in handled thing 160 exposes, but is not limited to this.In other embodiments, above-mentioned optical processing is for example that a metal level or the layer to be etched for the treatment of in handled thing made optical etching.
Fig. 3 A is the schematic diagram of optical processing system in another embodiment of the present utility model, and Fig. 3 B to Fig. 3 C is vertical view when picture plane is projected by image beam in Fig. 3 A.Please refer to Fig. 3 A, optical processing system 100A in embodiment shown in optical processing system 100C and Figure 1A of the present embodiment is similar, difference is in the present embodiment, to have three as shown in FIG. of multiple image generation unit 110(examples), and optical processing system 100C has multiple luminescence unit modules 112 and multiple imaging lens 116, and each luminescence unit module 112 produces area image through light scanning unit 130 by imaging lens 116 separately on as plane 140, wherein the light scanning unit 130 of the present embodiment makes multiple image beams 111 scan along first direction d1.Please refer to Fig. 3 B and Fig. 3 C, optical processing system 100C is at the very first time region 119D to picture plane 140 simultaneously in the present embodiment, region 119E, region 119F produces area image, make can move along first direction d1 as the irradiation area in plane 140 by the scanning of light scanning unit 130 again, after arriving as the border of plane 140 along first direction d1, irradiation area passes through again the movement of microscope carrier 150, make irradiation area can back be scanned up to region 119G, region 119H, region 119I arrives region 119D again, region 119E, the superimposed picture pattern that completes is carried out in region between the 119F of region.Therefore, the optical processing system 100C in the present embodiment can, by multiple image generation units 110 to produce area image as the multiple regions in plane 140 simultaneously, promote treatment effeciency so more.In other embodiments, optical processing system can also have seven or multiple image generation units of other quantity, and these image generation units are for example that the regional location staggering produces picture pattern to do scanning as plane simultaneously on as plane.
Fig. 4 is the schematic diagram of optical processing system in another embodiment of the present utility model.Please refer to Fig. 4, the optical processing system 100D of the present embodiment is similar in appearance to the optical processing system 100B in the embodiment shown in Fig. 2 A, difference is in the optical processing system 100D of the present embodiment, also comprise an actuator 170, it is connected to microscope carrier 150, move along first direction d1 or aforementioned second direction and actuator 170 orders about microscope carrier 150, but be not limited to this.In other embodiments, actuator 170 can also connect microscope carrier 150 and order about it and move along other directions, can also make microscope carrier 150 move up and down as through-thickness.In other embodiments, optical processing system can also comprise multiple actuators, and these actuators can move along multiple directions microscope carrier.Please refer to Fig. 4, in the present embodiment, can make to be created in as the area image of plane 140 by the movement of microscope carrier 150 also has relative position to move in the lump, and completes picture pattern whereby.In another embodiment, optical processing system can also scan along first direction d1 by light scanning unit 130 simultaneously, and microscope carrier moves along the second direction different from first direction d1 by actuator 170, change whereby the irradiation position of image beam 111 in picture plane 140.In addition, light scanning unit 130 can be also the direction that the mode of rotating (rotating polygon) changes image beam 111 more.
Fig. 5 A is the schematic diagram of optical processing system in another embodiment of the present utility model.Fig. 5 B to Fig. 5 E is vertical view when picture plane is projected by image beam in Fig. 5 A.Please refer to Fig. 5 A, the optical processing system 100E of the present embodiment is similar in appearance to the optical processing system 100A in the embodiment shown in Figure 1A, difference is that in the present embodiment, light scanning unit 130 comprises the first galvanometer 132 and the second galvanometer 134, wherein the first galvanometer 132 and the second galvanometer 134 are disposed on the bang path of image beam 111, and the first galvanometer 132 is suitable for swinging around first axle L1, the second galvanometer 134 is disposed on the bang path from the image beam 111 of the first galvanometer 132, and is suitable for swinging around the second axis L2.By swing and the configuration of the first galvanometer 132 and the second galvanometer 134, can make image beam 111 can move along first direction d1 and second direction d2 the position of imaging on as plane.More particularly, please refer to Fig. 5 A to Fig. 5 E, by the configuration of above-mentioned the first galvanometer 132 and the second galvanometer 134, can produce area image by the region 119J in picture plane 140, and the position that can make image beam 111 produce area image on as plane 140 by the swing of the first galvanometer 132 and the second galvanometer 134 moves to region 119K from region 119J, continue again to move to region 119L, finally move to region 119M and complete picture pattern, wherein in mobile, image generation unit 110 is also corresponding changes the area image that its institute's energy projection goes out, so as to making each area image be overlapped into picture pattern and adding high light treatment effect.In other embodiments, optical processing system 100E is overlapped into picture pattern by other directions and route to do scanning as plane 140.
Please refer to Fig. 5 A, optical processing system 100E can make image beam 111 can move along first direction d1 and second direction d2 the position of imaging on as plane in the present embodiment, and first direction d1 is in fact perpendicular to second direction d2, but is not limited to this.In other embodiments, the light scanning unit in optical processing system can also move the irradiation position of image beam 111 in picture plane by other multiple directions.
Fig. 6 is the stereographic map of optical processing system in another embodiment of the present utility model.Please refer to Fig. 6, the optical processing system 100F of the present embodiment is similar in appearance to the optical processing system 100B in the embodiment shown in Fig. 2 A, difference is that the optical processing system 100F in the present embodiment also comprises control module 180, it is electrically connected to image generation unit 110 and light scanning unit 130, wherein in the time that image beam 111 is moved to a position of picture plane 140 by control module 180 order light scanning units 130, image beam 111 is producing an area image as the region in plane 140, and in the time that image beam 111 is moved to the diverse location of picture plane 140 by control module 180 order light scanning units 130, image beam 111 produces respectively multiple area images in the zones of different as in plane 140, and these area images are overlapped into picture pattern.Therefore, the optical processing system 100F of the present embodiment can be by control module 180 to completing high efficiency optical processing as plane 140 easily.
Fig. 7 is the schematic diagram of optical processing system in another embodiment of the present utility model.Please refer to Fig. 7, the optical processing system 100G of the present embodiment is similar in appearance to the optical processing system 100E in the embodiment shown in Fig. 5 A, difference is that in the present embodiment, light scanning unit 130 comprises galvanometer 136, it is disposed on the bang path of image beam 111, and is suitable for swinging in two dimensions.More particularly, galvanometer 136 is suitable for swinging along third direction d3 around axis I1, also be suitable for swinging along fourth direction d4 around axis I2, therefore swing that can be in two dimensions by galvanometer 136, allow optical processing system 100G can be subject to position that image beam 111 irradiates on as plane and also have the movement of two dimensions, and so as to producing area image in zones of different, and be overlapped into picture pattern by these area images.
Fig. 8 is the schematic diagram of optical processing system in another embodiment of the present utility model.Please refer to Fig. 8, the optical processing system 100H of the present embodiment is similar in appearance to optical processing system 100D in the embodiment shown in Fig. 4, difference is that in the present embodiment, image beam 111 is directly to arrive as plane 140 after penetrating imaging lens 116, and microscope carrier 150 moves by actuator 170 the pending thing 160 being positioned at as plane 140 can be moved along first direction d1, making as plane is to be for example overlapped into picture pattern with the flow process of Fig. 2 B to Fig. 2 D.In other embodiments, optical processing system can also can move along one or more directions microscope carrier by one or more actuators or other modes, so as to making image beam can be overlapped into picture pattern at the area image as in plane.
In another embodiment, optical processing system can be similar in appearance to the optical processing system shown in Fig. 8, difference is that the present embodiment also comprises a control module, control module is electrically connected the luminescence unit module 112 in microscope carrier 150, actuator 170 and image generation unit, in the time that image beam is moved to a position of picture plane 140 by control module order microscope carrier 150 or actuator 170, image beam 111 is producing an area image as the region in plane 140.In the time that image beam 111 is moved to the diverse location of picture plane 140 by control module order microscope carrier 150 or actuator 170, image beam 111 produces respectively multiple area images in the zones of different as in plane 140, and these area images are overlapped into picture pattern.
In sum, optical processing system in embodiment of the present utility model produces a zone map to one as plane by luminescence unit module collocation imaging lens, therefore can exempt unnecessary light source waste (light loss being produced when via DMD, and via the switch of controlling each luminescence unit).The multiple luminescence units included with luminescence unit module produce the image beam with high light energy, and so as to improving optical treatment effeciency.Meanwhile, then come each regional location of picture plane to produce area image by light scanning unit, wherein the area image of each regional location also changes according to the change of position and is overlapped into picture pattern, therefore can make the efficiency of optical processing more promote.
Finally it should be noted that: above each embodiment, only for the technical solution of the utility model is described, is not intended to limit; Although the utility model is had been described in detail with reference to aforementioned each embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record aforementioned each embodiment is modified, or some or all of technical characterictic is wherein equal to replacement; And these amendments or replacement do not make the essence of appropriate technical solution depart from the scope of the each embodiment technical scheme of the utility model.
Claims (10)
1. an optical processing system, is characterized in that, for producing a picture pattern one on as plane, this optical processing system comprises:
At least one image generation unit, this image generation unit comprises:
One luminescence unit module, for sending an image beam, and comprises multiple non-linear arrangement or lines up the luminescence unit of array;
One imaging lens, is disposed on the bang path of this image beam, and for this image beam is projeced into this as plane; And
One light scanning unit, is disposed on the bang path of this image beam, and for making this image beam scan this as plane, to produce this picture pattern.
2. optical processing system according to claim 1, it is characterized in that, also comprise a control module, be electrically connected to this image generation unit and this light scanning unit, wherein in the time that this image beam is moved to this position as plane by this this light scanning unit of control module order, this image beam produces an area image at this as the region in plane, and in the time that this image beam is moved to this diverse location as plane by this this light scanning unit of control module order, this image beam produces respectively multiple area images at this as the zones of different in plane, and those area images are overlapped into this picture pattern.
3. optical processing system according to claim 1 and 2, is characterized in that, this light scanning unit comprises:
One first galvanometer, is disposed on the bang path of this image beam, and is suitable for swinging around a first axle; And
One second galvanometer, is disposed on the bang path from this image beam of this first galvanometer, and is suitable for around one second axis oscillating,
Those luminescence units in this luminescence unit module are Autoluminescence light source, this image beam being sent by this Autoluminescence light source by the swing of this first galvanometer and this second galvanometer change this image beam at this as the relative exposure position in plane.
4. optical processing system according to claim 1 and 2, it is characterized in that, this scanning element comprises a galvanometer, be disposed on the bang path of this image beam, and be suitable for swinging in two dimensions, those luminescence units in this luminescence unit module are Autoluminescence light source, this image beam being sent by this Autoluminescence light source by the swing of this galvanometer change this image beam at this as the relative exposure position in plane.
5. optical processing system according to claim 1 and 2, it is characterized in that, also comprise a microscope carrier, be positioned at this as plane place, and for carrying a pending thing, this microscope carrier is suitable for moving or promoting this microscope carrier by an actuator making this image beam scan this as this pending thing in plane.
6. an optical processing system, is characterized in that, for producing a picture pattern one on as plane, this optical processing system comprises:
At least one image generation unit, this image generation unit comprises:
One luminescence unit module, for sending an image beam, and comprises multiple non-linear arrangement or lines up the luminescence unit of array;
One imaging lens, is disposed on the bang path of this image beam, and for this image beam is projeced into this as plane; And
One microscope carrier, this is positioned on this microscope carrier as plane, and this microscope carrier is used for carrying a question response thing, and this microscope carrier is suitable for mobile or promotes this as plane by an actuator, makes this image beam scan this as plane, to produce this picture pattern at this on as plane.
7. optical processing system according to claim 6, it is characterized in that, also comprise a control module, be electrically connected to this image generation unit and this microscope carrier or this actuator, wherein in the time that this this microscope carrier of control module order or this actuator make this image beam be irradiated to this position as plane, this image beam produces an area image at this as the region in plane, and in the time that this this microscope carrier of control module order or this actuator make this image beam be irradiated to this diverse location as plane, this image beam produces respectively multiple area images at this as the zones of different in plane, and those area images are overlapped into this picture pattern.
8. according to the optical processing system described in claim 1 or 2 or 6 or 7, it is characterized in that, this image beam scans this as plane along a first direction, or the second direction that this image beam is different from this first direction along this first direction and scans this as plane, wherein this first direction and this second direction form this as plane.
9. according to the optical processing system described in claim 1 or 2 or 6 or 7, it is characterized in that, those luminescence units in this luminescence unit module are Autoluminescence light source, comprise light emitting diode, superluminescent diode or laser diode.
10. according to the optical processing system described in claim 1 or 2 or 6 or 7, it is characterized in that, the wavelength of this image beam drops in the scope of 200 nanometer to 430 nanometers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420096365.4U CN203825362U (en) | 2014-03-04 | 2014-03-04 | Optical processing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420096365.4U CN203825362U (en) | 2014-03-04 | 2014-03-04 | Optical processing system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203825362U true CN203825362U (en) | 2014-09-10 |
Family
ID=51480842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420096365.4U Expired - Lifetime CN203825362U (en) | 2014-03-04 | 2014-03-04 | Optical processing system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203825362U (en) |
-
2014
- 2014-03-04 CN CN201420096365.4U patent/CN203825362U/en not_active Expired - Lifetime
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103597404B (en) | Lithographic apparatus, programmable patterning device and lithographic method | |
| US8309903B2 (en) | Optical device, method for producing master for use in producing optical device, and photoelectric conversion apparatus | |
| JP5753320B2 (en) | Lithographic apparatus | |
| JP2019530201A (en) | Maskless parallel pick and place transfer of micro devices | |
| TWI575332B (en) | Lithography apparatus, patterning device, and lithographic method | |
| CN107255913B (en) | Substrate processing method using same | |
| US11284517B2 (en) | System for direct writing on an uneven surface of a workpiece that is covered with a radiation sensitive layer using exposures having different focal planes | |
| JPH0653105A (en) | Aligner | |
| WO2024007502A1 (en) | Non-mechanical optical scanning fiber photolithography machine | |
| WO2024007501A1 (en) | Acousto-optic scanning super-resolution optical fiber lithography machine | |
| CN104898377A (en) | Optical processing system | |
| JP2016528556A (en) | Lithographic apparatus, programmable patterning device and lithographic method | |
| CN112764320A (en) | Photoetching exposure system and method for multi-focus laser parallel direct-writing close-packed nano structure | |
| CN108062006A (en) | The write-through screen printing system and method for platemaking of a kind of automatic top and bottom plate | |
| CN201083959Y (en) | Integrated type direct-writing lithographic equipment | |
| CN203825362U (en) | Optical processing system | |
| CN1578377A (en) | Plotter and plotting method | |
| CN201083960Y (en) | Direct-writing lithographic equipment | |
| CN206523740U (en) | A kind of write-through screen printing equipment | |
| US20220219260A1 (en) | Additive manufacturing systems and related methods utilizing risley prism beam steering | |
| JP2016164679A (en) | Assembly for modifying properties of plural radiation beams, lithography apparatus, method of modifying properties of plural radiation beams and device manufacturing method | |
| US20220246460A1 (en) | Apparatus for transferring light-emitting diode chip | |
| KR20100087974A (en) | Marking apparatus having digital micromirror device | |
| TWM484111U (en) | Optical treatment system | |
| CN215008252U (en) | Micro LED chip stripping off device and peel off machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20181015 Address after: B District, 2 building, 9 South Road six, Tainan, Taiwan, China Patentee after: Bo Long Precision Polytron Technologies Inc. Address before: Taiwan, China Tainan Park Road 994 Lane 56-9 floor Patentee before: Zheng Bowen |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140910 |